CN201206745Y - LED lamps - Google Patents

Abstract

A light-emitting diode lamp includes a light-emitting diode module and an AC/DC conversion device electrically connected with the light-emitting diode module. Wherein, the LED lamp further includes a heat dissipation device, and the heat dissipation device includes a substrate, and the LED module and the AC/DC conversion device are arranged on the substrate in parallel. In the utility model, the light-emitting diode module and the AC-DC conversion device are arranged side by side on the substrate, and the light-emitting diode module and the AC-DC conversion device can be simultaneously dissipated through the substrate to ensure that the entire lamp works at a normal temperature Within the range, it can ensure that the LED lamps work normally and stably.

Description

LED lamps

technical field

The utility model relates to a light-emitting diode lamp, in particular to a light-emitting diode lamp with a cooling module.

Background technique

With the advancement of science and technology, the development from general tungsten filament lamps to the current Cold Cathode Fluorescent Lamp (Cold Cathode Fluorescent Lamp, CCFL) and Light Emitting Diode (Light Emitting Diode, LED) are all in the direction of size reduction and flattening.

At present, CCFL can hardly be reduced because of its size, and CCFL will interfere when boosted to 600 volts. In addition, CCFL will cause mercury pollution, so some countries will also ban it. LED has many characteristics such as environmental protection, high brightness, power saving, long life, etc., so LED will gradually replace CCFL. However, today's high-brightness LEDs generate relatively large localized heat. If CCFLs are to be replaced as lighting products, a proper heat dissipation design is required; otherwise, LED luminous efficiency will be reduced and lifespan will be shortened.

In addition, the power required by LEDs is DC and low voltage, so the AC power used to drive tungsten lamps, cold cathode fluorescent tubes, etc. is not suitable for directly driving LED lamps. For this reason, an AC-to-DC conversion device is usually used in LED lamps to convert AC power into DC power so as to drive LED lamps. However, the AC-DC conversion device will generate a large amount of heat during the working process. If the heat generated cannot be dissipated in time, the temperature of the AC-DC conversion device will rise, which will reduce the energy conversion efficiency of the AC-DC conversion device and cause As a result, the current and voltage output by the AC-DC conversion device are unstable, thereby causing problems such as a decrease in LED luminous efficiency.

Therefore, the heat dissipation of the LED and the AC/DC conversion device is a problem that the industry needs to overcome urgently.

Utility model content

In view of this, it is necessary to provide a light-emitting diode lamp with good heat dissipation and stable operation.

A light-emitting diode lamp includes a light-emitting diode module and an AC/DC conversion device electrically connected with the light-emitting diode module. Wherein, the LED lamp further includes a heat dissipation device, and the heat dissipation device includes a substrate, and the LED module and the AC/DC conversion device are arranged on the substrate in parallel.

Compared with the prior art, the utility model arranges the light-emitting diode module and the AC-DC conversion device side by side on the substrate, and can simultaneously dissipate heat from the light-emitting diode module and the AC-DC conversion device through the substrate to ensure The whole lamp works in the normal temperature range, so that the normal and stable work of the light-emitting diode lamp can be ensured.

The utility model will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

Description of drawings

Fig. 1 is a partially exploded view of an LED lamp in an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the AC-DC conversion device and the cooling device in FIG. 1 .

FIG. 3 is an exploded perspective view of the AC-DC conversion device and the cooling device in FIG. 2 when the bottom faces upward.

Fig. 4 is a perspective view of an AC/DC conversion device and a heat dissipation device of an LED lamp in another embodiment of the present invention.

FIG. 5 is an exploded view of FIG. 4 .

FIG. 6 is a three-dimensional exploded view of the AC-DC conversion device and the cooling device in FIG. 5 when the bottom faces upward.

Detailed ways

Fig. 1 shows a LED lamp in an embodiment of the utility model. The LED lamp includes a heat sink 100 , an LED module 200 and two AC-DC converting devices 300 , and the AC-DC converting devices 300 are electrically connected to the LED module 200 . Wherein, the LED module 200 and the two AC-DC conversion devices 300 are placed side by side on the upper surface of the heat sink 100, and the heat generated by the LED module 200 and the two AC-DC conversion devices 300 can pass through the heat sink 100 disseminated into the external environment.

Please refer to FIG. 2 and FIG. 3 together. The heat dissipation device 100 includes a heat sink 110 and a plurality of heat pipes 120 embedded in the upper surface of the heat sink 110 . The heat sink 110 includes a substantially rectangular base plate 112 and a plurality of fins 114 extending from a lower surface of the base plate 112 . A plurality of parallel grooves 1120 are disposed on the upper surface of the substrate 112 , and the grooves 1120 extend from one end of the substrate 112 to the other end of the substrate 112 . As shown in FIG. 2 where the heat sink 110 is located, the grooves 1120 extend along the length direction of the substrate 112 from the rear end area of the heat sink 110 to the front end area of the heat sink 110 .

The heat pipes 120 are placed in the grooves 1120 one by one, so that the heat pipes 120 are embedded in the substrate 112 and extend from one end of the substrate 112 to the other end of the substrate 112 . These heat pipes 120 are flat, and the upper surfaces of these heat pipes 120 and the upper surface of the substrate 112 are in the same plane so that the radiator 110 and the heat pipes 120 are in contact with the LED module 200, and the heat sink 100 and the LED module 200 are lowered. thermal resistance between. In addition, a number of threaded holes 1122 are respectively provided on both sides of the groove 1120 on the substrate 112 , and fixing elements such as screws (not shown in the figure) are used to pass through the LED module 200 and screw into the corresponding threaded holes 1122 That is, the LED module 200 is fixed on the upper surface of the heat sink 110 and the heat pipe 120 is in direct contact with the LED module 200 .

The LED module 200 includes a plurality of strip-shaped circuit boards 210 and a plurality of LEDs 220 disposed on each circuit board 210 . These circuit boards 210 are placed parallel to the rear end area of the substrate 112 along the extension direction of the heat pipe 120, and a heat pipe 120 is correspondingly arranged under each circuit board 210, and the branch heat pipe 120 is below the corresponding circuit board 210 Extending beyond the circuit board 210 to the front end region of the substrate 112 . The circuit board 210 can be fixed on the upper surface of the heat sink 110 by using fixing elements such as screws to pass through the circuit board 210 and screw into the corresponding threaded holes 1122 , and make the heat pipe 120 contact with the circuit board 210 . In addition, these circuit boards 210 are electrically connected to the AC-DC conversion device 300. When the AC-DC conversion device 300 converts AC power into DC power and drives the LED 220 to emit light through the circuit board 210, the heat generated by the LED 220 can be dissipated. Heater 110 and heat pipe 120 absorb and dissipate to the external environment. At the same time, the AC-DC converting device 300 will also generate heat, which can also be absorbed by the radiator 110 and the heat pipe 120 and dissipated to the external environment. The specific positional relationship between the AC-DC conversion device 300 and the heat sink 100 will be described below.

Each AC-DC conversion device 300 is electrically connected to a certain number of circuit boards 210 . The AC/DC conversion device 300 includes a driving circuit board 310, a plurality of capacitors 320 disposed on the driving circuit board 310, and a heating electronic element 330 disposed on the driving circuit board 310 and generating more heat, such as a power field effect transistor (MOSFET), etc. Wherein, the driving circuit board 310 is provided with a driving circuit (not shown in the figure) for AC/DC conversion, the capacitors 320 are located above the driving circuit board 310 , and the heating electronic components 330 are located below the driving circuit board 310 .

The two drive circuit boards 310 of the two AC-DC conversion devices 300 are parallel to each other and arranged side by side on the upper surface of the front end of the substrate 112, and the heating electronic components 330 on the drive circuit boards 310, the substrate 112 and the heat pipe 120 extend to the circuit Portions outside the plate 210 are in direct contact at the same time. In this way, the heat generated by the heating electronic component 330 of the AC-DC conversion device 300 can be absorbed by the substrate 112 and the heat pipe 120 at the same time, thereby ensuring that the AC-DC conversion device 300 works within a normal temperature range to ensure that the light-emitting diodes 220 normal glow.

