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TWI371821B - Apparatus and method for bonding substrates - Google Patents

Apparatus and method for bonding substrates

Info

Publication number
TWI371821B
TWI371821B TW096124848A TW96124848A TWI371821B TW I371821 B TWI371821 B TW I371821B TW 096124848 A TW096124848 A TW 096124848A TW 96124848 A TW96124848 A TW 96124848A TW I371821 B TWI371821 B TW I371821B
Authority
TW
Taiwan
Prior art keywords
bonding substrates
substrates
bonding
Prior art date
Application number
TW096124848A
Other languages
Chinese (zh)
Other versions
TW200811987A (en
Inventor
Hirofumi Umemura
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW200811987A publication Critical patent/TW200811987A/en
Application granted granted Critical
Publication of TWI371821B publication Critical patent/TWI371821B/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW096124848A 2006-08-17 2007-07-09 Apparatus and method for bonding substrates TWI371821B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006222666 2006-08-17
JP2007138902A JP5117109B2 (en) 2006-08-17 2007-05-25 Bonded substrate manufacturing method and bonded substrate manufacturing apparatus

Publications (2)

Publication Number Publication Date
TW200811987A TW200811987A (en) 2008-03-01
TWI371821B true TWI371821B (en) 2012-09-01

Family

ID=39292439

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096124848A TWI371821B (en) 2006-08-17 2007-07-09 Apparatus and method for bonding substrates

Country Status (3)

Country Link
JP (1) JP5117109B2 (en)
KR (1) KR100838684B1 (en)
TW (1) TWI371821B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI652745B (en) 2016-02-29 2019-03-01 大陸商上海微電子裝備（集團）股份有限公司 Wafer bonding device and method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5467531B2 (en) * 2008-06-26 2014-04-09 株式会社ニコン Display element manufacturing method and manufacturing apparatus
KR101116322B1 (en) * 2009-08-17 2012-03-09 에이피시스템 주식회사 Method of aligning substrate
TWI449005B (en) * 2010-12-31 2014-08-11 Au Optronics Corp Functional film lamination method, lamination device and film positioning method
WO2012172603A1 (en) * 2011-06-15 2012-12-20 クライムプロダクツ株式会社 Precision workpiece gluing device and precision workpiece gluing method
KR102045234B1 (en) * 2013-02-13 2019-11-18 삼성디스플레이 주식회사 Method of verifying display lamination aligns
US9418882B2 (en) * 2013-06-17 2016-08-16 Ev Group E. Thallner Gmbh Device and method for aligning substrates
CN105702881B (en) * 2016-01-21 2017-11-07 京东方科技集团股份有限公司 A kind of substrate jacking system, substrate package device and method
JP7186632B2 (en) * 2019-02-13 2022-12-09 三菱電機株式会社 Measuring device and method
CN110767589B (en) * 2019-10-31 2021-11-19 长春长光圆辰微电子技术有限公司 SOI silicon wafer alignment bonding method
CN112908172A (en) * 2021-02-01 2021-06-04 深圳市冠运智控科技有限公司 Full-automatic mobile phone screen laminating system and laminating method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0778029A (en) * 1993-09-08 1995-03-20 Matsushita Electric Ind Co Ltd Panel alignment device
JP3363308B2 (en) * 1996-04-18 2003-01-08 株式会社日立製作所 Substrate assembling method and liquid crystal display cell manufacturing method
JPH11183860A (en) 1997-12-19 1999-07-09 Fujitsu Ltd Substrate superposition method and substrate superposition apparatus
JP2001264723A (en) 2000-03-17 2001-09-26 Seiko Epson Corp Electro-optical device, method of manufacturing the same, and projection display device
JP2003066466A (en) * 2001-08-23 2003-03-05 Internatl Business Mach Corp <Ibm> Substrate superposing device, substrate sticking method and manufacturing method for liquid crystal cell
JP2004205530A (en) * 2002-10-28 2004-07-22 Matsushita Electric Ind Co Ltd Panel alignment apparatus and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI652745B (en) 2016-02-29 2019-03-01 大陸商上海微電子裝備（集團）股份有限公司 Wafer bonding device and method

Also Published As

Publication number Publication date
JP5117109B2 (en) 2013-01-09
TW200811987A (en) 2008-03-01
KR100838684B1 (en) 2008-06-16
JP2008070857A (en) 2008-03-27
KR20080016449A (en) 2008-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees