1325602 九、發明說明： 【發明所屬之技術領域】 本發明係有關-種研絲置及其自動化研磨方法，更具體來說，侧 於-種應麟大尺寸液晶顯不φ板之具有修整㈣研練置及其自動化研 磨方法。 【先前技術】 於現今液晶顯不器產業中’為因應顯示面板尺寸增加，對薄化玻璃基 • ’使其輕量化的要#，其係利用化學機械研磨(Chemical Mechanical Polishing ; CMP)裝置薄化玻璃基板之厚度。該化學機械研磨裝置係藉由一 研磨盤對玻璃基板施卜旋轉之彳㈣力，㈣達到薄化玻璃基板之厚度。 經過對玻璃基板進行研磨-定時間之後，該研磨面除了因研磨而產生些許 參疯不齊之磨痕外，另因於距離研磨面中心較遠之表面耗損較少，距離研 磨面中心較近之表面耗損較多’以至於導致研磨面形成一碗型之弧度。此 時若無適當修整該研磨©’將造成研磨之玻璃基板表面平坦度的不均句。 • 習知應用於研磨半導體產業之晶圓的化學機械研磨褒置，其所具備之 晶圓吸附盤和修整舰為@]定式。因此為了 _晶圓完整平坦化之目的， 其研磨面之半徑必需大於晶圓吸附盤之直徑。然而，若將化學機械研磨機 台之概念沿用於研磨液晶顯示器產業之玻璃基板時，由於玻璃基板之尺寸 甚大於該晶圓之尺寸’因此必需增大研磨盤之面積，此舉將導致研磨機台 之體積更呈倍數增大。 現今研磨裝置中研磨盤之研磨面經過一定時間之研磨製程後，均會形 成-碗型之弧度，然而，現今研磨賴基板之研磨裝置均無具備修整盤之 6 1325602 設計’因此欲修整該研磨盤之研磨㈣，係先以人工方式拆卸研磨盤，於 研磨面上放置-修整盤’接著再旋轉研缝以帶動修整倾轉之運作以進 行修整處理。其巾，由於修魏麵跡健面範_之研磨面部份區域 平坦化。紐研磨面完整平坦化，係再以工方式働修㈣至其他未平 坦化之區域，或以人工方式㈣磨面中心、繞行，移動修整盤，並重複上述 旋轉之運作靖整個面平坦化。但以工方式移_修整盤容易於研 磨面產生段差，常無法達成面之平坦度(unif_ity)要求，因此習知技 術之修整處理不但無法縮短修整製程時間，提高製程效率外，更有可能無 法達到研磨面完整之平坦化之目的。 上述之方法中’修整盤並無-特定固定之尺寸。當所使用之修整盤大 於或等於研磨面之摊，由於修整_細之研磨面面積較大，即具有高 修整效率，但卻容易研磨過多之厚度，造成研磨盤無謂的消耗。而如一般 習知技術使用直徑小於該研磨面半徑許多之修整盤，由於修整面所接觸之 研磨面面積較少，雖較能精確地控制研磨處理之厚度’但卻必然耗費較多 修整時間及如前述容易導致該研磨面產生細微之段差。 綜上所述，可知當今大尺寸玻璃基板之研磨裝置除了體積較一般研磨裝 置呈倍數增大外’亦因修整時間、修整盤尺寸以及修整方法的影響，無法 提高該研磨製程之產能及良率。因此有必要提供一種研磨裝置及其修整方 法’使之當應用於大尺寸玻璃基板之研磨時，除了可有效縮減修整時間， 製程效率外，更能進一步改善研磨面之平坦度(uniformity)。 7 1325602 【發明内容】 本發明之主要目的係提供—種研磨裝置，其包含—研磨盤盘一修整 .& ’該研雜置·龍健如自動财式修魏研磨面。 本發明之另—目的係提供上述研縣置之自動化研封法，可有效地 大_減修整該研磨面所需耗費之作業時間與人力的付出。 本發明之研練置係包含-研雜與—修錢，其巾該研雜係具有 —研磨面’且該修整盤具有一修整面，其直徑介於研磨面直徑之ι/5與2/3 _之間’且本發明卿絲整盤跨職研磨面巾^肋之運作，修整該研磨 面〇 本發明之自動化研磨方法係包含触一研磨裝置；利用該修整盤對該 研磨面執行第-修整動作；再利用該修整盤對該研磨面執行第二修整動 作，其中該第二修整動作係包含跨過該研磨面中心之擺動，用以將該研磨 面達到完整之平坦化。 ^ 藉由本發明之研磨裝置及其自動化研磨方法，當應用於大尺寸玻璃基板 之研磨裝置時，除了可有效縮減修整時間，提高製程效率外，更能進一步 改善研磨面之平坦度(uniformity)。 【實施方式】 請參閱圖1 ’係闡示根據本發明實施例之自動化研磨之第一修整示意 圖。如圖所示，本發明之研磨裝置包含一研磨盤，其具有一研磨面，一修 整盤’其具有一修整面，並與該研磨面相互接觸。如前所述’該研磨盤101 因研磨產生耗損而導致研磨面1〇la產生些許參疵不齊之磨痕。首先’將修 8 1325602 整盤1〇2移置研磨® 1Gla上方，並雜整®職躺至研磨面1Gla之欲 平坦化的特㈣域1G，接著藉由研雜1Q1之旋轉帶動修麵⑽旋轉之 運作，使修整盤102之旋轉方向係與研磨盤1〇1之旋轉方向相同，即如同 見頭104所示之均為逆時針之旋轉方向。由於第—修整動作係針對研磨面 腿之特^區域K)做平坦化處理，因此於第—修整動作結束後，將該研磨 面101a未、.砰坦化處理之非特定區域與經平坦化處理後之特定區域相 比較’兩者將具有-高度之差異，導致於該研磨面1()la產生細微之段差。 本實施例於第-修整中雖然該修整盤1〇2之旋轉之運作係藉由研磨盤 101之旋__，但本發明並不關於此。該修錄lG2之娜之運作亦 可為-主動、具動力之旋轉’且旋轉方向與研磨盤1〇1之旋轉方向相反，以 縮短修整時間。 請參閱圖2，係闡示根據本發明實施例之自動化研磨之第二修整示意 圖。如圖所示，修整盤102除持續對_面1〇la執行相同於該第一修整步 驟之旋轉之運作外’亦同時或於後執行一擺動之運作，即箭頭2〇1所示之 擺動方向，其擺動之運作係沿研磨面lGia之-紐軌_動，該擺動之軌 跡係跨過研磨面101a之巾c 1G3 ’时蓋整個研磨面1Qla，以齡研磨面 101a因第一修整動作所產生細微之段差，從而達到研磨面1〇la完整之平坦 化。 請參閱圖3A與圖3B’係闡示根據本發明實施例之使用不同尺寸之修整 盤102所造成的影響不思圖’圖中所示之研磨面1()1&於經過對玻璃基板進 行研磨-㈣間之後，因距離研磨面赚中心較遠之表面耗損較少距離 9 1325602 研磨面101a中心較近之表面耗損較多，進而導致研磨面1〇la形成一碗型之 弧度。箭頭201係表示如同圖2所示之擺動方向。如圖3A所示，使用修整 盤101之直徑大於研磨面l〇la直徑之2/3時，由於修整面i〇2a所接觸之研 磨面101a面積較大，雖具有高修整效率，但卻容易研磨研磨盤1〇1過多之 厚度301 ,造成研磨盤1〇1無謂的消耗。而如一般習知技術，使用修整盤 102之直徑小於研磨面i〇ia直徑之1/5時，即如同圖38所示由於修整面 102a所接觸之研磨面2〇la之面積較少，因此較能精確地控制研磨處理之厚 度301 ’但卻必然耗費較多修整時間及如前述容易導致於研磨面i〇ia產生 k差。故如將修整盤1〇2之直徑大小介定於研磨面1〇1&直徑1/5與2/3之 間’尤其較佳為研磨面l〇la直徑之1/4，除同時具有上述兩者之優點，並 可將兩者所具有之缺點降至最低。 凊參閱圖4A至圖4E，係闡示根據本發明實施例之修整面j 〇2a之刻紋 示意圖。如騎示，刻_包含圖4A所示之無職之紐狀、圖犯所 示之網格狀、圖4C所示之放射狀、圖4D所示甜甜圈狀以及圖4E所示之 風車狀。於本發明實施例巾，躲修㈣_上形賴五種雜之其中一 種’用以執行研磨面1Gla之修賊s ’其巾修整面職之材f可為鑽石、 不錄鋼、齡金及鑄鐵之其中—種，關犯啦之風車狀敏時，可獲 得較佳之修整結果。 請參閱圖5，係闡示本發明自動化研磨方法之流程圖。首先，提供一研 磨裝置該研磨裝置除具備用以研磨玻璃基板之研磨盤外，亦具備一修整 盤。研磨盤於經過長時間之研磨運作之後，其研磨能力、平坦性以及均勾 13256〇2 性皆出現劣化之現象，因此係需要執行一修整處理以維持該研磨盤之加工 能力。是以將修整盤移置於研磨面上，並使修整面與研磨面相互接觸。 於步驟S501中，利用修整盤對研磨面執行第—修整動作，該第一修整 動作係為一旋轉之運作。 於步驟S502中，利用修整盤對研磨面執行第二修整動作，該第二修整 動作係為一同時包含旋轉及跨過研磨面中心擺動之運作，用以消除研磨面 因第一修整盤所產生細微之段差，以使得該研磨面達到一完整之平坦化。 結束該第二修整動作，並移去該修整盤，此時該研磨面係已被修整為 —平坦之表面，並恢復所具有之研磨能力、平坦性以及均勻性等特性。 根據本發明之自動修整方法，於第一修整動作結束之後，分別測量該 研磨面中心與邊緣之部分，測量出中心與邊緣之段差約為30μπι至40μπι之 間，於第二修整動作結束之後，再次測量該研磨面中心與邊緣之部分其 段差已縮減至10μιη内’是以利用該第一修整動作與該第二修整動作即可使 該研磨面達到-近乎完整之平坦化。根據上述之測量，發現若需將該段差 縮減為ΙΟμιη以内’則該第二修整動作之修整時間係需為該第一修整動作之 一倍為較佳。換言之’若需將該研磨面達到完整之平坦化，則該第一修整 動作與該第二修整動作所需之時間比大麟1:1〜1:3較佳，尤其是以i : 2 時為最佳。 藉由本發明之研磨裝置及其自動化研磨方法，當應用於大尺寸玻璃基板 研磨震置時’除了可有效縮減修整時卩01，提高製程效率外，更能進一步 改。研磨面之平坦度(耐随办）。並且，本發明所提供研磨裝置及其自動 1325602 化研磨方法之JL件對象並非限^於玻璃基板。凡舉需要改善研磨面之平坦 度(unifc_ty) ’紋研磨鱗之㈣研磨製程本㈣冑可適用。 综合以上所述’雖然本發明已較佳實施例揭露如上然其並非用以限定 本發明’任何熟習此徽藝者，在不脫離本發明之精神和範_，當可作 種更動”满飾’因此本發明之保護範圍當視後附之申請專利範圍所界定 者為準。 【圖式簡單說明】 圖1係闡示根據本發明實施例之自動化研磨之第一修整示意圖。 圖2係闡示根據本發明實施例之自動化研磨之第二修整示意圖。 圖3A係闡示根據本發明實施例之使用直#大於研磨面直徑之於之修整 盤時，該修整盤所造成的影響示意圖。 圖3B係闡示根據本發明實施例之使用直徑小於研磨面直徑之1/5之修整 • 盤時，該修整盤所造成的影響示意圖》 圖4A係闡示根據本發明實施例之修整面之刻紋係為無刻紋之光滑狀之示 意圖。 圖4B係闡示根據本發明實施例之修整面之刻紋係為網格狀之示意圖。 圖4C係闡示根據本發明實施例之修整面之刻紋係為放射狀之示意圖。 圖4D係闡示根據本發明實施例之修整面之刻紋係為甜甜圈狀之示意圖。 圖4E係闡不根據本發明實施例之修整面之刻紋係為風車狀之示意圖。 圖5係闡示本發明實施例之自動化研磨流程圖。 12 1325602 【主要元件符號說明】 ίο:特定區域 101 :研磨盤 101a:研磨面 102 :修整盤 102a:修整面 103 :研磨面中心 104、201 :箭頭 401 :厚度 S501、S502 :步驟1325602 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a method for grinding a wire and an automatic grinding method thereof, and more particularly, to a side-by-side type of a large-size liquid crystal display having a trimming plate (4) Research and its automated grinding methods. [Prior Art] In today's liquid crystal display industry, 'in response to the increase in the size of the display panel, the thin glass base is made to make it lighter. It uses a chemical mechanical polishing (CMP) device. The thickness of the glass substrate. The chemical mechanical polishing apparatus is configured to apply a grinding disc to the glass substrate to rotate the crucible (four) force, and (4) to achieve the thickness of the thinned glass substrate. After grinding the glass substrate for a certain period of time, the polished surface has little wear scarring due to grinding, and the surface is farther away from the center of the grinding surface, and is closer to the center of the grinding surface. The surface is more worn out so that the polished surface forms a bowl of curvature. At this time, if the polishing is not properly trimmed, the unevenness of the flatness of the surface of the polished glass substrate will be caused. • The chemical mechanical polishing device used in the grinding of wafers in the semiconductor industry is equipped with a wafer adsorption disk and a trimming ship. Therefore, for the purpose of _ wafer complete planarization, the radius of the abrasive surface must be larger than the diameter of the wafer adsorption disk. However, if the concept of a chemical mechanical polishing machine is used to polish a glass substrate of the liquid crystal display industry, since the size of the glass substrate is much larger than the size of the wafer, it is necessary to increase the area of the polishing disk, which will result in a grinding machine. The volume of the table is more multiplied. Nowadays, in the grinding device, the grinding surface of the grinding disc will form a bowl-shaped arc after a certain period of grinding process. However, the grinding device for polishing the substrate is not equipped with the 6 1325602 design of the conditioning disc. Therefore, it is necessary to trim the grinding. The grinding of the disc (4) is to manually disassemble the grinding disc, place the trimming disc on the grinding surface and then rotate the grinding joint to drive the trimming and tilting operation for the trimming process. The towel is flattened due to the area of the polished surface of the face. The new grinding surface is completely flattened, and it is repaired by the working method (4) to other unflattened areas, or manually (4) grinding the center of the surface, bypassing, moving the conditioning disc, and repeating the operation of the above rotation to flatten the entire surface. . However, it is more likely that the repairing process will not achieve the flatness (unif_ity) requirement of the surface. Therefore, the trimming process of the prior art can not shorten the dressing process time and improve the process efficiency, and may not be able to Achieve the complete flattening of the abrasive surface. In the above method, the trim disk does not have a specific fixed size. When the dressing disc used is larger than or equal to the spread surface, since the dressing_fine grinding surface area is large, that is, it has high dressing efficiency, but it is easy to grind too much thickness, resulting in unnecessary consumption of the grinding disc. However, as in the prior art, a trimming disc having a diameter smaller than the radius of the grinding surface is used, and since the trimming surface is in contact with a small area of the grinding surface, the thickness of the grinding treatment can be accurately controlled, but the finishing time is inevitably consumed. As described above, it is easy to cause a fine step difference in the polished surface. In summary, it can be seen that the grinding device of the large-size glass substrate can not increase the productivity and yield of the polishing process due to the modification time, the size of the conditioning disk and the dressing method. . Therefore, it is necessary to provide a polishing apparatus and a trimming method thereof. When applied to the polishing of a large-sized glass substrate, in addition to effectively reducing the dressing time and the process efficiency, the flatness of the polished surface can be further improved. 7 1325602 SUMMARY OF THE INVENTION The main object of the present invention is to provide a polishing apparatus comprising: a grinding disc, a trimming machine. & Another object of the present invention is to provide the above-mentioned automatic research and sealing method of the research and development of the county, which can effectively reduce the labor time and manpower required for repairing the polished surface. The cultivating system of the present invention comprises - grinding and repairing, the napkin has a grinding surface and the conditioning disc has a trimming surface, the diameter of which is between the diameters of the grinding surfaces λ/5 and 2/ 3 _ between 'and the operation of the present invention, the entire cross-machine grinding face towel ribs, trimming the polished surface 〇 the automatic grinding method of the present invention comprises a touch-on grinding device; using the conditioning disk to perform the first - a trimming action; performing a second trimming action on the polishing surface by using the trimming disk, wherein the second trimming action comprises swinging across the center of the polishing surface to achieve complete planarization of the polished surface. According to the polishing apparatus and the automated polishing method of the present invention, when applied to a polishing apparatus for a large-sized glass substrate, in addition to being effective in reducing the dressing time and improving the process efficiency, the flatness of the polished surface can be further improved. [Embodiment] Please refer to Fig. 1' for a first trimming diagram of automated polishing according to an embodiment of the present invention. As shown, the polishing apparatus of the present invention comprises an abrasive disk having a polishing surface, a conditioning disk having a trimming surface and in contact with the polishing surface. As described above, the grinding disc 101 is worn out due to grinding, which causes the grinding surface 1〇la to generate a slight unevenness. First of all, 'Repair 8 1325602, the whole plate 1〇2 is placed on the top of the Grinding® 1Gla, and the Piano® is placed on the polished surface 1Gla to flatten the special (4) domain 1G, and then the grinding is carried out by the rotation of the 1Q1 (10) The operation of the rotation causes the rotation direction of the conditioning disk 102 to be the same as the rotation direction of the grinding disk 101, i.e., as shown in the head 104, which is a counterclockwise direction of rotation. Since the first trimming operation is performed on the special surface K of the polishing surface leg, after the first trimming operation is completed, the non-specific region and the flattened surface of the polished surface 101a are not flattened. The specific area after treatment is compared to 'the two will have a difference in height, resulting in a fine section difference in the abrasive surface 1()la. In the first embodiment, although the operation of the rotation of the conditioning disk 1〇2 is performed by the grinding disk 101, the present invention is not related thereto. The operation of the repairing lG2 can also be - active, powered rotation 'and the direction of rotation is opposite to the direction of rotation of the grinding disc 1 〇 1 to shorten the dressing time. Referring to Figure 2, there is illustrated a second trimming illustration of automated grinding in accordance with an embodiment of the present invention. As shown in the figure, the conditioning disk 102 performs the operation of simultaneously performing a swing, that is, the swing shown by the arrow 2〇1, in addition to performing the same operation as the rotation of the first trimming step. Direction, the operation of the swing is along the grinding surface lGia - the new rail _ movement, the trajectory of the traverse across the surface of the polishing surface 101a towel c 1G3 ' cover the entire grinding surface 1Qla, the age of the grinding surface 101a due to the first trimming action A slight difference is produced to achieve complete planarization of the abrasive surface 1〇la. Please refer to FIG. 3A and FIG. 3B ′ for illustrating the effect of using the different sizes of the conditioning disk 102 according to the embodiment of the present invention. The polishing surface 1 ( ) shown in the figure is performed on the glass substrate. After the grinding-(d), the surface loss from the center of the grinding surface is less than the distance 9 1325602. The surface near the center of the grinding surface 101a is more worn, which causes the grinding surface 1〇la to form a bowl-shaped arc. Arrow 201 represents the direction of the wobble as shown in FIG. As shown in FIG. 3A, when the diameter of the conditioning disk 101 is larger than 2/3 of the diameter of the polishing surface 10a, the polishing surface 101a which is in contact with the trimming surface i〇2a has a large area, and although it has high dressing efficiency, it is easy. The excessive thickness 301 of the grinding disc 1〇1 causes unnecessary consumption of the grinding disc 1〇1. However, as in the conventional technique, when the diameter of the conditioning disk 102 is less than 1/5 of the diameter of the polishing surface i,ia, as shown in FIG. 38, since the area of the polishing surface 2〇la contacted by the conditioning surface 102a is small, It is more accurate to control the thickness 301' of the grinding process, but it inevitably consumes more dressing time and, as mentioned above, easily causes a k difference in the grinding surface. Therefore, if the diameter of the conditioning disk 1〇2 is set to be between the polishing surface 1〇1& the diameter between 1/5 and 2/3, especially preferably 1/4 of the diameter of the polishing surface l〇la, in addition to having the above The advantages of both, and can minimize the shortcomings of both. 4A to 4E are schematic views showing the embossing of the trimming surface j 〇 2a according to an embodiment of the present invention. Such as riding, engraving _ includes the no-load shape shown in Fig. 4A, the grid shape shown in Fig. 4C, the radial shape shown in Fig. 4C, the doughnut shape shown in Fig. 4D, and the windmill shape shown in Fig. 4E. . In the embodiment of the present invention, the towel (4) _ top-shaped one of the five kinds of miscellaneous 'used to perform the grinding surface 1Gla's thief s' its towel repairing face material f can be diamond, not recorded steel, age gold And the kind of cast iron, when the windmill is sensitive, you can get better finishing results. Referring to Figure 5, a flow chart of the automated polishing method of the present invention is illustrated. First, a grinding device is provided. The polishing device has a trimming disk in addition to the grinding disk for grinding the glass substrate. After the grinding disc has been subjected to a long-time grinding operation, the grinding ability, the flatness, and the uniformity of the 13256〇2 are deteriorated. Therefore, it is necessary to perform a trimming process to maintain the processing capability of the grinding disc. The dressing disc is placed on the grinding surface, and the trimming surface and the grinding surface are brought into contact with each other. In step S501, a first trimming operation is performed on the polishing surface by using the conditioning disc, and the first trimming operation is a rotation operation. In step S502, a second trimming operation is performed on the polishing surface by using the conditioning disc, and the second trimming operation is an operation including simultaneously rotating and swinging across the center of the grinding surface to eliminate the grinding surface due to the first conditioning disc. The subtle difference is such that the polished surface achieves a complete flattening. The second trimming operation is ended, and the conditioning disc is removed. At this time, the polishing surface has been trimmed to a flat surface, and the properties such as polishing ability, flatness, and uniformity are restored. According to the automatic dressing method of the present invention, after the end of the first trimming operation, the center and the edge of the grinding surface are respectively measured, and the difference between the center and the edge is measured to be between 30 μπι and 40 μπι, after the end of the second trimming operation, Re-measurement of the portion of the center and the edge of the abrasive surface whose step difference has been reduced to 10 μm is to use the first trimming action and the second trimming action to achieve a nearly complete flattening of the polished surface. According to the above measurement, it is found that if the step difference is reduced to within ΙΟμηη, then the dressing time of the second trimming action is preferably doubled for the first trimming action. In other words, if the polished surface is to be completely flattened, the time required for the first trimming action and the second trimming action is better than that of the big 1:1 to 1:3, especially when i: 2 For the best. According to the polishing apparatus and the automated polishing method of the present invention, when applied to a large-sized glass substrate, the polishing apparatus can be further modified in addition to the 卩01 which can effectively reduce the trimming process and improve the process efficiency. The flatness of the polished surface (resistance). Further, the JL member object of the polishing apparatus and the automatic 1325602 polishing method provided by the present invention is not limited to the glass substrate. It is necessary to improve the flatness of the polished surface (unifc_ty) ‘grain grinding scale (4) Grinding process (4) 胄 is applicable. In view of the above, the present invention has been described as a preferred embodiment of the present invention, and it is not intended to limit the invention to anyone skilled in the art, and without departing from the spirit and scope of the invention, Therefore, the scope of the present invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing a first trimming of automated grinding according to an embodiment of the present invention. A second trimming diagram of automated grinding according to an embodiment of the present invention. Fig. 3A is a schematic view showing the effect of the conditioning disc when the straight disc is larger than the diameter of the grinding surface according to an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4A is a schematic view showing the effect of the dressing surface according to an embodiment of the present invention when a dressing disc having a diameter smaller than 1/5 of the diameter of the grinding surface is used according to an embodiment of the present invention. Figure 4B is a schematic view showing the embossing of the trimming surface in the form of a grid according to an embodiment of the present invention. Figure 4C illustrates an embodiment of the present invention. Fig. 4D is a schematic view showing the embossing of the trimming surface in the form of a doughnut according to an embodiment of the present invention. Fig. 4E is a view showing a trimming surface not according to an embodiment of the present invention. Fig. 5 is a schematic diagram showing the automatic grinding of the embodiment of the present invention. 12 1325602 [Description of main component symbols] ίο: specific area 101: grinding disc 101a: grinding surface 102: conditioning disc 102a : Finishing surface 103: grinding surface center 104, 201: arrow 401: thickness S501, S502: step