TWI320300B - Dissipating heat device of fin-type - Google Patents
Dissipating heat device of fin-type Download PDFInfo
- Publication number
- TWI320300B TWI320300B TW094140619A TW94140619A TWI320300B TW I320300 B TWI320300 B TW I320300B TW 094140619 A TW094140619 A TW 094140619A TW 94140619 A TW94140619 A TW 94140619A TW I320300 B TWI320300 B TW I320300B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat pipe
- hole
- fin
- ring
- Prior art date
Links
Classifications
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- H10W40/73—
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- H10W40/43—
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- H10W40/226—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
1320300 九、發明說明: 【發明所屬之技術領域】 本發明係關於-種散熱裝置,特別侧於散_片與人 構造。 【先前技術】 佩著電子資訊«之贿發展,GPU等電枝讀職力大大加 、 強,電子70件集成度越來越高,鮮愈來絲,使得其所産生之熱量 也隨之增多’如果熱量不及時散發出去,導致熱量累積使其溫度升高, 就會大大影響其運行之穩定性,因此,必須將cp(J産生之熱量及時散 發出去’業界通常在其表面加裝_散熱器辅助散熱。 ' 如第—至二圖所示’一觀有散熱裝置包括熱管21和複數散熱鰭 片10,散熱錯片1〇穿套於熱管21上,每一散熱藉片10向外突出設有 =緣12 ’當散熱則1G多片堆疊時,各環緣12即形成側壁密閉的 ^柱體13 ’熱官21焊合於該柱體13内,在散熱則1G與熱管21 焊合過程中,焊料如錫膏(圖未示)炫化後,其助焊劑中之松香(圖未示) …、、、從焊接Φ間排出,在部份焊接面上形成了只靠松香接觸之情況或 接觸面間有松香揮發後產生的氣泡,使得錫不能很好的在焊接面間 焊接之侧’焊合效紅孩直接導致產純能之*穩定。因此, 業界直希望解決焊料Ί7殘留物帶來的負面問題。 【發明内容】 有鑑於此’有必要提供-種散熱裝置,萌決焊料巾殘留物帶來 6 l3203〇〇 的負面問題。 該裝置包括至少—熱管及複數散熱鰭片,每一散熱鰭片設有熱管 孔並藉由熱管孔穿套於熱管上,熱管孔的周緣向散熱簿片一側延伸設 有環緣,環緣端部抵靠相鄰散熱鰭片,環緣上設有至少一通孔,該通 孔的邊緣與環緣端部間隔一段距離。 該散熱裝置中,因為在環緣上設有通孔,在焊合過程中,錫膏或
^條等後’其助焊射之㈣從通孔巾排丨,因此增強了 散熱鰭片與熱管之焊合效果,可有效提高散熱效率。 【實施方式】 下面參照附圖,結合實施例作進一步說明。 请參照第二圖,麵片式散熱器40包括-用於與中央處理器等發 熱電子7C件接觸之基座4卜熱管50和複數散麟片,熱管5〇與基 座41相接觸,散細片60穿套於熱管5〇上,該散熱器4〇可由基座 4卜及收發麵子元件產生之熱量而域管5()制散_片6q,進而 散發出去。 再請參照第四圖,係第三圖巾散熱㈣之局部放大示意圖。各散 _片60有-定的間隔並保持平行,每一散熱转片6〇上設有一環緣 63 ’環緣63端部65抵靠相鄰散熱鋒片6〇,即其中相鄰兩散熱鋒片昍 間之距綱料環㈣之高度,環緣63上財複數通孔62,並且通 孔62的邊緣與環緣63端部65間隔有—定距離^在本實補中通孔 62為與熱管50平行的狹槽62,當散熱韓片6〇多片堆叠時各環緣犯 7 1320300 對應堆叠即形成一中空的私辦^ ^ 的柱體64 ’熱官50焊接於該中空的柱體64内, 在政熱韓>{ 6G與熱官5()焊合過程中因為通孔⑽與柱體料的中空 相通’故錫膏或錫條等焊接劑(圖未示)中助焊劑中之松香 (圖未不) 受熱揮發從通孔62排出,使焊接而搜入亡v r ^ 便斗接面烊合充分,最終形成之成品性能穩 —、效率°㈤速有效地排出了錫膏或錫條料接劑的助焊劑中 的松香。 下面結合第五圖與第增介紹散熱H 4G的製作過程。 月〜、第五圖’將散熱韓片6◦先預沖熱管孔Η,並在散熱趙片 6〇接近齡孔61的位置軸複數分布均自的通孔62,此時通孔犯與 熱管孔61不連貫。 再請參照第六圖,沖壓散熱鰭片60接近熱管孔61的部位,形成 %緣63 ’通孔62均勻分布於環緣63上,並且通孔62的邊緣與環緣 63端部65間隔-段距離’將各散熱錯片6〇堆疊,結合熱管5〇即可形 成散熱器40。 综上所述,本發明符合發明專利之要件,爰依法提出專利申請。 准以上所述者僅為本發明之實施例之一,舉凡熟悉本案技藝之人士, 在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專 利範圍内。 【圖式簡單說明】 第一圖係現有技術争鰭片式散熱裝置中散熱器之示意圖。 第二圖係現有技術中鰭片式散熱裝置中散熱鰭片之示意圖。 8 1320300 第三圖係本發収散《置中散熱器之示意圖。 第四圖係第三圖中散熱器之局部放大示意圖。 第五圖係本發明鰭片式散熱裝置中散熱鰭片沖壓前之_立 乃、-I 高j 第六圖係本發明鰭片式散熱裝置中散熱鰭片沖壓後之示意圖 【主要元件符號說明】 散熱器 40 基座 41 _ 熱管 50 散熱讀片 60 熱管孔 61 通孔 62 環緣 63 柱體 64 65 端部
