13〇〇481 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種測試分類裝置，特別是指一種立 體轉盤式的測試分類裝置。 【先前技術】 一個完整的積體電路（1C)製造，概可包括初期的積體電 路設計（IC Design)與晶圓製造（Wafer Fabricati〇n)，中期的 晶圓測試（Wafer Sorting)與封裝（Assembly & Packaging)，及 後期的最終測試（Final Test)與產品出貨（Shipmem)。 在積體電路日益微小化的同時，上述積體電路的製程 /、在每一個製程階段都相當重要。其中，於後期的最終測 试乃是積體電路於封裝後，用以測試封裝完成產品的電性 功能，以保證出廠的積體電路功能上的完整性，並對已測 试的產品依其電性功能分類（即& Bin)，以作為ic不同等 級產品的評價依據。 電性功能測試乃針對產品之各種電性參數進行測試以 確保產品能正常運作，用於測試之系統設備將根據產品不 同之測試項目而载入不同之測試程式，能在所賦予最糟的 %境定義下’保證半導體元件（根據最初設計的功幻能 正常的工作，並予以分類。 b13 〇〇 481 IX. Description of the Invention: [Technical Field] The present invention relates to a test classification device, and more particularly to a test and classification device for a stereo turntable. [Prior Art] A complete integrated circuit (1C) manufacturing can include initial IC design and wafer fabrication (Wafer Fabricati〇n), mid-term wafer testing (Wafer Sorting) and packaging. (Assembly & Packaging), and later final test (Final Test) and product shipment (Shipmem). At the same time as the integrated circuit is becoming smaller and smaller, the process of the above integrated circuit / is very important in each process stage. Among them, the final test in the later stage is to test the electrical function of the packaged product after packaging, to ensure the functional integrity of the factory integrated circuit, and to test the product according to its The electrical function classification (ie & Bin) is used as the basis for evaluation of different grades of ic products. The electrical function test is to test the various electrical parameters of the product to ensure that the product can work normally. The system equipment used for testing will load different test programs according to different test items of the product, and the worst % can be given. Under the definition of 'guarantee semiconductor components (according to the original design of the work can work properly and classified. b
如圖1所示’習知歸測試半導體構裝元件1G 分類裝置（HandleiOl，包含一工作I二n 、 么 工作十台11、一位於該工作」 :U側邊並可用於容置所述半導體構裝元件的供料[ 、四並排地與該供料E12相間隔的分類E13、四間隔言As shown in Fig. 1, the conventional semiconductor component 1G classification device (HandleiO1, including a working I2, a working ten, 11 in the work): U side and can be used to accommodate the semiconductor The supply of the component (the classification E13, the fourth interval which is spaced apart from the supply E12 side by side)
1300481 置該工作平台11上的測試公板14，及一設置在該工作平台 11上並介於所述的供料匣12、分類匣13與測試公板η之 間的輸送單元15。 母一測試公板14形成有一可供單一半導體構裝元件1〇 肷插的測试槽141，該輸送單元15具有一沿該工作平台11 邊緣滑移並鄰近於所述的供料匣12與分類匣13的第一滑 移組151、一可橫向於該第一滑移組151滑移的第二滑移組 152及15又置在忒第一滑移組152上並可吸取所述半導體 構裝元件10的吸取頭153。藉由該第一、二滑移組151、 152的移動配合，使該吸取頭153可將所述的半導體構裝元 件10自該供料E 12取出，並置放於每一測試公板14上的 測試槽14卜進行各種㈣參數的_。待完成測試之後， 再將該半導體構裝元件H)取出，依據測試的結果予以分類 ，並放置於適當的分類匣13中。 由上述說明可知，習知的測試分類裝置」在操作與設 置上具有下列幾項缺點·· /' - Η Μ是橫向 間隔排列，若是需要增加測試公板i 、 ^ , . ^ I j 1U数日Τ，則必須繼 續検向地向外延伸’而需佔用較大平面空間，特別 今吋土吋金的時代，一個測試廠房要容置 八1 a w I 馬數眾夕的測試 为類裝置1，相對也須較大的土地 所需的營運成本。 積也因此大幅地提高 半導 二、難以有效地縮㈣丨試時間：利用該輸送單3 體構裝元件10從該置料Ε 12搬移至測試公板 15將 進行 6 1300481 :設置在該中心轴上並可繞該中心軸轉動的轉盤，該取料 單元可將所述的半導體構裝元件於該置料單元與該轉塔單 凡之間進行搬移，該測試介面單元設置在該轉塔單元之每 一轉盤上並與該測試設備電連接，並可供所述的半導體= 裝元件嵌合連接。 # 利用該取料單元將待測試的半導體構裝元件，從該置 料早几搬移至該轉塔單元上的測試介面單元進行電性測試 ，之後，再將完成測試之半導體構裝元件搬移該置料單元 上並進行分類。 本t月之功效在於利用設計成圓盤狀的轉盤，以縮小 所佔用的平面H $時，#由該等轉盤的轉動速度不同 亦可減少該取料單元移動的距離並縮短等待取貨的時間 甘使侍搬移半導體構装元件的時間可以有效地縮短，進而 提回產旎，降低成本，藉以增加競爭力。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 、下配a參考圖式之四個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明中’類似的元件是以相同的編號來表示。 如圖2所示，本發明轉盤式測試分類裝置之一第一較 仏只施例’是與一測試設備（Tester)2電連接，適於測試複 數半導體構裝元件3。該測試設備2主要是能對所述的半導 體構衣元件3進行電性測試與特性分析，該轉盤式測試分 1300481 類裝置包含一置料單元4、一轉塔單元5、一取料單元6、 一測試介面單元7，及一控制器8。 該置料單元4具有五個上下相疊置的置料匣41，該等 置料S 41是用於放置所述的半導體構裝元件3，例如是盛 裝成盤之態樣，方便整盤取走或置放。該等置料匣41至少 可分成待测試與測試完成兩個部分，其中，完成測試的半 導體構襞元件3更可依產品級次、良品與否分裝在不同的 置料E 41 ’以達到分類的目的。在該第一較佳實施例中， 所述的置料匣41是相互堆疊，當然，所述的置料匣41也 可以疋平放排列，較佳地，是以圍繞該取料單元6排列。 另外，睛特別注意本較佳實施例所使用之置料匣41的個數 是取決於所需的分類項數，實際實施時，當然也可以只有 一個置料匣41，而以分區域的方式進行分類，不應以此為 限。 "亥轉塔單元5具有一直立的中心軸51，及複數上下相 間隔地設置在該中心軸51上的轉盤52，每一轉盤U可繞 忒中心軸51轉動。在該第一較佳實施例中，是以三個轉盤 52為例，實際使用上是以產量的需求作為個數的設置依據 ’當然也可以只有一個轉盤52，不應以此為限。值得一提 的疋’貫際設計上，也可以令所述轉盤52可相對該中心軸 51上下移動，以增加操作的彈性。 該取料單元6是介於該置料單元4與該轉塔單元$之 ，，可將所述之半導體構裝元件3於該置料單& 4與該轉 塔單元5之間搬移，該取料單元6具有一直立的主軸6卜 9 1300481 ::相對該主軸61作上下移動的滑移件62、—可相對該滑 =Q轉動的轉動件63,及二分別在該轉動件幻兩端部 上移動並可捉取所述半導體構裝元件3的取料件料。A test board 14 on the work platform 11 and a transport unit 15 disposed on the work platform 11 and interposed between the supply magazine 12, the sorting magazine 13 and the test board η. The mother-test test board 14 is formed with a test slot 141 for the single semiconductor component 1 to be inserted, the transport unit 15 having a slide along the edge of the work platform 11 adjacent to the feed port 12 and The first slip group 151 of the class 13 and a second slip group 152 and 15 which are slidable transversely to the first slip group 151 are further disposed on the first slip group 152 and can suck the semiconductor The suction head 153 of the component 10 is constructed. The suction head 153 can take the semiconductor component 10 out of the feed E 12 and place it on each test board 14 by the movement of the first and second slip groups 151 and 152. The test slot 14 is _ for various (four) parameters. After the test is completed, the semiconductor component H) is taken out, sorted according to the results of the test, and placed in an appropriate classification 匣13. As can be seen from the above description, the conventional test classification device has the following disadvantages in operation and setting. · / - - Η Μ is horizontally spaced, if it is necessary to increase the test board i, ^, . ^ I j 1U number In the future, it must continue to extend outwards to the ground and need to occupy a large flat space. Especially in the era of earth and soil, a test plant should accommodate eight 1 aw I horses. Relatively, the operating costs required for larger land are also required. Therefore, the product is greatly improved, and it is difficult to effectively shrink. (4) Test time: the transfer of the transport unit 3 from the magazine 12 to the test board 15 will be carried out 6 1300481: set at the center a turntable on the shaft and rotatable about the central axis, the reclaiming unit can move the semiconductor component between the receiving unit and the turret, and the test interface unit is disposed on the turret Each of the turntables of the unit is electrically connected to the test device and is splicably coupled to the semiconductor=mounting component. #Using the reclaiming unit to move the semiconductor component to be tested from the pre-loading material to the test interface unit on the turret unit for electrical testing, and then moving the semiconductor component to be tested. Sort and sort on the unit. The effect of this month is to use the turntable designed to be disc-shaped to reduce the occupied plane H $, # by the rotation speed of the turntables can also reduce the distance of the reclaiming unit moving and shorten the waiting for picking up Time can make the time for shifting the semiconductor component to be effectively shortened, thereby reducing the cost and increasing the cost, thereby increasing competitiveness. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. As shown in Fig. 2, one of the first rotary type test classification devices of the present invention is electrically connected to a tester 2 for testing the plurality of semiconductor package components 3. The testing device 2 is mainly capable of performing electrical testing and characteristic analysis on the semiconductor coating component 3, and the rotary testing device 1300481 type device comprises a loading unit 4, a turret unit 5, and a reclaiming unit 6. , a test interface unit 7, and a controller 8. The loading unit 4 has five upper and lower stacked magazines 41 for placing the semiconductor component 3, for example, in the form of a tray, which facilitates the whole tray. Walk or place. The loading magazines 41 can be divided into at least two parts to be tested and tested, wherein the semiconductor structure elements 3 that have been tested can be further divided into different materials E 41 ' depending on product grade, good quality or not. Achieve the purpose of classification. In the first preferred embodiment, the loading magazines 41 are stacked on each other. Of course, the magazines 41 can also be arranged in a flat manner, preferably arranged around the reclaiming unit 6. . In addition, it is particularly noted that the number of the magazines 41 used in the preferred embodiment depends on the number of classification items required. In actual implementation, of course, there may be only one magazine 41, but in a sub-region manner. Classification should not be limited to this. The "Hair turret unit 5 has a central axis 51 that is standing upright, and a plurality of turntables 52 that are spaced apart from each other on the central axis 51, and each of the turntables U is rotatable about the central axis 51. In the first preferred embodiment, three turntables 52 are taken as an example, and the actual use is based on the requirement of the output as a number. Of course, there may be only one turntable 52, which should not be limited thereto. It is worth mentioning that the turntable 52 can also move the dial 52 up and down relative to the central axis 51 to increase the flexibility of the operation. The reclaiming unit 6 is interposed between the loading unit 4 and the turret unit $, and the semiconductor component 3 can be moved between the loading list & 4 and the turret unit 5, The reclaiming unit 6 has an upright main shaft 6 9 1300 481 :: a sliding member 62 that moves up and down with respect to the main shaft 61, a rotating member 63 that is rotatable relative to the sliding = Q, and two respectively in the rotating member The take-up material of the semiconductor component 3 is moved on both ends.
