1334525 九、發明說明： 【务明所屬之技術領域】 本么月係關於種散熱裝置，尤指一種應用於筆記型 電腦之中央處理器上之散熱裝置結構設計。 【先前技術】 筆。己型電細因具有輕薄短小之功能，其可攜性極佳， 而f多數人選購使用。該筆記型電腦因係將多數電子組件 集聚於一體積小的機殼内， ，、中，筆圮型電腦之設計愈作 愈輕溥’其中央處理器 延异忿來愈快，而其高速運算耗 電所產生的熱量相對愈高， ^ ^ 怼巧因此，該筆記型電腦工作時產 ^之南溫（尤其是中央處理器）之散熱問題，—直以來為 筆圮型電腦研發之重點項目之一。 ’、、' 目前應用於筆記型雷腦φ 散熱裝置設計，其主央處理器散熱用途之 板以及-裝設於散熱板::::;有::散…之散熱 於中央處理器上，用以將十央=三其中利用散熱板抵貼 f夹處理态工作時產生古，田 散導向各散熱鰭片上，復由 A 產生的…皿分 溫。 由風扇吹送出氣流使其散熱降 惟’ ϋ揭習用筆記划雷 萆己士電知之散熱裝置以 扇之組合結構設計，雖可捭# /、政…板及風 雖r扣供一項具有散埶 但是該筆記型電腦之中央處 ”·、 b之裝置， 熱板後，完全藉本身傳導生之高溫傳導至散 熱傳導速率較差，且因目前上’而因固體物之 速率“，其工作產生的高 盗處理 對棱问，故該散熱裝置受1334525 IX. Invention Description: [Technical field of the law] This month is about the heat sink device, especially the heat sink structure design applied to the central processing unit of the notebook computer. [Prior Art] Pen. The type has a light, thin and short function, and its portability is excellent, and most people choose to use it. Because the notebook computer collects most of the electronic components in a small-sized case, the design of the pen-type computer becomes more and more frivolous. The faster the central processor is, the faster it is. The heat generated by the computing power consumption is relatively high, ^ ^ 怼 因此 因此 因此 因此 因此 因此 因此 因此 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该One of the projects. ',,' is currently applied to the design of the notebook Thunderbolt φ heat sink, the main heat sink of the main processor and the heat sink::::;::: The heat dissipation on the central processor, It is used to make the ten central = three of which use the heat sink to abut the f-clamp processing state to produce the ancient, the field scattered to the heat-dissipating fins, and the temperature generated by the A-... The fan blows out the airflow to make it cool down. 'ϋ ϋ 习 习 笔记 划 萆 萆 萆 萆 电 电 电 电 电 电 电 电 电 电 电 电 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇 扇埶But the device at the center of the notebook computer, the device, after the hot plate, is completely conducted by the self-conducting high-temperature conduction to the heat conduction rate, and because of the current 'because of the rate of solid matter,' its work produces The high thief handles the ribs, so the heat sink is subject to
ZJ 限於電腦機殼空間之限制下， 法與產熱之速度相匹配，對此 要。 該散熱裝置之散熱效能實無 ’實有進一步加以改善之必 【發明内容】 本發明之主要目 置，希藉此設計，用 之散熱效能。 的在於提供一種筆記型電腦之散熱裝 以增進其對筆記型電腦之中央處理器ZJ is limited to the space of the computer case, and the method matches the speed of heat production. The heat dissipating performance of the heat dissipating device is practically improved. Further, the main object of the present invention is to design and use the heat dissipating performance. Is to provide a notebook computer cooling device to enhance its central processor for notebook computers
