[go: up one dir, main page]

TWI319221B - Substrate alignment apparatus and method for aligning substrate using the same - Google Patents

Substrate alignment apparatus and method for aligning substrate using the same

Info

Publication number
TWI319221B
TWI319221B TW095137619A TW95137619A TWI319221B TW I319221 B TWI319221 B TW I319221B TW 095137619 A TW095137619 A TW 095137619A TW 95137619 A TW95137619 A TW 95137619A TW I319221 B TWI319221 B TW I319221B
Authority
TW
Taiwan
Prior art keywords
substrate
same
alignment apparatus
aligning
substrate alignment
Prior art date
Application number
TW095137619A
Other languages
English (en)
Other versions
TW200802755A (en
Inventor
Dae-Soo Lee
Chae-Woong Kim
Kyoung-Ook Lee
Sim-Man Yuk
Jin-Hyeong Kim
Original Assignee
Doosan Mecatec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Mecatec Co Ltd filed Critical Doosan Mecatec Co Ltd
Publication of TW200802755A publication Critical patent/TW200802755A/zh
Application granted granted Critical
Publication of TWI319221B publication Critical patent/TWI319221B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/191Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
    • H10P72/57

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW095137619A 2006-06-16 2006-10-13 Substrate alignment apparatus and method for aligning substrate using the same TWI319221B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060054396A KR100712953B1 (ko) 2006-06-16 2006-06-16 기판 얼라인장치 및 이를 이용한 기판얼라인방법

Publications (2)

Publication Number Publication Date
TW200802755A TW200802755A (en) 2008-01-01
TWI319221B true TWI319221B (en) 2010-01-01

Family

ID=38269293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137619A TWI319221B (en) 2006-06-16 2006-10-13 Substrate alignment apparatus and method for aligning substrate using the same

Country Status (4)

Country Link
KR (1) KR100712953B1 (zh)
CN (1) CN101461284A (zh)
TW (1) TWI319221B (zh)
WO (1) WO2007145402A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581057B (zh) * 2012-05-31 2017-05-01 三星顯示器有限公司 遮罩拉緊裝置、遮罩薄片、以及包含其之遮罩製造系統

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5297046B2 (ja) * 2008-01-16 2013-09-25 キヤノントッキ株式会社 成膜装置
TWI423187B (zh) * 2009-09-30 2014-01-11 Innolux Corp 自發光平面顯示器及用於組裝該自發光平面顯示器之對位系統
US9325007B2 (en) * 2009-10-27 2016-04-26 Applied Materials, Inc. Shadow mask alignment and management system
KR101203171B1 (ko) 2012-05-22 2012-11-21 주식회사 아이.엠.텍 글래스 기판 합착을 위한 얼라인 장치
KR101289050B1 (ko) * 2012-10-23 2013-07-22 유진디스컴 주식회사 진공챔버 정렬 장치
KR101310336B1 (ko) 2013-03-28 2013-09-23 주식회사 아이.엠.텍 대면적 글라스의 얼라인 구동장치
KR102141855B1 (ko) * 2014-03-31 2020-08-07 주식회사 선익시스템 마스크 얼라인 장치
TWM526177U (zh) * 2014-11-03 2016-07-21 應用材料股份有限公司 視覺化系統及具有其之製程腔室
KR101599205B1 (ko) * 2015-01-30 2016-03-03 주식회사 테스 트레이 어셈블리 및 이를 구비한 박막증착장치
KR101629462B1 (ko) * 2015-02-17 2016-06-13 주식회사 에스에프에이 기판 정렬 장치 및 기판 정렬 방법
KR101979149B1 (ko) * 2018-04-27 2019-05-15 캐논 톡키 가부시키가이샤 얼라인먼트 방법, 이를 사용한 증착방법 및 전자디바이스 제조방법
KR102591646B1 (ko) * 2018-06-29 2023-10-20 삼성디스플레이 주식회사 증착 장치 및 증착 장치의 마그넷 플레이트 얼라인 방법
CN112771688A (zh) * 2018-10-30 2021-05-07 应用材料公司 基板处理装置
CN112117230B (zh) * 2020-10-19 2025-01-24 北京航空航天大学杭州创新研究院 高密度图案化加工的衬底-掩模板原位保持装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100422487B1 (ko) * 2001-12-10 2004-03-11 에이엔 에스 주식회사 전자석을 이용한 유기전계발광소자 제작용 증착장치 및그를 이용한 증착방법
KR100647577B1 (ko) * 2002-06-12 2006-11-17 삼성에스디아이 주식회사 기판정렬장치 및 기판정렬방법
JP4184771B2 (ja) * 2002-11-27 2008-11-19 株式会社アルバック アライメント装置、成膜装置
JP2004183044A (ja) * 2002-12-03 2004-07-02 Seiko Epson Corp マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器
KR20040083653A (ko) * 2003-03-24 2004-10-06 (주)네스디스플레이 기판 홀더 및 이를 적용한 기판 클립핑장치
KR20050022749A (ko) * 2003-08-29 2005-03-08 이충화 기판과 마스크를 밀착시키는 방법과 장치 그리고 이를이용한 스퍼터링 방법 및 장치
KR100863902B1 (ko) * 2003-12-02 2008-10-16 삼성에스디아이 주식회사 마스크 프레임 조합체, 이를 이용한 기판 및 마스크 정렬방법
JP4596794B2 (ja) * 2004-02-27 2010-12-15 日立造船株式会社 真空蒸着用アライメント装置
KR100672971B1 (ko) 2004-12-28 2007-01-22 두산디앤디 주식회사 기판얼라인장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581057B (zh) * 2012-05-31 2017-05-01 三星顯示器有限公司 遮罩拉緊裝置、遮罩薄片、以及包含其之遮罩製造系統

Also Published As

Publication number Publication date
KR100712953B1 (ko) 2007-05-02
CN101461284A (zh) 2009-06-17
TW200802755A (en) 2008-01-01
WO2007145402A1 (en) 2007-12-21

Similar Documents

Publication Publication Date Title
SG123786A1 (en) Apparatus and method for aligning devices on carriers
TWI317807B (en) Positioning apparatus and method
TWI370508B (en) Substrate processing apparatus and substrate processing method
TWI347650B (en) Substrate processing apparatus and substrate transferring method
GB2462734B (en) Substrate inspection apparatus
GB2435942B (en) Auto-focusing method and auto-focusing apparatus using the same
TWI370510B (en) Substrate processing apparatus
TWI367538B (en) Substrate processing apparatus and substrate processing method
TWI340997B (en) Substrate treatment apparatus and substrate treatment method
TWI348189B (en) Substrate treatment apparatus and substrate treatment method
TWI340411B (en) Substrate processing apparatus
IL197590A0 (en) Method and apparatus for mutual authentication
GB2453892B (en) Method and apparatus for clamping a substrate
EP2069589A4 (en) DEVICE AND METHOD FOR STRUCTURAL SURFACE MEASUREMENT AND ALIGNMENT
TWI371638B (en) Electro-optical device, method for manufacturing electro-optical device, and electronic apparatus
TWI371821B (en) Apparatus and method for bonding substrates
TWI368071B (en) Apparatus and method for attaching substrates
GB2451441B (en) Optical alignment apparatus and method thereof
IL183692A0 (en) Apparatus and method for substrates handling
TWI350133B (en) Apparatus for attaching substrates
TWI368067B (en) Apparatus for attaching substrates
TWI315783B (en) Integrated positioning apparatus and implementation method thereof
TWI319221B (en) Substrate alignment apparatus and method for aligning substrate using the same
ZA200709026B (en) Apparatus and method for coating a substrate
TWI369727B (en) Substrate processing apparatus

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees