TWI335399B - Led lamp - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting diode lamp, and more particularly to a light-emitting diode lamp having a heat dissipation module. [Prior Art] [0002] 13⁄4 science and technology steps, from the general crane lamp to the current Cold Cathode Fluorescent Lamp s (Cold Cathode Fluorescent Lamp,

CCFL) and j^ght Emitting Diode (LED) are all moving toward shrinking and flattening. [0003] At present, the CCFL can hardly shrink because of the volume, and the CCFL will increase to 600 volts, and the CCFL will cause mercury pollution, which will be banned in some countries. And 1^1) has many characteristics such as high environmental brightness, power saving, long life, etc., so LED will gradually replace CCFL. However, today's high-brightness LEDs generate large local heat. To replace CCFL as a lighting product, it is necessary to have a proper heat dissipation design; otherwise, LED lighting efficiency will be reduced and life will be shortened. [0004] In addition, the power supply required for the LED is DC and low voltage, so the AC power source for driving the ballast lamp, the cold cathode fluorescent lamp, etc. is not suitable for directly driving the LED lamp. To this end, LED lamps typically use an AC-DC converter to convert AC power to DC power to drive LED fixtures. However, the AC/DC converter will generate a large amount of heat during the working process. If the heat generated by the AC/DC converter cannot be dissipated in time, the temperature of the AC/DC converter will increase, which will cause the energy conversion efficiency of the AC/DC converter to decrease. The current and voltage output of the AC/DC converter are unstable, which causes problems such as reduced LED luminous efficiency. Form No. A0101 3V Total 7 pages 0993293793-0 1335399 August 17th, 2008, the shuttle is replacing 'page [0005] Therefore, the heat dissipation system for LEDs and AC/DC converters is currently in need of overcome difficulties. SUMMARY OF THE INVENTION [0006] In view of the above, it is necessary to provide a light-emitting diode lamp with good heat dissipation and stable operation. [0007] A light-emitting diode lamp includes a light-emitting diode module and an AC-DC conversion device electrically connected to the light-emitting diode module. The illuminating diode lamp further includes a heat dissipating device, and the heat dissipating device includes a substrate, and the illuminating diode module and the AC/DC converting device are juxtaposed on the substrate. Compared with the prior art, the present invention provides a light emitting diode module and an AC/DC converter device on the substrate in parallel, and the LED module and the AC/DC converter device can be simultaneously passed through the substrate. The heat is dissipated to ensure that the entire luminaire operates within the normal temperature range, so that the illuminating diode lamp can work normally and stably. Embodiments [0009] FIG. 1 shows a light-emitting diode lamp according to an embodiment of the present invention. The illuminating diode device includes a heat dissipating device 100, a illuminating diode module 200, and two AC/DC converting devices 300. The AC/DC converting device 300 is electrically connected to the illuminating diode module 200. The LED module 200 and the two AC/DC converters 300 are placed in parallel on the upper surface of the heat sink 100. The heat generated by the LED module 200 and the two AC/DC converters 300 can pass through. The heat sink 100 is dissipated to the external environment. 096134426 Form No. A0101 Page 4 of 17 0993293793-0 1335399 I I [0010]

[0012] [0012]

Please refer to FIG. 2 and FIG. 3 together. The heat sink 1 includes a heat sink 110 and a plurality of heat pipes 120 embedded in the upper surface of the heat sink 110. The heat sink 110 includes a substantially rectangular substrate 112 and a plurality of fins 114 extending from a lower surface of the substrate 112. A plurality of mutually parallel grooves 1120 are provided on the upper surface of the substrate 112, and the grooves 1120 extend from one end of the substrate 112 toward the other end of the substrate 112. The trenches 1120 extend from the rear end region of the heat sink 110 to the front end region of the heat sink 110 along the length direction of the substrate 112, as in the position where the heat sink 110 is located in FIG. The heat pipes 120 are correspondingly placed in the grooves 1120 such that the heat pipes 120 are embedded in the substrate 112 and extend from one end of the substrate 11 2 to the other end of the substrate 112. The heat pipes 120 are flat, and the upper surfaces of the heat pipes 120 are in the same plane as the upper surface of the substrate 112 so that the heat sink 110 and the heat pipe 120 are in contact with the light emitting diode module 2, and the heat sink 100 is lowered. The thermal resistance between the LED module 200 and the LED module 200. In addition, a plurality of threaded holes 1122 are respectively disposed on two sides of the groove 1120 on the substrate 112, and a fixing component such as a screw (not shown) is passed through the light emitting diode module 200 and screwed to the corresponding In the threaded hole 112 2 , the LED module 200 can be fixed on the upper surface of the heat sink 11 并 and the heat pipe ι 2 直接 is directly in contact with the LED module 200. The LED module 200 includes a plurality of LED modules 200 . a strip-shaped circuit board 21A and a plurality of light-emitting diodes 220 disposed on a mother board 210. The circuit boards 210 are placed in parallel along the extending direction of the heat pipe 120 in a rear end region of the substrate board. A heat pipe 120 is disposed correspondingly below each of the circuit boards 21, and the heat pipe 12 extends below the corresponding circuit board 21 and extends beyond the circuit board 210 to the front end region of the substrate 112. Use the screw 096134426 Form nickname A0101 Page 5 of 17 0993293793-0 1335399 099 August 17th Press the replacement page

The fixing member passes through the circuit board 210 and is screwed into the corresponding screw hole 1122 to fix the circuit board 210 to the upper surface of the heat sink 110 and to bring the heat pipe 120 into contact with the circuit board 210. In addition, the circuit board 210 is electrically connected to the AC/DC converter 300. When the AC/DC converter 300 converts the AC power to the DC power source and drives the LED 220 to emit light through the circuit board 210, the LED 220 is generated. The heat can be absorbed by the heat sink 110 and the heat pipe 120 and distributed to the external environment. At the same time, the AC/DC converter 300 generates heat, and the heat generated by it can also be absorbed by the radiator 110 and the heat pipe 120 and radiated to the external environment. The specific I positional relationship between the AC/DC converter 300 and the heat sink 100 will be described below. [0013] Each of the AC/DC converting devices 300 is electrically connected to a certain number of circuit boards 210. The AC/DC converter 300 includes a driving circuit board 310, a plurality of capacitors 320 disposed on the driving circuit board 310, and a heat generating electronic component 330, such as a power field, disposed on the driving circuit board 310 and generating more heat. Effect transistor (MOSFET), etc. The driving circuit board 310 is provided with a driving circuit (not shown) for performing AC/DC conversion, 4 the capacitors 320 are located above the driving circuit board 310, and the heat generating electronic components 330 are located on the driving circuit board 310. Below. [0014] The two driving circuit boards 310 of the two AC/DC converting devices 300 are disposed in parallel with each other and juxtaposed on the upper surface of the front end of the substrate 112, and the heat-generating electronic components 330 on the driving circuit board 310 and the substrate 112 and the heat pipe 120 are disposed. The portion extending to the outside of the circuit board 210 is simultaneously in direct contact. In this way, the heat generated by the heat-generating electronic component 330 of the AC-DC converter 300 can be simultaneously absorbed by the substrate 112 and the heat pipe 120, thereby ensuring the AC-DC converter 096134426 Form No. A0101 Page 6 of 17 Page 99993293793-0 1335399 - On August 17, 099, the replacement page set 300 is operated within the normal temperature range to ensure normal illumination of the LED 220. [0015] As described above, the driving circuit board 310 and the circuit board 210 are both disposed on the upper surface of the substrate 112, and the heat pipe 120 extends from below the circuit board 210 to below the driving circuit board 310. In other words, each heat pipe 120 can be divided into two segments, a first segment between the circuit board 210 and the substrate 112 and a second segment between the drive circuit board 310 and the substrate 112. The heat generated by the LED 220 and the AC/DC converter 300 can be absorbed by the substrate 112 and the heat pipe 120 at the same time, and transmitted to the heat sink 114 to be radiated to the external environment, thereby ensuring that the LED lamp works. Within the normal temperature range. 4 to FIG. 6 show a heat dissipation device 100a and an AC/DC conversion device 300a of a light-emitting diode lamp according to another embodiment of the present invention. The main difference between the AC/DC converting device 300a and the AC/DC converting device 300 of the previous embodiment is that the heat generating electronic component 330a and the capacitor 320a of the AC/DC converting device 300a are disposed above the driving circuit board 310a. The main difference between the heat dissipation device 100a and the heat dissipation device 100 of the previous embodiment is that the heat dissipation device 100a further includes a plurality of heat conduction elements 130a disposed at the front end of the substrate 112a, such as a thermal conductive paste, a metal block, or the like. The heat dissipating device 100a and the AC/DC converting device 300a are assembled in the same arrangement as in the previous embodiment, and the heat conducting members 130a are positioned between the driving circuit board 310a and the substrate 112a. Thus, the heat generated by the AC/DC converting device 300a is transferred to the substrate 11 2a and the heat pipe 120a through the heat conducting member 130a, and is then radiated to the external environment. [0017] In the above embodiment, the LED luminaire includes two AC-DC conversions 096134426 Form No. A0101 Page 7 of 17 0993293793-0 1335399 On August 17, 1999, the device is replaced by the device; The usage can change the number of AC/DC converters, such as one, three, etc., and the number of boards driven by each AC/DC converter. [0018] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art to the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0019] FIG. 1 is a partially exploded view of a light-emitting diode lamp according to an embodiment of the present invention. 2 is an exploded perspective view of the AC/DC converting device and the heat sink device of FIG. 1. 3 is an exploded perspective view showing the AC/DC converter of FIG. 2 and the bottom of the heat sink facing upward. [0021] FIG. 4 is a perspective view of an AC/DC converting device and a heat sink of a light emitting diode lamp according to another embodiment of the present invention. [0023] FIG. 5 is an exploded view of FIG. 4. 6 is an exploded perspective view showing the AC/DC converter of FIG. 5 and the bottom of the heat sink facing upward. [0024] FIG. [Main component symbol description] [0025] Heat sink: 100, 100a [0026] Substrate: 112, 112a [0027] Threaded hole: 1122 096134426 Form number A0101 Page 8 of 17 0993293793-0 1335399 099 August 17 Japanese nuclear replacement page

[0030] [0030] [0030] [0030] [0034] [0034] [0038] [0039] [0039] Heat pipe: 120, 120a Circuit board: 210 AC/DC converter: 300, 300a Capacitance: 320, 320a Thermal Conduction Component: 130a Heatsink: 110 Trench: 1120 Heatsink: 114 Light Emitting Diode Module: 200 Light Emitting Diode: 220 Driver Circuit Board: 310, 310a Heated Electronic Components: 330 330a

096134426 Form No. A0101 Page 9 of 17 0993293793-0

Claims (1)

1335399 On August 17, 099, Shuttle is replacing Jiqi. The scope of application for patents is as follows: 1. A light-emitting diode lamp comprising a light-emitting diode module and an AC-DC connected to the LED module. The illuminating device further includes: a heat dissipating device, the heat dissipating device comprising a substrate and a heat pipe disposed on the substrate, the substrate having a groove for accommodating the heat pipe; The pole body module and the AC/DC converter are arranged side by side on the substrate; the heat pipe includes a circular arc surface attached to the groove and a flat outer surface coplanar with a surface of the substrate; and the heat pipe is flattened The outer surface is in contact with at least one of the light emitting diode module and the AC/DC converter. 2. The illuminating diode lamp of claim 1, wherein the AC/DC converting device comprises a driving circuit board fixed on the substrate and a heat generating electronic component, the heat generating electronic component and the substrate and the heat pipe At least one contact. 3. The illuminating diode lamp of claim 1, wherein the AC/DC converting device comprises a driving circuit board fixed on the substrate and a heat generating electronic component disposed on the driving circuit board, the driving A circuit board is located between the g-thermal electronic component and the substrate. 4. The illuminating diode lamp of claim 3, wherein the heat pipe comprises a first segment between the driving circuit board and the substrate, and extending from the first segment and located at the illuminating A second segment between the diode module and the substrate. 5. The illuminating diode lamp of claim 4, wherein the heat sink further comprises a heat conducting element disposed between the driving circuit board and the substrate and corresponding to the heat generating electronic component. 096134426 Form No. A0101 Page 10 of 17 0993293793-0 1335399 - A modified light-emitting diode according to claim 1, wherein the substrate has a groove a groove, the heat pipe being disposed in the groove. 7. The illuminating diode lamp of claim 1, wherein the illuminating diode module comprises a plurality of circuit boards arranged side by side in parallel on the substrate, and disposed on each of the circuit boards. The plurality of light-emitting diodes comprise: a plurality of heat pipes disposed on the substrate, the heat pipes being in contact with at least one of the light-emitting diode modules and the AC-DC converter. 8. The illuminating diode lamp of claim 1, wherein the illuminating diode module and the AC/DC converting device are juxtaposed on the same surface of the substrate. 096134426 Form Number A0101 Page 11 of 17 0993293793-0