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TWM384340U - Improved structure for heat dissipation fins - Google Patents

Improved structure for heat dissipation fins Download PDF

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Publication number
TWM384340U
TWM384340U TW98222972U TW98222972U TWM384340U TW M384340 U TWM384340 U TW M384340U TW 98222972 U TW98222972 U TW 98222972U TW 98222972 U TW98222972 U TW 98222972U TW M384340 U TWM384340 U TW M384340U
Authority
TW
Taiwan
Prior art keywords
heat
fin
recess
improved structure
dissipating
Prior art date
Application number
TW98222972U
Other languages
Chinese (zh)
Inventor
zhi-ren Qin
Original Assignee
Prolimatech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Prolimatech Co Ltd filed Critical Prolimatech Co Ltd
Priority to TW98222972U priority Critical patent/TWM384340U/en
Publication of TWM384340U publication Critical patent/TWM384340U/en

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M384340 五、新型說明: 【新型所屬之技術領域】 本創作係有關於散熱鰭片,尤指一種提供散熱鰭片可 緊在'與熱管接觸’以提高熱管傳熱效率之散熱鰭片改良結 構。 【先前技術】 近年來’為因應大量資訊處理之需求,電腦内部所設 φ 中央處理單元的發展係朝向如何提高演算能力為主要訴 求’而高效能所伴隨而來的問題是其發熱量亦大幅增加, 過咼的溫度將造成電子裝置運作效能降低,故於中央處理 單元上常設置有散熱裝置,散熱裝置係與中央處理單元接 觸,使中央處理單元所產生的熱量可傳導至散熱裝置並予 以排除,如此以確保中央處理單元不會過熱而能正常運 作。M384340 V. New Description: [New Technology Area] This creation is about heat sink fins, especially a heat sink fin improved structure that provides heat sink fins that can be in contact with the heat pipe to improve heat transfer efficiency. [Prior Art] In recent years, in response to the demand for a large amount of information processing, the development of the φ central processing unit set up inside the computer is mainly related to how to improve the calculation ability. The problem with high efficiency is that the heat is also greatly increased. If the temperature of the electronic device is reduced, the heat dissipation device is often disposed on the central processing unit. The heat dissipation device is in contact with the central processing unit, so that the heat generated by the central processing unit can be transmitted to the heat dissipation device and Exclude, so as to ensure that the central processing unit does not overheat and function properly.

-月參閱第七圖所不,現有技術之散熱裝置,其具有複 數依序層疊的政熱鰭片(40),各散熱鰭片㈣)係貫穿設有 複數個穿孔(41),於各散熱鰭片(4〇)表面且位於肖穿孔⑷) =突::成有一環側壁(42),—散熱鰭片(4〇)之環側 之m 一散熱·韓片(4〇)底面,使各散熱鰭片(4〇) 的距離以形成散熱通道,熱管(50) 貝穿-置於對應的穿孔⑷)中,且熱管(5〇)管 ==互接觸,進而使熱管(5。)吸收的熱能可: 政一片(’,並由散熱韓片(4〇)將熱量排除。 然而,上述之散熱裝置於製程時存在有以下的缺,占. 3 M384340 製程步驟係先將若干散熱鰭片(40)依序疊置,再以熱管⑺ 貫穿於穿孔(41)中,由於熱管(5〇)係以緊迫方式依序貫穿 層疊的散熱鰭片(40),造成熱管(5〇)管壁容易產生磨損而 無法與散熱鰭片(40)之環側壁(42)確實貼合導致熱管(5〇) :吸收到的熱量無法傳遞至散熱鰭片(4〇),散熱效果不佳, 實有待加以改良。 【新型内容】- Referring to the seventh figure, the heat dissipation device of the prior art has a plurality of political fins (40) stacked in sequence, and each of the heat dissipation fins (4) is provided with a plurality of perforations (41) for heat dissipation. The surface of the fin (4 〇) is located in the louver (4)) = protrusion: a ring side wall (42), the ring side of the heat sink fin (4 〇), a heat sink, and the bottom surface of the Korean film (4 〇). The distance between each fin (4〇) is to form a heat dissipation channel, the heat pipe (50) is placed in the corresponding perforation (4), and the heat pipe (5〇) tube == mutual contact, thereby making the heat pipe (5.) The absorbed heat energy can be: a piece of government (', and the heat is removed by the heat sink (4〇). However, the above heat sink has the following defects during the process. 3 M384340 process steps are first to fix some heat sink fins The sheets (40) are sequentially stacked, and then the heat pipes (7) are inserted through the through holes (41). Since the heat pipes (5〇) sequentially pass through the stacked heat dissipation fins (40) in a pressing manner, the heat pipes (5〇) tubes are formed. The wall is prone to wear and cannot be properly bonded to the side wall (42) of the heat sink fin (40), causing the heat pipe (5〇): the absorbed heat cannot be transferred to the heat sink fin (4〇) The heat dissipation effect is not good, and it needs to be improved. [New content]

有鏗於前述現有技術之缺點,本創作之創作目的係在 於提供-種散熱縛片改良結構,#由依序層疊的散熱韓片 可緊貼於熱管管壁’藉以提升散熱效率。 良結構,其係具有一片體,該片 ’,、、'^改 側逯内凹設有至少一 凹部’於該片體表面且位於該凹部周 I同,,彖處大伸形成有—側 0 '、中S亥另片體該側邊進一 其中該翼片上貫穿設有一 之定位孔處係貫穿設有一 其中該凹部與該翼片係呈 其中該凹部形成有兩個。 其中該翼片$成有三個 其中該凹部呈半圓弧形。 所述之散熱鰭片改良結構, 步延伸形成有至少一翼片。 所述之散熱鰭片改良結構, 定位孔,於片體上且相對於翼片 定位孔。 所述之散熱鰭片改良結構, 間隔且對稱形成於片體的側邊。 所述之散熱鰭片改良結構, 所述之散熱鰭片改良結構 母一個凹部位在兩個翼片之間。 所述之散熱鰭片改良結構, 4 M384340 本創作所提供之散埶缺κ 狀.、、、-片改良結構, 及功效增進至少包括:相較 獲侍的優.玷 係貫穿散熱鶴片之片體表 # —曰片之穿孔 u ^ U ^ ^ ^ 本創作係改良穿孔為散熱鰭 片之片體側邊的凹部,於散埶获w Μ制 u M m u ^ …、裝置的製程時,係依序將 散熱鰭片以其側壁緊貼於熱管管 ^ il . ^ ^ z* - * 由於不會造成熱管的 文扣’使熱管確實傳熱至散哉 欺熱鰭片,而達到良好之散熱效 果。 【實施方式】 請參閱第一圖所示,本創作 4 A作之散熱鰭片改良結構,其 係具有一片體(10),該片體(10)於其中-侧邊内凹設有至 少-凹部⑴),該凹部⑴)係呈弧形,於該片體(1Q)表面且 位於該凹部(11)周緣處向上突伸形成有一呈弧形的側壁 (111),另片體(10)該側邊上進—步朝向外部突出延伸形成 有至少一翼片(12) ’該翼片(12)上貫穿設有一定位孔 (121),於片體(10)上且相對於翼片(12)之定位孔處係 貫穿設有一定位孔(1 3),於圖中具體實施例所示,該凹部(1 j) 與該翼片(12)係呈間隔且對稱形成於片體(1〇)的側邊,該 凹部(1 1)呈半圓弧形並間隔形成有兩個,該翼片(1 2)係間 隔形成有三個,每一個凹部(11)位在兩個翼片(彳2)之間。 請參閱第二及三圖所示,各散熱鰭片於相互疊置組成 散熱裝置,係將各散熱鰭片以其設有凹部與翼片(12) 的一側邊相對並重疊設置,使一散熱鰭片上的側壁(111)與 另一散熱鰭片上的側壁(111A)相向接觸以形成有一容置空 間(14)(如第三圖所示),且以一片體(Ί〇)之翼片(12)之定位 孔(1 21)係對應於另一片體(1 〇A)之定位孔(1 3A)。 5 M384340 請配合參閱第四圖所示,本創作於實際進行組設時, 係將各散熱缝片依序以其側壁(111)緊密接觸於熱管(2〇)管 壁’ 一散熱,鰭片之片體(1〇)的側壁⑴1)頂面可抵頂於間隔 設置的另一散熱鰭片的底面 片(12)可貼合於相對設置的 ’該散熱鰭片之片體(10)的翼 另—散熱鰭片之片體(10A)頂In contrast to the shortcomings of the prior art described above, the purpose of the creation of the present invention is to provide an improved structure for the heat-dissipating tabs, and the heat-dissipating Korean sheets stacked in sequence can be closely attached to the heat pipe wall to improve heat dissipation efficiency. a good structure, which has a body, the piece ',, '^ is modified to be provided with at least one recessed portion on the surface of the sheet body and located at the same circumference of the concave portion, and the side portion of the concave portion is formed to have a side 0', the middle S is another piece of the side of the sheet into which a positioning hole is formed through the flap, and the recess is formed with the recessed portion in which the recess is formed. Wherein the fins are formed into three, wherein the recess has a semicircular arc shape. The heat dissipating fin has an improved structure, and the step extends to form at least one fin. The heat dissipating fin has an improved structure, and the positioning hole is located on the sheet body and is positioned relative to the fin. The heat dissipating fin improved structure is formed at intervals on the sides of the sheet body. The heat dissipating fin improving structure, wherein the heat dissipating fin improving structure has a concave portion between the two fins. The improved structure of the fins, 4 M384340 provided by the creation of the κ 埶 . 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Sheet body #—Perforation of the cymbal sheet u ^ U ^ ^ ^ This creation is to improve the perforation as the concave side of the side of the sheet of the fin, when the 的 埶 u u u mu ^ ..., the process of the device, The heat-dissipating fins are closely attached to the heat pipe tube by the side wall thereof. ^ ^ z* - * Since the heat pipe is not caused by the buckle of the heat pipe, the heat pipe is surely transferred to the heat-dissipating fin, and the good is achieved. heat radiation. [Embodiment] Referring to the first figure, the improved heat sink fin structure of the present invention has a body (10), and the body (10) is recessed at least in the side-side thereof. a concave portion (1)) having an arc shape, and a curved side wall (111) is formed on the surface of the sheet body (1Q) and located at a periphery of the concave portion (11), and the other body (10) The side advance step is formed by extending at least one fin (12) toward the outer portion. The locating piece (12) is provided with a positioning hole (121) on the sheet body (10) and opposite to the flap (12). a positioning hole (13) is formed through the positioning hole, and the concave portion (1j) is spaced apart from the fin (12) and symmetrically formed on the sheet body (1〇) as shown in the specific embodiment of the drawing. The side of the recess, the recess (1 1) has a semicircular arc shape and is formed with two spacers. The fins (12) are formed by three partitions, and each recess (11) is located on two fins (彳2). )between. Referring to the second and third figures, each of the heat dissipating fins is stacked on top of each other to form a heat dissipating device, and the heat dissipating fins are disposed opposite to each other with the concave portion and the side of the fin (12), so that one The sidewall (111) on the heat dissipation fin is in contact with the sidewall (111A) on the other heat dissipation fin to form an accommodation space (14) (as shown in the third figure), and is a piece of the body (Ί〇) The positioning hole (1 21) of (12) corresponds to the positioning hole (1 3A) of the other sheet (1 〇 A). 5 M384340 Please refer to the fourth figure. In the actual assembly, the heat dissipation slits are in close contact with the heat pipe (2〇) wall by a side wall (111). The side wall (1) 1) of the sheet body (1) can be attached to the oppositely disposed sheet (10) of the heat dissipating fin (10). Wing another - heat sink fin piece (10A) top

