[go: up one dir, main page]

TWI318231B - Ink jet printing process and solder mask ink composition - Google Patents

Ink jet printing process and solder mask ink composition

Info

Publication number
TWI318231B
TWI318231B TW092125062A TW92125062A TWI318231B TW I318231 B TWI318231 B TW I318231B TW 092125062 A TW092125062 A TW 092125062A TW 92125062 A TW92125062 A TW 92125062A TW I318231 B TWI318231 B TW I318231B
Authority
TW
Taiwan
Prior art keywords
parts
solder mask
mask ink
ink
jet printing
Prior art date
Application number
TW092125062A
Other languages
English (en)
Other versions
TW200420682A (en
Inventor
Alan John Hopper
Mark Robert James
Original Assignee
Fujifilm Imaging Colorants Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Imaging Colorants Ltd filed Critical Fujifilm Imaging Colorants Ltd
Publication of TW200420682A publication Critical patent/TW200420682A/zh
Application granted granted Critical
Publication of TWI318231B publication Critical patent/TWI318231B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Glass Compositions (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
TW092125062A 2002-09-20 2003-09-10 Ink jet printing process and solder mask ink composition TWI318231B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0221893.1A GB0221893D0 (en) 2002-09-20 2002-09-20 Process

Publications (2)

Publication Number Publication Date
TW200420682A TW200420682A (en) 2004-10-16
TWI318231B true TWI318231B (en) 2009-12-11

Family

ID=9944479

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092125062A TWI318231B (en) 2002-09-20 2003-09-10 Ink jet printing process and solder mask ink composition

Country Status (11)

Country Link
US (1) US20060047014A1 (zh)
EP (1) EP1543704B1 (zh)
JP (1) JP2005539390A (zh)
KR (1) KR20050057461A (zh)
CN (1) CN1695407A (zh)
AT (1) ATE326828T1 (zh)
AU (1) AU2003260739A1 (zh)
DE (1) DE60305333T2 (zh)
GB (1) GB0221893D0 (zh)
TW (1) TWI318231B (zh)
WO (1) WO2004028225A1 (zh)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69819740T2 (de) * 1997-02-24 2004-09-30 Superior Micropowders Llc, Albuquerque Aerosolverfahren und -gerät, teilchenförmige produkte, und daraus hergestellte elektronische geräte
US20050039634A1 (en) * 2003-07-11 2005-02-24 Hermansky Clarence Gaetano Non-aqueous ink jet inks with improved decap
JP4290510B2 (ja) * 2003-08-22 2009-07-08 太陽インキ製造株式会社 インクジェット用光硬化性・熱硬化性組成物とそれを用いたプリント配線板
US7485242B2 (en) * 2004-01-23 2009-02-03 Printar Ltd Reactive fine particles
US7439285B2 (en) * 2004-01-23 2008-10-21 Printar Ltd. Liquid thermosetting ink
GB0414847D0 (en) * 2004-07-02 2004-08-04 Avecia Ltd Process
JP4852953B2 (ja) * 2004-09-30 2012-01-11 セイコーエプソン株式会社 インク組成物およびそれを用いた画像形成方法
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076608A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
WO2006076615A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of compositionally no-uniform features
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US20060190917A1 (en) * 2005-01-14 2006-08-24 Cabot Corporation System and process for manufacturing application specific printable circuits (ASPC'S) and other custom electronic devices
WO2006076613A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Metal nanoparticle compositions
WO2006076607A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of passive electricalcomponents
WO2006076605A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Circuit modeling and selective deposition
WO2006076604A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
WO2006076606A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
WO2007026366A1 (en) 2005-08-31 2007-03-08 Printar Ltd. Uv curable hybridcuring ink jet ink composition and solder mask using the same
EP1967556B8 (en) * 2005-11-11 2014-08-27 Toyo Ink Mfg. Co. Ltd. Active energy beam-curable inkjet ink
ATE423172T1 (de) * 2005-11-28 2009-03-15 Agfa Graphics Nv Nichtwässerige chinakridondispersionen unter verwendung von dispersionssynergisten
US7794918B2 (en) 2005-12-28 2010-09-14 Fujifilm Corporation Ink composition, inkjet recording method, printed material, method for producing planographic printing plate, and planographic printing plate
JP4979232B2 (ja) * 2005-12-28 2012-07-18 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
US20070281099A1 (en) * 2006-05-31 2007-12-06 Cabot Corporation Solderable pads utilizing nickel and silver nanoparticle ink jet inks
US20080291169A1 (en) * 2007-05-21 2008-11-27 Brenner David S Multimodal Adaptive User Interface for a Portable Electronic Device
US7883092B2 (en) 2007-12-31 2011-02-08 Scientific Games International, Inc. Energy cured coating
KR101401488B1 (ko) * 2008-01-10 2014-06-03 동우 화인켐 주식회사 착색 감광성 수지 조성물 및 이를 이용하여 제조된컬러필터와 액정표시장치
US8399175B2 (en) * 2008-04-07 2013-03-19 Addison Clear Wave, Llc Photopolymer resins for photo replication of information layers
CN105968954A (zh) 2009-07-20 2016-09-28 马克姆-伊玛杰公司 基于溶剂的喷墨油墨制剂
JP2011178832A (ja) * 2010-02-26 2011-09-15 Dic Corp 紫外線硬化型インクジェット記録用インク、それから得られた絶縁膜、電子素子及び電子素子の製造方法
WO2012084786A1 (en) 2010-12-20 2012-06-28 Agfa Graphics Nv A curable jettable fluid for making a flexographic printing master
ES2550469T3 (es) * 2010-12-20 2015-11-10 Agfa Graphics N.V. Método para fabricar una matriz de impresión flexográfica
TW201233403A (en) * 2011-02-11 2012-08-16 Univ Nat Taiwan Dental composite material and applications thereof
CN102858091B (zh) * 2011-06-28 2015-08-19 北大方正集团有限公司 一种清除混压成型pcb板树脂流胶的方法
JP6057406B2 (ja) * 2012-01-06 2017-01-11 住友重機械工業株式会社 薄膜形成装置及び薄膜形成方法
JP2015507046A (ja) * 2012-01-19 2015-03-05 イソラ・ユーエスエイ・コーポレーシヨンＩｓｏｌａ ＵＳＡ Ｃｏｒｐ． 合成樹脂並びにそれらから製造されるワニス、プレプレグおよび積層物
TW201442130A (zh) * 2013-04-29 2014-11-01 Zen Voce Corp 可增進積體電路基板植球良率之方法
CN103568612B (zh) * 2013-11-06 2015-06-17 复旦大学 一种基于压电式家用喷墨打印技术制备印制电子阻焊材料的方法
US20150197062A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Method, device, and system of three-dimensional printing
TW201600349A (zh) * 2014-03-26 2016-01-01 肯提克有限公司 多色列印技術
US9902006B2 (en) 2014-07-25 2018-02-27 Raytheon Company Apparatus for cleaning an electronic circuit board
US9606430B2 (en) * 2014-08-28 2017-03-28 Xerox Corporation Method of aerosol printing a solder mask ink composition
WO2016178989A1 (en) 2015-05-01 2016-11-10 Sun Chemical Corporation Electrically-insulating energy curable ink or coating composition
