1310580 九、發明說明： 【發明所屬之技術領域】 牿明係有關於一種晶粒拾取分類（Pickandplace)裝置， 別疋有關於—種可以連續進行拾取分類的晶粒拾取分類裝置。 - 【先前技術】 於晶圓（wafer)上面製作積體電路時，需經過相當多 • 物製程步驟。製作完成的各個積體電路，其品質往往不盡相同； :使是位於同—片晶圓的各個晶粒（.，或稱為晶片chip)之 <體電路’其質也是各有差別。因此，在切割出晶粒以前，必 /貝先對晶圓上的各個晶粒進行測試；依據測試結果，將其分為數 個品質類別。以第一圖所示為例，晶圓10上面的各個晶粒12智 ，試後，依據其品質好壞而標示出分類值如i至3;通常，這些 曰日粒12的分類值係儲存於測試設備的記憶體當甲。 〜 • 經分類後的晶圓10即可以進行切割，亦即在晶圓10上面鑛 八Γ割道（scribe lane)。接著，此晶圓10將被送至晶粒拾取 • ( pick and place)裝置令，將相同品質類別的晶粒12收 ”在起f 一 A圖至第二c圖顯示傳統晶粒拾取分類裝置中的 主f吸取分類動作及相關物件—首先，使用真空吸附頭2〇將相 同口口質類別的晶粒12吸起（第三a圖），祕動此真空吸附頭2〇 承盤22上方’並將晶粒12依序填入承盤22的容置槽％内（第 β圖）°裝滿晶粒12的承盤22再被堆疊於承盤收集架％中。 第二c圖顯示承盤收集架26的側面剖面圖，裝滿晶粒12的承盤 22係從承盤收集架26的下方，採由下往上的方向（如箭頭所示) 1310580 進行堆疊。 在傳統晶粒拾取分類裝置中，當-晶圓1G的所有同-類別 都已拾取並置於承盤22之後，晶粒拾取分類裝置必須暫 寺知機，待操作人員將承盤收集架26中的所有承盤22取出後， 才可以恢復裝置的運轉，以進行另一品質類別晶粒的拾取及分 類。此時，空出來的承盤收集架26才能用於堆疊另—品質 承盤22。但是’褒置的暫時停機相當浪費時間，影響晶板 刀類的效率；更糟的是，有時候會發生操作人員因為忘了將前— 品質類別的承盤22取下，就繼續進行下—品f晶粒的拾取，因 而讓不同品質類別的承盤產生混淆，而造成產能上的損失。 鑑於傳統晶粒拾取錢裝置之效率極低， 情事’因此’即需要提出-種可以持績進行拾取分類之晶粒 为類裝置，以克服上述之問題。 【發明内容】 本發明目的之-為提供一種可以連績進行拾取分類的晶教 拾取分類裝置。 本發明的另-目的在於解決習知的晶粒拾取裝置於收集不 :品質類別之晶粒時，需停機將承盤取出，才能繼續收集另— 品質類別所造成的時間耗費。 本發明之又-目的在於解決因人員疏失未將載有晶粒之承 1310580 盤即時取出所造成的混晶問題。 根據上述之目的，本發明提供了—種晶粒拾取分 —晶圓取放控制模組，將晶圓放置於拾取平台上。 '、 吸取晶圓中的晶粒至承盤。當承盤裝滿晶粒時，3二 由承盤運輸模組被疊入多個承盤收集架之一，盆中， 分別，、至不同的晶粒品質類別。藉此，可以連續不間斷地= :::質：：的晶粒至相對應的承盤收集架’因而增加; 的效率，且可避免混晶問題。 刀頰 【實施方式】 本發明的-些實施例料細描述如下。然而，除了該詳細描 述外，本發明還可以廣泛地在其它的實施例施行。亦即，本發明 的範圍不受限於已提出之實施例，而應以本發明提出之中請專利 範圍為準。其次’ t本發明之實施例圖式中的各元件或結構以單 一元件或結構描述說明時，不應以此作為有限定的認知，即如下 之說明未制_數目上的限料，本發日月之精神與應用範圍可 推及多數個元件或結構並存的結構與方法上。再者，在本說明書 中，每個元件之不同部分並沒有依照尺寸繪圖。某些尺度與其他 相關尺度相比已經被誇張或是簡化，以提供更清楚的描述和本發 月的理解而本發明所沿用的現有技藝，在此僅做重點式的引用， 以助本發明的闡述。 1310580 第二圖顯示根據本發明實施例之晶粒拾取分類裝置1〇〇的俯 • 視示意圖。首先，將裝載有多片晶圓的晶舟送入晶舟載入區（input cassette loader) 1〇2内。第四a圖顯示裝載有晶圓40之晶舟 42的側視圖，這些已經過測試且分割的晶圓4〇藉由置晶凹槽而 --承載於晶舟内。 再回到第三圖所示的晶粒拾取分類裝置100。晶圓取放控 φ 制模組（frame feeder) 104藉由移動並伸長機械手臂106至晶 舟載入區102中，取出一片晶圓4〇 ;接著，再移動機械手臂1〇6 並將此晶圓40置於拾取平台（table) 1〇8上面。這個拾取平台 108主要是絲承載王作中的晶圓4q<5在本實施财，此拾取 平台108可以作水平方向的移動調整，以便於配合真空吸附頭 110 (詳後述）來進行晶粒的精確拾取。 第三圖中所示的符號110及112分別代表真空吸附頭110 及控制移動此真空吸附頭11Q的運行軌道112。從第四B圖所示 • 的側視圖，可以比較清楚看到運行軌道112、真空吸附頭110, 以及和晶圓40、拾取平台108的相對關係位置。 第二圖左側設有一縱貫整個晶粒拾取分類裝置的承盤運輸 模組114 ’係用以將空的承盤（tray) 46從其前端送入；再經 由承盤運輸模組114的運送，將承盤46移至適當位置，以進行 拾取分類。（關於真空吸附頭110如何將相同品質類別的晶粒吸 起，以及將晶粒依序填入承盤46的容置槽中，此與第二A、二 B圖類似，因此不再贅述。）第四c圖之側視圖顯示本„實: 1310580 例的承盤運輸模組114的主要組成要件，其主要包含一執道 1140 ;承盤座台（tray stand) 1142係用以承載承盤46之用， 且此承盤座台1142藉由一升降機構（elevat〇r) 1144可移動於 執道1140上，且此升降機構1144還可以上下移動承盤座台 1142。 回到第三圖所示的晶粒拾取分類裝置1〇〇。於承盤運輸模 組114的執道後端，設有多個（亦即，至少二個或以上）承盤 收集架116a、116b、116c，其數目通常相等甚或更多於晶粒品 質分類的數量。於第三圖所示的例子中，晶粒的品質分類數值 為1至3’因此，承盤收集架U6a、U6b、U6c分別對應至品 質刀類1、2、3。當承盤46裝滿了晶粒後，承盤運輸模組114 就會將其運送至相對應的承盤收集架n6a/b/c中。 第四D圖顯示局部側視圖，用以說明本發明的承盤運輸模 組114如何將裝滿晶粒的承盤46運送至適當的承盤收集架 i_c中。如圖所示’承盤座台1142藉由升降機構⑽， 將承盤46水平移動至對應的承盤收集架116_々下面；接著， =降機構1144升高，並將承盤46由下往上堆疊進入承盤收 j 116a/b/c裡面。例如’如果目前係正在吸取品質類別為2 隹趣n朴賴^之阳粒的承盤46將會被推入承盤收 果朱116b，其餘類推。 夕以上所述為本發明之晶粒拾取分類襄置ι〇〇，由於其設 夕個承盤收集架1 1 6a/b/ 分 般益L 刀別對應以收集不同品質類別的承 盤’藉此’本發明所揭露的晶粒拾取分類裝置⑽可以連續不 1310580 間斷地進行所有品質類別晶粒的拾取及分類，晶粒在拾取及分 類過程當中’不再需要暫時停機。因此，分類效率大大提高， 且不會再發生傳統裝置的混晶問題。 本發明之晶粒拾取分類裝置可以作其它的等效變化。第五 圖顯不根據本發明另一實施例之晶粒拾取分類裝置500。與第三 圖不同的是’承盤收集架516a、516b、516c的設置位置是與承 盤運輪模組114互相垂直的。此種方向上的轉換，可以具有一 些優點。例如，可以提高晶粒拾取分類裝置500的空間利用率。 另外，第六圖顯示根據本發明又一實施例之晶粒拾取分類 裝置600。此裝置中的承盤收集架616a、616b、616c、616d、616e、 、616g、616h之設置係呈矩陣排列方式，可說是前二者（第 —圖及第五圖）之結合形式。此種排列方式具有一些優點，例 如可以增加承盤收集架的數量（亦即，可以增加品質類別的數 目），且可以增加空間利用率。 此外，如第七圖所示之晶粒拾取分類裝置7〇〇，為本發明 之另一實施例，其與前述的實施例不同之處在於用以運輸承盤 的承盤運輸模組114為圍繞著晶粒拾取分類裝置·。承盤運輸 '、、’且114的一知用以載入空的承盤46，而另一端則與數個承盤 收集木716a/b/c相接並且兩端皆位於晶粒拾取分類裝置的 同側，並且承盤運輸模組114中包含了數個承盤暫留區 可暫時停放承盤46。因此’不必等待前__個承盤完成拾取分類 與置入承盤收集架716a/b/c等動作，才可已載人另—個承盤处 進仃拾取分類，而可以利用這些承盤暫輕118做為緩衝而連 1310580 續作動。本實施例之承盤收集架716a/b/c與承盤運輸模组ii4 為相同方向但也可以如前述之實施例為互相垂直甚至為一矩陣 排列。 以上所述僅為本發明之較佳實施例，並非用以限定本發明之 申請專利範圍。在不脫離本發明之實質内容的範疇内仍可予以變 化而加以實施，此等變化應仍屬本發明之範圍。因此，本發明之 範疇係由下列申請專利範圍所界定。 • 【圖式簡單說明】 第一圖顯示晶圓上的晶粒於測試之後，各具有不同品質分類。 第二A圖至第二c圖顯示傳統晶粒拾取分類裝置中的主要吸取分 類動作及相關物件。 第三圖顯不根據本發明實施例之晶粒拾取分類裝置的俯視示意 圖。 第四A圖顯示裝載有晶圓之晶舟的側視圖。 第四β圖顯示第三圖中’運行執道、真空韻頭、晶圓、拾取平 台的側視圖。 第四C圖顯示第三圖中’承盤運輸模組的側視圖。 第四D圖之側視圖顯示第三圖中，承盤運輸模組如何將裝滿晶粒 11 1310580 的承盤運送至適當的承盤收集架中。 第五圖顯示根據本發明另一實施例之晶粒拾取分類裝置。 第六圖顯示根據本發明又一實施例之晶粒拾取分類裝置。 第七圖顯示根據本發明又另一實施例之晶粒拾取分類裝置。 【主要元件符號說明】 10晶圓 12晶粒 20真空吸附頭 22承盤 24容置槽 26承盤收集架 40晶圓 42晶舟 46承盤 100晶粒拾取分類裝置 102 晶舟載入區（input cassette loader) 104晶圓取放控制模組（frame feeder) 106機械手臂 108拾取平台 110真空吸附頭 12 1310580 112運行轨道 114承盤運輸模組 116a-c承盤收集架 118承盤暫留區 500晶粒拾取分類裝置 516a-c承盤收集架 600晶粒拾取分類裝置 616a-h承盤收集架 700晶粒拾取分類裝置 1140執道 1142 承盤座台（tray stand) 1144 升降機構（elevator) 131310580 IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to a type of pick-and-place device for picking and sorting, and there is no related to a kind of die picking and sorting device which can continuously perform picking and sorting. - [Prior Art] When making an integrated circuit on a wafer, it takes a lot of process steps. The quality of each integrated circuit that is produced is often different; the quality of the <body circuit' is the same for each die (. or wafer chip) located in the same wafer. Therefore, before cutting out the die, each die on the wafer is tested first; according to the test results, it is divided into several quality categories. Taking the first figure as an example, each of the crystal grains on the wafer 10 is wise. After the test, the classification values such as i to 3 are marked according to the quality thereof; generally, the classification values of the 曰 粒 12 are stored. Test the memory of the device as a. ~ • The sorted wafer 10 can be cut, that is, the scribe lane is drilled on the wafer 10. Next, the wafer 10 will be sent to a pick and place device to receive the same quality class of the die 12 from the f-A to the second c-picture display conventional die picking and sorting device. The main f in the middle absorbs the sorting action and related objects - first, the vacuum die 2 is used to suck up the die 12 of the same mouth quality category (third a picture), and the vacuum adsorption head 2 is above the retainer disk 22 'The crystal grains 12 are sequentially filled into the receiving groove % of the retainer 22 (Fig. β). The retainer 22 filled with the crystal grains 12 is then stacked in the retainer collecting frame %. The second c-picture shows A side cross-sectional view of the tray collection frame 26, the tray 22 filled with the die 12 is stacked from the lower side of the tray collection frame 26 in the direction of the bottom up (as indicated by the arrow) 1310580. In the picking and sorting device, when all the same-category of the wafer 1G has been picked up and placed on the retainer 22, the die picking and sorting device must be in the knowing machine, and the operator will take all the retaining trays in the collecting frame 26. After the 22 is removed, the operation of the device can be resumed to perform picking and sorting of another quality class of crystal grains. At this time, the empty tray collection frame 26 can be used to stack another quality pallet 22. However, the temporary shutdown of the installation is quite a waste of time, affecting the efficiency of the crystal plate cutter; even worse, sometimes operation occurs. Because the staff forgot to remove the pre--quality category of the tray 22, they continued to pick up the lower-product f-grain, which caused confusion in the different quality categories, resulting in loss of productivity. The efficiency of picking up money devices is extremely low, and the situation 'so that' needs to be proposed - a type of device that can perform picking and sorting to overcome the above problems. [Invention] The object of the present invention is to provide a A crystal teaching picking and sorting device for picking and sorting. Another object of the present invention is to solve the problem that when the conventional crystal picking device collects the crystal grains of the quality category, it is necessary to stop the take-up tray to continue collecting the other quality. The time-consuming cost caused by the category. The present invention is also aimed at solving the problem of mixed crystals caused by the fact that the 1310580 disk carrying the die is not taken out immediately due to personnel loss. For the purpose of the present invention, the present invention provides a die pick-and-drop access control module that places a wafer on a pick-up platform. ', draws the die from the wafer to the carrier. When the carrier is full In the case of granules, the platoon transport module is stacked into one of the plurality of retainer collection frames, in the basins, respectively, to different grain quality categories. Thereby, continuous uninterrupted = ::: Qualitative:: the grain to the corresponding disk holder 'and thus increase the efficiency; and the problem of mixing crystals can be avoided. Knives [Embodiment] Some embodiments of the invention are described in detail below. In addition, the present invention may be widely practiced in other embodiments, that is, the scope of the present invention is not limited to the embodiments which have been proposed, and the scope of the invention is subject to the scope of the invention. In the following description, the elements or structures in the drawings of the embodiments of the present invention are described in terms of a single element or structure, and should not be used as a limited cognition, that is, the following description is not made. The spirit and scope of the sun and the moon can be pushed into the structure and method in which many components or structures coexist. Furthermore, in this specification, different parts of each component are not drawn in accordance with the dimensions. Certain scales have been exaggerated or simplified compared to other related scales to provide a clearer description and understanding of the present invention, and the prior art of the present invention is hereby incorporated by reference in its entirety to facilitate the present invention. Elaboration. 1310580 The second figure shows a schematic view of a die picking and sorting device 1 according to an embodiment of the present invention. First, a wafer boat loaded with a plurality of wafers is fed into the input cassette loader 1〇2. Figure 4a shows a side view of the wafer boat 42 loaded with wafers 40, which have been tested and divided into wafers by means of crystallized grooves. Returning to the die picking and sorting apparatus 100 shown in the third figure. The wafer pick-and-place control frame feeder 104 removes a wafer 4 by moving and elongating the robot arm 106 into the wafer loading area 102; then, moving the robot arm 1〇6 and The wafer 40 is placed on top of a picking table 1〇8. The picking platform 108 is mainly a wafer carrying a wafer 4q<5 in the implementation of the wire. The picking platform 108 can be adjusted in the horizontal direction to facilitate accurate picking of the die in conjunction with the vacuum chucking head 110 (described later). . Symbols 110 and 112 shown in the third figure represent the vacuum adsorption head 110 and the running track 112 for controlling the movement of the vacuum adsorption head 11Q, respectively. From the side view shown in Fig. 4B, the position of the relative position of the running rail 112, the vacuum suction head 110, and the wafer 40 and the picking platform 108 can be clearly seen. The left side of the second figure is provided with a deck transport module 114' extending through the entire die picking and sorting device for feeding an empty tray 46 from its front end; and then transporting it via the deck transport module 114. , the retainer 46 is moved to the appropriate position for picking and sorting. (How the vacuum adsorption head 110 sucks up the crystal grains of the same quality category, and sequentially fills the crystal grains into the accommodating grooves of the retainer 46, which is similar to the second A and B diagrams, and therefore will not be described again. The side view of the fourth c-figure shows the main components of the 1310580 example of the pallet transport module 114, which mainly includes a road 1140; the tray stand 1142 is used to carry the retainer. For the purpose of 46, the deck platform 1142 can be moved to the lane 1140 by a lifting mechanism 1144, and the lifting mechanism 1144 can also move the deck platform 1142 up and down. A die picking and sorting device 1 is shown. A plurality of (ie, at least two or more) retainer collection shelves 116a, 116b, 116c are provided at the rear end of the carrier transport module 114. Usually equal or even more than the number of grain quality classifications. In the example shown in the third figure, the quality classification of the grain is 1 to 3'. Therefore, the tray collection frames U6a, U6b, U6c correspond to the quality knife respectively. Class 1, 2, 3. When the retainer 46 is filled with the die, the deck transport module 114 will Shipped to the corresponding deck collection rack n6a/b/c. The fourth D diagram shows a partial side view to illustrate how the deck transport module 114 of the present invention transports the tray 46 filled with the die to the appropriate The tray holder is in the tray i_c. As shown in the figure, the tray holder 1142 horizontally moves the tray 46 to the corresponding tray collection frame 116_々 by the lifting mechanism (10); then, the =down mechanism 1144 is raised. And the tray 46 is stacked from bottom to top into the receiving tray to receive j 116a/b/c. For example, if the current department is drawing a quality category of 2, the price of the box 46 will be Pushing into the receiving fruit Zhu 116b, and the rest of the analogy. The above mentioned the grain picking classification of the present invention is set to 〇〇, because of its ceremonial collection frame 1 1 6a/b/ The chip picking and sorting device (10) disclosed in the present invention can perform picking and sorting of all quality types of grains continuously without delay, and the crystal grains are in the process of picking and sorting. 'No longer need to be temporarily shut down. Therefore, the classification efficiency is greatly improved, and will not be The crystal picking and sorting device of the present invention can be used for other equivalent changes. The fifth figure shows a die picking and sorting device 500 according to another embodiment of the present invention. The position of the 'receiver collecting racks 516a, 516b, 516c is perpendicular to the retaining wheel module 114. This direction of conversion may have some advantages. For example, the die picking and sorting device 500 may be improved. In addition, the sixth figure shows a die picking sorting apparatus 600 according to still another embodiment of the present invention. The arrangement of the tray collection frames 616a, 616b, 616c, 616d, 616e, 616g, and 616h in the apparatus is arranged in a matrix, which can be said to be a combination of the former two (the first and fifth figures). This arrangement has several advantages, such as increasing the number of deck collection racks (i.e., the number of quality categories can be increased) and increasing space utilization. In addition, the die picking and sorting device 7A shown in FIG. 7 is another embodiment of the present invention, which is different from the foregoing embodiment in that the retainer transport module 114 for transporting the retainer is Around the die picking sorting device. The carrier transport ', ' and 114 is used to load the empty retainer 46, while the other end is connected to several deck collection wood 716a/b/c and both ends are located in the die picking and sorting device. On the same side, and the plurality of retaining areas in the deck transport module 114 can temporarily park the retainer 46. Therefore, 'you don't have to wait for the previous __ ___ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Temporary light 118 as a buffer and even 1310580 continued to move. The tray collection racks 716a/b/c of the present embodiment are in the same direction as the tray transport module ii4, but may be arranged perpendicular to each other or even in a matrix as in the foregoing embodiments. The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the invention. Changes may be made without departing from the spirit and scope of the invention, and such changes are still within the scope of the invention. Accordingly, the scope of the invention is defined by the scope of the following claims. • [Simple description of the diagram] The first figure shows that the wafers on the wafer have different quality classifications after testing. The second to second c-pictures show the main suction sorting actions and related objects in the conventional die picking and sorting apparatus. The third figure shows a top plan view of a die picking sorting apparatus according to an embodiment of the present invention. Figure 4A shows a side view of a wafer boat loaded with wafers. The fourth beta image shows a side view of the 'running pass, vacuum rhyme, wafer, and pick-up platform in the third figure. Figure 4C shows a side view of the 'receiving transport module' in the third figure. The side view of the fourth D-figure shows in the third figure how the deck transport module transports the pallets filled with the mould 11 1310580 into the appropriate retainer collection rack. The fifth figure shows a die picking sorting apparatus according to another embodiment of the present invention. The sixth figure shows a die picking and sorting apparatus according to still another embodiment of the present invention. The seventh figure shows a die picking sorting apparatus according to still another embodiment of the present invention. [Main component symbol description] 10 wafer 12 die 20 vacuum adsorption head 22 retaining plate 24 receiving groove 26 disk collecting frame 40 wafer 42 crystal boat 46 bearing plate 100 die picking and sorting device 102 wafer loading area ( Input cassette loader) 104 wafer pick and place control module (frame feeder) 106 robot arm 108 picking platform 110 vacuum adsorption head 12 1310580 112 running track 114 retaining transport module 116a-c retaining plate collection frame 118 retaining area 500 die picking and sorting device 516a-c disk collecting frame 600 die picking and sorting device 616a-h disk collecting frame 700 die picking and sorting device 1140 way 1142 disk stand (tray stand) 1144 lifting mechanism (elevator) 13