1328688 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種檢測系統及其所用之檢測板，特 別疋拓一種供檢測空板（Bare Board)或插件（p〇pulated)之電 路板所用的導接模組。 【先前技術】 一般組裝電路板之生產流程主要有表面黏著、波焊及 檢測等製程，其中檢測製程（Functi〇n Test Pr〇cess)包括内線 路檢測（In-Circuit Tester;簡稱ICT) '製造缺陷分析 (Manufacture Defect Analyzer;簡稱 MDA)與功能檢測 (Functional Test;簡稱FT)，其主要是檢測電路板在製程中 是否不良、檢測零件及設計功能等，在此檢測過程中，往 往需要大量的人力與時間，因此業界無不希望能縮短檢測 時間或簡化檢測流程來提昇檢測的效率。 參閱圖1，一主機板9具有一電路板91及一供一電子 元件（圖未示）電性連接的電連接器92，該電連接器92具有 谷至90及複數導電端子92丨。為了方便檢測起見，目前 是將一導接模組93置於在電連接器92的容室9〇内，由於 導接模組93具有與各導電端子921導接的複數導孔9〇1， 因此檢測人員只需使用一檢測儀器8之探測棒81來--對 導接模組93之導孔901作檢測，即可得知主機板9是否有 開路/短路或元件損壞。 參閱圖1、圖2及圖3，檢測用的導接模組93具有— 上表面932(如圖2)及一下表面931(如圖3)，下表面931佈 5 1328688 設有複數金屬接點920,用於對應導接電連接器92之導電 端子921，上表面932則佈設有複數檢測點93〇，用以供檢 測儀？§ 8之探測棒8ι--探測電連接器92的各導電端子 921導通與否。 但是目前使用的導接模組93具有下述缺點： 1. 如圖2所示，由於上表面932的每個檢測點93〇外 觀都相同，檢測人員難以迅速找出需要作檢測的檢測點93〇 〇 2. —些可供調整信號的檢測點，由於是隱藏在眾多的 檢測點930裡，必須仰賴檢測人員的經驗或以對照查表來 找出可供調整信號的檢測點，十分麻煩。 3. 由於檢測點930是在接觸緊固裝置（一般為鐵蓋） 的表面也有金屬鍍膜，容易在緊固裝置施加壓力時令其露 出裸銅而形成短路。 【發明内容】 有鑒於電子元件的功能多有一定的信號類別，例如可 依據傳遞信號之不同區分為電壓、位址、f料及控制的信 號類別，如果能將各檢測點分別標示出其類別，將有助於 檢測人員迅速找出需要作檢測的檢測點。 因此，本發明之一目的，即在提供一種讓檢測人員能 夠迅速找出檢測點的供檢測電路板的導接模組。 本發明之另一目的，即在提供一種讓檢測人員能夠迅 速找出檢修點的供檢測電路板的導接模組。 於是，本發明供檢測電路板的導接模組包含一板體及 6 1328688 複數個貫穿該板體之導接部，該板體具有-第—表面及一 第二表面，且各該導接部具有導通的一第—接點及一第二 接點H點係形成於該第—表面1二接點係形成: 該第一表面並與該電路板之導電路徑電性 於：該導接模組的各該第—接點可由外觀區別出 屬信號類別。1328688 IX. Description of the Invention: [Technical Field] The present invention relates to a detection system and a detection board therefor, and in particular to a circuit board for detecting a bare board or a plug-in (p〇pulated) The guiding module used. [Prior Art] The general assembly circuit board production process mainly includes surface adhesion, wave soldering and inspection processes. The inspection process (Functi〇n Test Pr〇cess) includes In-Circuit Tester (ICT) Manufacture Defect Analyzer (MDA) and Functional Test (FT) are mainly used to detect whether the board is defective in the process, detecting parts and design functions. In this process, a large number of Manpower and time, so the industry wants to shorten the inspection time or simplify the inspection process to improve the efficiency of detection. Referring to Fig. 1, a motherboard 9 has a circuit board 91 and an electrical connector 92 for electrically connecting an electronic component (not shown). The electrical connector 92 has a valley to 90 and a plurality of conductive terminals 92A. For the convenience of the detection, a conductive module 93 is placed in the cavity 9 of the electrical connector 92. The conductive module 93 has a plurality of conductive holes 9 导1 connected to the conductive terminals 921. Therefore, the detecting personnel only need to use the detecting rod 81 of the detecting device 8 to detect the guiding hole 901 of the guiding module 93, and it can be known whether the motherboard 9 has an open/short circuit or component damage. Referring to FIG. 1, FIG. 2 and FIG. 3, the guiding module 93 for detecting has an upper surface 932 (as shown in FIG. 2) and a lower surface 931 (FIG. 3), and a lower surface 931 cloth 5 1328688 is provided with a plurality of metal contacts. 920, for the corresponding conductive terminal 921 of the conductive connector 92, the upper surface 932 is provided with a plurality of detection points 93 〇 for the detector? Detector 8 of § 8 - The conductive terminals 921 of the detecting electrical connector 92 are turned on or not. However, the currently used guiding module 93 has the following disadvantages: 1. As shown in FIG. 2, since each detecting point 93 of the upper surface 932 has the same appearance, it is difficult for the detecting personnel to quickly find the detecting point 93 that needs to be detected. 