1328512 九、發明說明 【發明所屬之技術領域】 本發明係關於可適合用於 TAB ( Tape Automated Bonding，帶狀自動化黏合構裝置）等之半導體實裝電路 帶（tape )等之製造之塑膠膜-導體金屬箔層積體及其製造 方法。 【先前技術】 近年來，於電腦或電視等之顯示器，由省空間的觀點 來看被要求要薄型化。因此，對液晶顯示器面板（LCD ) 或電漿顯示器面板（PDP)等之平面面板顯示器之要求越 來越高。爲了驅動這些平面面板顯示器，使用通常驅動用 之半導體，而這樣的驅動用之半導體的大多數，被實裝於 TAB等之半導體實裝用電路紙帶。 電路帶通常藉由以下的方法製造。 於圖1(a)、圖1(b)，首先於聚醯亞胺樹脂等塑 膠膜3形成由環氧樹脂等所構成的黏接劑層4得到複合體 2。於此複合體2藉由打孔形成被稱爲裝置孔（device hole )之開口部5。爲了防止在打孔時黏接劑附著於模具 ，可以因應必要性，在黏接劑層4之上，形成稍後可以容 易剝離的保護膜層8。又，保護膜層8不一定要設置。 其次，如圖2(a)、圖2(b)所示，剝下所自己意 願而設的保護膜層8之後，於未硬化黏接劑層4之上，以 貼膜機（laminator)等預備接合銅箔等導體金屬箔6,得 1328512 到塑膠膜3與導體金屬箔6介由未硬化黏接劑層4貼合而 成之預備接合體1。 其次，藉由使預備接合體1之未硬化黏接劑層4加熱 硬化而得到塑膠膜-導體金屬箔層積體。此預備接合體1 之黏接劑層4的加熱硬化，如圖3所示，通常係以被捲取 於鋁製等之捲軸11的狀態下進行。硬化結束後’進而於 塑膠膜-導體金屬箔層積體的兩端部形成被稱爲鏈輪孔的 搬送用之連續孔，藉由銅鈾刻用感光性光阻劑之塗布、曝 光、顯影、銅蝕刻、光阻劑剝離等而形成電路’藉由形成 供保護該電路之用的保護用光阻劑層，而得到電路帶。 發明所欲解決之課題 藉由前述之從前方法所得到的塑膠膜-導體金屬箔層 積體，有著（1)塑膠膜-導體金屬箔層積體會發生翹曲或 扭曲等不良，（2)塑膠膜2與導體金屬箔6之間的黏接 力容易變得不安定，（3)藉由銅鈾刻形成的電路產生缺 陷，等問題點。 本發明的目的在於提供可以適切用於TAB等電路帶 的製造，耐熱性及尺寸安定性優異，導體金屬箔表面的污 染極少之塑膠膜-導體金屬箔層積體以及其製造方法。 【發明內容】 供解決課題之手段 本發明爲了克服前述從前技術之問題而反覆累積硏發 -5- 1328512 的結果，發現這些問題是出自未硬化黏接劑層4之加熱硬 化步驟所造成。亦即，前述問題點，應該是捲軸所捲取的 預備接合體1之加熱沒有均勻地進行，使得黏接劑層4之 硬化狀態或塑膠膜3之熱收縮等產生個體差異所致。此外 ，包含於未硬化黏接劑層4的樹脂、寡聚物、殘存單體、 硬化劑等成分被加熱而產生揮發成分，其於加熱硬化步驟 會污染被形成於塑膠膜3與黏接劑層4的開口部5周邊的 導體金屬箔6的表面7，所以會在蝕刻加工導體金屬箔6 時產生不良情形。 根據這些見解，本案發明人進而經過不斷硏究的結果 ，發現了要使導體金屬箔被預備接合於塑膠膜的預備接合 體之未硬化黏接劑層熱硬化時，藉由進而將1層共捲用金 屬膜與預備接合體一起被捲成卷筒狀的狀態下進行，因爲 在鄰接的預備接合體之間中介著有共捲用金屬膜，所以黏 接劑硬化時溫度變成均勻，不易發生黏接劑的硬化不良或 者塑膠膜的熱收縮之個體差異等問題，結果可得到耐熱性 提高，進而將塑膠膜-導體金屬箔層積體之導體金屬箔蝕 刻加工而得的電路施以加熱處理時之尺寸變化的個體差異 也被抑制了。此外，共捲用金屬膜作爲導體金屬箔表面的 保護層而發揮功能，所以防止來自未硬化黏接劑層的揮發 成分造成導體金屬箔表面的污染’而可以抑制電路帶製作 時之導體金屬箔的蝕刻步驟之不良情形的發生。本發明係 根據這些發現與見解而完成的。 根據本發明，提供一種塑膠膜-導體金屬箔層積體之 -6- 1328512 製造方法，具備：塑膠膜，與在其表面藉由未硬化黏接劑 層被預備黏接的導體金屬箔所構成，具有貫通塑膠膜與未 硬化黏接劑層而藉由導體金屬箔閉塞之裝置孔（device hole)之預備接合體之準備步驟，及將該預備接合體與共 捲用金屬膜一起被捲爲卷筒狀的步驟，及加熱該卷筒使未 硬化黏接劑硬化的步驟。 本發明另外提供將前述之硬化後之卷筒捲回，分離除 去該共捲用金屬膜而得之塑膠膜-導體金屬箔層積體。 本發明進而提供一種塑膠膜-導體金屬箔層積體與共 捲用金屬膜捲成卷筒狀而成的塑膠膜-導體金屬箔層積體 卷筒，該塑膠膜-導體金屬箔層積體在塑膠膜的表面藉由 硬化黏接劑層黏接的導體金屬箔所構成，同時貫通塑膠膜 與硬化黏接劑層而藉由導體金屬箔閉塞之具有裝置孔之塑 膠膜-導體金屬箔層積體之塑膠膜-導體金屬箔層積體卷筒 〇 以下參照圖面詳細說明本發明之塑膠膜-導體金屬箔 層積體及其製造方法。 【實施方式】 供實施發明之最佳型態 本發明之塑膠膜-導體金屬箔層積體（以下亦會簡稱 爲層積體）之製造方法，首先準備由塑膠膜，與其表面藉 由未硬化黏接劑層黏接的導體金屬箔所構成，具有貫通塑 膠膜與未硬化黏接劑層藉由導體金屬箔閉塞之裝置孔的預 / ^ • ^3 1328512 備接合體。此預備接合體可以藉由從前的方法製造， 圖1(a) ,1 (b)，2(a)，2(b)所示，於塑膠膜3形 接劑層4，進而藉由開孔加工形成裝置孔5而製作複 2’其後，藉由透過黏接劑層4將導體金屬箔6貼合 膠膜3而製造預備接合體i。 作爲塑膠膜3，可以舉出聚醯亞胺、聚醚醯亞胺 胺、液晶聚酯、聚苯硫等任意之塑膠膜，特別是由耐 φ 或尺寸安定性的觀點來看，使用聚醯亞胺膜較佳。 塑膠膜3的厚度通常爲10〜200 μιη，較佳者爲 125μιη，更佳者可以使用25〜ΙΟΟμηι。其厚度只要在 以上，用在電路帶就具有充分的強度，如果在2 0Ομηι 的話，則不會損及經濟性。 此外，爲了提高所得到的層積體的平坦性或導體 箔蝕刻後的尺寸安定性，塑膠膜3，其線膨脹係數最 10〜30ppm/K的範圍，而在15〜25ppm/K的範圍更佳 φ 作爲預備接合體1之構成黏接劑層4的黏接劑， 舉出聚醯亞胺樹脂，聚胺樹脂、聚酯樹脂、環氧樹脂 克力樹脂等黏接劑。其中於聚胺、聚酯樹脂等熱可塑 脂，混入環氧樹脂等熱硬化性樹脂者，具有廉價、耐 或黏接性優異，所以適於採用。混和熱塑性樹脂與熱 樹脂的場合，其比例較佳者爲熱塑性樹脂：熱固性樹 重量比率爲10: 90〜90: 10之範圍，較佳者爲20: 80 : 20之範圍。 此外，作爲黏接劑使用環氧樹脂等熱固性樹脂的 例如 成黏 么幽 a W. 於塑 、聚 熱性 20〜 1 Ομιη 以下 金屬 好在 〇 可以 、壓 性樹 熱性 固性 脂之 80〜 場合 -8- 1328512 ，其硬化劑或硬化觸媒，可以倂用酚樹脂、胺類、無水酸 、咪唑類或者是雙氰胺等。進而，應需要，添加矽土或碳 酸鈣等塡充料或矽烷耦合劑等亦可。硬化劑的添加量對通 常熱固性樹脂之添加量爲0.5〜300重量百分比。 作爲在塑膠膜3上形成黏接劑層4的方法，可以採用 任意方法，例如可以舉出在塑膠膜3上直接塗布黏接劑的 方法，或在被施以脫膜處理的聚酯等可剝離的膜上形成黏 接劑層之後，轉印至塑膠膜上的方法等。特別是爲了防止 在後述的打孔加工等進行開孔處理時黏接劑附著到模具上 ’把在被施以脫膜處理的聚酯膜等可剝離的膜上形成黏接 劑層者貼合於塑膠膜，將可剝離的膜作爲保護膜層8而一 起進行開孔較佳。 作爲保護膜8，可以使用前述之聚酯膜、聚乙烯膜、 聚丙烯膜等任意薄膜。 黏接劑層4的厚度，較佳者爲5〜50μηι，較佳者爲10 〜4 0 μιη。該厚度只要在5 μιη以上，可以在與導體金屬箔6 之界面不形成空隙而堅固地黏接，如果在ΙΟΟμηι以下的話 ，損及耐熱性或尺寸安定性之可能性較小。 如此進行’作爲在被形成黏接劑層4的塑膠膜3施以 形成裝置孔5的開孔加工的方法，可以採用利用模具之衝 壓加工等從前習知的任意方法。又，於黏接劑層4上形成 保護膜層8而施以開孔加工的場合，在進行次一貼合步驟 之前，需要拉剝開保護膜層8。 藉由在如此進行所得到的被施加開孔加工的複合體2 -9- 1328512 上貼合導體金屬箔6,製造預備接合體1。導體金屬箔6 被施加蝕刻加工，作爲導體電路發揮功能，可以使用銅箔 、鎳箔、鋁箔等任意金屬箔。其中由廉價、蝕刻加工容易 、可形成高精度的電路圖案等的觀點來看，以使用銅箔較 佳。 導電金屬箔6的厚度較佳者爲3〜35μηι，更佳者爲5 〜20μιη。其厚度只要在3μιη以上，就可以流以供作電路 發揮功能的必要電流，如果在350μχη以下的話，則可以容 易形成搭載平面面板驅動用半導體之電路帶所要求的高精 細電路圖案。 於暫時黏接步驟，被設有黏接劑層4的塑膠膜3(複 合體2)與導體金屬箔6使用熱層壓裝置等黏接而形成預 備接合體1。亦即，預備接合體1，係由塑膠膜3、於其表 面藉由未硬化黏接劑層4而預備黏接之導體金屬箔所構成 ，具有貫通塑膠膜4與未硬化黏接劑層4藉由導體金屬箔 6閉塞之裝置孔5。 其次，將所得到的預備接合體1與共捲用金屬膜12 —起捲爲卷筒狀。亦即，預備接合體1’如圖3所示，在 被捲取於捲軸11等之適當的軸上時’與共捲用金屬膜12 一起被捲取。如此所得到的卷筒’在預備接合體1之鄰接 的2層之間，必定有共捲用金屬膜1 2中介於其間。亦即 ，預備接合體1之裝置孔5與導體金屬箔係藉由共捲用金 屬膜1 2而相互隔離》 作爲共捲用金屬膜12例如可以使用銅箔、鋁箔、鉻 -10- 1328512 箔、鎢箔，以及不銹鋼箔等之合金箔等，任意之金屬箔膜 。特別是由廉價 '熱傳導性優異的理由來看’以使用銅箔 較佳。 共捲用金屬膜12的厚度較佳者爲5〜50μιη，更佳者 爲10〜40 μηα。藉由使用5〜50 μηι厚度的共捲用金屬膜12 ，可以防止在操作時產生皺紋等。 共捲用金屬膜12的熱傳導率，由提高在後續加熱步 驟使黏接劑層 4等均勻加熱的效果來看，於 27 °C在 l〇〇W/m . K以上較佳，在 200W/m . K以上更佳，在 3 0 0W/m · K以上又更佳，在3 5 0W/m · K以上最佳，又， 銅箔的熱傳導率爲4 0 2 W/m · K，銀的熱傳導率爲427 W/m · K。 將預備接合體1與共捲用金屬膜12 —起共捲之卷筒 ，接著加熱而使黏接劑層4熱硬化。黏接劑層4的熱硬化 溫度隨著使用的黏接劑的種類不同而可以選擇較佳的溫度 ，但是使用在熱塑性樹脂混入環氧樹脂系熱固性樹脂的場 合，以7(TC以上較佳，尤以l〇〇°C以上尤佳。熱硬化溫度 在70 °C以上的話，黏接劑的硬化可以生產性良好地有效率 地進行，可得耐熱性優異的層積體。熱硬化溫度的上限爲 3 00°C，較佳者爲2 5 0 °C。 於黏接劑層4的熱硬化步驟，共捲用金屬膜12中介 於鄰接的2層預備接合體1之間，所以可得：防止由黏接 劑層4產生的揮發成分因爲再附著而污染導體金屬箔6的 表面7，同時可以使被捲於捲軸11的塑膠膜3、黏接劑層 1328512 4以及導體金屬箔6的溫度均勻，縮小黏接劑層4的硬化 度的差異’進而中介著黏接劑層4與導體金屬箔6貼合的 塑膠膜3的熱收縮率等熱特性的個體差異可以減低等效果 〇 藉由如前所述進行黏接劑層4的熱硬化，如圖4所示 ’可得塑膠膜-導體金屬箔層積體1〇與共捲用金屬膜12 捲成卷筒狀而成的塑膠膜·導體金屬箔層積體10之卷筒， 該層積體10在塑膠膜3的表面藉由硬化黏接劑層4黏接 的導體金屬箔6所構成，同時貫通塑膠膜3與硬化黏接劑 層4而藉由導體金屬箔6閉塞之具有裝置孔5之本發明的 塑膠膜-導體金屬箔層積體卷筒。 捲回塑膠膜-導體金屬箔層積體卷筒，將此共捲用金 屬膜12分離除去，可得本發明之塑膠膜-導體金屬箔層積 體丨〇。進而，以慣用的方法於層積體〗〇的兩端部形成鏈 輪孔，藉由銅蝕刻用感光性光阻的塗布、曝光、顯影、銅 蝕刻、光阻剝離等形成電路，而形成供保護該電路之用的 保護用光阻層，可以得到電路帶。 本發明之層積體1 0，與從前的商品相比，抑制了翹曲 或扭曲，在塑膠膜與導體金屬箔之間的黏接力很均勻，進 而還具有不會發生在銅蝕刻形成的電路上產生缺陷等優異 的特性。因此，可是用於TAB等半導體實裝電路帶（ Tape)等之製造。 實施例 -12- 1328512 以下，根據實施例具體說明本發明。但本發明並不以 此爲限。 實施例1 混合聚胺樹脂（富士化成工業（股）製造之TOMAID (音譯）PA-100、20%異丙醇溶液）l〇〇g、環氧樹脂（曰 本環氧樹脂（股）製造之EPICOAT (音譯）828 ) 8g、烷 基酚樹脂（大日本油墨化學工業（股）製造之TD-2 62 5、 50%甲乙酮溶液）l〇g以及2-乙基咪唑0.5g而調製黏接劑 組成物。 其次將所得到的黏接劑組成物以乾燥後成爲25μιη厚 的方式塗布於厚度2 5 μπι之被施以脫膜處理的聚酯膜（三 菱化學聚酯膜（股）製造，MRX)上’以100°C乾燥5分 鐘，進而與厚度75 μιη的聚醯亞胺膜（宇部興產（股）製 造，UP REX (音譯）75S )貼合，製作設有保護膜層以及 黏接劑層之聚醯亞胺膜。其次，使用連續衝壓裝置，對被 設有黏接劑層之聚醯亞胺膜施以開孔加工，得到具有保護 膜層之複合體。 其後，剝離保護膜，藉由熱層壓裝置在120°C將12μιη 厚之導體用電解銅箔（三井金屬（股）製造SQ-VLP )暫 時黏接爲複合體’得到預備接合體。其次，將聚醯亞胺膜 與導體用銅箔之預備接合體，與18 μπι厚之電解銅箔（曰 礦材料（股）製造JTC箔）共捲，同時於鋁製的捲軸捲取 爲卷筒狀，開放於大氣中以170°C、60分鐘的條件使黏接 -13- 1328512 劑硬化，製造聚醯亞胺膜-導體用銅箔層積體。 所得到的層積體跨全長大致爲平坦，沒有發生翹曲或 扭曲等不良情形。此外，聚醯亞胺膜以及導體用銅箔之黏 接力分別以1.0kN/m、1.2kN/m堅固地黏接。 此外，於導體用銅箔表面並無特別從黏接劑的揮發成 分導致的污染，可形成良好的電路。亦即，於導體用銅箔 上電路狀地形成光阻圖案，進而以氯化亞鐵水溶液進行蝕 刻加工而施以電路形成時，並沒有蝕刻不良、光阻剝離、 電路斷線等缺陷。 實施例2 除了作爲共捲用金屬膜，使用12 μπι厚之電解銅箔（ 曰礦材料（股）製造JTC箔）以外，與實施例1同樣地製 造層積體。 所得到的層積體跨全長大致爲平坦，沒有發生翹曲或 扭曲等不良情形。此外，聚醯亞胺膜以及導體用銅箔之黏 接力分別以1.0kN/m、l.lkN/m堅固地黏接。 此外，於導體用銅箔表面並無特別從黏接劑的揮發成 分導致的污染，與實施例1同樣可形成良好的電路。 實施例3 除了作爲共捲用金屬膜，使用35μιη厚之鋁箔以外， 與實施例1同樣地製造層積體。 所得到的層積體跨全長大致爲平坦，沒有發生翹曲或 -14- 1328512 扭曲等不良情形。此外，聚醯亞胺膜以及導體用銅箔之黏 接力分別以l.lkN/m、1.3kN/m堅固地黏接。 此外，於導體用銅箔表面並無特別從黏接劑的揮發成 分導致的污染，與實施例1同樣可形成良好的電路。 比較例1 與實施例1同樣調製黏接劑組成物，使用該黏接劑組 成物與實施例1同樣製作設置保護膜層以及黏接劑層之聚 醯亞胺膜，與實施例1同樣對帶有黏接劑的聚醯亞胺膜施 以開孔加工，得到具有保護膜層之複合體。 其後，與實施例1同樣，得到預備接合體。將預備接 合體再不使用共捲用金屬膜的情況下，單獨捲取於鋁製捲 軸，在開放大氣中以1 70°c、3 0分鐘的條件使黏接劑硬化 ，製造層積體》 於所得到的層積體，由於黏接劑硬化時溫度不均勻而 有若干彎曲起伏。此外黏接劑硬化時所產生的來自黏接劑 的揮發成分導致的污染，也可以在聚醯亞胺膜與黏接劑之 開口部周邊的導體用銅箔上被確認。因此在導體用銅箔上 形成電路狀的光阻圖案，進而以氯化亞鐵蝕刻加工形成電 路時，會發生因爲導體表面的污染所導致的蝕刻不良以及 光阻剝離等導致電路斷線的不良情形。 比較例2 除了取代共捲用金屬膜而以25μιη厚的聚醯亞胺膜共 -15- 1328512 捲以外，與實施例1同樣地製造層積體。 所得到的層積體的導體銅箔表面雖然沒有被認爲是黏 接劑的揮發成分所導致的污染，但是在黏接劑硬化時則有 由於溫度不均勻所導致在聚醯亞胺膜-導體銅箔層積體之 彎曲起伏。 【圖式簡單說明】 圖1 (a)係具有裝置孔之塑膠膜與未硬化黏接劑層之 複合體之一例之平面圖，圖1 ( b )係圖1 ( a )之沿著I-I 線之剖面圖。 圖2(a)係由塑膠膜、未硬化黏接劑層、導體金屬箔 所構成，被形成裝置孔之預備接合體之一例之平面圖，圖 2 ( b)係圖2 ( a)之沿著II-II線之剖面圖。 圖3係預備接合體被捲取於捲軸的狀態之模式圖。 圖4係共捲圖2(a)之預備接合體與共捲用金屬膜， 接著加熱硬化未硬化黏接劑層而得之本發明之塑膠膜-導 體金屬箔層積體卷筒之部分模式剖面圖。 【主要元件符號說明】 1 :預備接合體 2 :複合體 3 :塑膠膜 4 :黏接劑層 5 :裝置孔 16- 1328512 6 :導體金屬箔 7 :表面 8 :保護膜層 10 :層積體 1 1 :捲軸 12 :共捲用金屬膜[Technical Field] The present invention relates to a plastic film which can be suitably used for the manufacture of semiconductor mounted circuit tapes such as TAB ( Tape Automated Bonding). Conductive metal foil laminate and method of manufacturing the same. [Prior Art] In recent years, displays such as computers and televisions have been required to be thinner from the viewpoint of space saving. Therefore, the requirements for flat panel displays such as liquid crystal display panels (LCDs) or plasma display panels (PDPs) are increasing. In order to drive these flat panel displays, a semiconductor for normal driving is used, and most of such semiconductors for driving are mounted on a semiconductor tape for semiconductor mounting such as TAB. The circuit strip is usually manufactured by the following method. In Fig. 1 (a) and Fig. 1 (b), first, a composite 2 is obtained by forming an adhesive layer 4 made of an epoxy resin or the like on a plastic film 3 such as a polyimide resin. In the composite 2, an opening portion 5 called a device hole is formed by punching. In order to prevent the adhesive from adhering to the mold at the time of punching, a protective film layer 8 which can be easily peeled off later can be formed on the adhesive layer 4 as necessary. Further, the protective film layer 8 does not have to be provided. Next, as shown in Fig. 2 (a) and Fig. 2 (b), after peeling off the protective film layer 8 which is desired, it is prepared on the uncured adhesive layer 4 by a laminator or the like. The conductive metal foil 6 such as a copper foil is bonded to obtain the preliminary bonded body 1 in which 1328512 is bonded to the plastic film 3 and the conductive metal foil 6 via the uncured adhesive layer 4. Next, the plastic film-conductor metal foil laminate is obtained by heat-hardening the uncured adhesive layer 4 of the preliminary joined body 1. The heat curing of the adhesive layer 4 of the preliminary joined body 1 is usually carried out in a state of being wound up on a reel 11 made of aluminum or the like as shown in Fig. 3 . After the hardening is completed, a continuous hole for transporting a sprocket hole is formed at both end portions of the plastic film-conductor metal foil laminate, and coating, exposure, and development of the photosensitive photoresist by copper uranium engraving are performed. The circuit is formed by copper etching, photoresist stripping, etc., by forming a protective photoresist layer for protecting the circuit. SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION The plastic film-conductor metal foil laminate obtained by the aforementioned prior method has (1) plastic film-conductor metal foil laminate which may be warped or twisted, and (2) plastic The adhesion between the film 2 and the conductor metal foil 6 tends to be unstable, and (3) defects occur in the circuit formed by the copper uranium engraving, and the like. It is an object of the present invention to provide a plastic film-conductor metal foil laminate which can be suitably used for the production of a circuit tape such as TAB, which is excellent in heat resistance and dimensional stability, and which has little contamination on the surface of a conductor metal foil, and a method for producing the same. SUMMARY OF THE INVENTION Means for Solving the Problems The present invention has been found to overcome the above-mentioned problems of the prior art and to repeatedly accumulate the results of the burst -5-1328512, which are found to be caused by the heat hardening step of the uncured adhesive layer 4. That is, the above problem is caused by the fact that the heating of the preliminary joined body 1 taken up by the reel does not proceed uniformly, so that the hardened state of the adhesive layer 4 or the heat shrinkage of the plastic film 3 is caused by individual differences. Further, components such as a resin, an oligomer, a residual monomer, and a hardener contained in the uncured adhesive layer 4 are heated to generate a volatile component, which is contaminated in the heat-hardening step to be formed on the plastic film 3 and the adhesive. Since the surface 7 of the conductor metal foil 6 around the opening 5 of the layer 4 causes a problem when the conductor metal foil 6 is etched. Based on these findings, the inventors of the present invention have further discovered that the conductive metal foil is to be thermally bonded to the uncured adhesive layer of the preliminary bonded body of the plastic film, and then one layer is further The roll metal film is wound into a roll shape together with the preliminary joined body. Since the metal film for co-rolling is interposed between the adjacent preliminary joined bodies, the temperature becomes uniform and hardly occurs when the adhesive is hardened. The problem of poor curing of the adhesive or individual difference in heat shrinkage of the plastic film results in improved heat resistance, and the circuit obtained by etching the conductive metal foil of the plastic film-conductor metal foil laminate is subjected to heat treatment. Individual differences in the dimensional changes of time are also suppressed. Further, since the metal film for co-rolling functions as a protective layer on the surface of the conductor metal foil, it is possible to prevent contamination of the surface of the conductor metal foil by volatile components from the uncured adhesive layer, and it is possible to suppress the conductor metal foil when the circuit ribbon is produced. The occurrence of a bad condition in the etching step. The present invention has been completed based on these findings and insights. According to the present invention, there is provided a method for manufacturing a plastic film-conductor metal foil laminate, which comprises: a plastic film, and a conductor metal foil which is preliminarily bonded by an uncured adhesive layer on a surface thereof. a preparation step of a preliminary bonding body having a device hole through which a plastic film and an uncured adhesive layer are closed by a conductor metal foil, and the preliminary bonding body and the metal film for co-rolling are rolled together a roll-like step and a step of heating the roll to harden the uncured adhesive. Further, the present invention provides a plastic film-conductor metal foil laminate obtained by winding up the above-mentioned hardened roll and separating and removing the metal film for co-rolling. The present invention further provides a plastic film-conductor metal foil laminate roll in which a plastic film-conductor metal foil laminate and a metal film for co-rolling are wound into a roll, the plastic film-conductor metal foil laminate a plastic film-conductor metal foil layer having a device hole formed by a conductive metal foil adhered to the surface of the plastic film by a hardened adhesive layer while passing through the plastic film and the hardened adhesive layer while being occluded by the conductive metal foil Plastic film-conductor metal foil laminate roll of integrated body The plastic film-conductor metal foil laminate of the present invention and a method for producing the same are described in detail below with reference to the drawings. [Embodiment] The manufacturing method of the plastic film-conductor metal foil laminate (hereinafter also referred to simply as a laminate) of the present invention is first prepared by a plastic film, and the surface thereof is not hardened. The conductor metal foil adhered by the adhesive layer has a pre-/^3 1328512 joint body penetrating through the hole of the plastic film and the uncured adhesive layer occluded by the conductor metal foil. The preliminary joint body can be manufactured by the former method, as shown in Fig. 1 (a), 1 (b), 2 (a), 2 (b), in the plastic film 3 forming agent layer 4, and further by opening After the device hole 5 is formed and the film 2 is formed, the conductor metal foil 6 is bonded to the film 3 through the adhesive layer 4 to produce the preliminary bonded body i. Examples of the plastic film 3 include any plastic film such as polyimide, polyetherimide, liquid crystal polyester, or polyphenylene sulfide, and in particular, from the viewpoint of resistance to φ or dimensional stability, use of polyfluorene The imine film is preferred. The thickness of the plastic film 3 is usually 10 to 200 μm, preferably 125 μm, and more preferably 25 to ΙΟΟ μη. If the thickness is more than the above, it will have sufficient strength for the circuit tape, and if it is 20 Ομηι, the economy will not be impaired. Further, in order to improve the flatness of the obtained laminate or the dimensional stability after etching of the conductor foil, the plastic film 3 has a coefficient of linear expansion of 10 to 30 ppm/K, and in the range of 15 to 25 ppm/K. Φ is an adhesive for the adhesive layer 4 of the preliminary joined body 1, and examples include an adhesive such as a polyimide resin, a polyamine resin, a polyester resin, and an epoxy resin. Among them, a thermoplastic resin such as a polyamine or a polyester resin, which is incorporated in a thermosetting resin such as an epoxy resin, is inexpensive, excellent in adhesion, or excellent in adhesion, and is therefore suitable for use. In the case where the thermoplastic resin and the thermoplastic resin are mixed, the ratio is preferably a thermoplastic resin: thermosetting tree weight ratio of 10: 90 to 90: 10, preferably 20: 80: 20. In addition, as a binder, a thermosetting resin such as an epoxy resin is used, for example, to form a viscous a W. In plastic, heat-generating 20 to 1 Ομιη The following metals are good in the case of enamel, pressed tree heat-curing grease 80~ occasions - 8- 1328512, its hardener or hardening catalyst can be phenolic resin, amine, anhydrous acid, imidazole or dicyandiamide. Further, a ruthenium or a ruthenium coupling agent such as alumina or calcium carbonate may be added as needed. The amount of the hardener added is usually from 0.5 to 300% by weight based on the amount of the usual thermosetting resin. As a method of forming the adhesive layer 4 on the plastic film 3, any method may be employed, and for example, a method of directly applying an adhesive to the plastic film 3, or a polyester to which a release treatment is applied may be mentioned. A method of transferring an adhesive layer on a peeled film, transferring it to a plastic film, or the like. In particular, in order to prevent the adhesive from adhering to the mold during the drilling process, such as the punching process described later, the adhesive layer is formed on the peelable film such as the polyester film to which the release film is applied. In the plastic film, it is preferable to use a peelable film as the protective film layer 8 to perform opening together. As the protective film 8, any film such as the above-mentioned polyester film, polyethylene film, or polypropylene film can be used. The thickness of the adhesive layer 4 is preferably 5 to 50 μm, preferably 10 to 40 μm. When the thickness is 5 μm or more, it is possible to firmly adhere to the interface with the conductor metal foil 6 without forming a gap, and if it is ΙΟΟμηι or less, the possibility of impairing heat resistance or dimensional stability is small. In the above-described method of performing the drilling process for forming the device hole 5 in the plastic film 3 on which the adhesive layer 4 is formed, any conventional method known from the prior art such as press working using a mold can be employed. Further, when the protective film layer 8 is formed on the adhesive layer 4 and subjected to the drilling process, the protective film layer 8 needs to be peeled off before the next bonding step. The preliminary bonded body 1 is produced by bonding the conductor metal foil 6 to the composite 2 -9 to 1328512 to which the obtained hole processing is performed. The conductor metal foil 6 is subjected to etching processing and functions as a conductor circuit, and any metal foil such as copper foil, nickel foil or aluminum foil can be used. Among them, from the viewpoint of being inexpensive, etching is easy, and a highly precise circuit pattern can be formed, it is preferable to use a copper foil. The thickness of the conductive metal foil 6 is preferably 3 to 35 μm, more preferably 5 to 20 μm. When the thickness is 3 μm or more, it is possible to flow a current necessary for the circuit to function. When the thickness is 350 μχ or less, it is possible to easily form a high-precision circuit pattern required for a circuit board on which a flat panel driving semiconductor is mounted. In the temporary bonding step, the plastic film 3 (composite 2) provided with the adhesive layer 4 and the conductor metal foil 6 are adhered by a heat laminating device or the like to form a prepared joint body 1. That is, the preliminary bonding body 1 is composed of a plastic film 3 and a conductor metal foil whose surface is preliminarily bonded by the uncured adhesive layer 4, and has a through-plastic film 4 and an uncured adhesive layer 4 The device hole 5 is closed by the conductor metal foil 6. Next, the obtained preliminary joined body 1 and the co-rolling metal film 12 are wound into a roll shape. That is, as shown in Fig. 3, the preliminary joined body 1' is taken up together with the metal film 12 for co-rolling when being wound up on a suitable shaft such as the reel 11. The reel obtained in this manner is necessarily interposed between the two adjacent layers of the preliminary joined body 1 with the metal film 12 for co-rolling. In other words, the device hole 5 of the preliminary bonding body 1 and the conductor metal foil are separated from each other by the metal film 12 for co-rolling. As the metal film 12 for the rewinding, for example, copper foil, aluminum foil, or chromium-10- 1328512 foil can be used. , metal foil such as tungsten foil, stainless steel foil, etc., any metal foil film. In particular, it is preferable to use a copper foil from the viewpoint of inexpensive "excellent heat conductivity". The thickness of the metal film 12 for co-rolling is preferably 5 to 50 μm, more preferably 10 to 40 μη α. By using the metal film 12 for co-rolling having a thickness of 5 to 50 μm, it is possible to prevent wrinkles and the like from occurring during handling. The thermal conductivity of the metal film 12 for co-rolling is preferably at a temperature of 27 ° C at 10 ° C/m·K or more at 200 W/ by the effect of improving the uniform heating of the adhesive layer 4 or the like in the subsequent heating step. More preferably m. K or more, more preferably 300 W/m · K or more, and most preferably 305 W/m · K or more, and the thermal conductivity of copper foil is 4 0 2 W/m · K, silver The thermal conductivity is 427 W/m · K. The preliminary bonded body 1 and the co-rolling metal film 12 are wound together, and then heated to thermally harden the adhesive layer 4. The thermosetting temperature of the adhesive layer 4 can be selected to be a preferred temperature depending on the type of the adhesive to be used. However, when the thermoplastic resin is mixed with the epoxy resin thermosetting resin, it is preferably 7 or more. In particular, when the thermal curing temperature is 70 ° C or more, the curing of the adhesive can be carried out efficiently and efficiently, and a laminate having excellent heat resistance can be obtained. The upper limit is 300 ° C, preferably 2 50 ° C. In the thermal hardening step of the adhesive layer 4, the metal film 12 for the common roll is interposed between the adjacent two layers of the preliminary bonded bodies 1, so that it is available : preventing the volatile component generated by the adhesive layer 4 from contaminating the surface 7 of the conductor metal foil 6 by reattaching, and simultaneously winding the plastic film 3, the adhesive layer 1328512 4 and the conductor metal foil 6 wound on the reel 11 The temperature difference is uniform, and the difference in the degree of hardening of the adhesive layer 4 is reduced, and the individual difference in thermal characteristics such as the thermal shrinkage ratio of the plastic film 3 to which the adhesive layer 4 and the conductive metal foil 6 are bonded can be reduced. Thermal hardening of the adhesive layer 4 is performed as described above, 4 is a roll of a plastic film-conductor metal foil laminate 10 in which a plastic film-conductor metal foil laminate 1 and a metal film 12 for a coil are wound into a roll, and the laminate is laminated. The body 10 is formed on the surface of the plastic film 3 by a conductive metal foil 6 adhered by the hardened adhesive layer 4, and penetrates the plastic film 3 and the hardened adhesive layer 4 to be closed by the conductor metal foil 6. 5. The plastic film-conductor metal foil laminate roll of the present invention. The plastic film-conductor metal foil laminate roll is wound back, and the co-rolling metal film 12 is separated and removed to obtain the plastic film of the present invention- Conductor metal foil laminate 丨〇. Further, sprocket holes are formed at both end portions of the laminate body by a conventional method, and coating, exposure, development, copper etching, and light are performed by photosensitive photoresist for copper etching. A circuit strip can be obtained by forming a circuit for preventing peeling or the like, and forming a protective photoresist layer for protecting the circuit. The laminate 10 of the present invention suppresses warpage or distortion as compared with the prior art. The adhesion between the plastic film and the conductive metal foil is very uniform, and thus does not occur. The circuit formed by copper etching has excellent characteristics such as defects. Therefore, it can be used for manufacturing semiconductor mounted circuit tapes such as TAB, etc. Embodiment -12 - 1328512 Hereinafter, the present invention will be specifically described based on examples. The present invention is not limited thereto. Example 1 Mixed polyamine resin (Tomaid PA-100, 20% isopropanol solution manufactured by Fuji Chemical Industry Co., Ltd.) l〇〇g, epoxy resin (曰EPICOAT (transliteration) 828 manufactured by this epoxy resin (stock) 8g, alkylphenol resin (TD-2 62 5, 50% methyl ethyl ketone solution manufactured by Dainippon Ink Chemical Industry Co., Ltd.) l〇g and 2-B The adhesive composition was prepared by using 0.5 mg of imidazole. Next, the obtained adhesive composition was applied to a polyester film (manufactured by Mitsubishi Chemical Polyester Film Co., Ltd., MRX) having a thickness of 25 μm by drying to a thickness of 25 μm. The film was dried at 100 ° C for 5 minutes, and further bonded to a polyimide film of a thickness of 75 μm (manufactured by Ube Industries, Ltd., UP REX 75S) to form a protective film layer and an adhesive layer. Polyimine film. Next, the polyimine film provided with the adhesive layer was subjected to a drilling process using a continuous press device to obtain a composite having a protective film layer. Thereafter, the protective film was peeled off, and a 12 μm thick conductor was temporarily bonded to a composite body by electrolytic copper foil (manufactured by Mitsui Metals Co., Ltd.) at 120 ° C to obtain a preliminary bonded body. Next, the pre-bonded body of the polyimide film and the copper foil for the conductor was co-rolled with an 18 μm thick electrolytic copper foil (JTC foil made of tantalum ore), and the coil was wound into a roll. The tubular shape was opened in the atmosphere, and the adhesive-13-1328512 was cured at 170 ° C for 60 minutes to produce a polyimide foil laminate for a polyimide film. The obtained laminate was substantially flat across the entire length, and no problems such as warpage or distortion occurred. Further, the adhesive strength of the polyimide film and the copper foil for conductor were strongly bonded at 1.0 kN/m and 1.2 kN/m, respectively. Further, the surface of the copper foil for conductor does not have any contamination due to the volatilization component of the adhesive, and a good circuit can be formed. In other words, when a resist pattern is formed in a circuit pattern on a copper foil for conductor, and further, etching is performed by an aqueous solution of ferrous chloride to form a circuit, there are no defects such as etching failure, peeling of the photoresist, and disconnection of the circuit. (Example 2) A laminate was produced in the same manner as in Example 1 except that a metal foil for co-rolling was used, and a 12 μm thick electrolytic copper foil (JTC foil made of tantalum ore) was used. The obtained laminate was substantially flat across the entire length, and no problems such as warpage or distortion occurred. Further, the adhesive strength of the polyimide film and the copper foil for conductor were firmly bonded at 1.0 kN/m and 1.0 kN/m, respectively. Further, the surface of the copper foil for conductor does not have any contamination due to the volatilization component of the adhesive, and a good circuit can be formed in the same manner as in the first embodiment. Example 3 A laminate was produced in the same manner as in Example 1 except that a 35 μm thick aluminum foil was used as the metal film for co-rolling. The obtained laminate was substantially flat across the entire length, and there was no problem such as warpage or twisting of -14-1328512. Further, the adhesive strength of the polyimide film and the copper foil for the conductor were strongly bonded at llkN/m and 1.3 kN/m, respectively. Further, the surface of the copper foil for conductor does not have any contamination due to the volatilization component of the adhesive, and a good circuit can be formed in the same manner as in the first embodiment. Comparative Example 1 A binder composition was prepared in the same manner as in Example 1. A polyimide film having a protective film layer and an adhesive layer was formed in the same manner as in Example 1 using the same as in Example 1, and the same procedure as in Example 1 was carried out. The polyimide film with an adhesive is subjected to a drilling process to obtain a composite having a protective film layer. Thereafter, in the same manner as in Example 1, a preliminary joined body was obtained. When the pre-bonded body is not used for the metal film for co-rolling, the aluminum reel is separately wound up, and the adhesive is cured in an open atmosphere at a temperature of 1 70 ° C for 30 minutes to produce a laminate. The resulting laminate has a number of bending undulations due to uneven temperature during curing of the adhesive. Further, the contamination by the volatile component of the adhesive generated during the curing of the adhesive may be confirmed on the copper foil for the conductor around the opening of the polyimide film and the adhesive. Therefore, when a circuit-shaped photoresist pattern is formed on the copper foil for a conductor, and the circuit is formed by etching with ferrous chloride, the etching failure due to contamination of the conductor surface and the peeling of the photoresist may cause malfunction of the circuit. situation. Comparative Example 2 A laminate was produced in the same manner as in Example 1 except that the laminate film was replaced with a 25 μm thick polyimide film having a thickness of -15 to 1328512. Although the surface of the conductor copper foil of the obtained laminate is not considered to be a contamination caused by the volatile component of the adhesive, when the adhesive is hardened, the polyimide film is formed due to temperature unevenness - The bending of the conductor copper foil laminate is undulating. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 (a) is a plan view showing a composite of a plastic film having a device hole and an uncured adhesive layer, and Fig. 1 (b) is a line along line II of Fig. 1 (a) Sectional view. Fig. 2(a) is a plan view showing an example of a preliminary assembly of a hole formed by a plastic film, an uncured adhesive layer, and a conductor metal foil, and Fig. 2(b) is along the line of Fig. 2(a) Sectional view of line II-II. Fig. 3 is a schematic view showing a state in which the preliminary joined body is taken up on a reel. 4 is a partial pattern of the plastic film-conductor metal foil laminate roll of the present invention obtained by co-rolling the preliminary bonded body and the metal film for co-rolling of FIG. 2(a), and then heat-hardening the uncured adhesive layer. Sectional view. [Explanation of main component symbols] 1 : Preparation of bonded body 2 : Composite 3 : Plastic film 4 : Adhesive layer 5 : Device hole 16 - 1328512 6 : Conductive metal foil 7 : Surface 8 : Protective film layer 10 : Laminated body 1 1 : Reel 12 : Metal film for co-rolling
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