在该第-較佳實施例中，該滑移件62是利用線性馬達 直線移動，㈣也可以應用其他類型的直線器。該二取 料64是利用氣/㈣的方式，在該轉動件^上進行直線 的移動，但也可以是利用電動馬達帶動的方式，作直線移 動。該二取料件64是透過真空吸力的方式，將單—個半導 體構裝元# 3賴起來’但也可透過機 式 單一個半導體構裝元件3夾取起來。 式將 需說明的是，在實際操作上，也可以不設置該滑移件 仏即該轉動件63是僅可相對於該主軸61轉動而不會在 軸61上移動，同樣可以達到將所述的半導體構裝元件 3於該置料單元4與該轉塔單元5間搬移之目的。 /在實際執行時，該置料單元4的置料匣41可與該轉塔 早凡5之轉盤52高度相對應，可以同時進行所述之半導體 構袭元件3的取出與放下，可減少些許時間。當然，其高 度也可以不相對應，應注意的是，在該轉動件63轉動時， 以不撞擊該置料單元4或是該轉塔單元5為限。 如圖3、4所示，並配合圖2，該測試介面單元7是以 模組化設計的方式設置，並具有複數設置在每一轉盤52上 並與該測試設備2電連接的測試插座71，及複數分別可拆 離地與該複數測試插座71插設連接的測試模組72。每一測 試模組72具有一與該測試設備2電連接的測試公板72ι， 10 1300481 及一形成於該測試公板721上並可供單一半導體構裝元件3 甘欠插的測試槽722。所述的測試公板721是可以對每一個半 導體構裝元件.3進行公板測試，並筛選出通過公板測試之 半導體構裝元件3，並依品質等級加以分類，以確定其須具 備有的功旎。在該第一較佳實施例中，每一個測試模組Μ 疋圍繞該轉塔單元5之中心軸51排列成圈，即在每一轉盤 52上，又置十二個測試模組72，在實際使用時，所設置的個 • 數疋以產量的需求作為依據，不應以此為限。 忒控制8是與該轉塔單元5之每一轉盤52電連接， 用以分別控制其轉動速率，該控制器、8亦與該取料單元6 之滑移件62、轉動件63、取料件討等構件電連接，用於 控制這些構件的運動，使得每一轉盤52、滑移件Μ、轉動 件63與取料件64能相互配合，U完成所述之半導體構裝 兀件3的電性測試。實際上，該控制器8也可以設置在該 測試設備2中將功能整合在一起。 • 在進行所述的半導體構裝元件3電性測試時，首先， 是利用該取料單元6之取料件64，將放在該等置料！£ 41中 的待測試半導體構裝元件3吸附取出，接著，控制該滑移 件62與轉動件63的作動，使該半導體構裝元件3可轉至 其中之測δ式模組72上並置入該測試槽722中。若該等置 料H 4丨是與該㈣盤52的高度對麟，财將該半導體 構裝元件3嵌人時，可同時利用位於該轉動件63另-端部 的取料件64將另-個待测試的半導體構|元件3吸附上來 ，以減少該取料單元6的作動次數，進而縮短麗。 I3〇〇48i 而後，透過該測試設備2中内定的測試程式對該半導 體構裝元件3進行電性功能檢測。最後，依照其檢測後的 結果，傳送至該控制器8，以控制該滑移件62與轉動件63 的作動，讓完成測试的半導體構裝元件3再轉回該置料單 元4,並放置於適當的置料匣41中，即可完成所述半導體 構裴元件3的測試與分類。In the first preferred embodiment, the glide member 62 is linearly moved by a linear motor, and (iv) other types of linearizers can be applied. The two stocks 64 are linearly moved on the rotating member by means of gas/(four), but may be linearly moved by means of an electric motor. The two take-up members 64 are vacuum-absorbed to separate the single-semiconductor components #3, but can also be sandwiched by a single semiconductor component 3. It should be noted that, in actual operation, the sliding member may not be provided, that is, the rotating member 63 is only rotatable relative to the main shaft 61 without moving on the shaft 61, and the same can be achieved. The semiconductor component 3 is transferred between the loading unit 4 and the turret unit 5. / In actual execution, the loading cassette 41 of the loading unit 4 can correspond to the height of the turntable 52 of the turret, and the semiconductor scribing element 3 can be simultaneously taken out and lowered, which can be reduced a little. time. Of course, the height may not correspond to each other. It should be noted that when the rotating member 63 is rotated, it is not limited to hit the loading unit 4 or the turret unit 5. As shown in FIGS. 3 and 4, and in conjunction with FIG. 2, the test interface unit 7 is arranged in a modular design, and has a plurality of test sockets 71 disposed on each of the turntables 52 and electrically connected to the test equipment 2. And a plurality of test modules 72 detachably connected to the plurality of test sockets 71, respectively. Each test module 72 has a test board 72, 10 1300481 electrically connected to the test device 2 and a test slot 722 formed on the test board 721 for a single semiconductor component 3. The test board 721 can perform public board test on each semiconductor component 3. and select the semiconductor component 3 tested by the public board, and classify according to the quality level to determine that it must have The merits. In the first preferred embodiment, each test module 排列 is arranged in a circle around the central axis 51 of the turret unit 5, that is, on each turntable 52, twelve test modules 72 are placed. In actual use, the number of units to be set is based on the demand for production and should not be limited to this. The cymbal control 8 is electrically connected to each of the turntables 52 of the turret unit 5 for controlling the rotational speed thereof, and the controller, 8 and the sliding member 62 of the reclaiming unit 6, the rotating member 63, and the reclaiming material The components are electrically connected for controlling the movement of the members such that each of the turntable 52, the slide member Μ, the rotating member 63 and the pick-up member 64 can cooperate with each other to complete the semiconductor assembly member 3 Electrical test. In fact, the controller 8 can also be arranged in the test device 2 to integrate the functions together. • When performing the electrical test of the semiconductor component 3, first of all, the picking member 64 of the picking unit 6 is used to place the stocks! The semiconductor component 3 to be tested in the film 41 is sucked and taken out, and then the operation of the sliding member 62 and the rotating member 63 is controlled, so that the semiconductor component 3 can be transferred to the δ-type module 72 for juxtaposition. Into the test slot 722. If the material H 4 is the height of the (4) disk 52, the semiconductor component 3 can be embedded, and the picking member 64 at the other end of the rotating member 63 can be used simultaneously. A semiconductor structure to be tested is adsorbed up to reduce the number of actuations of the reclaiming unit 6, thereby shortening the brightness. I3〇〇48i Then, the semiconductor component 3 is electrically functionally detected by the test program specified in the test device 2. Finally, according to the result of the detection, the controller 8 is sent to control the operation of the sliding member 62 and the rotating member 63, and the semiconductor component 3 for testing is returned to the loading unit 4, and The testing and classification of the semiconductor structure element 3 can be accomplished by placing it in a suitable magazine 41.
值得一提的是，可以藉由調整該轉塔單元5之每一個 轉盤52的轉速不同，達到縮短Index time，例如，設定最 上層的轉盤52的轉速較慢，而第二層之轉盤52的轉速較 快，可利用等待最上轉盤52轉動的時間，可先處理第二層 之轉盤52進行取放作業，處理完成之後，回到最上層的轉 盤52進行取放作業，因此，可以縮短該取料單元6等待取 ^的時間。 如圖5所示’為本發明轉盤式測試分類裝置之一第二 較佳實施例，該第二較佳實施例大致上與該第—較佳實施 例相同’相同之處於此不再贅述，其中不同之處在於：該 取料單元6具有二可相對該滑移件62轉動的轉動件63，該 二取料件64是分別設置在該二轉動件Μ上。在實際設計 上’當然也可以設置更多的轉動# 63 ’並在每—個轉動件 63上設置-個取料件64，以同時進行取出與放置動作，藉 此進一步縮短作業時間。 如圖6 較佳實施例 施例相同， 所不，為本發明轉盤式測試分類裝置之一第三 ’該第三較佳實施例大致上是與該第一較佳實 相同之處於此不再贅述，其中不同之處在於： 12 1300481 每-個測試公板72是直接設置該等轉# 52上而成為一體 狀’此種的好處是當f進行更換所述的測試公板72 時’可以直接將整個轉盤52予以抽換，節省拼裝多數個測 咸公板72與-個個抽換的時間’讓更換作業變得更加方便 • 〇 如圖7所不，為本發明轉盤式測試分類裝置之一第四 車交佳實施例，該第四較佳實施例大致上是與該第一較佳實 « 施例相同，相同之處於此不再贅述，其中不同之處在於： 該置料皁7〇 4具有五個水平關放置的置料g 41，以進行 分類。該轉塔單元5僅具有—可相對該中心軸51轉動且可 上下移動的轉盤52。該取料單元6具有介於該轉塔單元5 與該置料單元4之間平台65、—設置在該平台^上並可沿 該平台65滑移的第一滑移組％、一可橫向於該第一滑移組 06上滑移的第二滑移組67，及—設置在該第二滑移組67 上並可拾取所述半導體構裝元件3的拾取頭68。 φ 8亥第一、一滑移組66、67可利用氣壓、液壓、電動馬 達或疋兹力的方式進行移動，而該拾取頭68可以真空吸 力，或是機械夾取的方式，以拾取所述的半導體構裝元件3 。值彳于提的疋，上述該取料單元6也可以是採用可三度 空間移動的機械手臂進行取料作業。 4測4 ;ι面單元7的設計可以如該第一較佳實施例所 揭示的I、樣（參見罔3、4)，以模組化的設計為主，當然也可 如該第三較佳實施例所揭示的態樣（參見β 6)，是與該轉盤 52設計成一體狀的方式。 13 1300481 由上述說明可知，本發明在實際操作與設置時，確且 有以下幾項優點： 了作具 一、可有效地縮小所佔用的空間：由於每—個 組72是以環繞的方式排列’甚至是可以分層向上堆疊：方 式排列，而不是如習知般的方式q水平橫向間隔 ，因此，可縮小所佔用的空間，即使再增加測試模組72, 亦為向上增面，而不去佔用平面空間，可降低土地面積的 需求，減少土地購置成本的支出。 、、 二、 可大幅地縮短測試時間：由於每—個測試模組Μ 是圍繞該轉塔單元5之中心軸51排列成圈，藉由該等轉盤 的轉動，可帶動所有的職模組72的位移，相對於習知的 方式’僅有該輸送單元15(見圖丨)在移動，而所有的半導體 構裝X件H)(見圖W是在原地等待，因此，本發明能大^ 地縮短huiex time，偶若能使用更多的轉動件^與取料; 64時，則更能加快測試的時間，提高設備的產能，進而降 低作業成本，以有效地提昇競爭力。 三、 測試公板的置換作業較為方便且迅速：由於該等 測試模組72是設置在每―個轉盤52上，更換時，口兩直 接將所述的轉盤52 ^更換，並不需要—個—個將該^ 試模組72置換，可讓置換時間縮短並且較為方便。 歸納上述，本發明之轉盤式測試分類裝置，是利用將 該測試單元7設置在所述的轉盤52上，而能有效地縮小所 佔用的空間’同時，將每一個測試純721設計成環繞成 圈的排列’讓每-個半導體構裝元件3在測試的同時，亦 14 l3〇〇48l 進行位移，以大幅度地降低index time，而可降低成本，再 者，如此的設計，也讓更換該等測試公板72丨的作業更為 方便且迅速，故確實能達到本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 . 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 Φ 【圖式簡單說明】 圖1是習知之測試分類裝置的一立體圖； 圖2是一立體示意圖，說明本發明轉盤式測試分類裝 置之弟一較佳實施例的態樣； 圖3是一立體示意圖，說明每一測試模組是可以拆離 地與一轉塔單元之轉盤組合； 圖4疋一側視示意圖，用以辅助說明圖3 ; 圖5疋一側視示意圖，說明本發明轉盤式測試分類裝 φ 置之第二較佳實施例的態樣； 壯圖6是一局部立體示意圖，說明本發明轉盤式測試分 類裝置之第三較佳實施例，其測試單元是直接設置 盤上；及 圖7是一立體示意圖，說明本發明轉盤式測試分類裝 置之第四較佳實施例的態樣。 15 1300481 【主要元件符$虎§兒明】 1…· 測試設備 64 · · •取料件 3 * * * 半導體構裝元件 65 · · •平台 4 · · * 置料單元 66 · · ♦第一滑移組 41 ·… 置料匣 67 · · •第二滑移組 5…* 轉塔單元 68 · · • 拾取頭 51 *… 中心軸 7 · · •測試介面單元 52·… 轉盤 7卜· • 測試插座 6 r φ 取料單元 72 · · • 測試模組 61 ·… 主軸 721 · ，·測試公板 62 * · 滑移件 722 · •測試槽 63·… 轉動件 8 … •控制器It is worth mentioning that the index time can be shortened by adjusting the rotation speed of each of the turntables 52 of the turret unit 5, for example, setting the rotation speed of the uppermost turntable 52 to be slow, and the turntable 52 of the second layer The rotation speed is fast, and the time for waiting for the rotation of the uppermost turntable 52 can be used. The second layer of the turntable 52 can be processed to perform the pick-and-place operation. After the processing is completed, the turn-up operation is returned to the uppermost turntable 52, so that the take-up can be shortened. The material unit 6 waits for the time of taking the ^. As shown in FIG. 5, which is a second preferred embodiment of the rotary type test classification device of the present invention, the second preferred embodiment is substantially the same as the first preferred embodiment, and the details are not described herein again. The difference is that the reclaiming unit 6 has two rotating members 63 that are rotatable relative to the sliding member 62. The two reclaiming members 64 are respectively disposed on the two rotating members. In actual design, of course, more rotations #63' can be provided and a retracting member 64 is provided on each of the rotating members 63 to simultaneously perform the take-out and placement operations, thereby further shortening the working time. 6 is the same as the preferred embodiment of the present invention. No, it is one of the turntable type test classification devices of the present invention. The third preferred embodiment is substantially the same as the first preferred embodiment. For the details, the difference is: 12 1300481 Each test board 72 is directly set up to become the integral one. The advantage of this is that when f is replaced by the test board 72, Directly replace the entire turntable 52, saving the assembly time of the majority of the test salt plate 72 and the time of each change 'to make the replacement work more convenient. 〇 Figure 7 is not, the turntable test classification device of the present invention A fourth embodiment of the vehicle is provided, and the fourth preferred embodiment is substantially the same as the first preferred embodiment, and the same is not described herein again, wherein the difference is: the soap 7〇4 has five horizontally placed placements g 41 for sorting. The turret unit 5 has only a turntable 52 that is rotatable relative to the central axis 51 and movable up and down. The reclaiming unit 6 has a platform 65 between the turret unit 5 and the loading unit 4, a first slip group % disposed on the platform and sliding along the platform 65, and a horizontally A second slip group 67 that slides on the first slip group 06, and is disposed on the second slip group 67 and picks up the pick-up head 68 of the semiconductor component 3. The first and a slip groups 66 and 67 of the φ 8 hai can be moved by means of air pressure, hydraulic pressure, electric motor or force, and the picking head 68 can be vacuum suctioned or mechanically gripped to pick up the pick-up. The semiconductor package component 3 described. The value of the pick-up unit 6 may also be a retracting operation using a mechanical arm that can move in three degrees. 4 test 4; the design of the imaginal unit 7 can be as shown in the first preferred embodiment (see 罔 3, 4), with a modular design as the main design, and of course, the third comparison The aspect disclosed in the preferred embodiment (see β 6) is a manner of being integrated with the turntable 52. 13 1300481 It can be seen from the above description that the present invention has the following advantages in actual operation and setting: The work can effectively reduce the occupied space: since each group 72 is arranged in a surrounding manner. 'Even even layered up stacking: way of arrangement, rather than horizontally spaced horizontally as in the conventional way, therefore, the space occupied can be reduced, even if the test module 72 is added, the face is increased upwards instead of To occupy the plane space, the demand for land area can be reduced, and the cost of land acquisition costs can be reduced. 2. The second can greatly shorten the test time: since each test module 排列 is arranged in a circle around the central axis 51 of the turret unit 5, all the service modules 72 can be driven by the rotation of the turntables. The displacement is relative to the conventional method 'only the transport unit 15 (see Fig. 丨) is moving, and all the semiconductor components are X pieces H) (see Fig. W is waiting in place, therefore, the present invention can be large ^ Shorten the huiex time, even if you can use more rotating parts ^ and reclaiming; 64, it can speed up the test time, increase the equipment's production capacity, and thus reduce operating costs, in order to effectively enhance competitiveness. The replacement operation of the male board is convenient and rapid: since the test modules 72 are disposed on each of the turntables 52, when the replacement is made, the two directly replace the turntables 52^, and it is not necessary to The replacement of the test module 72 can shorten the replacement time and is convenient. In summary, the rotary test type classification device of the present invention can effectively reduce the test unit 7 by being disposed on the turntable 52. The space occupied 'at the same time Each of the test pure 721 is designed to be arranged in a circle around the circle, so that each of the semiconductor component 3 is also displaced while being tested, and 14 l3 〇〇 48l is displaced to greatly reduce the index time, thereby reducing the cost. Moreover, such a design also makes it easier and faster to replace the test panels 72. Therefore, the object of the present invention can be achieved. However, the above description is only a preferred embodiment of the present invention. It is to be understood that the scope of the present invention is limited by the scope of the invention, and that the simple equivalent changes and modifications made by the present invention are still within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a conventional test classification device; FIG. 2 is a perspective view showing a preferred embodiment of a rotary type test classification device of the present invention; FIG. 3 is a perspective view illustrating Each test module is detachably combined with a turntable of a turret unit; FIG. 4 is a side view showing the same as FIG. 3; FIG. 5 is a side view showing the turn of the present invention. The second test example of the second preferred embodiment of the test set is shown in FIG. 6 is a partial perspective view showing a third preferred embodiment of the turntable test classification device of the present invention, wherein the test unit is directly disposed on the disk. And Fig. 7 is a perspective view showing the aspect of the fourth preferred embodiment of the rotary type test classification device of the present invention. 15 1300481 [Main component symbol $虎§儿明] 1...·Testing device 64 · · • fetching Material 3 * * * Semiconductor component 65 · · • Platform 4 · · * Loading unit 66 · · ♦ First slip group 41 ·... Loading 匣 67 · · • Second slip group 5...* Tower unit 68 · · • Pickup head 51 *... Center shaft 7 · · • Test interface unit 52 ·... Turntable 7 · Test socket 6 r φ Reclaimer unit 72 · · • Test module 61 ·... Spindle 721 · , • Test plate 62 * · Slip 722 · • Test slot 63 ·... Rotating member 8 ... • Controller
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