〇〇2. Some detection points for adjusting the signal, because they are hidden in many detection points 930, it is very troublesome to rely on the experience of the inspectors or to check the checklists to find the detection points for the adjustment signals. 3. Since the inspection point 930 is also coated with a metal coating on the surface of the contact fastening device (generally an iron cover), it is easy to expose the bare copper to form a short circuit when the fastening device applies pressure. SUMMARY OF THE INVENTION In view of the fact that the function of an electronic component has a certain signal type, for example, it can be classified into a voltage, an address, a material, and a control signal type according to the difference of the transmission signal. If each detection point can be marked with its category, It will help the inspectors quickly identify the detection points that need to be tested. Accordingly, it is an object of the present invention to provide a pilot module for a test circuit board that allows an inspector to quickly find a detection point. Another object of the present invention is to provide a pilot module for a test circuit board that allows an inspector to quickly find an access point. Therefore, the guiding module for the detecting circuit board of the present invention comprises a board body and a plurality of guiding portions extending through the board body, the board body has a first surface and a second surface, and each of the guiding portions a first contact and a second contact H are formed on the first surface 1 to form a contact: the first surface and the conductive path of the circuit board are electrically connected to: the conductive connection Each of the first contacts of the module can be distinguished from the appearance of the signal type by the appearance.
本發明供檢測電路板的導接模組的原理，是藉由依據 不同信號類別而給予各接點不同之標示，如此一來，無論 是在檢測或是檢修階段’都可以讓檢測或檢修人員能夠迅 速地找到檢測點或檢修點。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二個較佳實施例的詳細說明中，將可 清楚的呈現。The principle of the guiding module for detecting the circuit board of the present invention is to give different indications of the contacts according to different signal categories, so that the testing or maintenance personnel can be made in the inspection or maintenance stage. Ability to quickly find detection points or inspection points. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention.
參閱圖4,本發明的導接模組i的第一較佳實施例係供 一主機板3作檢測，主機板3具有—電路板31及―供一電 子疋件（如.中央處理器）電性連接的電連接器32，亦即，待 測的主機板3係-設置有至少—電連接器32的電路板31。 電連接胃32是供-例如以基地格拇陣歹^ 咖An*ay)封裝的電子元件與電路板31之導電路徑彼此電 性連接，且電連接器32具有一 機構322的複數導電端子321， (圖未示）固持在電連接器32的一容室3〇内 固定機構322及埋設在固定 導接模組1是藉由緊固裝置 包含一板體10及 參閱圖4、圖5及圖6，導接模組j 7 1328688 複數個貫穿板體Π)之導㈣u，且板體1G具有一朝上的 第-表面m(如圖5)及-朝向電連接器32置放的第二表面 120(如圖6) ’各導接部u係一位於導孔内的金屬鍍膜或— 金屬導線，且金屬鍍膜用於導通形成於第一表面11〇的一第 —接點in及形成於第二表面12〇的一第二接點ιΐ2，第二 接點112並與電路板31之導電路徑電性連接。 參閱圖4及圖5，檢測人員係使用一檢測儀器2之探針 來對第一表面110之任一第一接點ln作檢測，且各第一接 點111可由外觀區別出所屬信號類別，例如可以是電源、位 址、資料或控制其中任一種信號類別，藉此可偵知電路板 3 1之導電路徑是否有短路/開路或其他損壞情況。 以一種LGA封裝的中央處理器（intel 775-land LGA Package socket)為例’其信號依其功能類別可區分為電源 (VCC，VTT，GTLREF，VCCA，VCC-IOPLL，GND)、位址 (ADDRESS)、資料（DATA)及控制（CTRL)等幾組訊號，因此 ，可將導接模組1位於第一表面110歸屬不同信號類別的各 第一接點111 (即檢測點）分別給予不同之標示。 如圖5所示，以不同形狀、文字、顏色或隔線之標示 說明如下： 1· :表明該檢測點之信號為GND信號。 2· + :表明該檢測點之信號為VCC，VTT信號，由 於VCC，VTT信號眾多，在VTT信號集中區域以 隔線劃分，並以文字” T”標示以方便區分。 3 ·_ :表明該檢測點之信號為Control信號。 8 1328688 4.春.表明該檢測點之信號為DATA或ADDRESS作 號，且在DATA信號集中區域以文字，，D”標示， 在ADDRESS信號集中區域以文字’’a”標示，並 各有隔線劃分。 參閱圖5，導接模組1更於第一表面11〇對應中央區 域規劃一重點檢測區15，且重點檢測區15具有複數檢測點 113,例如在第一表面no之中央區域將可供調整信號的檢 測點113，如VID[7:0]，BSEL[2:0]信號，之外觀設計成具有 特殊造型的外框，並將其設置在預設的位置，如此一來，檢 測人員只要將導接模組i安裝在電連接器32即可檢測 VID[7:0]，BSEL[2:0]信號’同時也可以對個別的vid[7:0]， BSEL[2:0]以開路/短路（〇pen/sh〇rt)的方式作設置調整，由於 是將可供調整信號的檢測點113都獨立出來並置放在明顯處 ，因此可容易找到，如表1所示。Referring to FIG. 4, a first preferred embodiment of the conductive module i of the present invention is for detecting a motherboard 3, and the motherboard 3 has a circuit board 31 and an electronic component (such as a central processing unit). The electrically connected electrical connector 32, that is, the motherboard 3 to be tested, is provided with a circuit board 31 of at least the electrical connector 32. The electrical connection 32 is electrically connected to the electrical path of the circuit board 31, for example, and is electrically connected to the circuit board 31, and the electrical connector 32 has a plurality of conductive terminals 321 of a mechanism 322. (not shown) is fixed in a chamber 3 of the electrical connector 32, and the fixing mechanism 322 is embedded in the fixed guiding module 1 by means of a fastening device comprising a plate body 10 and referring to Figs. 4 and 5 6, the conductive module j 7 1328688 is a plurality of guides (four) u penetrating through the board body, and the board body 1G has an upward facing first surface m (as shown in FIG. 5) and a first side facing the electrical connector 32. The two surfaces 120 (Fig. 6) 'each of the guiding portions u is a metal plating film or a metal wire located in the guiding hole, and the metal plating film is used for conducting a first contact in and formed on the first surface 11? A second contact ι 2 on the second surface 12 , and a second contact 112 are electrically connected to the conductive path of the circuit board 31. Referring to FIG. 4 and FIG. 5, the tester uses a probe of the detecting device 2 to detect any first contact ln of the first surface 110, and each of the first contacts 111 can distinguish the signal type from the appearance. For example, it can be a power source, an address, a data, or a control of any of the signal categories, thereby detecting whether there is a short circuit/open circuit or other damage to the conductive path of the circuit board 31. Take an LGA packaged central processing unit (intel 775-land LGA Package socket) as an example. Its signal can be divided into power supply (VCC, VTT, GTLREF, VCCA, VCC-IOPLL, GND) and address (ADDRESS) according to its function category. a plurality of sets of signals, such as data (DATA) and control (CTRL), so that the first contacts 111 (ie, detection points) of the first module 110 on the first surface 110 belonging to different signal categories can be respectively given different Marked. As shown in Fig. 5, the descriptions of different shapes, characters, colors or lines are as follows: 1· : Indicates that the signal of the detection point is the GND signal. 2· + : Indicates that the signal of the detection point is VCC, VTT signal, due to VCC, VTT signal is numerous, divided in the VTT signal concentration area by the dividing line, and marked with the text "T" for easy distinction. 3 · _ : indicates that the signal of the detection point is a Control signal. 8 1328688 4. Spring. It indicates that the signal of the detection point is DATA or ADDRESS, and it is marked with text, D" in the DATA signal concentration area, and is marked with the text ''a' in the ADDRESS signal concentration area. Line division. Referring to FIG. 5, the guiding module 1 further designs a key detecting area 15 corresponding to the central area 11 ,, and the key detecting area 15 has a plurality of detecting points 113, for example, the central area of the first surface no is adjustable. The signal detection point 113, such as the VID[7:0], BSEL[2:0] signals, is designed to have a specially shaped outer frame and set it at a preset position, so that the tester only needs Mounting the conduction module i on the electrical connector 32 can detect VID[7:0], and the BSEL[2:0] signal can also be used for individual vid[7:0], BSEL[2:0] Open/short (〇pen/sh〇rt) is used for setting adjustment. Since the detection points 113 for adjusting signals are independent and placed in obvious places, they can be easily found, as shown in Table 1.
Def a iult CPU CLK: 200ΗΗτ ! BSEL2 BSEL1 丨BSELO ! ' _ -0i ' 1 ! 0! '!一 ： 1.. ... 1 ! ! 1 1 Defa iult Vcore: i ! ! VR10：1. 175v VR11:1.24375v VID7 6 5 4 3! 2 1 VIDO —· 0 0 1 1 10 1 1Def a iult CPU CLK: 200ΗΗτ ! BSEL2 BSEL1 丨BSELO ! ' _ -0i ' 1 ! 0! '! One: 1.. ... 1 ! ! 1 1 Defa iult Vcore: i ! ! VR10:1. 175v VR11 :1.24375v VID7 6 5 4 3! 2 1 VIDO —· 0 0 1 1 10 1 1
表1 需說明的是’對應中央處理器之固定鐵蓋區域的檢測 點113可以是於第一表面11〇表層沒有金屬鍍膜的導孔，因 此長期使用時可避免短路（sh〇rt)的問題發生β 參閱圖5及圖6’導接模組1又額外在其中央區域預留 9 1328688Table 1 It should be noted that the detection point 113 corresponding to the fixed iron cover area of the central processing unit may be a conductive hole having no metal plating on the surface of the first surface 11 , so that the problem of short circuit (sh〇rt) can be avoided in long-term use. The occurrence of β refers to Figure 5 and Figure 6 'The conductive module 1 additionally reserves 9 1328688 in its central area.
十四個導孔供一具有十四接腳的電連接器（圖未示）分別將 BCLK[l：〇], RESET#, PWRGOOD, VCC, VCCA, VTT VTTPWRGD，VCCPLL，GTLREF[l:〇], MCHGTLREF 等最為 重要的k號在電連接器導出，不但能讓檢測人員迅速找出 最為常用/重要的信號，透過電連接器，也可直接通過纜線 連接外部檢測卡/檢測儀器來對此電連接器作檢測。 再參閱圖4,檢測人員檢測時，只需將導接模組丨放在 電連接器32容室30内，再使用檢測儀器2的探針來接觸 各第一接點111或檢測點1丨3即可。 參閱圖7,本發明供檢測電路板的導接模組於第二實施 例中，是使用一種用於内線路檢測（In_circuit Tester)之電路 測試系統6來測試一空板（未插件）之電路板31，，所用的導 接模組1概與第一實施例相同，因此不再贅述其構造及原 理。 電路測試系統6包括一控制主機611、一顯示裝置612 、一輸入裝置613、一檢測電路621及一檢測針床（Bed 〇f Nails)622。 參閱圖5及圖7,導接模組i的第一面11〇係朝向具有 複數彈性探針623的檢測針床622，且各第一接點及/ 或測試點113係對應與各彈性探針623導接，且導接模組^ 更由一緊固裝置（圖未示）將其固定於電路板31，上。 測試時，控制主機611係接受輸入裝置613之命令，藉 由控制檢測電路621開關的啟閉（〇N/〇FF)來對第—接點1 η 及/或測試點113 —一作測試以執行對於電路板3ι，的開路 10 (open)、短路（short)及元件（component)之檢測，最後產生— 報表顯示在顯示裝置612，讓檢測人員可依據檢測結果得知 電路板31’之導電路徑是否有問題以方便後續的檢修。 歸納上述，本發明供檢測電路板的導接模組1、丨，具有 下述優點： 1 ·將每個檢測點可 <外觀出所屬信號類別，例如 可以是電源、位址、資料或控制其中任一種信號類別，分 別以不同形狀、文字、顏色或隔線來標示，檢測或維修人 員就可以迅速找出需要作檢測的檢測點。 2.將一些可供調整信號的檢測點集中放置到重點檢測 區，檢測人員無須經驗或以對照查表來查找，就可以容易 地針對重點檢測區的檢測點來作調整。 3·由於一般導接模組的檢測點是在接觸緊固裝置（一 般為鐵蓋）的表面也有金屬鍍膜，可將該等檢測點改為在表 層沒有金屬鍍膜的導孔，因此當緊固裝置施加壓力時也不 會露出裸銅而形成短路。 4.由於維修人員就可以迅速找出需要作檢測的檢測點 ，因此可以節省檢測人員在測試或維修時量測各信號所需 的大量時間。 准以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請^利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】Fourteen pilot holes for a fourteen-pin electrical connector (not shown) will be BCLK[l:〇], RESET#, PWRGOOD, VCC, VCCA, VTT VTTPWRGD, VCCPLL, GTLREF[l:〇] The most important k number, such as MCHGTLREF, is exported in the electrical connector, which not only allows the inspector to quickly find the most commonly used/important signal, but also directly connects the external test card/detection instrument through the cable through the electrical connector. The electrical connector is tested. Referring to FIG. 4, when the detecting personnel detects, the guiding module is only placed in the housing 30 of the electrical connector 32, and then the probe of the detecting device 2 is used to contact the first contact 111 or the detecting point 1丨. 3 can be. Referring to FIG. 7, the guiding module for the detecting circuit board of the present invention is used in the second embodiment to test a circuit board of an empty board (not plugged in) by using a circuit test system 6 for internal circuit detection (In_circuit Tester). 31. The guiding module 1 used is the same as that of the first embodiment, and therefore its construction and principle will not be described again. The circuit test system 6 includes a control host 611, a display device 612, an input device 613, a detection circuit 621, and a detection needle bed (Bed Naf Nails) 622. Referring to FIG. 5 and FIG. 7 , the first surface 11 of the guiding module i is directed toward the detecting needle bed 622 having a plurality of elastic probes 623 , and each of the first contacts and/or the testing points 113 corresponds to each elastic probe. The pin 623 is guided, and the guiding module is further fixed to the circuit board 31 by a fastening device (not shown). During the test, the control host 611 accepts the command of the input device 613 to test the first contact 1 η and/or the test point 113 by controlling the opening and closing (〇N/〇FF) of the switch of the detection circuit 621 to perform For the open circuit 10 (open), short circuit and component detection of the circuit board 3, the final report is displayed on the display device 612, so that the tester can know the conductive path of the circuit board 31' according to the detection result. Is there a problem to facilitate subsequent maintenance? In summary, the guiding module 1 for detecting a circuit board of the present invention has the following advantages: 1. Each detecting point can be <appears to the associated signal type, such as power, address, data or control. Any of the signal categories are marked with different shapes, characters, colors or lines, and the inspection or maintenance personnel can quickly find the detection points that need to be tested. 2. Set some detection points for adjusting signals to the key detection area. The inspection personnel can easily adjust to the detection points of the key detection areas without having to experience or look up the table. 3. Since the detection point of the general conduction module is also a metal coating on the surface of the contact fastening device (generally the iron cover), the detection points can be changed to the guide holes without metal coating on the surface layer, so when tightening When the device is pressurized, bare copper is not exposed to form a short circuit. 4. Since the maintenance personnel can quickly find out the inspection points that need to be tested, it can save a lot of time for the inspectors to measure each signal during testing or maintenance. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the present invention in accordance with the scope of the invention and the description of the invention. All remain within the scope of the invention patent. [Simple description of the map]