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TWI301658B - - Google Patents

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Publication number
TWI301658B
TWI301658B TW95114028A TW95114028A TWI301658B TW I301658 B TWI301658 B TW I301658B TW 95114028 A TW95114028 A TW 95114028A TW 95114028 A TW95114028 A TW 95114028A TW I301658 B TWI301658 B TW I301658B
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TW
Taiwan
Prior art keywords
axis
glue
alignment
machine
injection
Prior art date
Application number
TW95114028A
Other languages
Chinese (zh)
Other versions
TW200741992A (en
Inventor
Hung Yueh Hwang
Original Assignee
Hung Yueh Hwang
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Publication date
Application filed by Hung Yueh Hwang filed Critical Hung Yueh Hwang
Priority to TW095114028A priority Critical patent/TW200741992A/en
Publication of TW200741992A publication Critical patent/TW200741992A/en
Application granted granted Critical
Publication of TWI301658B publication Critical patent/TWI301658B/zh

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  • Injection Moulding Of Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Making Paper Articles (AREA)

Description

1301658 八、本案若有化學式時’請揭示最能顯科明特徵的化學式 九、發明說明: 【發明所屬之技術領域】 本發明係有關一種快速對位注膠方法及其裝置,匕 提供-種具有自動偵測對位且注膠快速之注膠=法及= 【先前技術】 的相:tt!子製造業技術的不斷進步’製造過程中各環節 的相關故備的速度及精密度需求逐漸提高,用來封裝帝 兀件的注膠設備亦隨之產生對應需求。 弘 如第一圖所不,係為一種習用自動注膠設備1,其大 匕括有承載台1 1、一移位裝置1 2、一注膠機1 3 及=演算單元1 4。此承載台1丄具有供放置待注膠之電 :元件之一上表面丄丄丄,·移位裝置1 2則具有設置承載 :11上之一基座121、及位於上表面111上方之— 定位#1 22 ’定位臂1 22可相對上表面於χ、γ、ζ· 方向上移動;而注膠機具有設於移位裝置2 2定位臂丄2 f上之一可拆卸之膠搶i 3 i、與一加壓器丄3 2,其膠 知1 3 1内填充有膠,而其針頭2 3丄2係垂直面對承載1301658 VIII. If there is a chemical formula in this case, please disclose the chemical formula of the most obvious characteristics. 9. Description of the Invention: The present invention relates to a rapid alignment method and a device thereof, and provides With the automatic detection of the alignment and rapid injection of glue injection = method and = [previous technology] phase: tt! sub-manufacturing technology continues to advance 'the speed and precision requirements of the relevant requirements in the various stages of the manufacturing process gradually Improvements, the injection molding equipment used to package the emperor parts will also have corresponding requirements. As shown in the first figure, Hong is a conventional automatic glue injection device 1, which mainly includes a carrying table 1 1 , a shifting device 1 2 , a glue filling machine 1 3 and a = calculating unit 14 . The carrying platform 1 has an electric device for placing the glue to be injected: one of the upper surfaces of the component, and the shifting device 12 has a mounting carrier: a base 121 on the upper surface 111 and above the upper surface 111. Positioning #1 22 'positioning arm 1 22 can move relative to the upper surface in the direction of χ, γ, ζ ·; and the glue injection machine has a detachable glue provided on the positioning arm 丄 2 f of the displacement device 2 2 3 i, and a pressurizer 丄 3 2, the glue knows that 1 3 1 is filled with glue, and the needle 2 3 丄 2 is vertically facing the bearing

1301658 :1 1之上表面1 1 1 ’該演算單元1 4係絲控制移位 衣置1 2之定位臂1 2 2於Χ、γ、ζ軸方向上之移位。 如此,當待注膠之電子元件置放於承載台1 1之上表 面1 1 1後,分別調整演算單元14f"、Y、z軸方向: 位移值:就可以使膠搶i3隨移位裝置工2移動至待注膠 之電子元件上方,而後注膠機丄3之加壓器1 3 2作動, j使膠搶1 3 1内的膠由針頭! 3丄丄溢出至待注膠之電 二件上,進行注膠作業。如此,利用演算單元1 4與移 2 ’使膠搶1 3 1可自動移動定位,便於使用者 進仃自動化之注膠作業。 待J二ΓΓ寅算單元14使膠搶131自動移位至 ^如之琶子兀件上’使用者需明確知道目 ΐ待注膠之電子元件的相關位置,使能輸人正確的= 二:般未操作前膠搶131所處之-備用位置座標 fr ,〇),並妓待注膠之電子^件置放於-1 膠例如(5 0,5 0,5 0 )者 叹疋刼作該位移量,以驅動膠搶丄3 i運行。 然而,電子元件之微型化,使 小,實際相對座標猶有偏差,盈縮 正確移位至待注膠之電子元件致m31無法 用者不查膠搶131的實際備二(〇舉=而:使 定座標原點(0,〇,〇),則膠搶為而非預 0, 5 0, 5 D】並非待注勝之 達位置【例如(5 5 〇),即會造成注膠位置不==的位!(5 〇:5〇, 有經驗之工作人員,藉由嘗 二目:業者常僱用 、’曰决之方式,在數分鐘内完 1301658 成校準定位之動作,但此種校準方式不但浪費時間、同時 需仰賴資駐員之調整經驗,違反了自動化潮㈣趨勢。 尤其’當關機或膠搶1 3 1内的膠耗盡時,則須將膠 知1 3 1自定位臂1 2 2拆離’以冷藏、灌膠或者更換一 管膠搶1 3 1。再重新開機使用前’須重新將膠搶丄31 裝設於注膠機1 3之定位臂i 2 2上’以供注膠作用使 用。如此’反覆拆裝騎i 3丄使其位置偏移的機率大幅 立曰加,並使注膠作業良率與速度難以有效提高。 【發明内容】 •皿於此’本發明即在提供—種可以於注膠作業前先 =對位料,即可解決上述之缺失,利用影像操取 衣ΰ又置於忒注膠機上,並可擷取待注膠之電子元件 :::之相對位置’並作為對位之依據,可降低注膠位置 不正確之缺點,並可提高注膠速度。 勺人f達:h述目的,本發明之快速對位注膠裝置,係至少 =有可供置放待注膠電子元件之承載台、移位裝置、 林機、影像擷取裝置以及演算單元,由移絲動 :機:影像操取裝置,並由影像操取裝置擷 二 =、版成像位置,並將該成像位置傳送至心 X、”二:::Γ該Γ位置轉換為座標值,並計算 位動作,使注膠機可受置使其t適當之移 上方而進行注膠,以 =V力至待注膠電子元件 凡成決速且對位正確之注膠作業。 (s) 7 1301658 【實施方式】' 毳 、為缺責審查委員请楚— 及貫施方式,兹配合圖式說明如^要技術内谷,以 本發明「快速對位注膠及 第三圖所示,至少包含有· 去及,、衣置」,如弟二圖及 一承載台2 0,Vi班‘ # -載台2 0並可受lit/ 膠電子元件80,該承 作,請同時泉閱第二 4 0而作γ軸方向橫移之動 受演算單707 G之控制而移動。其私位敕置4 0係可 v/夕位^置4◦,該移位裝置4Q係至少包含有X 轴、γ軸及z轴移動裝置41、4 二;有/ 本實施例中兮x虹^ J 滑執44, q n 軸、Y軸及z軸移動裝置4 1、4 2、4 w相、it服馬達’亚可纽膠機5 Q以及影像操取裝置 目連1ί ’可使注膠機5 ◦及影像操取裝置6 〇作χ、z 向之移位(請同時參閱第五圖及第六圖所示)。 -注膠機5 〇 ’垂直設置於承載台2 〇上,可受移位 Γ置1〇之帶動至待注膠電子元件2 q上方而進行注膠, 5玄/主膠機^ 0至少包含有至少一個之針頭5 1、膠筒5 2 加壓$ 5 3 ’如本圖實施例中,係具有二個針頭5 1、 膠同5 2以及加壓器5 3,其注膠機5 〇處並進—步設 有微調裝置5 4,可微量調整注膠機5 〇χ、γ轴之位^。 土 一影像擷取裝置6 0,其至少包含有設於注膠機5 〇 罪近上方位置之定位攝影機6工,以及可擷取各個針頭已 1之檢查攝影機6 2,其影像擷取裝置6 〇可受移位裝置 (S) 8 l3〇l658 4 〇之帶動至待注膠電子元件8 〇上 、6 1絲該待注膠f子元件 /彳用定位攝影機 :"亥成像位置傳送至演算單元7〇,而丄之並 二ί::頭否確實將膠滴落於待注膠:子元件: 敌。可進—步將影像傳送至監視螢幕63並播 一凋异單元7 〇,接收影像擷 像位置,計算χ、γ轴方向之位::取tf60所傳送之成 〇使其作適當之移位動作。 L至移位裝置4 括有= 夬速對位注膠之方法,如第七圖所示,係^ 時丄f待:膠電子元件8 〇置放於承載台2 0上,請同 弟一圖及弟八圖所示’該待注膠電子元件8 〇係分 :注膠區域8 1、8 2、8 3,而各注膠區域並呈有 複數個朝X、γ軸排列整齊之注膠部8 4。 百姑1、、由移位裝置4 〇帶動影像掏取裝置6 0移動,並擷 左膠電子凡件8 〇之χ、γ轴成像位置,如第八圖實 鉍例所不,利用定位攝影機擷取定位出注膠區域8 1中X、 Y軸之成像位置(亦即對角線之位置)。 二、。將待注膠電子元件8 kX、Y軸之成像位置傳送 至演算單元7 Q,將其轉換成座標值,並計算χ、γ轴 之位移值。 4 〇卜凟异單元7 〇將計算過後之位移值傳送至移位裝置 、利用移位裝置4 0之X、Υ軸移動裝置4丄、4 2 1301658 制左膠機5 0於χ軸或、γ軸方向移位’令該注膠機5 〇 先於X軸方向進行注膠作業,再朝γ軸方向橫移作另一 χ 軸方向排列之注膠部8 4的注膠作業。 b d之,主恥動作丽,即重複上述B〜£之動作, ==或82、8 3之注膠作業;當然,該軸 可先操取注膠區域中每—注膠部之影像,並傳送 一、、早元‘可以預先得知每—注膠部之狀況,若有其中 毀壞’則使注膠機於該注膠部上不進行注膠動作。 所-Α ’该承載台2 〇—側設有—載板2 1,如第九圖 所不,其可供注膠機5 0預先注膠 f :62:r取其㈣上之膠球211大小 ΐ及:梅像傳送至演算單元7 0,由演算單元7〇:; 機60於χ'γ、;^^ 4卜43’使注膠 離,故當更換針頭^^==載板21間之最佳距 式可調整針頭51與待注二】用上述之調整方 上Μ, 、行!恥電子凡件80間之距離。 如弟十圖所示為本發明之另一杏 2 0可以進-步受移動裝置9 〇之::二該承載台 子元件8 〇 一一進料沒屮4』9 〇之τ動而形成將待注膠電 有驅動件91、傳重^^其移動裝置9〇係至少包含 子元件嶋置 驅動件91以及傳動件92之帶動而形成;:件上!則受 9 3輸送待_電子元件 :卜4达件 口疋位置處,該影像擷取 1301658 裴置6 0受X軸及γ軸移動褒置4 ^ 膠電子元件80上方,利用定位攝影機主 ㈡8 成像位置,並將該成像以 至凟#早兀,接收衫像擷取 專k 計算[Y轴方向之位移值,並傳送0至:^1301658: 1 1 upper surface 1 1 1 ' The calculation unit 1 4 wire controls the displacement of the positioning arm 1 2 2 of the garment 1 2 in the Χ, γ, ζ axis directions. Thus, when the electronic component to be glued is placed on the upper surface 11 1 of the carrying platform 1 1 , the arithmetic unit 14 f ", Y, z axis direction is respectively adjusted: displacement value: the glue can be grabbed i3 with the shifting device Work 2 moves to the top of the electronic component to be glued, and then pressurizer 1 3 2 of the glue injection machine 作3, j makes the glue grab the glue in 1 3 1 from the needle! 3丄丄 Spilled onto the two pieces of electricity to be glued, and the glue injection operation was carried out. In this way, the calculus unit 1 4 and the shift 2 ′ can be used to automatically move and position the glue, so that the user can enter the automated glue injection operation. After the second calculation unit 14 automatically shifts the glue grab 131 to the 琶 兀 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' : Generally, before the operation, the rubber is grabbed at 131, the spare position coordinates fr, 〇), and the electronic parts to be glued are placed in -1 glue, for example (5 0, 5 0, 5 0 ) The amount of displacement is used to drive the glue to run. However, the miniaturization of the electronic components makes the small, actual relative coordinates still biased, and the correct shrinkage of the profit and shrinkage to the electronic components to be injected, so that the m31 cannot be used without checking the actual number of the rubber grabs 131 (〇举=而: If the origin of the coordinates (0, 〇, 〇) is fixed, then the glue is grabbed instead of pre-zero, 5 0, 5 D] is not the position to be won (for example, (5 5 〇), it will cause the injection position not = = position! (5 〇: 5〇, experienced staff, by the taste of the second: the industry often employs, 'decisive way, in a few minutes to complete 1301658 into a calibration positioning action, but this calibration method Not only is a waste of time, but also depends on the adjustment experience of the resident staff, which violates the trend of automation (4). Especially when the glue in the shutdown or glue grab 1 1 1 is exhausted, the glue must be known 1 1 1 self-positioning arm 1 2 2 detachment 'to refrigerate, glue or replace a tube of glue to grab 1 3 1. Before restarting the use of 're-removing the glue 丄 31 installed on the positioning arm i 2 2 of the glue injection machine 1' It is used for the injection of glue. It is so difficult to disassemble and disassemble the rider, and the probability of positional deviation is greatly increased, and the yield and speed of injection work are difficult. In order to effectively improve the content of the present invention, the invention can provide the above-mentioned defects before the injection molding operation, and the above-mentioned defects can be solved by using the image manipulation. On the glue machine, the electronic component to be glued::: relative position ': and as the basis of the alignment, can reduce the disadvantage of incorrect injection position, and can improve the injection speed. h for the purpose, the quick-alignment injection molding device of the present invention is at least = a loading table, a displacement device, a forest machine, an image capturing device and a calculation unit for placing electronic components to be glued, and moving by wire : Machine: Image manipulation device, and the imaging operation device 撷2 =, the imaging position, and the imaging position is transmitted to the heart X, "2:::" The position is converted into a coordinate value, and the position action is calculated. In order to allow the glue injection machine to be placed so that it is properly moved upwards to perform the injection molding, and the pressure of the electronic component to be injected is determined to be the final speed and the alignment is correct. (s) 7 1301658 Ways] ' 毳 为 为 缺 缺 缺 缺 缺 缺 缺 — — — — — — — — — For example, if you want to use the technology, you can use the "fast-alignment injection and the third picture, at least include, go, and clothes", such as the second figure and a carrying table. - The stage 20 can be subjected to the lit/adhesive electronic component 80. The bearing is moved to the second 40 and the movement in the γ-axis direction is controlled by the calculation of the calculation sheet 707 G. The shifting device 4Q includes at least an X-axis, a γ-axis, and a z-axis moving device 41, 4; and has / in this embodiment 兮x rainbow ^ J sliding 44, qn axis, Y-axis and z-axis moving device 4 1, 4 2, 4 w phase, IT service motor 'Asian rubber machine 5 Q and image manipulation device can be connected to 1 ί ' can make glue machine 5 ◦ And the image manipulation device 6 is shifted by z and z (please refer to the fifth and sixth figures at the same time). - The glue injection machine 5 〇' is vertically disposed on the carrying table 2 ,, and can be injected by the displacement device 1 上方 to the top of the electronic component 2 q to be injected, and the 5 玄/主胶机 ^ 0 contains at least There are at least one needle 5 1 , and the cartridge 5 2 is pressurized by $ 5 3 '. In the embodiment of the figure, there are two needles 5 1 , glue 5 2 and presser 5 3 , and the glue injection machine 5 〇 At the same time, there is a fine adjustment device 5 4, which can adjust the position of the 5 〇χ and γ axis of the glue injection machine. The soil image capturing device 60 includes at least a positioning camera 6 disposed at a position near the top of the glue injection machine 5, and an inspection camera 6 2 that can capture each needle 1. The image capturing device 6 〇 can be driven by the shifting device (S) 8 l3〇l658 4 至 to the electronic component to be injected 8 〇, 6 1 wire to be injected f sub-component / 定位 positioning camera: " Hai imaging position transmission to The calculation unit is 7〇, and the 丄 并 ί ::: The head does indeed drop the glue on the glue to be injected: sub-component: enemy. The image can be transferred to the monitoring screen 63 and the fading unit 7 播, the position of the image image is received, and the position of the χ and γ axes is calculated: the 传送 传送 transmitted by tf60 is appropriately shifted. action. The L to shifting device 4 includes a method of idling the positional injection, as shown in the seventh figure, the system is required to be: the plastic electronic component 8 is placed on the carrying platform 20, please Figure 8 and Figure 8 show the electronic component 8 of the glue to be injected: the injection area 8 1 , 8 2 , 8 3 , and each injection area has a plurality of neatly aligned X and γ axes. Glue part 8 4. Baigu 1, the shifting device 4 〇 drives the image capturing device 60 to move, and the left gel electronic device 8 〇 χ, γ axis imaging position, as shown in the eighth figure, using a positioning camera The imaging position (ie, the position of the diagonal line) of the X and Y axes in the injection molding area 81 is located. two,. The imaging position of the 8 kX and Y-axis of the electronic component to be injected is transmitted to the calculation unit 7 Q, converted into a coordinate value, and the displacement values of the χ and γ axes are calculated. 4 凟 凟 单元 单元 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 The shift in the γ-axis direction is such that the glue injection machine 5 performs the injection operation in the X-axis direction, and then traverses the γ-axis direction to perform the injection operation of the injection portion 84 which is arranged in the other axial direction. Bd, the main shame action is Li, that is, repeat the above B~£ action, == or 82, 8 3 glue injection operation; of course, the shaft can first take the image of each injection part in the injection area, and The transmission of one, early yuan 'can be known in advance - the condition of each glue injection part, if there is damage", the glue injection machine does not perform the glue injection action on the glue injection part. The carrier plate 2 is provided with a carrier plate 2 1, as shown in the ninth figure, which can be used for the glue injection machine 50 to pre-fill the glue f: 62: r to take the rubber ball 211 on the (four) Size ΐ and: the plum image is transmitted to the calculation unit 70, and the calculation unit 7〇:; the machine 60 is χ'γ,; ^^ 4 卜 43' to make the injection, so when the needle is replaced ^^== carrier 21 The best distance between the adjustable needle 51 and the to-be-applied two] with the above adjustments, 行, OK! Shame electronic parts 80 distance. As shown in the figure 10, another apricot 20 of the present invention can be further moved by the mobile device 9: 2, the carrier table member 8 is fed without any 』4』9 〇之之动The glue to be injected has a driving member 91, and the moving device 9 is formed by at least the sub-component driving device 91 and the driving member 92; the member is received by the _ electronic component. : Bu 4 reaches the position of the mouth, the image captures 1301658, and the 60 is moved by the X-axis and the γ-axis to the top of the glue electronic component 80. The positioning position of the main camera (2) 8 is used, and the image is imaged. #早兀, Receive the shirt image capture special k Calculate [the displacement value in the Y-axis direction, and send 0 to: ^

輛及z軸移動裝置41、4 、 夕衣置之X軸、Y 當之移位動作,並快速完成對位注膠機50作適 待、、主^子im5 Q可__之形式,直接點至於 待庄月“子兀件8 〇之固定位置 於 示;亦可利用劃膠之形式, 不同指定圖案,如第十一圖所示。 上形成 而該注膠機5 〇可進一步讲 可偵測針頭51之長度,如^貞測載台22’其 2可以利用連接有電;,::t圖所示’該偵測載台2 —動而接觸該偵測載◦帶動針頭5U主下 故接觸偵測載台上:有 =若該針頭金二^ 往下^ ^ ^ " 同樣§注膠機5 0帶動針頭5 ] 彺下-動而接觸該偵測载台2 2時,、5 1 到屢力變化,同樣可以得知針頭之長卢。、° 2感側 之方斤ΐ晋本發明提供—種較^行之快速對位注月雾 之實;:明:圖式 此侷限本發明,是以,兴’、么明較仏只施例者,並非以 等近似、雷同者:屬 , ☆月之創a又目的及申請專利範 1301658 , 1 3 1—膠搶 、 :I 3 1 1 —針頭 13 2 一加壓器 14 --演算單元 ' 2 0 承載台 - 2 1 載板 2 1 1—膠球 2 2--偵測載台 ❿ 4 0——移位裝置 4 1--X軸移動裝置 4 2--Y軸移動裝置 4 3--Z轴移動裝置 4 4---滑軌 5 0--注膠機 5 1--針頭 5 2 —一膠筒 Φ 5 3--加壓器 5 4——微調裝置 6 0——影像擷取裝置 6 1--定位攝影機 6 2--檢查攝影機 6 3--監視螢幕 7 0——演算單元 8 0--待注膠電子元件 8 1--注膠區域 1301658 8 2--注膠區域 8 3--注膠區域 8 4——注膠部 9 0--移動裝置 9 1--驅動件 9 2——傳動件 9 3--輸送件The x-axis moving device 41, 4, the X-axis and Y of the yuyi set are shifted, and the alignment glue injection machine 50 is quickly completed, and the main body is im5 Q can be in the form of __ directly As for the fixed position of the 兀 “ “ “ ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Detecting the length of the needle 51, such as the test stage 22', 2 can be connected with electricity; ,:: t shown in the figure 'the detection stage 2 - moving and contacting the detection carrier to drive the needle 5U main On the lower contact detection stage: Yes = if the needle is gold II ^ down ^ ^ ^ " Similarly § glue machine 50 pushes the needle 5] 彺下-moving and touching the detection stage 2 2 5 1 to the repeated changes, you can also know the length of the needle Lu., ° 2 sense side of the side of the Jin Jin Jin this invention provides a kind of faster than the line of the rapid alignment of the moon fog;: Ming: pattern This limitation of the present invention is based on the fact that Xing' and Miaoming are only used by the applicator, not by similar approximation, similarity: genus, ☆ month's creation and purpose and patent application model 1301658, 1 3 1 - glue , : I 3 1 1 — Needle 13 2 A pressurizer 14 -- Calculation unit ' 2 0 Carrying table - 2 1 Carrier 2 1 1 - Rubber ball 2 2--Detecting stage ❿ 4 0 - Shift Device 4 1--X-axis moving device 4 2--Y-axis moving device 4 3--Z-axis moving device 4 4---slide rail 5 0--gluing machine 5 1--needle 5 2 —one cartridge Φ 5 3--pressurizer 5 4 - fine adjustment device 6 0 - image capture device 6 1--positioning camera 6 2--check camera 6 3--monitor screen 7 0 - calculation unit 8 0-- Plastic component to be injected 8 1--Injection area 1301658 8 2--Injection area 8 3--Injection area 8 4——Gluing part 9 0--Mobile device 9 1--Drive 9 2—— Transmission part 9 3--transport

Claims (1)

1301658 十、申請專利範圍: 1、-種快速對位注膠之方法,係包括有下列步驟: A、將待注膠電子元件置放於承載台上. 膠電 算單1、,:==元件之之成像位置傳送至演 ϋ轉換成座標值,並計算χ、γ軸方向之位移值; 次异早兀將計算過後之位移值傳送至移位裝置; 、利用移位裝置控制注膠機於X、Υ軸方向移位。 # 2、如請求項1所述快速對位注膠之方法, 么士 置含有χ轴、γ轴及 ΊΖ軸移動裝置可與注膠機以及影像操取裝置相連 動作而Υ軸移動裝置及滑執可使承載台作γ軸方向橫移之 3、如請求項!所述快速對位注膠之方法,,兮 移位裝置係至少包含有χ轴、γ軸及ζ軸移動裝置。° / “ 4、如請求項2或3所述快速對位注膠之方法,其中, 该X軸、Υ軸及Ζ軸移動裝置可以為伺服馬達。八 ' 5、如請求項1所述快速對位注膠之方法,其中,該 左膠機係至少包含有至少—個之針頭、膠筒以及加壓器。 6、 如請求項1所述快速對位注膠之方法,並中,哕 影像擷取裝置係至少包含有設於㈣機靠近上綠置之定Λ 位攝影機。 7、 如請求項6所述快速對位注膠之方法,苴中,該 影像操取裝置可進-步包含有可操取各個針頭之檢查攝影 1301658 一 機。 * 8、如請求項7所述快速對位注膠之方法,並中,铉 承載台-側設有-載板,其可供注膠機預先注膠ς其上了 亚由檢查攝影機擷取其載板上之膠球大小及位置之与 亚將該影像傳送至演算單元,由演算 : =與載«之㈣,並㈣該移㈣践轉機於 Ζ軸方向之移動至與載板間之最佳距離。 1、如請求項!所述快速對位注膠之方法,並 影:Γ免有監視勞幕可接收並播放影像擷取裝置所掏取之 對位_之方法’其令, ^元‘二置之帶動而形成將待注膠電 丄1、-種快速對位注膠裝置,至少包 二承載台,可供置放待注膠電子元件. 軸方置,可使注膠機及影像掏取裝置作x、y、z 動至待子於承載台上,可受移位褒置之帶 电于兀件上方而進行注膠; -影像擷取裳置,可受移位裝置 =件上方,以掏取該待注膠電子元件力至:注膠電子 置,並將該成像位置傳送至演算單元,· 軸之成像位 叶曾χ 早凡’接收影像擷取裝置所傳送之成僮 由方向之位移 ::之成像位置, 之移位動作。 I得运至移位裝置使其作適當 16 1301658 修(臭)正替換頁 -1 2、如請求項1 1所述快速對位注膠裝置,其中, 該移位裝置係至少包含有X軸、Y軸及Z軸移動裝置。 1 3、如請求項1 2所述快速對位注膠裝置,其中, 該X軸、Y軸及Z軸移動装Ϊ可以為伺服馬達。 14、如請求項1 1所述快速對位注膠裝置,其中, 该>主膠機係至少包含有至少,個之針頭、膠筒以及加壓器。 1 5、如請求項1 1所述快速對位注膠裝置,其中, 該影像擷取装置係至少包含有設於注膠機靠近上方位置之 •定位攝影機。 1 6、如請求項1 1所述快速對位注膠裝置,其中, 該影像擷取裝置可進一步包含有可擷取各個針頭之檢查攝 影機。 1 7、如請求項1 6所述快速對位注膠裝置,其中, 該承載台一侧設有一載板,其可供注膠機預先注膠於其 上,並由檢查攝影機擷取其載板上之膠球大小及位置之影 像,並將該影像傳送至演算單元,由演算單元計算及換算 • 該注膠機與載板間之距離,並控制該移位裝置使注膠機於 X、Y、Z軸方向之移動至與載板間之最佳距離。 1 8、一種快速對位注膠裝置,至少包含有·· 一承載台,可供置放待注膠電子元件; 一移位裝置,可使承載台γ作軸方向之移位,以及注 膠機及影像擷取裝置作X、Z軸方向之移位; 一注膠機,垂直設置於承载台上,可受移位裝置之帶 動至待注膠電子元件上方而進行注膠; -影像擷取裝置,可受移位裝置之帶動至待注膠電子 1301658 j/f1月W日綠(勒正替換叫 -元件上方,以擷取該待注膠電子元件之X、γ軸之成像位 ' 置,並將該成像位置傳送至演算單元; • 一演算單元,接收影像擷取裝置所傳送之成像位置, 計算X、Y軸方向之位移值,並傳送至移位裝置使其作適當 之移位動作。 1 9、如請求項1 8所述快速對位注膠裝置,其中, 該移位裝置係至少包含有X軸、Y軸及Z軸移動裝置以及 滑執,其X、Z轴移動裝置可與注膠機以及影像擷取裝置相 • 連結,而Y軸移動裝置及滑軌可使承載台作Y軸方向橫移 之動作。 2 0、如請求項1 1或1 8所述快速對位注膠裝置, 其中,該注膠機可利用點膠之形式,直接點至於待注膠電 子元件之固定位置。 2 1、如請求項1 1或1 8所述快速對位注膠裝置, 其中,該注膠機可利用劃膠之形式,於待注膠電子元件上 形成不同指定圖案。 • 2 2、如請求項1 4所述快速對位注膠裝置,其中, 該承載台上可進一步設置有一偵測載台,其可偵測針頭之 長度。 181301658 X. Patent application scope: 1. The method of quick-alignment injection molding includes the following steps: A. Place the electronic component to be injected on the carrying platform. The glue calculation unit 1, 1, :== component The imaging position is transmitted to the deductive conversion into a coordinate value, and the displacement values in the χ and γ axis directions are calculated; the second premature 兀 transmits the calculated displacement value to the displacement device; and the displacement device controls the glue injection machine X, the axis direction shift. #2. According to the method of fast-alignment injection according to claim 1, the mobile device includes a χ-axis, a γ-axis and a ΊΖ-axis moving device, which can be connected with the glue injection machine and the image manipulation device, and the yaw axis movement device and slide Can make the carrying platform traverse the γ axis direction, such as the request item! In the method of rapid alignment injection molding, the 移位 shifting device comprises at least a χ axis, a γ axis and a ζ axis moving device. ° / "4. The method of fast-alignment injection according to claim 2 or 3, wherein the X-axis, the x-axis and the x-axis moving device may be a servo motor. Eight '5, as described in claim 1 The method of aligning the glue, wherein the left glue machine comprises at least one needle, a rubber cylinder and a pressurizer. 6. The method of fast alignment aligning according to claim 1, and 哕The image capturing device comprises at least a fixed position camera disposed on the (4) machine near the green setting. 7. The method of rapidly aligning the glue according to claim 6, wherein the image capturing device can be further advanced. Included in the inspection photography 1301658 for each needle. * 8. The method of quick-alignment injection as described in claim 7, and the carrier-side is provided with a carrier plate for injection molding. The machine is pre-filled and the camera is transferred to the calculation unit by the inspection camera to capture the size and position of the rubber ball on the carrier. The calculation is: = and the load «(4), and (4) the shift (4) Move the machine in the direction of the x-axis to the optimal distance from the carrier. 1. As requested in the item! The method of speed-alignment injection molding, and the shadow: the method of monitoring the screen can be received and played by the image capturing device _ the method of 'the order, ^ yuan' two sets of driving to form a note Glue 丄1, a kind of quick-alignment injection molding device, at least two carrying tables, which can be used for placing electronic components to be injected. The axis is placed so that the glue injection machine and the image capturing device can be used for x, y, z. Moving to the standby on the carrying platform, the displacement device can be charged above the element to perform the injection; the image capturing device can be received by the displacement device = above the piece to capture the glue to be injected The electronic component is forced to: electronically place the injection, and transmit the imaging position to the calculation unit. · The imaging position of the axis Ye Zengχ The displacement of the adult-oriented direction transmitted by the receiving image capturing device:: the imaging position , the shifting action. I is transported to the shifting device to make the appropriate 16 1301658 repair (smell) positive replacement page-1 2. The quick-alignment injection molding device according to claim 1 1 wherein the shifting device The system includes at least an X-axis, a Y-axis, and a Z-axis moving device. 1 3. Fast-alignment injection molding as described in claim 1 The X-axis, the Y-axis, and the Z-axis moving device may be a servo motor. 14. The quick-alignment injection device according to claim 1 , wherein the main glue machine comprises at least at least a needle, a cartridge, and a pressurizer. 1. The quick-alignment gel-injecting device according to claim 1 , wherein the image capturing device comprises at least a position near the top of the glue filling machine. The positioning camera is provided. The quick-alignment injection molding device according to claim 1 , wherein the image capturing device further comprises an inspection camera capable of capturing each needle. 1 7. As claimed in claim 16. A quick-alignment injection molding device, wherein a side of the loading platform is provided with a carrier plate for pre-filling the glue injection machine thereon, and the image of the size and position of the rubber ball on the carrier plate is captured by the inspection camera And transmitting the image to the calculation unit, calculating and converting by the calculation unit • the distance between the glue injection machine and the carrier, and controlling the displacement device to move the glue injection machine in the X, Y, and Z directions The optimal distance between the carriers. 18. A quick-alignment injection molding device, comprising at least one loading platform for placing electronic components to be injected; a displacement device for displacing the bearing γ in the axial direction and injecting glue The machine and the image capturing device are shifted in the X and Z directions; a glue injection machine is vertically disposed on the carrying platform, and can be injected by the displacement device to the electronic component to be injected; The device can be driven by the displacement device to the electron to be injected 1301658 j/f1 month W green (the positive replacement is called - above the component to capture the imaging position of the X, γ axis of the electronic component to be injected] And transmitting the imaging position to the calculation unit; • an arithmetic unit that receives the imaging position transmitted by the image capturing device, calculates the displacement value in the X and Y axis directions, and transmits the displacement value to the shifting device for proper shifting The quick-alignment injection molding device according to claim 18, wherein the displacement device comprises at least an X-axis, a Y-axis, and a Z-axis moving device, and a slipper, and the X and Z axes are moved. The device can be connected to the glue applicator and the image capture device, and Y The axis moving device and the slide rail can make the bearing table traverse in the Y-axis direction. 20. The quick-alignment glue injection device according to claim 1 1 or 18, wherein the glue injection machine can utilize the dispensing glue The form is directly pointed to the fixed position of the electronic component to be glued. 2 1. The quick-alignment injection molding device according to claim 1 1 or 18, wherein the glue injection machine can use the form of the glue to be injected A different designation pattern is formed on the plastic electronic component. 2 2. The quick-alignment injection molding device according to claim 14, wherein the detection platform is further provided with a detection carrier that can detect the length of the needle. 18
TW095114028A 2006-04-20 2006-04-20 Fast aligning and glue dispensing method and apparatus thereof TW200741992A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558470B (en) * 2015-05-20 2016-11-21 鴻騏新技股份有限公司 Horizontal glue dispensing device with automatic trimming dispensing-path and method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558470B (en) * 2015-05-20 2016-11-21 鴻騏新技股份有限公司 Horizontal glue dispensing device with automatic trimming dispensing-path and method thereof

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