TWI399455B - Chemical vapor deposition equipment - Google Patents
Chemical vapor deposition equipment Download PDFInfo
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- TWI399455B TWI399455B TW98135697A TW98135697A TWI399455B TW I399455 B TWI399455 B TW I399455B TW 98135697 A TW98135697 A TW 98135697A TW 98135697 A TW98135697 A TW 98135697A TW I399455 B TWI399455 B TW I399455B
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- vapor deposition
- chemical vapor
- deposition process
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- 238000005229 chemical vapour deposition Methods 0.000 title claims description 39
- 238000000034 method Methods 0.000 claims description 38
- 239000000919 ceramic Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 16
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 description 9
- 229910010293 ceramic material Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 208000034656 Contusions Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Description
本發明係關於一種用於化學氣相沈積製程之機台，尤指一種可置換反應腔內陶瓷檔板的化學氣相沈積製程機台。The invention relates to a machine for a chemical vapor deposition process, in particular to a chemical vapor deposition process machine for replacing a ceramic baffle in a reaction chamber.
在半導體或是液晶面板產業中常使用化學氣相沉積(Chemical Vapor Deposition，CVD)製程技術來成長純度高的薄膜。傳統的CVD製程是將晶圓或玻璃(基底)暴露在一種或多種不同的前驅物下，在基底表面發生化學反應或/及化學分解來產生欲沉積的薄膜。Chemical Vapor Deposition (CVD) process technology is often used in the semiconductor or liquid crystal panel industry to grow high purity films. Conventional CVD processes expose a wafer or glass (substrate) to one or more different precursors, chemically and/or chemically decomposed on the surface of the substrate to produce a film to be deposited.
請參閱第1圖以及第2圖，第1圖係習知化學氣相沉積機台10之示意圖，第2圖係繪示第1圖之陶瓷檔板15、固定溝槽16和固定導塊18。化學氣相沉積機台10在反應腔12之擴散器(Diffuser)14的周邊設有陶瓷檔板15，陶瓷檔板15之一側設有固定溝槽16，固定溝槽16係嵌合在機台10週邊的固定導塊18上。陶瓷檔板15的材質為陶瓷(Ceramic)料材，其功用為阻隔電漿(Plasma)及絕緣導電。但當擴散器14熱膨脹或是安裝不佳時，容易導致陶瓷檔板15之固定溝槽16被擠壓而崩裂。崩裂的碎屑不僅影響產品良率，當較大的碎塊掉落反應腔12內，甚至會造成玻璃因刮傷砸傷而報廢、反應腔12因電漿不正常集中放電而擊穿玻璃或破壞陽極膜等問題，耗費大量成本。Referring to FIG. 1 and FIG. 2, FIG. 1 is a schematic view of a conventional chemical vapor deposition machine 10, and FIG. 2 is a view showing the ceramic baffle 15, the fixed groove 16, and the fixed guide 18 of FIG. . The chemical vapor deposition machine 10 is provided with a ceramic baffle 15 around the diffuser 14 of the reaction chamber 12, and one side of the ceramic baffle 15 is provided with a fixing groove 16, and the fixing groove 16 is fitted to the machine. The fixed guide block 18 on the periphery of the table 10. The material of the ceramic baffle 15 is a ceramic material, which functions to block plasma and insulation. However, when the diffuser 14 is thermally expanded or poorly mounted, the fixing groove 16 of the ceramic baffle 15 is easily crushed and cracked. The cracked debris not only affects the product yield, but when the larger pieces fall into the reaction chamber 12, the glass may be scrapped due to scratches and bruises, and the reaction chamber 12 breaks through the glass due to abnormal discharge of the plasma or The problem of destroying the anode film and the like is costly.
因此，開發出一種使用不易崩裂且可替換固定溝槽的陶瓷檔板於化學氣相沈積製程機台上，以解決先前技術的問題。Therefore, a ceramic baffle plate which is not easily cracked and replaces a fixed groove is developed on a chemical vapor deposition process machine to solve the problems of the prior art.
本發明提出一種用於化學氣相沈積製程之機台，其包含邊框、導塊、第一固定件和第二固定件。該導塊突出於該邊框之一邊上，且向該邊框之中心方向延伸。該第一固定件朝向該邊框之一側開設一凹口，該第一固定件係由一第一材質構成。該第二固定件朝向該第一固定件之一側係以可拆卸的方式嵌合於該凹口，朝向該導塊之一側包含一溝槽，該導塊係以可拆卸的方式嵌合於該溝槽，該第二固定件係由一第二材質構成。該第二固定件朝向該第一固定件之一側的外形係順應該凹口之輪廓。The invention provides a machine for a chemical vapor deposition process, comprising a frame, a guide block, a first fixing member and a second fixing member. The guide block protrudes from one side of the frame and extends toward the center of the frame. The first fixing member opens a notch toward one side of the frame, and the first fixing member is formed of a first material. The second fixing member is detachably fitted to the recess toward one side of the first fixing member, and includes a groove toward one side of the guiding block, and the guiding block is detachably fitted In the groove, the second fixing member is composed of a second material. The shape of the second fixing member toward one side of the first fixing member conforms to the contour of the notch.
本發明之另一目的係提供一種用於化學氣相沈積製程之機台，其包含邊框、導塊、第一固定件和第二固定件。該導塊突出於該邊框之一邊上，且向該邊框之中心方向延伸。該第一固定件朝向該邊框之一側開設一凹口，該凹口包含至少一緩衝區。該第二固定件朝向該第一固定件之一側係以可拆卸的方式嵌合於該凹口，朝向該導塊之一側包含一溝槽，該導塊係以可拆卸的方式嵌合於該溝槽。Another object of the present invention is to provide a machine for a chemical vapor deposition process comprising a bezel, a guide block, a first fixture and a second fixture. The guide block protrudes from one side of the frame and extends toward the center of the frame. The first fixing member opens a notch toward one side of the frame, and the notch includes at least one buffer. The second fixing member is detachably fitted to the recess toward one side of the first fixing member, and includes a groove toward one side of the guiding block, and the guiding block is detachably fitted In the groove.
根據本發明之一實施例，該第一固定件之材質係陶瓷，該第二固定件係為鋁合金材質，並鍍上一陶瓷陽極膜。According to an embodiment of the invention, the material of the first fixing member is ceramic, and the second fixing member is made of aluminum alloy and plated with a ceramic anode film.
根據本發明，該第二固定件另包含複數個第二鎖固孔，該等鎖固孔係開設在對應於該溝槽之區域上且貫穿該第二固定件。該第一固定件另包含複數個第一鎖固孔，該等第一鎖固孔係開設在對應於該凹口之區域上。該機台利用鎖固件穿過第二鎖固孔，並鎖固於對應的第一鎖固孔上，使得第二固定件可固定在第一固定件上。According to the invention, the second fixing member further comprises a plurality of second locking holes, and the locking holes are formed on the region corresponding to the groove and penetrate the second fixing member. The first fixing member further includes a plurality of first locking holes, and the first locking holes are formed on an area corresponding to the notches. The machine uses the fastener to pass through the second locking hole and is locked to the corresponding first locking hole, so that the second fixing member can be fixed on the first fixing member.
根據本發明，該第二固定件另包含複數個保護孔，設置於該溝槽之兩旁，用來於該機台在加熱環境下，該第二固定件具有熱膨脹空間。According to the invention, the second fixing member further comprises a plurality of protective holes disposed on both sides of the groove for the second fixing member to have a thermal expansion space in the heating environment of the machine.
相較於先前技術，本發明的化學氣相沈積製程機台係將傳統一體成形之陶瓷檔板分成第一固定件和第二固定件組成，其中第一固定件仍採陶瓷材質，而第二固定件則利用鍛造鋁合金材料塗佈陶瓷陽極膜製成，之後再將第一固定件及第二固定件相互嵌合，再以螺絲固定。因為陶瓷與陶瓷陽極膜之「結晶相α-Al2O3」完全相同且硬度相當，不會因為彼此材料物性及機械性質差異過大，造成陽極膜被擠壓剝離(Peeling)，而使第二固定件的金屬基材裸露在電漿反應(Plasma)作用過程中，產生電弧集中放電現象(Arcing)，此外，由於第二固定件係以鍛造鋁合金為基材，因金屬材料具有塑性變形之容許能力，於製程使用過程中，可避免崩裂情況的發生。Compared with the prior art, the chemical vapor deposition process machine of the present invention divides the conventional integrally formed ceramic baffle into a first fixing member and a second fixing member, wherein the first fixing member is still made of ceramic material, and the second The fixing member is made by coating a ceramic anode film with a forged aluminum alloy material, and then the first fixing member and the second fixing member are fitted to each other and then fixed by screws. Because the ceramic and ceramic anode film "crystal phase α-Al2O3" is exactly the same and the hardness is equivalent, the difference between the physical properties and mechanical properties of the ceramic material is not too large, causing the anode film to be peeled off (Peeling), and the second fixing member The metal substrate is exposed to the plasma reaction process, and the arc concentration discharge phenomenon (Arcing) is generated. In addition, since the second fixing member is made of a forged aluminum alloy, the metal material has the plastic deformation tolerance. During the process of using the process, cracking can be avoided.
為讓本發明之上述內容能更明顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下：In order to make the above-mentioned contents of the present invention more comprehensible, the preferred embodiments are described below, and the detailed description is as follows:
以下各實施例的說明是參考附加的圖式，用以例示本發明可用以實施之特定實施例。本發明所提到的方向用語，例如「上」、「下」、「前」、「後」、「左」、「右」、「頂」、「底」、「水平」、「垂直」等，僅是參考附加圖式的方向。因此，使用的方向用語是用以說明及理解本發明，而非用以限制本發明。The following description of the various embodiments is provided to illustrate the specific embodiments of the invention. Directional terms as used in the present invention, such as "upper", "lower", "previous", "rear", "left", "right", "top", "bottom", "horizontal", "vertical", etc. , just refer to the direction of the additional schema. Therefore, the directional terminology used is for the purpose of illustration and understanding of the invention.
請參閱第3圖以及第4圖，第3圖係繪示本發明之化學氣相沈積製程機台30，第4圖係繪示第3圖之固定組件46和導塊44。本發明之化學氣相沈積製程機台30包含擴散器(diffuser)32、邊框42、複數個導塊44與複數個固定組件46組成，其中擴散器32用於控制流向基材電鍍表面之電解質的流動模式。而每一固定組件46係由第一固定件50和第二固定件60嵌合組成。第一固定件50係陶瓷材質。複數個導塊44係分別突出於邊框42之每一邊上，且包含一扣合部442和一抵持部444。扣合部442係向邊框42之中心方向延伸，抵持部444設於扣合部442之上，且外型大致呈一L字型。當導塊44嵌合於固定組件46時，導塊44之扣合部442係插入第二固定件60，而呈L字型之抵持部444則抵持第二固定件60之外緣。Please refer to FIG. 3 and FIG. 4, FIG. 3 illustrates the chemical vapor deposition process machine 30 of the present invention, and FIG. 4 illustrates the fixing assembly 46 and the guide block 44 of FIG. The chemical vapor deposition process machine 30 of the present invention comprises a diffuser 32, a frame 42, a plurality of guide blocks 44 and a plurality of fixing components 46, wherein the diffuser 32 is used to control the electrolyte flowing to the substrate plating surface. Flow mode. Each fixing component 46 is composed of a first fixing member 50 and a second fixing member 60. The first fixing member 50 is made of ceramic material. A plurality of guiding blocks 44 respectively protrude from each side of the frame 42 and include a fastening portion 442 and a resisting portion 444. The engaging portion 442 extends in the center direction of the frame 42 , and the abutting portion 444 is disposed on the engaging portion 442 and has an outer shape of an L shape. When the guide block 44 is fitted to the fixing component 46, the engaging portion 442 of the guiding block 44 is inserted into the second fixing member 60, and the L-shaped resisting portion 444 is pressed against the outer edge of the second fixing member 60.
請參閱第5圖和第6A圖，第5圖係繪示組裝前的固定組件46之第一固定件50和第二固定件60，第6A圖係繪示第5圖組裝後的固定組件46之第一固定件50和第二固定件60。第一固定件50朝向邊框42之一側開設一凹口52，第一固定件50係由陶瓷的材質構成。第一固定件50包含複數個第一鎖固孔54，第一鎖固孔54係開設在對應於凹口52之區域上，凹口52包含至少一大致呈弧形之緩衝區56。Referring to FIG. 5 and FIG. 6A , FIG. 5 illustrates the first fixing member 50 and the second fixing member 60 of the fixing assembly 46 before assembly, and FIG. 6A illustrates the fixing assembly 46 after assembly of FIG. 5 . The first fixing member 50 and the second fixing member 60. The first fixing member 50 defines a notch 52 toward one side of the frame 42. The first fixing member 50 is made of a ceramic material. The first fixing member 50 includes a plurality of first locking holes 54 defined in a region corresponding to the notch 52. The notch 52 includes at least one substantially arcuate buffer 56.
請一併參閱第4、5、6A和6B圖。第二固定件60朝向第一固定件50之一側的外形係順應凹口52之輪廓，係以可拆卸的方式嵌合於凹口52，換言之，第二固定件60對應於第一固定件50之緩衝區56處係設置嵌合區65，嵌合區65係順應緩衝區56之輪廓，以適當地將第二固定件60和第一固定件50組裝在一起。請注意，在另一實施例中，如第6B圖所示，第二固定件60之嵌合區65’亦可呈多邊型，較佳地多邊型之頂角需大於90度，當多邊型的嵌合區65’的邊數越多，則其輪廓和效果越近似於弧形之嵌合區65。同時，嵌合區65’與緩衝區56之輪廓必需相互順應，所以緩衝區56亦可呈與嵌合區65’相同輪廓之多邊型。由於凹口52上並無任何的銳角設計，所以在組裝時，可以避免因施力不當造成第一固定件50和第二固定件60因觸碰摩擦而有碎屑掉落而影響機台30生產的產品良率，在製程中亦不會產生應力集中，而造成破裂的問題。此外，第二固定件60朝向導塊44之一側包含一溝槽62。當導塊44嵌合於固定組件46時，導塊44之扣合部442係插入第二固定件60之溝槽62，呈L字型之抵持部444則抵持第二固定件60之外緣，使得導塊44係以可拆卸的方式嵌合於溝槽62(如第4圖所示)。第二固定件60係以可拆卸的方式嵌合於凹口52，再以複數個鎖固件70鎖固第一固定件50和第二固定件60。在本實施例中，第二固定件60係由金屬構成，並鍍上一層約50μm厚的陶瓷陽極膜。較佳地，第二固定件60係由鋁合金構成，並於整個構件上鍍上陶瓷陽極膜。由於第一固定件50的陶瓷和第二固定件60的陶瓷陽極膜之「結晶相α-Al2O3」完全相同且硬度相當，不會因為彼此材料物性及機械性質差異過大，造成陽極膜被擠壓剝離(Peeling)，而使第二固定件60的基材金屬裸露在電漿反應(Plasma)作用過程中，產生電弧集中放電現象(Arcing)，且由於鍛造鋁合金屬的材料具有塑性變形之容許能力，於製程使用過程中，絕對不會造成崩裂的發生。Please refer to Figures 4, 5, 6A and 6B together. The outer shape of the second fixing member 60 toward one side of the first fixing member 50 conforms to the contour of the recess 52, and is detachably fitted to the recess 52. In other words, the second fixing member 60 corresponds to the first fixing member. The buffer zone 56 of the 50 is provided with a fitting area 65 which conforms to the outline of the buffer zone 56 to properly assemble the second fixing member 60 and the first fixing member 50 together. Please note that in another embodiment, as shown in FIG. 6B, the fitting region 65' of the second fixing member 60 may also be of a polygonal type, and preferably the apex angle of the polygonal type needs to be greater than 90 degrees. The more the number of sides of the fitting region 65', the more the contour and effect thereof approximate the arc-shaped fitting region 65. At the same time, the contours of the fitting region 65' and the buffer zone 56 must conform to each other, so that the buffer zone 56 can also be of a polygonal shape having the same contour as the fitting region 65'. Since there is no sharp angle design on the notch 52, it is possible to prevent the first fixing member 50 and the second fixing member 60 from falling due to the frictional friction due to improper application of force, thereby affecting the machine table 30. The yield of the produced product does not cause stress concentration in the process, which causes cracking problems. Further, the second fixing member 60 includes a groove 62 toward one side of the guide block 44. When the guiding block 44 is engaged with the fixing component 46, the engaging portion 442 of the guiding block 44 is inserted into the groove 62 of the second fixing member 60, and the L-shaped resisting portion 444 abuts the second fixing member 60. The outer edge causes the guide block 44 to be detachably fitted to the groove 62 (as shown in Fig. 4). The second fixing member 60 is detachably fitted to the notch 52, and the first fixing member 50 and the second fixing member 60 are locked by a plurality of locking members 70. In the present embodiment, the second fixing member 60 is made of metal and is plated with a ceramic anode film of about 50 μm thick. Preferably, the second fixing member 60 is made of an aluminum alloy, and the ceramic anodic film is plated on the entire member. Since the "crystal phase α-Al2O3" of the ceramic of the first fixing member 50 and the ceramic anode film of the second fixing member 60 are identical and the hardness is equivalent, the anode film is not crushed because the material properties and mechanical properties of the first fixing member 50 are excessively different. Peeling, while the base metal of the second fixing member 60 is exposed to the plasma reaction process, causing an arc concentrated discharge phenomenon (Arcing), and the plastic deformation of the material of the forged aluminum alloy is allowed. Ability, in the process of using the process, will never cause cracking.
請一併參閱第7圖至第9圖，第7圖係第5圖之第二固定件60朝箭頭A所示方向的側視圖，第8圖係第5圖之第二固定件60朝箭頭B所示方向的側視圖。第9圖係第5圖之第二固定件60的頂視圖。第二固定件60包含複數個第二鎖固孔64、複數個保護孔66和二凸緣68。凸緣68係分別設置於第二固定件64之兩側，當欲將第二固定件60鎖固在第一固定件50時，二凸緣68用來使第二固定件60暫時卡持於第一固定件50上以防止第二固定件60脫離第一固定件50，換言之，當第二固定件60靠組於第一固定件50上時，二凸緣68分別抵靠於第一固定件50之底部，使第二固定件60可暫時定位於第一固定件50上。鎖固孔64係開設在對應於溝槽62之區域上且貫穿第二固定件60。第二鎖固孔64係包含一第一螺孔641以及一第二螺孔642，第一螺孔641之內徑小於第二螺孔642之內徑，而第一螺孔641之內徑大致上與第一固定件50之第一鎖固孔54之內徑相同。每一鎖固件70穿過其中之一第二鎖固孔64，鎖固於其中之一第一鎖固孔54上，使得第二固定件60固定在第一固定件50上。鎖固件70可為螺絲或是其它類似的固定元件，而且螺絲之螺帽半徑大於第一螺孔641之內徑，但小於第二螺孔642之內徑。除此之外，當機台30在加熱環境下，金屬材質的第二固定件60會因受熱而膨脹，所以設置於溝槽62之兩旁的複數個保護孔66，可提供第二固定件60熱膨脹空間。Please refer to FIG. 7 to FIG. 9 together. FIG. 7 is a side view of the second fixing member 60 of FIG. 5 in the direction indicated by the arrow A, and FIG. 8 is the second fixing member 60 of the fifth drawing. Side view of the direction indicated by B. Figure 9 is a top plan view of the second fixture 60 of Figure 5. The second fixing member 60 includes a plurality of second locking holes 64, a plurality of protection holes 66 and two flanges 68. The flanges 68 are respectively disposed on two sides of the second fixing member 64. When the second fixing member 60 is to be locked to the first fixing member 50, the two flanges 68 are used to temporarily hold the second fixing member 60 to the second fixing member 60. The first fixing member 50 prevents the second fixing member 60 from coming off the first fixing member 50. In other words, when the second fixing member 60 is assembled on the first fixing member 50, the two flanges 68 respectively abut against the first fixing member. The bottom of the member 50 allows the second fixing member 60 to be temporarily positioned on the first fixing member 50. The locking hole 64 is formed in a region corresponding to the groove 62 and penetrates the second fixing member 60. The second locking hole 64 includes a first screw hole 641 and a second screw hole 642. The inner diameter of the first screw hole 641 is smaller than the inner diameter of the second screw hole 642, and the inner diameter of the first screw hole 641 is substantially The upper inner diameter of the first locking hole 54 of the first fixing member 50 is the same. Each of the fasteners 70 passes through one of the second locking holes 64 and is locked to one of the first locking holes 54 such that the second fixing member 60 is fixed to the first fixing member 50. The locking member 70 can be a screw or other similar fixing member, and the nut radius of the screw is larger than the inner diameter of the first screw hole 641 but smaller than the inner diameter of the second screw hole 642. In addition, when the machine 30 is in a heated environment, the second fixing member 60 of metal material is expanded by heat, so a plurality of protection holes 66 disposed on both sides of the groove 62 can provide the second fixing member 60. Thermal expansion space.
