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TWI315689B - System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology - Google Patents

System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology

Info

Publication number
TWI315689B
TWI315689B TW094144783A TW94144783A TWI315689B TW I315689 B TWI315689 B TW I315689B TW 094144783 A TW094144783 A TW 094144783A TW 94144783 A TW94144783 A TW 94144783A TW I315689 B TWI315689 B TW I315689B
Authority
TW
Taiwan
Prior art keywords
dry
system method
low defect
laser dicing
proximity technology
Prior art date
Application number
TW094144783A
Other languages
English (en)
Other versions
TW200624207A (en
Inventor
John M Boyd
Fred C Redeker
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW200624207A publication Critical patent/TW200624207A/zh
Application granted granted Critical
Publication of TWI315689B publication Critical patent/TWI315689B/zh

Links

Classifications

    • H10P70/15—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H10P50/242—
    • H10P54/00—
    • H10P70/20—
    • H10P72/0406—
    • H10P72/0408—
    • H10P72/0414—
    • H10P72/0428—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
TW094144783A 2004-12-16 2005-12-16 System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology TWI315689B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/016,381 US7675000B2 (en) 2003-06-24 2004-12-16 System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology

Publications (2)

Publication Number Publication Date
TW200624207A TW200624207A (en) 2006-07-16
TWI315689B true TWI315689B (en) 2009-10-11

Family

ID=36588601

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144783A TWI315689B (en) 2004-12-16 2005-12-16 System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology

Country Status (3)

Country Link
US (2) US7675000B2 (zh)
TW (1) TWI315689B (zh)
WO (1) WO2006066100A2 (zh)

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US8141566B2 (en) * 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
JP4971078B2 (ja) * 2007-08-30 2012-07-11 東京応化工業株式会社 表面処理装置
US8051863B2 (en) 2007-10-18 2011-11-08 Lam Research Corporation Methods of and apparatus for correlating gap value to meniscus stability in processing of a wafer surface by a recipe-controlled meniscus
TW200934603A (en) * 2008-02-01 2009-08-16 Contrel Technology Co Ltd Jetting type laser processing machine
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WO2017033113A1 (en) 2015-08-21 2017-03-02 Acerta Pharma B.V. Therapeutic combinations of a mek inhibitor and a btk inhibitor

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Also Published As

Publication number Publication date
US20060088982A1 (en) 2006-04-27
WO2006066100A3 (en) 2008-11-06
US8330072B2 (en) 2012-12-11
US7675000B2 (en) 2010-03-09
WO2006066100A2 (en) 2006-06-22
US20100108652A1 (en) 2010-05-06
TW200624207A (en) 2006-07-16

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