Claims (1)
1320300 十、申請專利範圍: 游》月η日修正 1. -種鰭片式散熱裝置,包括至少—熱管及複數散熱鰭片,每一散 熱韓片設有熱管孔並藉由熱管孔穿套於熱管上,熱管孔周緣向散 熱縛片-側延伸設有魏’環緣善齡_散_片,其特徵 在於:所述環緣找設有複數通孔,所述通孔均句分佈於環緣上, 該複數通孔的邊緣與所述環緣的端部間隔一段距離。
2. 如申凊專利範圍第j項所述之鰭片式散熱裝置,其特徵在於:所述 通孔為與熱管平行的狹槽。 β片式散熱裝4’包括至少-熱管及複數散熱鰭片,每一散熱 鰭片叹有熱管孔並藉由熱管孔f套於熱管上,熱管孔周緣向散熱 : 側延伸设有ί哀緣’環緣端部抵靠相鄰散熱鰭片,環緣對應 轉形成—中空的柱體,熱管焊合於該柱體内,其特徵在於:所 ^ 側壁環叹有複數與該柱體中空部連通的通孔,所述通孔均 jpg 、衣緣上,該複數通孔的邊緣與所述環緣的端部間隔一段 距離。 、Θ專利範圍第3項所述之鰭>;式散熱裝置,其特徵在於:所述 通孔為與熱管平行的狭槽。 10
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094140619A TWI320300B (en) | 2005-11-18 | 2005-11-18 | Dissipating heat device of fin-type |
| US11/308,385 US7254026B2 (en) | 2005-11-18 | 2006-03-20 | Heat dissipation device with heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094140619A TWI320300B (en) | 2005-11-18 | 2005-11-18 | Dissipating heat device of fin-type |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200721945A TW200721945A (en) | 2007-06-01 |
| TWI320300B true TWI320300B (en) | 2010-02-01 |
Family
ID=38053232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094140619A TWI320300B (en) | 2005-11-18 | 2005-11-18 | Dissipating heat device of fin-type |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7254026B2 (zh) |
| TW (1) | TWI320300B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102833979A (zh) * | 2011-06-17 | 2012-12-19 | 富瑞精密组件(昆山)有限公司 | 散热装置 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8496161B2 (en) * | 2005-04-11 | 2013-07-30 | Wen-Chih Liao | Device and method for brazing a heat pipe |
| US20100212868A1 (en) * | 2008-02-15 | 2010-08-26 | Yang Chien-Lung | Assembled configuration of cooling fins and heat pipes |
| US20090218073A1 (en) * | 2008-02-28 | 2009-09-03 | Asia Vital Components Co., Ltd. | Cooling fin |
| US8359745B2 (en) * | 2009-07-29 | 2013-01-29 | Cpumate Inc. | Method for manufacturing a heat sink |
| TWI431238B (zh) * | 2010-05-14 | 2014-03-21 | 奇鋐科技股份有限公司 | Fin structure and its heat sink |
| TWI443294B (zh) * | 2011-12-28 | 2014-07-01 | Ind Tech Res Inst | 取熱裝置 |
| KR20140094126A (ko) * | 2013-01-21 | 2014-07-30 | 엘지전자 주식회사 | 열교환기 및 그 제조방법 |
| US20160101490A1 (en) * | 2014-10-08 | 2016-04-14 | Mersen Canada Toronto Inc. | Methods of manufacturing a complex heat pipe and a heat transfer plate including an opening therefor |
| TWM500919U (zh) * | 2015-01-29 | 2015-05-11 | 訊凱國際股份有限公司 | 水冷散熱裝置及其水冷頭 |
| JP7170881B2 (ja) * | 2019-07-24 | 2022-11-14 | 三菱電機株式会社 | 熱交換器およびそれを用いた空気調和装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3693710A (en) * | 1970-04-20 | 1972-09-26 | Sidney S Drosnin | Radiator fin-tube construction and method |
| JPS5612760A (en) * | 1979-07-10 | 1981-02-07 | Nec Corp | Multi chip lsi package |
| US4563725A (en) * | 1983-01-06 | 1986-01-07 | Welwyn Electronics Limited | Electrical assembly |
| US4968962A (en) * | 1990-01-12 | 1990-11-06 | Therm-O-Disc, Incorporated | Thermal cutoff and resistor assembly |
| JPH0732133A (ja) * | 1993-07-20 | 1995-02-03 | Zexel Corp | 熱交換器用偏平チューブの製造方法 |
| AU5501896A (en) * | 1995-04-26 | 1996-11-18 | Helmut Lingemann Gmbh & Co | Flat tube with multiple cavities for heat exchangers and pro cess for manufacturing the same |
| JPH11309564A (ja) * | 1998-04-28 | 1999-11-09 | Denso Corp | 熱交換器 |
| US6435266B1 (en) * | 2001-05-01 | 2002-08-20 | Aavid Taiwan Inc. | Heat-pipe type radiator and method for producing the same |
| TWM241626U (en) * | 2003-09-30 | 2004-08-21 | Huei-Ran Wu | Improvement on heat-dissipating fin assembly comprising heat pipe coupled to heat-dissipating fin |
| US20050155750A1 (en) * | 2004-01-20 | 2005-07-21 | Mitchell Paul L. | Brazed plate fin heat exchanger |
| US20060104033A1 (en) * | 2004-11-12 | 2006-05-18 | Chih-Chiang Yeh | Connection structure of thermal tube and heat dissipation fins |
-
2005
- 2005-11-18 TW TW094140619A patent/TWI320300B/zh not_active IP Right Cessation
-
2006
- 2006-03-20 US US11/308,385 patent/US7254026B2/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102833979A (zh) * | 2011-06-17 | 2012-12-19 | 富瑞精密组件(昆山)有限公司 | 散热装置 |
| TWI507655B (zh) * | 2011-06-17 | 2015-11-11 | 鴻準精密工業股份有限公司 | 散熱裝置 |
| CN102833979B (zh) * | 2011-06-17 | 2016-08-03 | 富瑞精密组件(昆山)有限公司 | 散热装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070115637A1 (en) | 2007-05-24 |
| US7254026B2 (en) | 2007-08-07 |
| TW200721945A (en) | 2007-06-01 |
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| Date | Code | Title | Description |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |