TWI399581B - The Structure and Method of Increasing Adhesion Strength of Panel - Google Patents

Description

Structure and method for increasing adhesion strength of panel sealant

The present invention relates to a technique for combining semiconductor substrates, and more particularly to a structure and method for increasing the adhesion strength of a panel sealant.

The liquid crystal panel is formed by stacking the upper and lower substrates. After the frame glue is applied onto the lower substrate and the liquid crystal is injected, the upper substrate and the lower substrate are assembled, and the two substrates are bonded by the sealant. In addition to the function of adhering the upper and lower substrates, the sealant has a function of supporting the spacing of the liquid crystal cells. As shown in FIG. 1, the upper substrate 12 includes a color filter substrate 122, a black matrix 124 and a conductive layer 126 on the lower substrate. After the sealant 14 is applied to the upper substrate 12 and the lower substrate 10, the spacer 14 is provided with a spacer 18 for reinforcing support. However, if the spacer 18 is located at the periphery of the black matrix 124, the support effect cannot be achieved. Although the area is small, when the light is hardened by UV light irradiation, the area is directly responsible for the adhesion of the panel, which affects the adhesion strength between the panels and the panel. gap.

Therefore, the present invention proposes a structure and method for increasing the adhesion strength of the panel sealant to effectively overcome the above problems, and the specific architecture and its implementation will be described in detail below.

The main object of the present invention is to provide a structure for increasing the adhesion strength of a panel seal, defining a support region on the sealant, and providing a plurality of supports in the support region, and relying on the support and the spacer to improve between the upper and lower substrates. Support strength.

Another object of the present invention is to provide a method for increasing the adhesion strength of a panel sealant. The support having a concave-convex surface on the conductive layer is a reticle method using a Gray Tone Mask or a Half Tone Mask. Production.

A further object of the present invention is to provide a structure for increasing the adhesion strength of a panel sealant, wherein the concave and convex design of the support can increase the adhesive contact area of the sealant to the upper substrate.

A further object of the present invention is to provide a structure for increasing the adhesion strength of a panel sealant, wherein the material of the support is transparent, translucent or the same material as the spacer, and has a high UV transmittance, so that the sealant of the support region can be made of UV. Light irradiation hardens.

In order to achieve the above object, the present invention provides a structure for reinforcing a panel to be aligned, comprising an upper substrate; a lower substrate, a periphery of which is coated with a sealant; and a support region which is located within the range of the sealant and the sealant portion. The overlaps are provided, and a plurality of supports are disposed between the upper substrate and the lower substrate.

The present invention further provides a method for reinforcing a panel combination alignment structure, comprising the steps of: forming a light-shielding region on an upper substrate; covering a conductive layer on the light-shielding region and the upper substrate; and using a Gray Tone Mask Or a half-tone film (Half Tone Mask) reticle method to produce a support having a concave-convex surface on the conductive layer, and the support is adjacent to the light-shielding region and the film thickness is close; and the coating frame is glued to the periphery of the lower substrate, The upper substrate and the lower substrate are combined.

The purpose, technical content, features and effects achieved by the present invention will be more readily understood by the detailed description of the embodiments.

The present invention provides a structure and a method for increasing the adhesion strength of a panel seal. FIG. 2 shows the structure of the present invention, comprising a lower substrate 10, an upper substrate 12 and a support region 16, and an upper substrate 12 and a color filter substrate. 122, a light-shielding region 124 and a conductive layer 126, wherein the light-shielding region 124 is on the color filter substrate 122, and the conductive layer 126 is formed outside the color filter substrate 122 and the light-shielding region 124; the light-shielding region 124 is black a black matrix, the conductive layer 126 is an indium tin oxide layer (ITO); the lower substrate 10 is provided with a sealant 14 for adhering the upper substrate 12 and the lower substrate 10; the support region 16 includes a plurality of supports 162 and at least a spacer 18, wherein the support 162 is subjected to exposure and development control of the film thickness of the support 162 by a glare method of a Gray Tone MaSk or a Half Tone Mask, which has a concave-convex surface, and The height of the support 162 is similar to the height of the light-shielding region 124. The spacer 18 is disposed between the conductive layer 126 of the upper substrate 12 and the lower substrate 10, and a spacer 18 is also disposed between the support 162 and the lower substrate 10.

FIG. 3 is a flow chart showing a method for increasing the adhesion strength of the panel sealant. Referring to FIG. 2 simultaneously, in steps S10 and S12, the light-shielding region 124 is formed on the color filter substrate 122 of the upper substrate 12, and then The light-shielding region 124 and the color filter substrate 122 are covered with a conductive layer 126; then, in step S14, a support 162 having a concave-convex surface is formed on the conductive layer 126 by using a gray mask or a halftone film mask. The support 162 is adjacent to the light-shielding region 124. The sealant 14 is applied to the periphery of the lower substrate 10 in step S16, and the upper substrate 12 and the lower substrate 10 are combined in step S18. Since the height of the support 162 is close to the height of the light-shielding region 124, the height of the light-shielding region 124 plus the conductive layer 126 is approximately equal to the height of the conductive layer 126 plus the support 162, so that the spacer 18 is built in the range of the sealant 14 Both the light-shielding region 124 and the support region 16 can achieve good support of the upper and lower substrates 12, 10.

The support 162 is a transparent or non-transparent material having a transmittance of 90% or more, so that the sealant 14 of the support region 16 can be hardened by UV light irradiation; the concave-convex surface design of the support 162 can increase the sealant 14 and the upper substrate 12 The adhesive area is increased to improve the adhesive effect; the support 162 can be formed simultaneously with the spacer 18 by the reticle method, and the materials of the two can be the same, so that the process steps, materials and time are not increased.

4 is a schematic view showing an embodiment of the upper substrate 12 of the present invention. The upper substrate 12 includes a color filter substrate 122, a light-shielding region 124, a conductive layer 126, and a plurality of supports 162. The support 162 is an arc-shaped protrusion connected at the bottom. If the support 162 is a spacer material ( The material of the photo spacer) is better in adhesion to the conductive layer 126 than the light-shielding region 124 and the conductive layer 126. The height of the support 162 is similar to the height of the light-shielding region 124. Therefore, the height of the light-shielding region 124 plus the conductive layer 126 is approximately equal to the height of the conductive layer 126 plus the support 162, but the support 162 may also be higher than the adjacent light-shielding region 124 and The height of the conductive layer 126, which is greater than 0 μm.

Figure 5 is a schematic view of another embodiment of the upper substrate 12 of the present invention. The upper substrate 12 includes a color filter substrate 122, a light-shielding region 124, a conductive layer 126, and a plurality of supports 162. The top of the support 162 has a plurality of circular arc-shaped recesses, and the recess can be fabricated by using a positive photoresist. The depth of the recess is greater than 0 μm. If the support 162 is made of a material of a photo spacer, the adhesion to the conductive layer 126 is better than the adhesion between the light-shielding region 124 and the conductive layer 126.

In summary, the structure and method for increasing the adhesion strength of the panel sealant provided by the present invention define a support region in the frame seal range, and provide a support for the gather surface in the support region, using the support and the spacer. Improve the support strength of the sealant between the upper and lower substrates.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Therefore, any changes or modifications of the features and spirits of the present invention should be included in the scope of the present invention.

10. . . Lower substrate

12. . . Upper substrate

122. . . Color filter substrate

124. . . Shading area

126. . . Conductive layer

14. . . Frame glue

16. . . Support area

162. . . Support

18. . . Spacer

Fig. 1 is a schematic view showing the panel structure of the sealant portion in the prior art.

Fig. 2 is a schematic view showing the structure of adding the adhesion strength of the panel sealant in the present invention.

Figure 3 is a flow chart of a method for increasing the adhesion strength of a panel sealant in the present invention.

Figure 4 is a schematic view showing an embodiment of increasing the adhesion strength of the panel sealant in the present invention.

FIG. 5 is a schematic view showing another embodiment of increasing the adhesion strength of the panel sealant in the present invention.

10. . . Lower substrate

12. . . Upper substrate

122. . . Color filter substrate

124. . . Shading area

126. . . Conductive layer

14. . . Frame glue

16. . . Support area

162. . . Support

18. . . Spacer

Claims (19)

A structure for increasing the adhesion strength of a panel sealant comprises: an upper substrate comprising a color filter substrate, a light shielding region and a conductive layer; a lower substrate, a periphery of which is coated with a sealant; and a support region a plurality of supports are disposed between the upper substrate and the lower substrate, wherein the support region is adjacent to the light shielding region, and the support is A region is formed on the conductive layer. The structure for increasing the adhesion strength of the panel sealant according to the first aspect of the patent application, wherein the support region is transparent or translucent. The structure for increasing the adhesion strength of the panel sealant according to the first aspect of the invention, wherein the support in the support region is connected to the bottom and the surface has a concave-convex shape. The structure for increasing the adhesion strength of the panel sealant according to the first aspect of the patent application, wherein the material of the support region is the same as the material of the support. The structure for increasing the adhesion strength of the panel sealant according to the first aspect of the patent application, wherein the light-shielding region partially overlaps with a portion of the sealant. The structure for increasing the adhesion strength of the panel sealant according to the first aspect of the invention, wherein the light-shielding region is a black matrix, and the conductive layer is an indium tin oxide layer. The structure for increasing the adhesion strength of the panel sealant according to the first aspect of the invention, wherein the support region further comprises a plurality of spacers between the support and the lower substrate. The structure for increasing the adhesion strength of the panel sealant according to the seventh aspect of the invention, wherein the section of the conductive layer covering the light-shielding region is in contact with the spacer. The structure for increasing the adhesion strength of the panel sealant according to the first aspect of the patent application, wherein the height of the support is similar to the height of the light-shielding region. A method for increasing the adhesion strength of a panel sealant comprises the steps of: forming a light-shielding region on an upper substrate; Covering a conductive layer on the light-shielding region and the upper substrate; using a gray tone mask or a half-tone mask (Half Tone Mask) to form a support having a concave-convex surface on the conductive layer And the support is adjacent to the light shielding region; and the coating frame is glued to the periphery of the lower substrate, and the upper substrate is combined with the lower substrate. The method for increasing the adhesion strength of a panel sealant according to claim 10, wherein the support is located within the range of the sealant and overlaps the sealant portion. The method of increasing the adhesion strength of a panel sealant according to claim 10, wherein the support is connected to the bottom and the surface has a concave-convex shape. The method for increasing the adhesion strength of a panel sealant according to claim 10, wherein the light-shielding region partially overlaps a portion of the sealant. The method of increasing the adhesion strength of a panel sealant according to claim 10, wherein the upper substrate is a color filter substrate, the light shielding region is a black matrix, and the conductive layer is an indium tin oxide layer. The method of increasing the adhesion strength of a panel sealant according to claim 10, wherein the height of the support is similar to the height of the light-shielding region. The method for increasing the adhesion strength of a panel sealant according to claim 10, wherein the support is controlled by exposure and development using a Gray Tone Mask or a Half Tone Mask. Thick thickness. The method of increasing the adhesion strength of a panel sealant according to claim 10, wherein the lower substrate is further provided with a plurality of spacers between the support and the lower substrate. The method for increasing the adhesion strength of a panel sealant according to claim 17, wherein the spacer is disposed in the sealant. The method of increasing the adhesion strength of a panel sealant according to claim 10, wherein the support is transparent or translucent.