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TWI309094B - Electrical connector in a flexible host and method for fabricating the same - Google Patents

Electrical connector in a flexible host and method for fabricating the same Download PDF

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Publication number
TWI309094B
TWI309094B TW094108355A TW94108355A TWI309094B TW I309094 B TWI309094 B TW I309094B TW 094108355 A TW094108355 A TW 094108355A TW 94108355 A TW94108355 A TW 94108355A TW I309094 B TWI309094 B TW I309094B
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Taiwan
Prior art keywords
array
conductive
sheet
contact
flexible insulating
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TW094108355A
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English (en)
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TW200603493A (en
Inventor
Larry E Dittmann
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Neoconix Inc
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

1309094 九、發明說明： 本申請案主張2004年3月1 〇 α & 士 嶋侧號之權益’其整體併入本案供參^國臨時申請案 【發明所屬之技術領域】 彈装本^侧於軸電連接器於絕緣主體巾，尤其關抑成 弹簧兀件陣列於撓性聚合物片材中。 句於肜成 【先前技術】 用：連接例如印刷電路板之組件的傳統電連接器，可 。常見方法係用模鍛(stamped ‘ 電黏者劑、束線(Wledwire)導電元件、以及小金二塊。
^加強元件性能之期望，驅使封裝科技縮小電連接（亦稱 做接聊（tads)」）間的間隔（或節距(pi她)）時，存在i縮 丄1固另1接$讀尺寸之需求。啊，每封餅之連接總數在 增加。舉例而言，現有積體電路封裝可具lmm或更小之節距， ===連接。此外，積體電路裝置係設計於持續增 率木作。舉例而言’供使用在計算、電信通訊以及網路 應關積體電路裝置可操作於數胞之頻率。因此，電子裝 置之m、封裝尺寸、以及裝置封裝之接腳數，對用以測
4SHAW/05006TW/NEO ; EPC-00027-TW 1309094 試或連接這些電子裝置的互連系 統 帶來嚴格之要求 發嚴ί其要電、柯她辟則變得益 顧可减聽，會财上鱗駐賴縣==== 求。一般而言，最佳化電性能 械和可靠产«Γ=ΓΓ傳統連接器系統具有不佳的機 統具有不佳的電特性。 了减的連接益系 腳的二1 遭遇的特別問題是’欲連接電子組件中接 =不共雜（―ity)。舉例而言，平面封裝中 =面性係存极_元件位在翻參考朗平辦。傳统封 件(或接腳)之不共面性的因素 „絲差異和基她曲warpage)。騎顺_之傳統連 接為兀件*言，封裝巾各處的共面性差異可超過連接器元件之 垂直公差，而導致一些元件中電連接失效。 共面性問題不限於積體電路封裝，亦存在於這些積體電路 封裳要附接的印刷電路板（PC板）中。因為Pc板基板翹曲， 形成為PC板上之一區域（area)陣列的基板栅格陣列墊（land grid array pads)，可能存在著共面性問題。—般傳統pc板中 與平度（flatness)之偏差在每英吋75至125微米或更多之等 級0
4SHAW/05006TW/NEO ； EPC-00027-TW 1309094 、，此外’使用電連接器陣列之電路板、封裝件及其他組件中 .·=面性偏差’料隨其他尺寸(例如陣觸隔和連接器大小） ,' 而縮小。因此，舉例而言，甚至電路板或其他具小節距的 二會之位置的大垂直偏差。對連㈣接觸間的節距 /約21米的傳統連接純言，#節距下降，更難生產可彌 :1ΪΪ面性偏差’而仍實現可接受電接觸特性（例如低電阻 和低電感）的彈性接觸。 * r 【發明内容】 本么月提供觀連接器，其係由金屬接觸陣列組成。金 屬接觸供作導電载體，每一個附接至—撓性絕緣片之開口陣列 之其内，開口陣列係提供於撓性片中。金屬接觸具有部份係 位於撓性絕緣片之相對側上，形成一接觸通道區域，扣住環繞 開Π之緣部。f連接器提供—撓性健供接職欲結合組 Y件之不規則接合表面。對給定接觸高度而言，電連接器更為接 觸板連接之組件提供一最小電路徑長度。 人施例’本發明亦提供—種製作連接器的方法，^ =備:撓性_ ’係具有—開口陣列；套合撓性絕緣片 2口陣列與-第—導電片之一第一突出·件 件陣列含有各接觸元件；套人拎 大 第n 〜办m、邑緣片中之開口陣列與 弟一 片之一弟二突出件陣列，撓性絕緣片贿第-與第
4SHAW/05006TW/NEO ； EPC-00027-TW 1309094 導電片之間；接合第-導電片至第二導電片，於每—導電片位 在開口_中之區域中；以及單—化已接合之第—與第二突 出陣列’以形成支持於撓性絕緣片上之—電隔離接觸陣列。 【實施方式】 圖1例示依本發明-實_排狀1連接㈣〇。連接 益100包含-撓性絕緣片搬，其保持（咖ns)各電接觸1〇4 之陣列。各電接觸KH藉絕緣片搬彼此電隔離。連接哭觸 可贱電連絲置組件、印刷板、和其他電封裝組;。因 此，母-電接觸104可供做一導電連接器，其電連接位於表面 106上之一組件至位於相對表面1〇8上的—組件。 實施例中，'絕緣片102由一聚合物材料組成，例如一聚 酯（polyester)，使得絕緣#102保持良好電絕緣性質。絕緣 ^搬夠薄，使得連接器卿具有撓性（flexMity)。舉例而 5 ’絕緣片102可具有大約5密耳或更少的厚度。雖然當安置 在平坦平面（flat ρΐ_；)的表面上時，連接器勘可採取一 整體平坦、平面之構型（conflg咖顧），絕緣片搬之撓性容 許表面K)6順應非平面（non_planar)或不平坦&職^表 面’使得連接器100—區域中的電接觸104可位於一平面，其 係在連接H 1GG另-區域巾的電連接器之平面之上或之下。因 此，相較於使用-機械剛性（stlff)連接器而言，電植件或裳 置雖然因厚度不—致或其他舰，使得觸概之高度呈現
4SHAW/050Q6TW/NEO ; EPC-00027-TW 1309094 差異’但疋使用連接器100可更容易結合至其他組件。 ® lb係電連接器1〇〇之剖面圖，例示依本發明一實作， 兩組件112和114個別之電耗合。撓性絕緣片1〇2採取之形狀 係順應不平坦組件112和114之形狀，有助於促進兩個不平坦 、、且件之躺&此外’如圖le所例示，接觸辦可彈性地變开》 至一更大或更小程度，以適應撓性絕緣片1〇2和組件ιΐ6間不 霍 同的距離，而仍保持接觸不平坦組件112。 圖2a與2b例示依本發明—實施例，連接器1〇〇之一個別 接觸KH的平面圖與剖面圖。接觸1〇4係一金屬材料，例如銅 合金、鐘金屬之鈦、或鍍金合金之不鏽鋼。接觸1〇4包含一基 邻202 ’其具平坦外表面204。如圖2b所緣示，基部202延伸 自絕緣片102之頂側206至底側208。於圖2b所示實例中， 基部202可包含導電層210，其位於頂基部2!2和底基部212, \ 間’如以下更詳述。基部202為行經接觸1〇4自頂區域214 至底區域216之電流提供一連續導電路徑。 - 接觸104亦包含一凹部（recess)(亦稱做「槽（chaimel)」) ' 222 ’谷納撓性絕緣片102之緣部（rim portion) 224。槽222 用以固定（anchor)接觸1〇4至撓性絕緣片1〇2。於圖2a與 2b例示之實施例中，槽222係一實質環形槽，沿接觸1〇4之 週邊’並接合（mates)片1〇2中一環形孔226。此實施例中，
4SHAW/05006TW/NEO ： EPC-00027-TW -10- 1309094 槽厚度D係大約與撓性絕緣片1〇2之厚度t相同，使得緣部 224緊貼地置入槽222。其他實施例巾，D可大於或小於t。槽 之覓度w可變化，但係設計以確保至少部份緣部224扣在槽 222 内。 接觸104包含彈簧元件230，自基部202高起，延伸於表 面204上至高度H。於所示實例中，彈簧元件包含四臂，其兩 臂中之各-係位於絕緣片搬之相對侧。絕緣片服之每一側 上的彈簧元件可變形-轉（dastiedist_，ED)，而保 持與印刷電路板、裂置、或其他電組件之元件的良好電接 觸。此實施例提供-額外機制，以確保
鱗度有變化的另—電組件_電接觸。舉例而言，當Γ不一 度之印刷電路板接觸連接器刚時，印刷電路板設計用以 口接觸1〇4的某些接觸點會首先建立接觸。印刷冑路板進一 =移可使&些接卿性地變形，祕其他點建立電接觸。因 祕距雜可適麟度—錄差魏A的欲接觸印 積體接觸 圖3a與3b分別例示依本發明—實施例形成之 4SHAW/05006TW/NE〇;Epc.〇〇〇27.tw -II- 1309094 300，以及形成在傳統絕緣基板3〇6上的電連接器元件3〇2之 比較。積體接觸300固定在實質上類似絕緣片1〇2的一撓性絕 ' 緣片304上，絕緣片102如以上關於圖卜2a、和2b所述。 連接器兀件302含有兩個接觸部3〇7，其具一形狀於平面圖實 質上和圖2b的接觸1〇4相同。接觸部3〇7可自導電片形成， 導電片、·、5_圖案化（patterned)並層合（iaminated)於絕緣基板 306之相對侧上。接觸部3〇7沿孔31〇間隔一距離L，係對應 | 、絕緣基板306之厚度。舉例而言，絕緣基板306可為-印刷電 路板具-典型厚度範圍在2〇_25〇密耳。連接器元件3〇2由— 導電襯（lining) 312電連接，其一般為鍍金屬塗層。電流緩 過連接器元件302自點C至C，的總電路徑長度ΕΡρΛ包含距離 L，以及接觸部307之厚度與沿彈簧臂部3〇8之距離。 另-方面’接觸300可提供遠較小的電路徑長度恥。為 比較之目的’可假設-實施例中，接觸3〇〇形成自接合導電片 、（Μ下詳述），其中基區域318之高度s等於用以形成元件撕 =導電片的厚度總和。進-步，彈簧部迎假設與連接器3〇2 的相同。因此’ EPpcb和EPf中的差異係相應於絕緣基板3〇6 . 之厚度L。 + -實施例中，如圖3c中例示，接觸3〇〇可包含結合於導 =面3Π的接觸部31S和316。每—接觸部Ή5和316個別 、有1始厚度，S1和S2 ’對應形成個別部的導電片厚度，
4SHAW/05006TW/NEO ； EPC-00027-TW -12- 1309094 如下詳加討論。如圖3a與3c所示，對可用來形成基部318之 V電片的給定總厚度S=S1+S2 *言，以及對雜部電流路捏
t而言’接觸300之構型產生最小祕徑長度恥。其中La 定義電流自-外部組件沿彈簧臂至基部的距離，或沿彈菁臂至 基部到外雜件的輯，EPf代表電流自點B至B，所行經之 距離’此二點可為接觸外部組件之接觸，點。不同於目孙中連
接器之情形，此實施例中，—絕緣載體（例如接觸之片 3〇4)之厚度Ts對電路徑長度無貢獻。這是因為基部314之厚 度s，如圖3a中例示，係設計超過Ts，使得基部318中的槽 可形成以扣住絕緣片3〇4，如上關於圖2b所述。因此^ 只等於S和2xLa之總和，且不隨Ts而變。在一實施例中，s ，大約1-8密耳。相對之下，傳統連接器中的L -般為20_25〇 邊、耳或更大。 圖4a、4b與4c分別例示依本發明另一實施例排列的接觸 〇之』面圖、上視圖、和下視圖。此實施例中，位 ^鄉之表面姻上的-第一基部搬，私至包含二彈性邑 #的一彈性部。位於絕緣片406之相對表面412上的一第 一基部410，延伸過孔414，並不含附接彈性部。舉例而今， 接觸400之底表面416可用來柄合—焊材球並形成永久連。接。 圖5a至5e例示之本發明另—實施辦，接觸_跟圖 仏和2b例示之接觸刚相同，除了位於絕緣片5Q4相對側的 4SHAW/05006TW/NEO ; 1：Ρ〇-〇〇〇27^ -13- 1309094 彈，元件502組之位置相對彼此旋轉外。現在這個實施例，當 彈只元件朝向彼此(例如朝向點A)時，可用以避免於絕緣片 5〇4相對側之彈簧元件5〇2的末（distal)端篇碰撞。 本發明其他實施例中，於一撓性絕緣片之一給定側中，接 觸之彈ί±。卩的形狀或構型可根據設計，於_巾接觸位置間變 化因此’舉例而言，某些接觸位置可包含較長彈性臂，而其 他接觸位置包含較^接觸臂。此外，接觸臂之冑度於陣列中 同接觸妞置間可變化。 m^ \之範例連接11具幾轉綱特徵。首先，連接器可機 二讀，比形成在剛性（rigid)絕緣載體（例如傳統印刷零 之二1的連接衫。另—特徵，如上所述，是於連接器連接 電、'且件間，提供最小電路徑長度的能力。此外，連接器
觸彼此間可間隔—最小距離，使得可達以小接顏 撓性絕緣片之平面t。以此方式，鄰近 =小你合’因此容許接觸間隔更近。最後，如下更詳述，指 觸之彈性部可由微影技術與形成製作，提供-给定接觸能承Ϊ 械變形。此些特徵提供傳統連接器無法二t; 性質概況（profile)。 吃刚蜀網 不 於緊接者的討論巾，本發明-實例面向侧於圖6所
4SHAW/〇5〇〇6TW/NE〇;EPC.〇〇〇27_TW 14- 1309094 說明供製作一電連接器之範例方法600。此方法之不同變化可 例如用以分別產生圖2與4的範例電連接器2〇〇與4〇〇。圖7 至13c顯示方法600中牽涉之不同步驟時的電連接器之特徵。 如圖6所示’於步驟602中，一撓性絕緣片備有一開口陣 列。可使用任何撓性絕緣片，但於一範例中，絕緣片係為—良 好電絕緣體之聚合物。撓性絕緣片之片厚度可變化，但於 • 例巾’係小於約G.5料並大於約6料。在—特定實例中貝， 撓性絕緣片係一 Mylar®片。 參照圖7，複數個孔（或「開π」）7()2係藉切割（⑽ 或衝孔（punching)製作於撓性絕緣片7〇〇中。一面向中 據欲形成於片上接觸元件之佈局，間隔形成開口他* 列7〇4。開口包含撓性絕緣片之整個厚度，因此形成通孔
於^之步驟_中，撓性絕緣片中之開口陣列由形成於 中的―突出件陣列套合（re細⑷。如上述， 形成電連接器之接觸元件，且可由任何金屬材料 ί金入^ 射材料貫例包含：銅合金、齡屬之鈦、或 鏽鋼。如下討論，—給定突出件本身可為未圖案 自突出件之-絲面。 # —獅成接觸元件延伸
4SHAW/05006TW/NEO ； EPC-00027-TW -15- 1309094 含突例示導電片802套合陣列704。導電片包 供產生^ Γ!之—陣列804 ’其構成導電片之突起部。陣列綱 出==伽之位置’其可插入陣列7〇4之開口 。突 對準突屮1於圖15進—步討論。如圖8a例示，排列孔702以 盘·^件祕。導電片8〇2接觸撓性絕緣片· % 例不，使得突出件806容納進開口 702。 化的例示依發明一實施例，導電片802之一實例變 圖。此變化中，導電⑽之頂義包含 ⑽孔规延瓣電請之整個厚度 示每例中骚例不，彈性部910延伸自底表面912。於所 件906之__Μ 译αί3910構型為二彈簧臂延伸自突出
二似"I ⑼件9G6於—孔之週邊區域中， 延-過突出件之厚度。然而’可使用任何方便的彈性壯 構取代此二賴臂，_挪性接觸結構。 、、口 自突出件之底孔、且沒有彈性部延伸 下更詳細討論。此外，彈性之形成_式，於以 下十八m +入祕接觸結構之形成，例如部910，於 下时确仏^於美國專利中請號1_2729中。
4SHAW/05006TW/NEO ; EPC-00027-TW -16- l3〇9〇94 導電片之突出件套合撓性絕緣片中 片自相對第-導電片所在之絕緣第二導: ^導電片可由組綱緣片 3有相同材料。視第一導電片之突出件择衣乍，但不一定要 的故置，可變除導電㈣ΐ料她陶之開口中 圖l〇a與l〇b例示步驟604後二 1〇a中，位於開口 1004中的導電片—可能實施例。圖 上延伸過撓性絕緣片1006夕敕^ 之犬出件1002實質 之心t 片之整個厚度。圖勘中，導雷M 1010 之犬出件1012尸、延伸過部份撓性 Τ *電片1010 1016中。 巴緣片1014之厚度於開口 圖6之步驟6〇6中，若已套合突 撓性絕緣㈣整個厚度，赠H質上延制 面。例示於圖他之出件之頂肩 緣月之表面齊平（flusl0，面本質上舆撓性絕 在表面。耻，本緣梅轉一片所 以及導議件之頂表面(胸. 步驟606尹’若已套人穸 緣片之厚度，程序移往步;m二伸過部份撓性絕 ^驟610中，具突出件陣列
4SHAW/05006TW/NEO ； EPC-00027-TW -17. 1309094 2一‘電片與撓性絕緣片之開口陣列套合。此情形中，笛-方^之犬出件的高度使得當第二片以類似圖8a至8C所示之 相接觸合撓性絕緣片時’第—與第二導㈣之突出件之頂部互
Ua中面迦 例示位於導電片1110之「頂」表面_(圖 盆中絕緣上的突出件1108 ’與絕緣片1106之範例套合， 套Γ的開口胞已與導電片_之突出件應 她14^’^請G含細部咖，其為形成自 之又弹頁# ’且位於突出件11〇8之底表面1114上。
OxJl之步驟612巾’第—與第二導電片彼此接合 片接觸I卜。如圖12巾例示，導於町區域彼此接合：兩 屬表面之7 Γ挽性絕緣片之開口陣列憎。接合可利用接合金 電糊<：可方1更的方法來進行。可用之已知方法包含應用導 著純卿^於¥電片表面之—或兩者上之欲接合區域中，接 金口 種方式是，一導電金屬層，例如低魅金屬、合 Ρ或可於蝴前制在導㈣之接合區域中。 接合後，於開口陣列之备 . 良好導電職。跡㈣糊，建立了 保持或不鋪-清細/Γ 後兩導·間可能 月疋的（dlstmct)導電介面層。
4SHAW/05006TW/NEO ； EPC-00027-TW -18- 1309094 圖12為清楚之目的，只顯示兩導電片12〇〇與12〇4，個 別突出件1202與1206彼此接觸於頂環狀（an皿lar)表面12〇8 與1210中。此實例中，表面1208具有—薄金屬接合層1212， 其交互擴散（interdifftise)入突出件1202與1206，當後者接 觸並加熱時。 圖6之步驟614中，已接合之導電層係利用形成撓性絕緣 f 載體中之隔離接觸陣列的任何便利方法來單一化，例如圖13a 至13c所例不。於例示實例中，一毯覆式遮罩塗層 c〇ating)1302應用於一導電片1300之一表面，其中導電片13〇〇 • 係透過一撓性絕緣體1306接合至一第二導電片13〇4。毯覆式 塗層1302可同時應用於導電片1300與13〇4兩者。一實例中， 共形地（conformally)應用毯覆式遮罩塗層13〇2塗覆特徵（例 如接觸臂）’以於界定翻元件基部日寺，保護後者免於侧。 圖1%中’毯覆式遮罩層1皿係使用如產生接觸界定遮罩特 \徵之標準微影製程圖案化。—實例中，遮罩特徵1310 為環形’但亦可為㈣（_1)、方形、或具特徵之結合，例 如-變平的圓，具四個直部互相以90度角排列並以一圓弧之 部份連接。若有需要，可同時使用類似難化製程於導電片 13〇4上。圖13c中，進行触刻以選擇性移除導電層13〇〇 (以 及導電層1綱於-實例中）。接著移除遮罩特徵留下 接觸基部1312。
4SHAW/050Q6TW/NEO ； HPC-00027-TW -19- 1309094 圖14例示依發明一實作，製作彈性元件之方法牽涉之實 例步驟，此方法形成例如圖3a彈性部308之連接器彈性呷。 步驟1402中，一遮罩塗層應用於一導電片。步驟14〇4中°，圖 案化遮罩塗層，以界定-彈簧元件之二維遮罩塗層圖案。兴二 而言’二維圖案可包含實質上與目2a中所示接觸1〇4相二之 雜。步驟1.中’侧導㈣，使得錢鱗層保護之區 域被完全侧移除。因此形成二維接觸結構具有例如 觸臂。步驟测中，二維接_吉構被形成為三維接觸結構。 供形成二維接觸之詳細實例製程揭露於 10/412,729。 闼甲明旎 列可固定^ Γ沿—最小電路徑提供電連接之撓性電接觸陣 驗載制，科織接合電接觸於絕緣 之侧㈣= 彡献最小電雜纽之—雛_陣列涉及
撓性接觸之纽=^於(欲=成接觸之期望彈性或電性質、 同領而用以形成接觸之兩導U之厚度不一定要相 厚度。因為撓性^= 載體的—撓性絕緣片之片 觸中之-#，^巾^開口之緣（細）部要適合形成於接 曰°圖2b例示’可選擇絕緣片厚度小於用以形成
4SHAW/05006TW/NEO ； EPC-00027-TW -20- 1309094 電接觸之兩片的導電片厚度總和。 步驟中，_蝴树㉝中，如上述。
步驟測中’界定特胁應用 叶界定於遮罩中之特徵的形狀與尺寸^之「遮罩中, 片之開口的突出件。 產生可適合撓性I 步驟1510中’突出件被_ 餘刻於相對導電片中之突出 電片。再:人參照圖7 約等於撓性絕緣片之厚度。當二導度D如 口中的區域t，形成-槽，可容、、^ 口於撓性絕緣片4 刻突出件於導電片之—或兩者中，;°如上述，月 要具有相同深度。 者中且右餘刻於兩片中，不- 觸之’―旦選擇導電片之厚度與接觸結構，容蜗 觸之撓性絕緣載體片的厚度 再谷、、，内 之電路續。梅言，崎 於發明之-撓性導雕中，心…、斗予導包片來形成接 們，來⑯σ藉如上相案化兩導以並結合| —、jt 大約3密耳厚度之槽。因此，要用來取 擇於0 5^^、耳科電片’絕、緣細之—聚合物β厚度可d m被耳或更少上至大約3密耳的範圍中。如圖3a明^ 的’連接if之魏域的厚度之此_化，不會辟電路
4SHAW/05006TW/NHO ； EPC-00027-TW •21 - 1309094 或連接為頂與底上相對臂間之電流行進。
本發明之實施例的以上揭露已為例示與說明之目的呈 現。其不欲為窮盡性或限制發明於所揭露精確形式。文中說明 之實施例的許多變倾修改，按鼓上賊賴此技藝者會是 明顯的。此發狀齡狀鱗_料·鼠其均等物定 義。
進步，本發明敘述代表實施例中，說明書可能呈現本發 製程為狀順序之辣。_，至方法或製程 ===愤祕定之舞的錢，方法或躲不應限於 疋順序。如熟此技藝者會理解的，其他步驟順序是可 專w圖此綱書中提出步驟之特定順序不應理解為對申請
專利。此外’針對本發明之方法及/或製程的申請 專利範财應限於依所寫順序之步:二 輕易理解猶领化，崎林剌之精m技 【圖式簡單說明】 圖la係依本發明—實施例 形 接器的立體@。 I成於撓性>；上之電連 圖lb係依本發明—實作之電連接器 一 組件之電耦合。 σ勺纠面圖，其例示兩 圖lc係依本發明另一實作之電 钱态的剖面圖，例示兩
4SHAW/〇5〇〇6XwmE〇 . EPC-〇〇〇27.TW •22· 1309094 組件之電耦合。 : 圖2a與2b例不依本發明一實施例之個別接觸的平面圖盥 . 剖面圖。 圖如與3b分別例示依本發明一例示實施例形成之積體接 觸’及形成在傳統絕緣基板上的電連接器元件。 圖3c例不依本發明—實施例之積體鋪的細節。 ® 4a、4b與4c分別例示依本發明另一實施例排列之電接 | 觸的剖面圖、上視圖及下視圖。 圖5a至5c例示依本發明另一實施例排列之電接觸的上視 圖、剖面圖及下視圖。 圖6描述依本發明-實作，供製作電連接器之方法的範例 步驟。 圖7例不依本發明_實施例排列之撓性絕緣片。 圖8a至8c例示導電片與開口陣列之例示套合。 圖9a與％例示依本發明一實施例，顯示導電片之例示變 化的頂與底立體圖。 圖l〇a與l〇b例示圖6之方法中之中間步驟後，連接器二 種不同的可能實施例。 - ®叫口 1關示依本發明一實施例，顯示導電片與絕緣 ' 片之套合，其中絕緣片已與另一導電片套人。 圖12描繪依圖6之方法，導電片之例示接合。 圖13a至13c例示依本發明一面肖，顯示接觸之單一化。
4SHAW/05006TW/NEO ： EPCO0027-TW -23- 1309094 - ^ ^發㈤—面向’製作形成連接11彈性部之彈 性7L件的範例方法。 圖15例示依本發明一面向，形成具最小電路徑長度之撓 性接觸陣列的範例方法。 【主要元件符號說明】 100連接器 102撓性絕緣片 104電接觸 106表面 108表面 112, 114, 116 組件 200電連接器 202基部 204表面 206頂侧 208底側 210導電層 212頂基部 212’底基部 214頂區域 216底區域 222槽 224緣部 23〇彈簧元件 300積體接觸 302電連接器元件 304撓性絕緣片 306傳統絕緣基板 307接觸部 3〇8彈簧臂部 310孔 312導電襯 315, 316接觸部 317導電介面 318基部 400接觸 402第一基部 -24-
4SHAW/05006TW/NEO ； EPC-00027-TW 1309094
404表面 408彈性部 412表面 416底表面 502彈簧元件 506遠端 702孔 802導電片 806突出件 902導電片 906突出件 910彈性部 1000導電片 1004 開口 1010導電片 1014撓性絕緣片 1100導電片 1104 開口 1108突出件 1110導電片 1116彈性部 1202, 1206突出件 406撓性絕緣片 410第二基部 414孔 500接觸 504絕緣片 700撓性絕緣片 704陣列 804陣列 900頂侧 904陣列 908孔 912底表面 1002突出件 1006撓性絕緣片 1012突出件 1016 開口 1102突;出件 1106絕緣片 1109頂表面 1114底侧 1200, 1204導電片 1208, 1210 表面
4SHAW/05006TW/NEO ； EPC-00027-TW -25 - 1309094 1212薄金屬接合層 1302毯覆式遮罩塗層 1306撓性絕緣體 1312接觸基部 1300導電片 1304第二導電片 1310界定接觸之遮罩特徵
4SHAW/05006TW/NEO ； EPC-00027-TW -26-

Claims (1)

1309094 、申請專利範園： 1. 一種製作一連接器的方法’包含： 準備一撓性絕緣片，具有一開口陣列； 套合該撓性絕緣片中該開口陣 I 一第苡該第—如件_含有各‘元二: 套a δ亥撓性絕緣片中該開口陣列與一第 2二突出件陣列’該撓性絕緣片位於該第—與第二導J 接合該第-導電片至該第二導電片，於每—導 在該開口陣列t之區域申；以及 單-化該已接合之第—與第二突出陣列，以形成支拍 於該撓性絕緣片上之一電隔離接觸陣列。 2. 述之方法，該第肩鱗狀各突出件包
3 Si::斤述之方法’該第二突出件陣列包含未 圖案化 4 1所述之方法，該接合該第—導至該第二導 -的f::導電層於該第一與第二突出件陣列之至少其 4SHAW/〇5〇〇6TW/ne〇 ； EPC-00027-TW -27- 1309094 針菩另與第—突出件陣列之該至少其一的表面 對者另一大出件陣列之—表面；以及 加熱該第—與第二突出件陣列。 5. 如請求項1所述之方法，更包含： 化:遮罩位於該“電片之一第一表面上，以 出件陣列之，祕 -突第-表面至-深度，爾第 以一遮罩圖案化該第二導 該第二突出件陣列之-面内形狀；狀表面’以界定 姓刻該第二導電片之第- 二突出件_之—=度，⑽定該第 的總和約等於或大於該触絕緣片^二厚大度出件陣列之高度
6. =求項2所述之方法，該第— 含各接觸元件，且該第—盘::陣歹j之各大出件包 上類似。 /、弟一 V电片之各接觸元件實質
8. 如請求項6所述之方法 件實質上不同。 如請求項6所述之方法 該第-與第二導電片之各接觸元 5亥第一導電片之各接觸元件直接 -28- 4SHAW/050Q6TW/NEO ； EPC-00027-TW *ϊ3〇9〇94 相對該第二導電片之各接觸元件 j 替換I、2007/2/14 九 94108355 事 9· ^請求項5所述之方法，該開口陣顺 該第一 =出件陣列之面内形狀特心 出件直徑，其小於或等於該開口直徑。 讥如請求項丨所述之方法，該套合該撓性 入該第—突出件陣列的每—突出件於該開 應開口中； 列，一導電片之該第一突出件陣列之步驟;包::: 口陣列的一對 該套合該撓性絕緣片+該開口 之該第二突出件陣狀步驟 ;一*電片 列的每一突出件於該開口陣列的 列的签一空山丛认,匕3 ·插入該第二突出件陣 對應開口令；以及 該接合該第一導電片至該第_ 接合每1 口中該第-導片的弟之步驟，包含： 突出件。 大出件至該第二導片的 11.如請求項1所述之 突出於該第—導以㈣的該接觸元為 撓性絕緣片的，内的該第二^^該 4SHAW/〇5〇〇6TW/NEO ； EPC-00027-TW -29- 12' 1309094
〜J攻 13·如#求項12所述之方法，該接 件的-環狀表面於㈣口料—突出 亥弟—犬出件的一相對環狀表面。 14·如請求項12所述之方法，該接 該第-突出件及第二突出φ 3應用—V電層於 矛—大出件之間，以及加熱該導電層。 15.如請求項1所述之方法 片的該第-突出件_的„‘=:=料:導電 於該撓性絕緣片的該開口陣列的一開口中。人。亥大出件 A :=所述之方法’更包含形成該第-突出件陣列的 :接觸兀件’以致於該接觸元件突出於該突出件的相二 17. 一種產生—撓性電連接器_的方法，包含： 準備-撓性絕緣片，具第—與第二側，且有 列，延伸自該撓性絕緣片之第—側至第二侧； 陣 形成一接觸元件陣列於一第一導電片上； =該，電片上卿★二酸該 =^開π _，使得該第—導體片接觸該撓性絕緣片= k供-第一導電片於該撓性絕緣片之第二側上； 4SHAW/05006TW/NEC ； ΕΡ〇〇〇〇27,ην -30- .1309094 98年1月案號：94丨〇8355 Θ 19臼修正-替換頁 透過該開口陣列接合該第一導電片之突私A ^ 二導電片，以確保撓性絕緣片於該第一與第〜^至°亥第 以及 〜等電片間； 單一化該陣列之各接觸元件，以形成〜轾 列，其彼此電隔離並支持於該撓性絕緣片上。 18.如請求項π所述之方法，該撓性絕緣片 (! + N L, , . &含一聚酯 (polyester)材料。 19. 如請求項π所述之方法，該接合該第一導電 ^ 至該第二導電片包含： 之突起部 以一導電層電鍍該第一導電片之各突起一 導電片之各所選部之至少其一； ，、弟 鄰接（abutting)該第一導電片之各突起部至兮# 一曾 電片之各所選部於該已套合開口中之區域中.〜弟一蜍 从及 加熱該第一導電片之各突起部與該第二 所選部，至一溫度足以永久結合該第一盥第〜电片之σ /'不〜導電片。 20. 如請求項17所述之方法，該接合該第一導電 ^ 部至該第二導電片包含： 之各突起 以一導電糊塗覆該第一導電片之各突起部； 鄰接該第—導電片之各突起部至該第 已套合開口令之各區域中；以及 ^“ 4SHAVV/〇5〇〇6tw/ne〇 . EpC.〇〇〇27-TW -31 - 1309094 加熱該第-導電片與該第二導電片，至—溫 與導一用，使勢 含有該等接7觸=具各突出件，其 22·=:=方法’該第二導電片具各突出件，其 23. 如請求項22所述之方法，該第_ 化之各突出件。 4一犬出件陣列包含未圖案 24. 如言^項17所述之方法，該形成該接觸元件陣列於一第 一導電片上包含： 微影地圖案化一遮罩冷屏. ^ 早土層，以界定二維接觸元件特 徵， 侧該導電片以形成二維接觸元件；以及 機械地變形該二維接觸轳 μ受峒斗寸喊，以形成三維接觸。 25. —種電連接器，包含： 一撓性絕緣片，界定—+々 或夕個開口穿過該撓性絕緣 片；以及 4SHAW/05006TW/NEQ ： EPC-00027-TW ~ 32 - 1309094 或多個導電連接器，每一導電連接 絕緣>{夕—μ , _ *益設置於該撓性 絕緣片^丨 導電連接器具—表面部於該撓性 絲面部具—凹部於其週射，发心 μ撓性絕緣片位於該凹部中之一區域。 ，、界疋 以及 彈黃兀件，延伸於該平面區域上方 如啤求項26所述之電連接器，爷 彈性臂，延雜Μ件包含-或多 絕 片之兩侧之t：；：外表面上，該基部於該撓性 片26φ所述之電連接器，該基部形成自結合二導臂 度的1和決定。-基‘度由该二導電片之厚 4SHAW/05006丁W/NEO ·· EPC-00027-TW -33- 1309094 卜年么月/闲修(更)j£替換頁i卜歲 L------------------- ! 替換頁 2007/2/14 案號：94108355 30.如請求項25所述之電連接器，該電連接器順應不平坦表 面’使得於該電連接器之一區域中的導電連接器可位於一 平面，其係異於該電連接器另一區域中的導電連接器之平 面。 31. -種用以電連接二表面之系統，此二表面具有複數個電接 觸，該系統包含一個二侧撓性介電基板，其具至少一連接 态位於該撓性介電基板之每一側上，該至少一連接器位在 該二表面間，以接合與電連接至該二表面上的該電接觸， 該至夕連接器具挽性接觸表面，且該至少一連接器與任 一其他連接器電隔離。 32. 參 —種於具開π的-可撓性基板二表面間提供電連接之系 統，包含： ―、-電接觸’具二相對電連接之接觸表面，該表面具有 一邊緣定義一通道於該邊緣中； 藉由該電_賴邊針之麵道，設置 該基板的-開口中；以及 驟 §玄電接觸於該二表面間提供—電連接。 種製作一連接器的方法，包含： 套合該撓性絕緣片中該開口 _盘 第一突出件陣列，該第-突出件陣列含有各接= -34- 4SHAW/05006TW/NEQ ; EPC-〇〇〇27.TW 替換頁2007/2/14 案號：94108355 套°該撓性絕緣片中該開U陣列與-第二導電片之 一第二突出件陣列，該撓性絕緣片位於該第-與第二導電 片之間； 接。該第—導電片至該第二導電片，於每-導電片位 在該開口陣列中之區域中； 化該已接合之第—與第二突出陣列，以形成支持 於該撓性絕緣片上之—麵離接觸陣列； =化:遮罩位於該第—導電片之—第__表面上，以 I疋“弟-突出件陣列之一面内（in_plane)形狀； 一導·之第—表面至—深度，以界定該第 大·出件陣列之一高度； 以=罩圖案化該第二導電片之—第二表面，以界定 以第一犬出件陣列之一面内形狀； 餘刻該第二導電片之第-矣 _ 二突出件_^ 面至界定該第 的编未」 度第—與第二突出件陣列之高度 的~和約等於或大於該撓性絕緣片之厚度。 職之方法’該開口陣列特徵在於一開口尺 出件尺與弟—突出件陣列之面_狀特徵在於-突 出件尺寸制、於或等_開口尺寸。 欠 4SHAW/〇5〇〇6Tw/Ne〇 - EPC-00027-TW -35- 1309094 七、指定代表圖·· (一) 本案指定代表圖為：圖la。 (二) 本代表圖之元件符號簡單說明： 100連接器 102撓性絕緣片 104電接觸 106表面 108表面
八、本案若有辨式時，觸魂識示綱徽谢碑式：
4SHAW/05006TW/NEO ； EPC-00027-TW
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US20050208788A1 (en) 2005-09-22
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WO2005091998A3 (en) 2006-12-21
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