KR102703886B1 - 에칭 저항성 잉크 조성물, 이로부터 제조된 광경화 필름 및 이를 이용한 인쇄회로기판의 제조방법 - Google Patents
에칭 저항성 잉크 조성물, 이로부터 제조된 광경화 필름 및 이를 이용한 인쇄회로기판의 제조방법 Download PDFInfo
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- KR102703886B1 KR102703886B1 KR1020210168865A KR20210168865A KR102703886B1 KR 102703886 B1 KR102703886 B1 KR 102703886B1 KR 1020210168865 A KR1020210168865 A KR 1020210168865A KR 20210168865 A KR20210168865 A KR 20210168865A KR 102703886 B1 KR102703886 B1 KR 102703886B1
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- 238000005530 etching Methods 0.000 title claims abstract description 90
- 239000000203 mixture Substances 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000000178 monomer Substances 0.000 claims description 52
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011247 coating layer Substances 0.000 claims description 20
- -1 2-acryloyl oxyethyl phosphate Chemical compound 0.000 claims description 18
- 229910019142 PO4 Inorganic materials 0.000 claims description 17
- 239000010452 phosphate Substances 0.000 claims description 17
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 4
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- PRBBFHSSJFGXJS-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O.C=CC(=O)OCC(C)(C)COC(=O)C=C PRBBFHSSJFGXJS-UHFFFAOYSA-N 0.000 claims description 3
- YENKRZXDJWBUIY-UHFFFAOYSA-N 1-phosphonooxypropan-2-yl 2-methylprop-2-enoate Chemical compound OP(=O)(O)OCC(C)OC(=O)C(C)=C YENKRZXDJWBUIY-UHFFFAOYSA-N 0.000 claims description 3
- WAJJFPMYKWCDNI-UHFFFAOYSA-N 2-[hydroxy(2-prop-2-enoyloxyethoxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOP(=O)(O)OCCOC(=O)C=C WAJJFPMYKWCDNI-UHFFFAOYSA-N 0.000 claims description 3
- NXBXJOWBDCQIHF-UHFFFAOYSA-N 2-[hydroxy-[2-(2-methylprop-2-enoyloxy)ethoxy]phosphoryl]oxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(=O)OCCOC(=O)C(C)=C NXBXJOWBDCQIHF-UHFFFAOYSA-N 0.000 claims description 3
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 3
- SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 claims description 3
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 3
- 125000005842 heteroatom Chemical group 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 238000013007 heat curing Methods 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 19
- 238000001723 curing Methods 0.000 description 16
- 239000011889 copper foil Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 238000000016 photochemical curing Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000007639 printing Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000001029 thermal curing Methods 0.000 description 4
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 3
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 description 2
- 101000720524 Gordonia sp. (strain TY-5) Acetone monooxygenase (methyl acetate-forming) Proteins 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000000443 aerosol Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- WDFFWUVELIFAOP-UHFFFAOYSA-N 2,6-difluoro-4-nitroaniline Chemical compound NC1=C(F)C=C([N+]([O-])=O)C=C1F WDFFWUVELIFAOP-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 150000001634 bornane-2,3-dione derivatives Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000671 polyethylene glycol diacrylate Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
| (중량%) | ACMO | TMPTA | HMP | ITX | 점도(cP) |
| 실시예 1 | 41.86 | 40.81 | 5.09 | 12.24 | 33 |
| 실시예 2 | 52.30 | 30.36 | 5.09 | 12.24 | 29 |
| 비교예 1 | - | 82.7 | 5.09 | 12.21 | 88 |
| 비교예 2 | 82.7 | - | 5.09 | 12.21 | 25 |
| 비교예 3 | 44.12 | 43.01 | - | 12.87 | 31 |
| 물성항목 | 광세기 [mW/㎠] |
실시예 3 | 실시예 4 | 실시예 5 | 비교예 4 | 비교예 5 | 비교예 6 |
| 잉크 조성물 | 실시예 1 | 실시예 2 | 실시예 1 | 비교예 1 | 비교예 2 | 비교예 3 | |
| 광경화시간 | 10.84 | 10초 | 10초 | 10초 | 10초 | 15초 | 10초 |
| 18.45 | 10초 | 10초 | 10초 | 5초 | 15초 | 10초 | |
| 24.3 | 3초 | 3초 | 3초 | 3초 | 10초 | 3초 | |
| 밀착성 | 10.84 | 10초 | 10초 | 10초 | 15초 | 15초 | 10초 |
| 18.45 | 10초 | 10초 | 5초 | 10초 | 15초 | 10초 | |
| 24.3 | 3초 | 3초 | 3초 | 10초 | 10초 | 3초 | |
| 에칭저항성 | 10.84 | 5초 | 5초 | 5초 | 15초 | 15초 | 10초 |
| 18.45 | 5초 | 5초 | 3초 | 10초 | 15초 | 10초 | |
| 24.3 | 3초 | 3초 | 3초 | 10초 | 10초 | 5초 | |
| 박리성 (5초간) |
10.84 | 23초 | 37초 | 31초 | 54초 | 42초 | 2분6초 |
| 18.45 | 1분40초 | 4분52초 | 4분56초 | 6분10초 | 5분34초 | 8분40초 | |
| 24.3 | 1분18초 | 5분26초 | 5분10초 | 9분39초 | 8분41초 | 15분7초 | |
Claims (14)
- 지환족 헤테로 고리를 갖는 (메타)아크릴계 단량체, 다관능성 (메타)아크릴계 단량체, 포스페이트기를 포함하는 (메타)아크릴계 단량체 및 광개시제를 포함하는 에칭 저항성 잉크 조성물로,
상기 지환족 헤테로 고리를 갖는 (메타)아크릴계 단량체는 조성물 전체 중량에 대하여 25 내지 65 중량%로 포함되고,
상기 다관능성 (메타)아크릴계 단량체는 조성물 전체 중량에 대하여 25 내지 65 중량%로 포함되고,
25 ℃에서의 점도 값이 50 mPa·s 미만인 에칭 저항성 잉크 조성물. - 제1항에 있어서,
상기 지환족 헤테로 고리를 갖는 (메타)아크릴계 단량체의 지환족 헤테로 고리는 탄소수 4 내지 6을 포함하고 질소, 산소 및 황으로 이루어지는 군에서 선택되는 하나 또는 둘의 헤테로 원소를 가지는 것인, 에칭 저항성 잉크 조성물. - 제1항에 있어서,
상기 다관능성 (메타)아크릴계 단량체는 디프로필렌글리콜 디아크릴레이트, 카르복시에틸 아크릴레이트, 히드록시 피발산 네오펜틸 글리콜 디아크릴레이트, 트리메틸롤프로판 트리아크릴레이트 및 트리메틸롤프로판 트리메타크릴레이트에서 선택되는 어느 하나 또는 둘 이상인 에칭 저항성 잉크 조성물. - 제1항에 있어서,
상기 포스페이트기를 포함하는 (메트)아크릴계 단량체는 2-히드록시에틸 (메타)아크릴레이트 포스페이트, 2-메타크릴로일 옥시에틸 포스페이트, 비스(2-메타크릴로일 옥시 에틸) 포스페이트, 2-아크릴로일 옥시 에틸 포스페이트, 비스(2-아크릴로일 옥시 에틸) 포스페이트, 메틸-(2-메타크릴로일 옥시 에틸) 포스페이트, 에틸 메타크릴로일 옥시 에틸 포스페이트, 메틸 아크릴로일 옥시 에틸 포스페이트 및 에틸 아크릴로일 옥시 에틸 포스페이트에서 선택되는 어느 하나 또는 둘 이상인 에칭 저항성 잉크 조성물. - 제1항에 있어서,
상기 지환족 헤테로 고리를 갖는 (메타)아크릴계 단량체는 에칭 저항성 잉크 조성물 전체 중량에 대하여 30 내지 55 중량%로 포함되는 것인 에칭 저항성 잉크 조성물. - 제1항에 있어서,
상기 다관능성 (메타)아크릴계 단량체는 에칭 저항성 잉크 조성물 전체 중량에 대하여 30 내지 55 중량%로 포함되는 것인 에칭 저항성 잉크 조성물. - 제1항에 있어서,
포스페이트기를 포함하는 (메타)아크릴계 단량체는 에칭 저항성 잉크 조성물 전체 중량에 대하여 1 내지 10 중량%로 포함되는 것인 에칭 저항성 잉크 조성물. - 제1항에 있어서,
상기 광개시제는 에칭 저항성 잉크 조성물 전체 중량에 대하여 5 내지 15 중량%로 포함되는 것인 에칭 저항성 잉크 조성물. - 삭제
- 제1항 내지 제8항 중 어느 한 항의 에칭 저항성 잉크 조성물로부터 제조된 광경화 필름.
- 제10항에 있어서,
상기 광경화 필름은 ASTM D 3359 규격에 따른 접착성이 5B 이상인 광경화 필름. - 제10항에 있어서,
상기 광경화 필름은 50 ℃, 5 % NaOH 수용액에서 박리성 테스트 결과값이 8분 이하인 광경화 필름. - 동박적층필름의 동박층 상에 소정의 패턴이 형성되도록 상기 청구항 제1항 내지 제8항 중 어느 한 항의 에칭 저항성 잉크 조성물을 도포하고, 광 조사하여 패터닝된 도포층을 형성하는 단계;
상기 도포층이 형성되지 않은 구역을 에칭(etching)하는 단계; 및
상기 도포층을 제거하는 단계;
를 포함하는 인쇄회로기판의 제조방법. - 제13항에 있어서,
상기 패터닝된 도포층을 형성하는 단계에서, 광 조사 후 열경화를 더 수행하는 것인 인쇄회로기판의 제조방법.
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