200834694 九、發明說明： 【發明所屬之技術領域】 本發明係有關-種研磨裝置及其自動化研磨方法，更具體來說，係關 於一種應用於大尺寸液SS顯示面板之具有修整盤的研磨裝置及其自動化研 磨方法。 【先前技術】 於現今液晶顯示器產業中，為因應顯示面板尺寸增加，對薄化玻璃基 0 S ’使其輕量化的要I ’其係利用化學機械研mchemieal Meehanieal200834694 IX. Description of the Invention: [Technical Field] The present invention relates to a polishing apparatus and an automated polishing method thereof, and more particularly to a polishing apparatus having a conditioning disk applied to a large-size liquid SS display panel And its automated grinding method. [Prior Art] In the current liquid crystal display industry, in order to increase the size of the display panel, it is necessary to reduce the weight of the glass base 0 S ', and the system uses chemical mechanics to study mchemieal Meehanieal.
Polishing ·，CMP)裝置薄化玻璃基板之厚度。該化學機械研磨裝置係藉由一 研磨鑛玻璃基板施予-旋轉之作用力，從而達到薄化玻璃基板之厚度。 經過對玻璃基板進行研磨一定時間之後，該研磨面除了因研磨而產生些許 參症不齊之磨痕外，另因於距離研磨面中心較遠之表面耗損較少，距離研 磨面中心較近之表面耗損較多，以至於導致研磨面形成一碗型之弧度。此 時若無適當修整該研磨面，將造成研磨之玻璃基板表面平坦度的不均勻。 • 習知應用於研磨半導體產業之晶圓的化學機械研磨裝置，其所具備之 晶圓吸附盤和修整盤係為固定式。因此為了達到晶圓完整平坦化之目的， 其研磨面之半徑必需大於晶圓吸附盤之直徑。然而，若將化學機械研磨機 台之概念沿用於研磨液晶顯示器產業之玻璃基板時，由於玻璃基板之尺寸 甚大於該晶圓之尺寸’因此必需增大研磨盤之面積，此舉將導致研磨機台 之體積更呈倍數增大。 現今研磨裝置中研磨盤之研磨面經過一定時間之研磨製程後，均會形 成-碗型之弧度’然而，現今研磨玻璃基板之·裝置均無韻修整盤之 6 200834694 設計，因此欲修整該研雜之研磨辦，係先以人以式拆卸研磨盤，於 研磨面上放置-修整盤，接著再旋轉研錄以帶動修整織轉之運=以進 行修整處理。其巾，由於修錢健將於修整喊_之研磨㈣份區域 平坦化。為使研磨面完整平坦化，係再以人工方式移動修整盤至其^平 坦化之區域’或以人工方式沿研磨面中心、繞行，移動修整盤，並重複上述 旋轉之運作靖整個研磨面平坦化。但以人工方式移動該修整盤容易於研 磨面產生μ，常無法賴研絲之平域(unif_㈣要求，因此習知技 術之修整處理不但無法雜修整餘_，提高製程鱗外，更有可能無 法達到研磨面完整之平坦化之目的。 上述之方法中，修整盤並無一特定固定之尺寸。當所使用之修整盤大 於或等於面之半徑，由於健輯接觸之研磨涵積較大，即具有高 修整效率，但卻容糾磨過多之厚度，造成研磨盤無謂的消耗。而如 習知技術使用直徑小於該研磨醉徑許多之修整盤，由於修整面所接觸之 研磨面面積較少，雖較能精確控制研磨處理之厚度，但卻必然耗費較多 修整¥間及如荊述容易導致該研磨面產生細微之段差。 綜上所述，可知當今大尺寸_級之研錄置除了體積較-般研磨敦 置呈倍數增大外，亦娜贿間、修健尺相及修整方_影響，無法 提同該研磨製程之產能及良率。因此有必要提供—種研絲置及其修整方 法，使之當應用於大尺寸玻璃基板之研磨時，除了可有效縮減修整時間， 提高製程效率外，更能進一步改善研磨面之平坦度(unif〇nnity)。 7 200834694 【發明内容】 本發明之主要目的係提供-種研磨裝置，其包含一研磨盤與一修整 盤，該研磨裝置可利用該修整盤以自動化方式修整料磨面。 本發明之另-目的係提供上述研磨裝置之自動化研磨方法，可有效地 大幅縮減修整該研磨面所需耗費之作鱗間與人力的付出。 本發明之研鍊置係包含-研磨盤與—修難，其中該補盤係具有 一研磨面’且該修整盤具有-修整面，其直徑介於研磨面直徑之1/5與2/3 之間’且本發明該修缝跨過麵磨面中心擺動之運作，修整該研磨 面。 本發明之自動化研磨方法係包含提供_研棘置；糊雜整盤對該 研磨面#uf第-修鶴作；翻㈣修整盤_研磨面執行第二修整動 乍，、中該第一修整動作係包含跨過該研磨面中心之擺動，用以將該研磨 面達到完整之平坦化。 藉由本發明之研磨裝置及其自動化研磨方法，當顧於大尺寸玻璃基板 研磨裝置時’除了可有效縮減修整時間，提高製程效率外，更能進一步 改善研磨面之平坦度(uniformity)。 【實施方式】 請參閱圖1，係闡示根據本^^明實施例之自動化研磨之第一修整示意 圖。如圖所示，本發明之磨裝置包含一研磨盤，其具有一研磨面，一修 整盤’其具有一修整面，並與該研磨面相互接觸。如前所述，該研磨盤1〇1 因研磨產生耗損而導致研磨面1〇la產生些許參疵不齊之磨痕。首先，將修 200834694 整盤102移置研磨面 平碎化的^「+ 上方，並將修整面膨接觸至研磨面HMa之欲 十坦化的特疋區域1〇， 筏者糟由研磨盤1〇1之旋轉帶動修整盤1〇2 運作，使觸心術蝴嘯默術向_，即如轉同之 見頭104所不之均為逆時針之旋轉方向。由於第—修整動作係針對研磨面 舰之特定區域1G做平坦化處理，因此於第一修整動作結束後，將該研磨 面未、、i"平坦化處理之非特定區域與經平坦化處理後之特定區域1〇相 比幸乂，兩者將具有-高度之差異，導致於該研磨面丨仙產生細微之段差。 本實施例於第-修整中雖然該修整盤觀之旋轉之運作係藉由研磨盤 101之旋轉所帶動，但本發明並不限制於此。該修整盤1〇2之旋轉之運作亦 可為-主動、縣力之旋轉，域轉額與研雜1G1之旋轉方向相反，以 縮短修整時間。 明參閱圖2 ’係闡不根據本發明實施例之自動化研磨之第二修整示意 圖。如圖所元，修整盤102除持續對研磨s 101a執行相同於該第一修整步 驟之旋轉之運作外，亦同或於後執行一擺動之運作，即箭頭期所示之 擺動方向，其擺動之運作係沿研磨面10la之一直徑軌跡擺動，該擺動之軌 跡係跨過研磨面l〇la之中心103，以含蓋整個研磨面1〇la，以消除研磨面 101a因第一修整動作所產生細微之段差，從而達到研磨面1〇la完整之平坦 化。 請參閱圖3A與圖3B ’係闡示根據本發明實施例之使用不同尺寸之修整 盤102所造成的影響示意圖，圖中所示之研磨面i〇ia於經過對玻璃基板進 行研磨一定時間之後’因距離研磨面l〇la中心較遠之表面耗損較少，距離 200834694 研磨面101a中心較近之表面耗損較多’進而導致研磨面1〇la形成一碗型之 弧度。箭頭201係表示如同圖2所示之擺動方向。如圖3A所示，使用修整 盤101之直徑大於研磨面101a直徑之2/3時，由於修整面1〇2a所接觸之研 磨面101a面積較大，雖具有高修整效率，但卻容易研磨研磨盤1〇1過多之 厚度301，造成研磨盤1〇1無謂的消耗。而如一般習知技術，使用修整盤 102之直徑小於研磨面i〇ia直徑之1/5時，即如同圖3B所示，由於修整面 102a所接觸之研磨面2〇la之面積較少，因此較能精確地控制研磨處理之厚 _ 度301，但卻必然耗費較多修整時間及如前述容易導致於研磨面l〇la產生 段差。故如將修整盤1〇2之直徑大小介定於研磨面1〇la直徑1/5與2/3之 間，尤其較佳為研磨面l〇la直徑之1/4，除同時具有上述兩者之優點，並 可將兩者所具有之缺點降至最低。 請參閱圖4A至圖4E，係闡示根據本發明實施例之修整面i〇2a之刻紋 不意圖。如圖所示，該刻紋係包含圖4A所示之無刻紋之光滑狀、圖犯所 示之網格狀、圖4C所示之放射狀、圖4D所示甜甜圈狀以及圖4E所示之 風車狀。於本發明實施例中，係於修整面1〇2a上形成該五種刻紋之其中一 種，用以執行研磨面l〇la之修整處理，其中修整面1〇2a之材質可為鑽石、 不銹鋼、鋁合金及鑄鐵之其中一種。採用圖4E所示之風車狀刻紋時，可獲 得較佳之修整結果。 請參閱圖5，係闡示本發明自動化研磨方法之流程圖。首先，提供一研 磨裝置，該研磨裝置除具備用以研磨玻璃基板之研磨盤外，亦具備_佟整 盤。研磨盤於經過長時間之研磨運作之後，其研磨能力、平坦性以及均勻 200834694 性皆出現劣化之·，因此麵要執行-修整處職轉該研磨盤之加工 能力。是靖修缝移置於哺面上，錄健面與研磨面相互接觸。 於步驟S501中，利用修整盤對研磨面執行第—修整動作，該第一修整 動作係為一旋轉之運作。 於步驟S502中，利用修整盤對研磨面執行第二修整動作，該第二修整 動作係為-同時包含旋轉及跨過研磨面中心擺動之運作，用以消除研磨面 因第-修整細產生細微之段差，赌得該研絲達到—完整之平坦化。 結束該第二修鶴作，並移魏修整盤，鱗該研磨面係已被修整為 一平坦之表面，並恢復所具有之研磨能力、平坦性以及均勻性等特性。 根據本發明之自動修整方法，於第―修整動作結束之後，分別測量該 研磨面中心與邊緣之部分，測量出中心與邊緣之段差約為鄉瓜至如，之 1於第一修整動作結束之後，再次測量該研磨面中心與邊緣之部分，其 段差已縮減至l〇Mm内，是以利用該第一修整動作與該第二修整動作即可使 #研磨面翻—近乎完整之平坦化。根據上述之_，發現若需將該段差 縮減為10’以内，則該第二修整動作之修整時間係需為該第一修整動作之 為#又it。換^之，若需將該研磨面達到完整之平坦化，則該第一修整 動作與該第二修整動作所需之時間比大約為1:1〜1:3較佳，尤其是以i :2 時為最佳。 藉由本發明之研磨裝置及其自動化研磨方法，當應麟大尺寸玻璃基板 1裝置時，除了可有效縮減修整時間，提高製程效率外，更能進一步 文。研磨面之平坦度(uniformity)。並且，本發明所提供研磨裝置及其自動 11 200834694 化研磨方法之轉聽並雜紐玻喊板。凡舉f魏善研磨面之平坦 度(uniformity)，提高研磨效率之任意研磨製程，本發明皆可適用。 綜合以上所述，雖然本發明已較佳實施例揭露如上，然其並非用以限定 本發明，任何熟習此項技藝者，在不脫離本發明之精神和範圍内，當可作 各種更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定 者為準。 【圖式簡單說明】 圖1係闡示根據本發明實施例之自動化研磨之第一修整示意圖。 圖2係闡示根據本發明實施例之自動化研磨之第二修整示意圖。 圖3A係闡示根據本發明實施例之使用直徑大於研磨面直徑之2/3之修整 盤時’該修整盤所造成的影響示意圖。 圖3B係闡示根據本發明實施例之使用直徑小於研磨面直徑之仍之修整 盤時’該修整盤所造成的影響示意圖。 圖4A係闡示根據本發明實施例之修整面之刻紋係為無刻紋之光滑狀之示 意圖。 圖4B係闞示根據本發明實施例之修整面之刻紋係為網格狀之示意圖。 圖4C係闡示根據本發明實施例之修整面之刻紋係為放射狀之示意圖。 圖4D係闡示根據本發明實施例之修整面之刻紋係為甜甜圈狀之示意圖。 圖4E係闡示根據本發明實施例之修整面之刻紋係為風車狀之示意圖。 圖5係闡示本發明實施例之自動化研磨流程圖。 12 200834694 【主要元件符號說明】 10:特定區域 101 :研磨盤 101a:研磨面 102 :修整盤 102a:修整面 103 :研磨面中心 104、201 :箭頭 401 :厚度 S501、S502 :步驟The Polishing, CMP) device thins the thickness of the glass substrate. The chemical mechanical polishing apparatus achieves the thickness of the thinned glass substrate by applying a force of a grinding ore glass substrate to the rotation. After the glass substrate is polished for a certain period of time, the polished surface has a slight unevenness due to grinding, and the surface is farther away from the center of the polishing surface, and is closer to the center of the polishing surface. The surface is worn out so much that the abrasive surface forms a bowl of curvature. If the polished surface is not properly trimmed at this time, the flatness of the surface of the polished glass substrate will be uneven. • A chemical mechanical polishing device for polishing wafers in the semiconductor industry, which has a wafer adsorption disk and a conditioning disk that are stationary. Therefore, in order to achieve complete planarization of the wafer, the radius of the abrasive surface must be larger than the diameter of the wafer adsorption disk. However, if the concept of a chemical mechanical polishing machine is used to polish a glass substrate of the liquid crystal display industry, since the size of the glass substrate is much larger than the size of the wafer, it is necessary to increase the area of the polishing disk, which will result in a grinding machine. The volume of the table is more multiplied. Nowadays, in the grinding device, the grinding surface of the grinding disc will form a bowl-shaped arc after a certain period of grinding process. However, the device for grinding the glass substrate has no design of the 200834694, so it is necessary to trim the grinding. In the grinding department, the grinding disc is firstly disassembled by humans, and the disc is placed on the grinding surface, and then the disc is rotated to drive the trimming and weaving operation for the trimming process. Its towel, due to the repair of Qian Jian will be repaired and shouted _ the grinding (four) area flattened. In order to completely flatten the polished surface, the trimming disc is manually moved to the flattened area thereof or manually along the center of the grinding surface, the trimming disc is moved, and the above-mentioned rotating operation is repeated. flattened. However, manually moving the trimming disc is easy to produce μ on the grinding surface, and it is often impossible to rely on the flat field of the grinding wire (unif_(4) requirements. Therefore, the trimming process of the prior art can not only repair the whole _, but also improve the process scale, and it is more likely The purpose of achieving complete flattening of the abrasive surface. In the above method, the conditioning disc does not have a specific fixed size. When the conditioning disc used is greater than or equal to the radius of the surface, the grinding volume due to the contact of the touch is large, that is, It has high dressing efficiency, but it can correct too much thickness, which causes unnecessary consumption of the grinding disc. However, as the conventional technology uses a dressing disc having a diameter smaller than that of the grinding path, since the trimming surface is in contact with the grinding surface area, Although it is more accurate to control the thickness of the grinding process, it is inevitably costly to repair more and more. If it is easy to cause a slight difference in the grinding surface, it can be seen that the size of the large size _ class is removed. Compared with the general-scale grinding, the multiples are increased, and the impact of the grinding process, the repairing ruler and the trimming side cannot be added to the production capacity and yield of the grinding process. For the grinding of the large-size glass substrate, in addition to effectively reducing the dressing time and improving the process efficiency, the flatness of the polished surface can be further improved (unif〇nnity). 7 200834694 SUMMARY OF THE INVENTION The main object of the present invention is to provide a polishing apparatus comprising a grinding disc and a conditioning disc, which can be used to automatically trim the grinding surface by means of the conditioning disc. The object of the invention is to provide an automatic grinding method for the above-mentioned grinding device, which can effectively reduce the labor and labor required for trimming the grinding surface. The research chain of the present invention comprises - grinding disc and repairing, wherein The replenishing system has a grinding surface 'and the conditioning disc has a trimming surface having a diameter between 1/5 and 2/3 of the diameter of the grinding surface' and the operation of the slit of the invention across the center of the surface grinding surface , the grinding surface is trimmed. The automatic grinding method of the present invention comprises providing a grinding blade; the paste whole plate is on the grinding surface #uf first-repairing crane; the turning (four) conditioning disk is _ grinding surface performing the second finishing movement The first trimming action includes a swing across the center of the polishing surface to achieve complete planarization of the polished surface. With the polishing apparatus of the present invention and its automated grinding method, when grinding with a large-sized glass substrate In addition to the effective reduction of the dressing time and the improvement of the process efficiency, the device can further improve the flatness of the polished surface. [Embodiment] Please refer to FIG. 1 for illustrating the automatic polishing according to the embodiment of the present invention. The first trimming schematic diagram. As shown, the grinding apparatus of the present invention comprises a grinding disc having a grinding surface, a trimming disc having a trimming surface and contacting the grinding surface. As described above, The grinding disc 1〇1 causes a slight unevenness in the grinding surface 1〇la due to the wear and tear caused by the grinding. First, the repairing of the 200834694 disc 102 is performed by arranging the surface of the grinding surface to be shredded, and The trimming surface is in contact with the surface of the grinding surface HMa. The smashing area of the grinding surface is 1由, and the rotation of the grinding disc 1〇1 drives the conditioning disc 1〇2 to operate, so that the touch of the heart is stunned to _, ie If the same See head 104 is not the counterclockwise direction of rotation. Since the first trimming operation is to flatten the specific region 1G of the polished surface ship, after the first trimming operation is completed, the non-specific region of the polished surface is not flattened and i" The specific area is better than the two, and the two will have a difference in height, resulting in a subtle difference in the polished surface. In the first embodiment, although the operation of the rotation of the dressing disc is driven by the rotation of the grinding disc 101, the present invention is not limited thereto. The rotation of the trimming disc 1〇2 can also be an active/county force rotation, and the domain transfer amount is opposite to the rotation direction of the grind 1G1 to shorten the dressing time. Referring to Figure 2, there is shown a second trimming diagram of automated grinding that is not in accordance with an embodiment of the present invention. As shown in the figure, the conditioning disk 102 performs the same operation as the rotation of the first sizing step, and also performs a swing operation, that is, the swing direction indicated by the arrow period, which swings. The operation is oscillated along a diameter track of one of the polishing surfaces 10la, and the trajectory of the oscillating traverses the center 103 of the polishing surface 10a to cover the entire polishing surface 1〇la to eliminate the polishing surface 101a due to the first trimming action. A subtle difference is produced to achieve complete planarization of the abrasive surface 1〇la. Please refer to FIG. 3A and FIG. 3B ' for illustrating the effect of using the different sizes of the conditioning disk 102 according to an embodiment of the present invention. The polishing surface i〇ia shown in the figure is after grinding the glass substrate for a certain time. 'The surface that is farther away from the center of the grinding surface l〇la is less worn, and the surface closer to the center of the polished surface 101a of 200834694 is more worn out', which causes the polished surface 1〇la to form a bowl-shaped arc. Arrow 201 represents the direction of the wobble as shown in FIG. As shown in FIG. 3A, when the diameter of the conditioning disk 101 is larger than 2/3 of the diameter of the polishing surface 101a, the polishing surface 101a which is in contact with the finishing surface 1〇2a has a large area, and although it has high dressing efficiency, it is easy to be ground and polished. The excessive thickness 301 of the disk 1〇1 causes unnecessary consumption of the grinding disk 1〇1. As is conventional in the art, when the diameter of the conditioning disk 102 is less than 1/5 of the diameter of the polishing surface i,ia, as shown in FIG. 3B, since the area of the polishing surface 2〇la contacted by the conditioning surface 102a is small, Therefore, it is possible to more precisely control the thickness _ degree 301 of the grinding process, but it inevitably consumes more dressing time and, as mentioned above, easily causes a step difference in the grinding surface l〇la. Therefore, if the diameter of the conditioning disk 1〇2 is between 1/5 and 2/3 of the diameter of the polishing surface 1〇la, especially preferably 1/4 of the diameter of the polishing surface l〇la, except for the above two The advantages of the two, and can minimize the shortcomings of both. Referring to Figures 4A through 4E, the engraving of the trimming surface i〇2a according to an embodiment of the present invention is not illustrated. As shown in the figure, the embossing includes the unscorched smooth shape shown in Fig. 4A, the grid shape shown in Fig. 4C, the radial shape shown in Fig. 4C, the doughnut shape shown in Fig. 4D, and Fig. 4E. The windmill shown. In the embodiment of the present invention, one of the five kinds of engravings is formed on the trimming surface 1〇2a for performing the trimming process of the polishing surface l〇la, wherein the material of the trimming surface 1〇2a can be diamond or stainless steel. One of aluminum alloy and cast iron. A better dressing result can be obtained by using the windmill-like engraving shown in Fig. 4E. Referring to Figure 5, a flow chart of the automated polishing method of the present invention is illustrated. First, a grinding device is provided which, in addition to the grinding disc for grinding the glass substrate, also has a 佟 佟 whole. After a long period of grinding operation, the grinding disc has deteriorated its grinding ability, flatness and uniformity. Therefore, it is necessary to perform the processing work of the grinding disc. It is the Jing repair seam that is placed on the feeding surface, and the recording surface is in contact with the grinding surface. In step S501, a first trimming operation is performed on the polishing surface by using the conditioning disc, and the first trimming operation is a rotation operation. In step S502, a second trimming operation is performed on the polishing surface by using the conditioning disc, and the second trimming operation is performed to simultaneously include the rotation and the center swing of the grinding surface to eliminate the fineness of the polishing surface due to the first trimming. The difference is that the gambling has reached the level of completeness. The second repairing crane is finished, and the whole plate is removed, and the polished surface has been trimmed to a flat surface, and the properties such as grinding ability, flatness and uniformity are restored. According to the automatic dressing method of the present invention, after the end of the first trimming operation, the center and the edge of the grinding surface are respectively measured, and the difference between the center and the edge is measured to be about the difference of the country, after the end of the first trimming operation. The portion of the center and the edge of the abrasive surface is measured again, and the step difference has been reduced to 1 〇 Mm, so that the first polishing action and the second trimming action can be used to make the #marble surface turn almost completely flat. According to the above, it is found that if the step difference is reduced to be less than 10', the dressing time of the second trimming action needs to be #又it for the first trimming action. In other words, if the polishing surface needs to be completely flattened, the time ratio required for the first trimming action and the second trimming action is preferably about 1:1~1:3, especially i: 2 is the best. According to the polishing apparatus and the automated polishing method of the present invention, when the large-size glass substrate 1 device is used, it is possible to further reduce the dressing time and improve the process efficiency. The flatness of the abrasive surface. Moreover, the present invention provides a polishing apparatus and an automatic polishing method thereof. The present invention is applicable to any grinding process in which the uniformity of the surface of Weishan is improved and the polishing efficiency is improved. In view of the above, the preferred embodiments of the present invention are disclosed above, but are not intended to limit the present invention, and various modifications and refinements can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a first trimming of automated grinding according to an embodiment of the present invention. 2 is a schematic view showing a second trimming of automated grinding in accordance with an embodiment of the present invention. Fig. 3A is a view showing the effect of the conditioning disk when a dressing disk having a diameter larger than 2/3 of the diameter of the polishing surface is used according to an embodiment of the present invention. Fig. 3B is a view showing the effect of the conditioning disk when a conventional conditioning disk having a diameter smaller than the diameter of the polishing surface is used according to an embodiment of the present invention. Fig. 4A is a view showing the embossing of the trimming surface in accordance with an embodiment of the present invention in a smooth shape without a knurling. 4B is a schematic view showing the embossing of the trimming surface in a grid shape according to an embodiment of the present invention. 4C is a schematic view showing the embossing of the trimming surface in a radial shape according to an embodiment of the present invention. 4D is a schematic view showing the embossing of the trimming surface in the form of a doughnut according to an embodiment of the present invention. 4E is a schematic view showing the embossing of the trimming surface in the form of a windmill according to an embodiment of the present invention. Figure 5 is a flow chart showing the automated grinding of an embodiment of the present invention. 12 200834694 [Description of main component symbols] 10: Specific area 101: Abrasive disc 101a: Abrasive surface 102: Trimming disc 102a: Trimming surface 103: Center of grinding surface 104, 201: Arrow 401: Thickness S501, S502: Step