EP3119170B1 (en) 2015-07-14 2018-12-26 Agfa-Gevaert Manufacturing printed circuit boards using uv free radical curable inkjet inks
US10941308B2 (en) 2016-07-27 2021-03-09 Sun Chemical Corporation Water-based electrically-insulating energy-curable fluids
EP3296368B1 (en) * 2016-09-14 2020-11-11 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing printed circuit boards
CN109906253B (zh) * 2016-11-10 2022-02-01 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
EP3321332B1 (en) * 2016-11-10 2019-07-31 Agfa-Gevaert Method for manufacturing an electronic device, such as printed circuit board
EP3321330B1 (en) * 2016-11-10 2022-01-05 Agfa-Gevaert Nv Solder mask inkjet inks for manufacturing printed circuit boards
EP3321331B1 (en) 2016-11-10 2020-10-21 Agfa-Gevaert Solder mask inkjet inks for manufacturing printed circuit boards
US10563014B2 (en) * 2017-09-11 2020-02-18 Fujifilm Electronic Materials U.S.A., Inc. Dielectric film forming composition
WO2019079037A1 (en) * 2017-10-17 2019-04-25 Kateeva, Inc. INK COMPOSITIONS HAVING HIGH QUANTUM POINT CONCENTRATIONS FOR DISPLAY DEVICES
US11441046B2 (en) 2017-12-18 2022-09-13 Agfa-Gevaert Nv Solder mask inkjet inks for manufacturing printed circuit boards
EP3498788B1 (en) 2017-12-18 2023-05-03 Agfa-Gevaert Nv Solder mask inkjet inks for manufacturing printed circuit boards
JP7025570B2 (ja) 2018-03-02 2022-02-24 アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ プリント回路基板を製造するためのインキジェットインキ
KR102762844B1 (ko) * 2018-03-23 2025-02-05 카티바, 인크. 유기 박막 형성을 위한 조성물 및 기술
US20210403738A1 (en) 2018-11-26 2021-12-30 Agfa-Gevaert Nv Novel photoinitiators
EP3656824A1 (en) 2018-11-26 2020-05-27 Agfa-Gevaert Nv Radiation curable inkjet for manufacturing printed circuit boards
EP3686252A1 (en) 2019-01-24 2020-07-29 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
CN112970337B (zh) * 2019-02-14 2022-05-24 奥宝科技有限公司 用于制备具有高度密集导体的pcb产品的方法及设备
CN110831345A (zh) * 2019-11-22 2020-02-21 东莞市鸿运电子有限公司 一种厚铜板的印刷方法
EP3981846A1 (en) * 2020-10-09 2022-04-13 Agfa Nv Free radical curable inkjet inks and inkjet printing methods
CN114395287A (zh) * 2021-12-30 2022-04-26 广州斯达利电子原料有限公司 阻焊油墨、阻焊层、Mini-LED印刷线路板
CN118206895A (zh) * 2022-12-16 2024-06-18 庆鼎精密电子（淮安）有限公司 感光防焊油墨及电路板的制造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1179398A (en) * 1967-06-26 1970-01-28 Ford Motor Co Improvements in or relating to Printed Circuit Boards
JPS61278577A (ja) * 1985-06-05 1986-12-09 Mitsubishi Rayon Co Ltd 紫外線硬化型インキ組成物
US4789620A (en) * 1986-03-03 1988-12-06 Mitsubishi Rayon Co. Ltd. Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates
JPH0686505B2 (ja) * 1986-03-10 1994-11-02 キヤノン株式会社 活性エネルギ−線硬化型樹脂組成物
US5089376A (en) * 1986-12-08 1992-02-18 Armstrong World Industries, Inc. Photoimagable solder mask coating
GB9123070D0 (en) * 1991-10-30 1991-12-18 Domino Printing Sciences Plc Ink
GB9014299D0 (en) * 1990-06-27 1990-08-15 Domino Printing Sciences Plc Ink composition
US5248752A (en) * 1991-11-12 1993-09-28 Union Carbide Chemicals & Plastics Technology Corporation Polyurethane (meth)acrylates and processes for preparing same
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
US5288589A (en) * 1992-12-03 1994-02-22 Mckeever Mark R Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
US5910854A (en) * 1993-02-26 1999-06-08 Donnelly Corporation Electrochromic polymeric solid films, manufacturing electrochromic devices using such solid films, and processes for making such solid films and devices
US5677398A (en) * 1995-04-13 1997-10-14 Mitsui Toatsu Chemicals, Inc. Epoxy acrylate resins and their uses
US5643657A (en) * 1995-04-28 1997-07-01 E. I. Du Pont De Nemours And Company Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
GB9603667D0 (en) * 1996-02-21 1996-04-17 Coates Brothers Plc Ink composition
JPH10158582A (ja) * 1996-05-01 1998-06-16 Minnesota Mining & Mfg Co <3M> 保護用コーティングおよびインクカートリッジのためのその液体の適用
FR2772522B1 (fr) * 1997-12-17 2000-02-25 Framatome Connectors Int Dispositif de connexion a emboitement perpendiculaire, connecteur etanche a double verrouillage obtenu
DE19842379A1 (de) * 1998-09-16 2000-05-11 Tron Elektronik Gmbh F Verfahren zum zweidimensional-gerasterten Herstellen von Schichtstrukturen auf Schaltungsplatinen
US6310115B1 (en) * 1998-10-29 2001-10-30 Agfa-Gevaert Ink compositions for ink jet printing
JP2001288387A (ja) * 2000-04-05 2001-10-16 Sony Chem Corp 電離放射線硬化型インクジェット用インク及びその印画物
JP4611554B2 (ja) * 2000-12-01 2011-01-12 昭和電工株式会社 感光性組成物およびその硬化物ならびにそれを用いたプリント配線基板
CN1484680B (zh) * 2000-11-09 2011-09-07 3M创新有限公司 特别适合户外用途的耐候性可辐照固化可喷墨的液体组合物
US20030203994A1 (en) * 2002-04-26 2003-10-30 Michael Chen Solventless photo-sensitive thermosetting-type ink

Also Published As

Publication number Publication date
AU2003260739A1 (en) 2004-04-08
ATE326828T1 (de) 2006-06-15
US20060047014A1 (en) 2006-03-02
KR20050057461A (ko) 2005-06-16
EP1543704B1 (en) 2006-05-17
DE60305333D1 (de) 2006-06-22
CN1695407A (zh) 2005-11-09
EP1543704A1 (en) 2005-06-22
WO2004028225A1 (en) 2004-04-01
DE60305333T2 (de) 2007-03-29
JP2005539390A (ja) 2005-12-22
GB0221893D0 (en) 2002-10-30
TW200420682A (en) 2004-10-16

Similar Documents

Publication Publication Date Title
TWI318231B (en) Ink jet printing process and solder mask ink composition
TWI340754B (en) Process and ink for making electronic devices
JP2005539390A5 (zh)
ATE412714T1 (de) Verfahren zum ätzen einer metall- oder metalllegierung oberfläche
EP0909407B1 (en) Photopolymerizable thermosetting resin composition
TW322680B (zh)
CN104204112B (zh) 光固化性热固化性组合物、其固化物的制造方法、固化物以及具有其的印刷电路板
US5328811A (en) Method of printing an image on a substrate particularly useful for producing printed circuit boards
JP3993691B2 (ja) レジストパターン形成方法
DE3916035C2 (de) Mit aktiven Energiestrahlen härtbare ungesättigte Harzmasse
US6156445A (en) Ablatively photodecomposable compositions
WO2000026724A1 (en) Organic-solvent-based photosensitive resist composition and method of forming resist pattern
TW201602188A (zh) 樹脂絕緣層之形成方法、樹脂絕緣層以及印刷配線板
JPH1152572A (ja) 感光性樹脂組成物及びそれを用いたパターン形成方法
EP0292219A2 (en) Printed circuit board fabrication
JPH04355450A (ja) 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
GB0221891D0 (en) Process
KR100421068B1 (ko) 액상 광경화성 조성물, 수계 광경화성 조성물 및 이들을사용하는 레지스트 패턴 형성 방법
JP3154782B2 (ja) レジストインキ組成物及びソルダーレジスト膜形成法
JPH04270345A (ja) 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
FR2440978A1 (fr) Compositions de revetement et procede de formation d&#39;un revetement a partir de ladite composition
CN116904063B (zh) Pcb光刻用uv固化水性抗蚀刻油墨的制备与应用方法
JPH0741716A (ja) ソルダーレジストインキ樹脂組成物
KR102703886B1 (ko) 에칭 저항성 잉크 조성물, 이로부터 제조된 광경화 필름 및 이를 이용한 인쇄회로기판의 제조방법
JP2002533775A (ja) フォトレジスト被膜の製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees