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Application filed by Super Talent Electronics IncfiledCriticalSuper Talent Electronics Inc
Priority to TW94113217ApriorityCriticalpatent/TWI329320B/en
Publication of TW200638429ApublicationCriticalpatent/TW200638429A/en
Application grantedgrantedCritical
Publication of TWI329320BpublicationCriticalpatent/TWI329320B/en
Cooling Or The Like Of Electrical Apparatus
(AREA)
Abstract
The present invention relates to a memory module assembly including one or two heat sinks attached directly onto one or more integrated circuits (ICs, such as memory ICs) of a memory module by an adhesive which is effective by being either heat-activated or heat-cured. The adhesive is applied onto either the memory integrated circuits or the heat sink before a fixture is employed to apply pressure between the heat sink plates and the memory module by clamping. Then, the fixture and the memory module assembly are both put into an oven to activate or cure the adhesive. After cooling, the fixture is removed to leave the memory module assembly with the heat sinks and the memory module fixed together.
TW94113217A2005-04-262005-04-26Memory module assembly and method for making the same
TWI329320B
(en)