TWI333265B - Window manufacture method of semiconductor package type printed circuit board - Google Patents

Description

1333265 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method of manufacturing a printed circuit board for a semiconductor package, which is processed by a single-sided, double-sided, multi-layer ( Multi Layer) On the substrate on which the whole copper is applied, the circuit is formed by development, etching, and stripping, and an insulating layer is formed on the portions other than the finger pads and the pads of the circuit formed above, and the wires are plated with gold. The finger-shaped soldering piece and the pad are plated with gold to form a gold-plated/nickel-plated layer, and the metal burr generated by the wire-plating wire and the notch is removed, and the finger-shaped pad portion is covered, and wiring and peeling are performed. Therefore, the electrical interference caused by the metal burrs of the finger pads can be eliminated, and the reliability can be improved. [Prior Art] FIG. 1 relates to a method of manufacturing a conventional printed circuit board for semiconductor packaging. As shown in Fig. 1 above, the conventional method includes the following steps: a developing step of pressing a dry film on both sides of a copper-clad substrate, except that a portion where the finger-shaped soldering piece is to be formed is exposed to the outside. The etching step removes the copper er which is exposed to the outer portion of the developing portion in the above developing step to form a finger-shaped soldering piece. In the film-removing step, after the finger-shaped soldering piece is formed in the silver etching step, the pressed dry film is removed. The solder resist coating step insulates all of the regions except the finger pads formed by the above-described film-removing step from the pads. " Gold-plated/nickel-plated step, which is plated with a finger-welded solder exposed on the top (four) cloth step to form a gold-plated/nickel-plated layer. The wiring step is performed by gold plating in the above-mentioned key gold/key, and then processed to form a printed circuit board outer shape and a notch. For a semiconductor package manufactured by the above method (5)

Chip) or FBGA (Fine Pitch Ball Grid Array) board, the wire bonding area is arranged in the center of the package in the lead finger production

The gold-plated wires required for gold plating are arranged in the center. However, the above-mentioned finger-shaped soldering piece (20) is used when the notch (3 〇) is processed by the wiring method in the case where the above-mentioned "four pieces (10) are not coated with other substances, as shown in FIG. ) The gold-plated wire (1〇) is pushed, the metal hair is produced, G) 'The above metal burr (10)) may approach or contact the conductive connection with the semiconductor chip. <Welding wire' if it is in contact with the adjacent finger-shaped solder: Interference, Short-circuited, resulting in poor appearance of the printed circuit board. [Summary of the Invention] ... This is the purpose of solving the above problems. [The purpose is to provide a window processing method for a printed circuit board for semi-conductive packaging, in semiconductor packaging In the manufacturing process of the printed circuit board used for the use of the circuit board, in order to prevent the wiring from being added to the gold after the gold/key nickel, the spring is pushed toward the processing direction of the wiring, and the above-mentioned key gold/plating After the nickel, the marriage supports the gold-plated wire of the mask processing part to prevent the occurrence of metal burrs. [Simple description of the drawing] Fig. 1 shows a flow chart of the manufacturing method of the printed circuit board for the conventional semiconductor package. Printed circuit board BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a flow chart showing a window processing method for a printed circuit board for semiconductor package according to the present invention. FIG. 4 is a view showing a window processing method for a printed circuit board for semiconductor package of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a drawing of a mask peeling step in a window processing method for a printed circuit board for a swivel package of the present invention. [Embodiment] A printed circuit for a semiconductor package of the present invention The manufacturing method of the board can reduce the gold wire of the lead finger-shaped soldering piece for removing the printed circuit board and the processing and semiconductor core 7 1333265. The above-mentioned invention is beneficial to the special office = under the condition ', with this (four) (four)- In the above-mentioned (four) (four) recording processing method, the problem of the spurting of the notch is carried out. The gold-plated wire 7 arranged at the above-mentioned notch processing portion is separated at the above-mentioned notch, and the cloth is eliminated. The wire is used to push the secret image to minimize the electrical interference of the metal hair, which can significantly reduce the defect rate of the printed circuit board. [Main component symbol description] 10 Gold plating 20 finger notch molten sheet 30 (window) 40 of the metal burr 100 bond finger shroud 130 120 110 Plated Wire slot (window) 9

Claims (1)

Patent application scope: 1. A window processing method for a printed circuit board for semiconductor packaging, a method for manufacturing a printed circuit board for semiconductor package which is not intended to produce metal burrs, characterized by the following steps: development step, copper-clad substrate Two _ attached, except that the part which will form the finger cymbal is exposed to the outside; in the etch 1 step, the copper forming and the soldering piece which are exposed to the outside in the above step (4) are removed, and the film detaching step is The step (4) above is performed to form the finger-shaped ruthenium sheet to remove the pressed dry film; the stripping step is to insulate the finger sheet formed by the above-mentioned film-removing step from the impurity region; the gold plating/plating step, in the above resistance The soldering coating is exposed to the material sheet and (4) is subjected to a key to form a gold plating/nickel plating layer; the mask coating step is performed after the gold plating/nickel plating step is performed, and the gold wire is covered by the cover; In the above-mentioned mask coating step, the coated ejection core is covered, and the shaft printed circuit board is shaped and grooved; the mask _ step, after the wiring is processed, the gold plating is removed Coated on the mask. 2. According to the material described in the article _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ A mask area is formed after the mask material is applied. 3. The window processing method for a printed circuit board for semiconductor package according to the application of the invention, characterized in that, in the mask coating step, the mask coating material uses a solid or liquid substance.