為達成則揭目的，太旅nB ^ 本發明所提出之技術方案係令該散 熱裝置之組成包括有具導熱性之散熱板及導熱體，該散熱 板係作為筆。己型電腦機殼底板之金屬板體，該散熱板頂 面中央設有一容置槽’ A自容置槽周邊設數道放射狀水平 延伸之延伸槽，I亥導熱體具有—可對應設置於容置槽中的 中空本體，該本體周邊具有數條分別對應設置於延伸槽中 的散熱官’各散熱管一端封閉，另端與本體相連通，且該 導熱體内部裝填有預定量的液態冷媒。 本發明以前揭技術方案之設計，主要係以令筆記型電 腦之中央處理器工作產生的高溫傳導至導熱體之本體上， 使其内之冷媒吸熱氣化後透過四周複數散熱管快速擴散傳 導至較大面積之散熱板散發降溫，而氣態冷媒降溫轉化為 液態後可再流回導熱體之本體中再行吸熱作用’如此，使 本發明藉氣態冷媒快速擴散之熱傳導效率，使該散熱裝置 具有極佳快速散熱之效能。 【實施方式】 有關本發明筆記型電腦之散熱裝置之具體實施例，請 I334525 配合參閱第一、二圖所示，該散熱裝置主要包括有一散熱 板（10)及一導熱體（20)，該散熱板（10)係二 可裝設於筆記型電腦本體底部之具導熱性金屬板體，該散 熱板（10)頂面中央設有一容置槽（11)，另自容置 槽（1 1 )周邊設數道呈放射狀水平延伸之延伸槽（i 2 )， 且散熱板（1 〇 )頂部可設置數組接孔（1 4 )提供電路 板組設之用。 該導熱體（2 0 )具有一可對應設置於容置槽（丄丄） 中的金屬中空本體（21)，該本體（21)周邊具有數 條分別對應設置於延伸槽（1 2 )中的散熱管（2 2 )， 各散熱管（22) —端與本體（21)相連通，另端為封 閉端，使導熱體（2 ◦)内部構成一封閉空間，該導熱體 (2 〇 )内部抽真空後再裝填預定量的液態冷媒（3 〇 )。 前述中’該導熱體（20)中間之本體（21)為略 低於散熱管（2 2)之型態，散熱管（2 2 )連接本體（2 1 )之内區段呈略向下傾斜’使散熱管（2 2 )外區段底 緣略高於本體（2 1 )頂面之位置，使液態冷媒集中於本 體（2 1 )内部。 前述中’散熱板（1 〇)之容置槽（1 1 )深度大於 導熱體（20)本體（2 1)之高度，容置槽（1 1)周 邊之延伸槽（1 2)深度約相當於導熱體（20)之散熱 管（22)管徑，藉此，使導熱體（2〇)之本體（21) 沉置於散熱板（1 0 )之容置槽（1 1 )内，散熱管（2 2)沉置散熱板（1 〇)的延伸槽（1 2)内，又該導熱 1334525 體（20)之本體（21)及散熱管（22)/分別與散熱 板（1 〇)之容置槽（1 1)及延伸槽（1 2)之槽壁間 設有導熱膏（1 3 )’用以增進彼此間之導熱性。 本發明之散熱裝置應用於筆記型電腦時，其係裝設於 電腦機殼之底部作為底板，如第三、®圖所示，並以導熱 體（2 〇 )中間之本體（2 1 )抵貼於電腦中之中央處理 器（4〇) ’該中央處理ϋ(40)與導熱體（2〇)本 體（2 1 )頂面之間可設導熱膏（丄3 )，以增加彼此間 之導熱性。 s忒筆s己型電腦啟動後，該中央處理器（4 〇 )工作 時產生的高溫即熱移轉至導熱體（20)之本體（2工） 上’進而使本體（2 1 )内的冷媒（3 〇 )吸熱而蒸發為 氣態’其中因導熱體（2 Q )内部係抽真空後再裝填冷媒， 故冷媒氣化後，其吸熱後升溫後膨脹後的氣體分別快速地 衝向四周的散熱管（22)中，再透過各散熱管（22 將熱分散傳導至散熱板（」〇 )各部&，並藉擴大其散熱 表面積而有效地將熱予以散發，此時再配合原設於筆記型 電腦機殼内之風扇（圖未示）則可進一步利用氣流輔助提 什其政熱效能，而原流至散熱管（2 2 )内之氣態冷媒（3 0 )則因散熱後降溫即凝結為液態’再流回本體（2 内部進行吸熱、分散散熱之循環作用。 經由以上之說明可以瞭解，本發明之散熱裝置可將筆 記型電腦之中央處理器工作時產生的熱傳導至導熱體上 由冷媒吸熱氣化後經由數散熱管放射狀傳遞至散熱板分散 1334525 散熱，其中因導熱體内部係抽真空後再填充冷媒，故冷媒 氣化後於散熱管内之擴散速度極快，藉此，使其在熱^導 之效率可以有效地快速提昇’進而使其具有優於習用散熱 板與風扇組合之散熱效能’因此’本發明具有創新的技^ 特徵及顯然的進步性，故本發明符合發明專利要件，爰依 法具文提出申請。 【圖式簡單說明】 第-圖係本發明散熱裝置實施例之立體分解示意圖。 第二圖係本發明散熱裝置實施例之剖面示意圖。 第三圖係本發明散熱裝置實施例應用於筆記型電腦中 之實施狀態參考圖。 第四圖係本發明散熱裝置對冑記型電腦t中央處理器 進行散熱作用之實施狀態參考圖。 (11)容置槽 (13)導熱膏 (2 1 )本體 【主要元件符號說明 (1 〇)散熱板 (1 2 )延伸槽 (1 4 )组接孔 (2 0 )導熱體 (2 2 )散熱管 (3 0 )冷媒 (40)中央處理器In order to achieve the goal, the technical solution proposed by the present invention is that the heat dissipating device comprises a heat-dissipating heat-dissipating plate and a heat-conducting body, and the heat-dissipating plate is used as a pen. The metal plate body of the bottom plate of the computer casing has a receiving groove in the center of the top surface of the heat dissipating plate. A A plurality of radially extending extending grooves are arranged around the receiving groove, and the I-thermal heat conductor has a corresponding arrangement. a hollow body in the accommodating groove, wherein the periphery of the body has a plurality of heat dissipating pipes respectively disposed in the extending grooves, and one end of each of the heat dissipating pipes is closed, and the other end is connected with the body, and the heat conducting body is filled with a predetermined amount of liquid refrigerant . The design of the prior art solution of the present invention mainly transmits the high temperature generated by the operation of the central processing unit of the notebook computer to the body of the heat conductor, so that the refrigerant therein is heated and vaporized and then rapidly diffused and transmitted through the surrounding heat pipes. A large area of the heat dissipation plate emits a temperature drop, and the gaseous refrigerant is cooled into a liquid state and can be returned to the body of the heat conductor for heat absorption. Thus, the heat transfer efficiency of the present invention is rapidly diffused by the gaseous refrigerant, so that the heat sink has Excellent fast cooling performance. [Embodiment] For a specific embodiment of the heat sink of the notebook computer of the present invention, please refer to the first and second figures of the I334525. The heat sink mainly includes a heat sink (10) and a heat conductor (20). The heat dissipating plate (10) is a heat-conducting metal plate body which can be installed on the bottom of the body of the notebook computer. The receiving plate (11) is disposed at the center of the top surface of the heat dissipating plate (10), and the self-receiving groove (1 1) There are several extending grooves (i 2 ) extending radially in the periphery, and an array of holes (14) can be arranged on the top of the heat dissipation plate (1 〇) to provide circuit board assembly. The heat conductor (20) has a metal hollow body (21) correspondingly disposed in the accommodating groove. The periphery of the body (21) has a plurality of correspondingly disposed in the extending groove (12). The heat pipe (2 2 ), the end of each heat pipe (22) is connected to the body (21), and the other end is a closed end, so that the heat conductor (2 ◦) internally forms a closed space, and the heat conductor (2 〇) interior A predetermined amount of liquid refrigerant (3 Torr) is charged after evacuation. In the foregoing, the body (21) in the middle of the heat conductor (20) is slightly lower than the heat pipe (2 2), and the inner section of the heat pipe (2 2 ) connected to the body (2 1 ) is slightly inclined downward. 'The bottom edge of the outer section of the heat pipe (2 2 ) is slightly higher than the top surface of the body (2 1 ), so that the liquid refrigerant concentrates inside the body (2 1 ). In the foregoing, the depth of the receiving groove (1 1 ) of the heat dissipation plate (1 〇) is greater than the height of the body ( 2 1 ) of the heat conductor (20), and the depth of the extending groove (12) around the receiving groove (1 1) is approximately equivalent. The heat pipe (22) has a diameter of a heat pipe (22), whereby the body (21) of the heat conductor (2) is placed in the receiving groove (1 1 ) of the heat sink (10) to dissipate heat. The tube (2 2) is placed in the extending groove (1 2) of the heat dissipating plate (1 〇), and the body (21) and the heat dissipating tube (22) of the heat conduction 1334525 body (20) are respectively separated from the heat dissipating plate (1 〇) A thermal conductive paste (13) is disposed between the groove of the receiving groove (11) and the extending groove (12) for enhancing the thermal conductivity between each other. When the heat dissipating device of the present invention is applied to a notebook computer, it is installed at the bottom of the computer casing as a bottom plate, as shown in the third and the figure, and is received by the body (2 1 ) in the middle of the heat conductor (2 〇). A central processing unit (4〇) attached to the computer 'The central processing unit (40) and the top surface of the heat conductor (2〇) body (2 1 ) may be provided with a thermal paste (丄3) to increase the mutual Thermal conductivity. After the computer is started, the high temperature generated by the central processing unit (4 〇) is transferred to the body of the thermal conductor (20) (and then the body (2 1 )) The refrigerant (3 〇) absorbs heat and evaporates into a gaseous state. The heat medium (2 Q ) is vacuumed and then filled with refrigerant. Therefore, after the refrigerant is vaporized, the gas that has been heated and then expanded is rapidly rushed to the surrounding area. In the heat pipe (22), the heat pipes (22) are further transmitted to the heat sinks ("〇"), and the heat is dissipated by expanding the heat dissipating surface area. The fan inside the notebook case (not shown) can further utilize the airflow to help the heat efficiency of the gas, and the gaseous refrigerant (30) that flows into the heat pipe (2 2 ) is cooled by the heat. Condensed into a liquid state and then flows back to the body (2 internal heat absorption, dispersion heat dissipation cycle. As can be understood from the above description, the heat sink of the present invention can transfer the heat generated by the central processing unit of the notebook computer to the heat conductor. Heat absorption by refrigerant After that, it is radiated to the heat dissipating plate through the number of heat dissipating tubes to disperse 1334525. Since the inside of the heat conductor is vacuumed and then filled with the refrigerant, the diffusion rate of the refrigerant in the heat dissipating tube is extremely fast, thereby making it hot in the heat ^ The efficiency of the lead can be effectively and quickly improved, and thus it has better heat dissipation performance than the combination of the conventional heat sink and the fan. Therefore, the present invention has innovative technical features and obvious advancement, so the present invention conforms to the patent requirements of the invention. The following is a schematic exploded view of an embodiment of the heat sink of the present invention. The second figure is a schematic cross-sectional view of an embodiment of the heat sink of the present invention. The example is applied to the implementation state reference diagram in the notebook computer. The fourth figure is the reference state of the implementation state of the heat dissipation device of the present invention for dissipating heat from the central processing unit of the notebook computer t. (11) accommodating groove (13) thermal paste (2 1 ) Body [Main component symbol description (1 〇) Heat sink (1 2 ) Extension groove (1 4 ) Assembly hole (2 0 ) Thermal body (2 2 ) Heat pipe (3 0 ) Refrigerant (4 0) CPU