面,使熱管(20)位於容置空間(14)中,且間隔設置的各散 熱籍片的片體(1〇,1〇A)之間形成有適當距離的散熱通道 (15) ’請配合參閱第五圖所示’以合金絲(3〇)貫穿設置於 對應的翼片(12)之定位孔(121)與片體(1〇A)之定位孔(13A) 中,使各散熱鰭片得以定位,並完成如第六圖所示的散熱 裝置,各散熱韓片之間亦可於一片體(1〇)的側壁(111)頂面 與間隔設置的另一散熱鰭片的底面以及一片體(1〇)的翼片 (12)與另一相對設置的片體(10A)頂面等相互接觸的面上以 焊接方式相互連結定位,藉由側壁(1彳彳)可確實貼合於熱管 (20),使熱管(20)吸收到的熱能得以順利傳導至各散熱鰭 片並予以排除,另可於熱管(20)管壁與側壁(111)之間塗佈 有錫膏(solder),錫膏具導熱與黏著的效果,提供散熱鰭 片之側壁(1 1 1)與熱管(20)之間相互黏固,以及熱管(2〇)確 貫傳熱於散熱鰭片上,進一步獲得有更佳的散熱效果。 【圖式簡單說明】 第一圖係本創作之立體外觀圖。 第二圖係本創作之組設示意圖。 第三圖係本創作之上視圖。 第四圖係本創作第三圖之A-A剖面圖。 第五圖係本創作第三圖之B_B剖面圖。 6 M384340 第六圖係本創作之組設狀態圖。 第七圖係現有技術之散熱裝置立體外觀圖。 【主要元件符號說明】 (1〇,1〇A)片體 (1 1)凹部 (1 11,1 11 A)側壁 (12)翼片 (121)定位孔 (13,13A)定位孔 (14)容置空間 (15)散熱通道 (20)熱管 (30)合金絲 (40)散熱鰭片 (41)穿孔 (42)環側壁 (50)熱管The heat pipe (20) is located in the accommodating space (14), and a heat dissipation channel (15) formed at an appropriate distance between the sheets (1〇, 1〇A) of the heat-dissipating sheets disposed at intervals is selected. Referring to the fifth figure, the alloy wire (3〇) is inserted through the positioning hole (121) of the corresponding fin (12) and the positioning hole (13A) of the sheet (1〇A) to make each heat sink fin. The film is positioned and completed as shown in FIG. 6, and each of the heat sinks may be on the top surface of the side wall (111) of one body (one side) and the bottom surface of another heat sink fin disposed at intervals The surface of the one piece (1) of the flap (12) and the top surface of the oppositely disposed sheet body (10A) are connected to each other by welding, and the side wall (1彳彳) can be surely fitted. In the heat pipe (20), the heat energy absorbed by the heat pipe (20) is smoothly transmitted to the heat dissipating fins and removed, and a solder paste (solder) is coated between the pipe wall and the side wall (111) of the heat pipe (20). ), the solder paste has the effect of heat conduction and adhesion, providing the sidewalls of the heat dissipation fins (1 1 1) and the heat pipes (20) to be adhered to each other, and the heat pipes (2〇) Consistent heat transfer to the cooling fins, there is further obtained a better cooling effect. [Simple description of the diagram] The first picture is a three-dimensional appearance of the creation. The second picture is a schematic diagram of the composition of the creation. The third picture is a top view of the creation. The fourth picture is a cross-sectional view of the A-A of the third figure of this creation. The fifth picture is a B_B cross-sectional view of the third figure of this creation. 6 M384340 The sixth picture is a set state diagram of this creation. The seventh figure is a stereoscopic appearance of the prior art heat sink. [Description of main component symbols] (1〇, 1〇A) Sheet (1 1) Recess (11,1 11 A) Side wall (12) Flap (121) Positioning hole (13, 13A) Positioning hole (14) Included space (15) heat dissipation channel (20) heat pipe (30) alloy wire (40) heat sink fin (41) perforation (42) ring side wall (50) heat pipe

Claims (1)

M384340 六、申請專利範圍: 1 · 一種散熱鰭片改 .^ 又良結構,其係具有一片體,該片體 一側邊内凹設有至少— 體 ^. 凹部,於該片體表面且位於該凹部 周緣處犬·伸形成有一側壁。 2.如申請專利範圍帛1項所述之散熱縛片改良結構, 其中該另片體該側邊進一步延伸形成有至少一翼片。 月專利乾圍帛2項户斤述之散熱籍片改良結 其中該翼片上貫穿設右 ’ °~定位孔,於片體上且相對於翼片 之定位孔處係貫穿設有… 、 ^ 疋位孔。 4.如申請專利範圍 岡弟1項所述之散熱鰭片改良結構, 其中該凹部係呈對稱 ^成於片體的側邊。 5 如申請專利範圍 ..^ 间第2項所述之散熱鰭片改良結構, 其中该凹部與該翼片 诉呈間隔且對稱形成於片體的側邊。 6_如申請專利範圍 .^ 吗第3項所述之散熱鰭片改良結構, 其中該凹部與該翼片 71 %里間隔且對稱形成於片體的側邊。 u ·如申請專利範圍第6項任一項所述之散熱鰭片 改良結構’其中該凹邹形成有兩個。 月專利範圍第2、3、5或6項所述之散熱趙片 改良結構,立中習μ ^異片形成有三個,每一個凹部位在兩個 翼片之間。 9·如申請專利範圍第1至6項任一項所述之散熱鰭片 改良結構’其中該凹部呈半圓弧形。 申月專利範圍第7項所述之散熱鰭片改良結構, 其中該凹部呈半圓弧形。 申吻專利軏圍第8項所述之散熱鰭片改良結構, 8 M384340 其中該凹部呈半圓弧形。 七、圖式:(如次頁)M384340 VI. Patent application scope: 1 · A heat-dissipating fin modification. ^ A good structure, which has a body, and a concave portion is provided on one side of the body, and is located on the surface of the body. A dog is formed at the periphery of the recess to form a side wall. 2. The improved heat dissipation tab structure of claim 1, wherein the side further extends to form at least one fin. The monthly patented dry cofferdam 2 pieces of households described the heat-dissipation film improvement knot. The wing piece is provided with a right '°~ positioning hole, which is arranged on the piece body and is located with respect to the positioning hole of the wing piece... , ^ 疋Bit hole. 4. The patent application scope of the heat sink fin improvement structure described in the above, wherein the recess is symmetrically formed on the side of the sheet. 5 The heat sink fin improving structure according to the second aspect of the invention, wherein the recess is spaced apart from the fin and symmetrically formed on a side of the sheet. The heat-dissipating fin-modified structure according to Item 3, wherein the recess and the fin are spaced apart from each other and symmetrically formed on the side of the sheet. u. The heat-dissipating fin improved structure according to any one of claims 6 to 6, wherein the concave shape is formed by two. The improved structure of the heat-dissipating film described in item 2, 3, 5 or 6 of the patent scope of the patent is formed in three stages, each of which is between two fins. The heat-dissipating fin improved structure according to any one of claims 1 to 6, wherein the recess has a semicircular arc shape. The heat-fixing fin improved structure according to Item 7 of the patent application of the present invention, wherein the concave portion has a semi-circular arc shape. The heat-fixing fin improved structure described in Item 8 of the patent application, 8 M384340, wherein the recess has a semi-circular shape. Seven, the pattern: (such as the next page)
TW98222972U 2009-12-09 2009-12-09 Improved structure for heat dissipation fins TWM384340U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103135720A (en) * 2011-12-05 2013-06-05 技嘉科技股份有限公司 radiating fin, radiator and manufacturing method of radiating fin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103135720A (en) * 2011-12-05 2013-06-05 技嘉科技股份有限公司 radiating fin, radiator and manufacturing method of radiating fin
TWI449497B (en) * 2011-12-05 2014-08-11 Giga Byte Tech Co Ltd Method of manufacturing fin
CN103135720B (en) * 2011-12-05 2018-07-20 技嘉科技股份有限公司 Radiating fin, radiator and manufacturing method of radiating fin

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