As mentioned above, both the driving circuit board 310 and the circuit board 210 are disposed on the upper surface of the substrate 112 , and the heat pipe 120 extends from the bottom of the circuit board 210 to the bottom of the driving circuit board 310 . In other words, each heat pipe 120 can be divided into two sections, that is, a first section located between the circuit board 210 and the substrate 112 and a second section located between the driving circuit board 310 and the substrate 112 . The heat generated by the LED 220 and the AC/DC conversion device 300 can be absorbed by the substrate 112 and the heat pipe 120 at the same time, and then transferred to the heat sink 114 and dissipated to the external environment, so as to ensure that the LED lamp works within a normal temperature range.

4 to 6 show a heat sink 100a and an AC/DC conversion device 300a of an LED lamp in another embodiment of the present invention. The main difference between the AC-DC conversion device 300a and the AC-DC conversion device 300 in the previous embodiment is that the heating electronic components 330a and capacitors 320a of the AC-DC conversion device 300a are disposed above the driving circuit board 310a. The main difference between the heat dissipation device 100a and the heat dissipation device 100 in the previous embodiment is that the heat dissipation device 100a further includes a plurality of heat conduction elements 130a, such as thermal conductive glue, metal blocks, etc., disposed on the front end of the substrate 112a. The heat sink 100a and the AC/DC conversion device 300a are assembled together in the same arrangement as in the previous embodiment, and the heat conducting elements 130a are located between the driving circuit board 310a and the substrate 112a. In this way, the heat generated by the AC-DC conversion device 300a is transferred to the substrate 112a and the heat pipe 120a through the heat conduction element 130a, and then dissipated to the external environment.

In the above embodiment, the light-emitting diode lamp includes two AC-DC conversion devices; the number of AC-DC conversion devices can be changed according to actual usage conditions, such as one, three, etc., and the number of circuit boards driven by each AC-DC conversion device wait.

Claims (10)

1. A light-emitting diode lamp, comprising a light-emitting diode module and an AC-DC conversion device electrically connected to the light-emitting diode module, characterized in that: the light-emitting diode light fixture also includes a heat sink, and the heat sink includes a The substrate, the light emitting diode module and the AC/DC converting device are arranged on the substrate side by side. 2. The LED lamp as claimed in claim 1, wherein the heat dissipation device further comprises a heat pipe disposed on the substrate, and the heat pipe is in contact with at least one of the LED module and the AC/DC conversion device. 3. The LED lamp as claimed in claim 2, wherein the heat pipe is embedded in the substrate, and a surface of the heat pipe and a surface of the substrate are located in the same plane. 4. The light-emitting diode lamp as claimed in claim 2, wherein the AC-DC conversion device comprises a driving circuit board fixed on the substrate and a heating electronic component, and the heating electronic component is connected with at least one of the substrate and the heat pipe. touch. 5. The light-emitting diode lamp as claimed in claim 2, wherein the AC-DC conversion device comprises a driving circuit board fixed on the substrate and a heating electronic element arranged on the driving circuit board, the driving circuit board Located between the heat-generating electronic component and the substrate. 6. The light-emitting diode lamp as claimed in claim 5, wherein the heat pipe comprises a first section located between the driving circuit board and the substrate, and extends from the first section and is located on the LED module. A second segment between the group and the substrate. 7 . The LED lamp as claimed in claim 6 , wherein the heat dissipation device further comprises a heat conduction element, the heat conduction element is disposed between the driving circuit board and the substrate and corresponds to the heat-generating electronic element. 8. The LED lamp as claimed in claim 2, wherein a groove is formed on the substrate, and the heat pipe is disposed in the groove. 9. The light-emitting diode lamp according to claim 1, wherein the light-emitting diode module includes a plurality of circuit boards arranged side by side and parallel on the substrate, and a plurality of light-emitting diodes arranged on each circuit board; The heat dissipation device includes several heat pipes arranged on the base plate, and these heat pipes are in contact with at least one of the LED module and the AC/DC conversion device. 10 . The LED lamp as claimed in claim 1 , wherein the LED module and the AC/DC converting device are arranged side by side on the same surface of the substrate. 11 .

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