相較於傳統化學氣相沈積製程機台的擴散器四邊之陶瓷檔板中所設置的固定溝槽容易崩裂的缺點，本發明機台30的固定組件46使用可拆換的第一個固定件50以及第二固定件60，其中第一固定件50仍採陶瓷材質，而與導塊44相嵌合的第二固定件60的本體係採用鍛造鋁合金材料，並整個構件鍍上陶瓷陽極膜。如此一來，藉由金屬具有塑性變形之容許能力，可以避免傳統擴散器四週的陶瓷檔板之固定溝槽易崩裂的問題。而且一但發現與導塊44相嵌合的第二固定件60有磨損現象時，可直接拆卸更換新的第二固定件60即可，而毋需大費周章的購買另一陶瓷檔板，這不僅減少成本而且可重複再生利用的第二固定件60不易產生廢料之特性，更符合綠色環保的要求。而且本發明更可確保反應腔內構件安全性，更不需擔心傳統固定溝槽被擠壓而崩裂產生的碎屑掉落反應腔內，影響產品良率等困擾。The fixing component 46 of the machine 30 of the present invention uses the first fixing member that can be replaced, compared to the disadvantage that the fixing groove provided in the ceramic baffle of the four sides of the diffuser of the conventional chemical vapor deposition process machine is easily broken. 50 and the second fixing member 60, wherein the first fixing member 50 is still made of ceramic material, and the second fixing member 60 of the guiding member 44 is made of a forged aluminum alloy material, and the whole member is plated with a ceramic anode film. . In this way, by the allowable ability of the metal to have plastic deformation, the problem that the fixing groove of the ceramic baffle around the conventional diffuser is easily broken can be avoided. Moreover, when it is found that the second fixing member 60 which is engaged with the guide block 44 has a wear phenomenon, the new second fixing member 60 can be directly removed and replaced, and it is not necessary to purchase another ceramic baffle. This not only reduces the cost, but also the reusable second fixing member 60 is less prone to waste characteristics, and is more in line with the requirements of green environmental protection. Moreover, the invention can ensure the safety of the components in the reaction chamber, and there is no need to worry that the debris generated by the conventional fixed groove being crushed and collapsed falls into the reaction cavity, which affects the product yield and the like.
雖然本發明已用較佳實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與修改，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the invention may be variously modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.
10、30．．．化學氣相沉積機台10, 30. . . Chemical vapor deposition machine
12．．．反應腔12. . . Reaction chamber
14、32．．．擴散器14, 32. . . Diffuser
16．．．固定溝槽16. . . Fixed groove
18．．．固定導塊18. . . Fixed guide block
32．．．擴散器32. . . Diffuser
42．．．邊框42. . . frame
44．．．導塊44. . . Guide block
46．．．固定組件46. . . Fixed component
50．．．第一固定件50. . . First fixture
52．．．凹口52. . . Notch
54．．．第一鎖固孔54. . . First locking hole
56．．．緩衝區56. . . Buffer
60．．．第二固定件60. . . Second fixture
62．．．溝槽62. . . Trench
64．．．第二鎖固孔64. . . Second locking hole
66．．．保護孔66. . . Protective hole
68．．．凸緣68. . . Flange
70．．．鎖固件70. . . Lock firmware
15．．．陶瓷擋板15. . . Ceramic baffle
65、65’．．．嵌合區65, 65’. . . Chimeric area
442．．．扣合部442. . . Buckle
444．．．抵持部444. . . Responsible department
641．．．第一螺孔641. . . First screw hole
642．．．第二螺孔642. . . Second screw hole
第1圖係習知化學氣相沉積機台之示意圖。Figure 1 is a schematic diagram of a conventional chemical vapor deposition machine.
第2圖係繪示第1圖之固定溝槽和固定導塊。Figure 2 is a diagram showing the fixed groove and the fixed guide of Figure 1.
第3圖係繪示本發明之化學氣相沈積製程機台。Figure 3 is a diagram showing the chemical vapor deposition process machine of the present invention.
第4圖係繪示第3圖之固定組件和導塊。Figure 4 is a diagram showing the fixing assembly and the guide block of Figure 3.
第5圖係繪示組裝前的固定組件之第一固定件和第二固定件。Figure 5 is a view showing the first fixing member and the second fixing member of the fixing assembly before assembly.
第6A圖係繪示第5圖組裝後的固定組件之第一固定件和第二固定件。Fig. 6A is a view showing the first fixing member and the second fixing member of the fixing assembly assembled in Fig. 5.
第6B圖係繪示組裝後的固定組件之第一固定件和第二固定件。Figure 6B shows the first fixing member and the second fixing member of the assembled fixing assembly.
第7圖係第5圖之第二固定件朝箭頭A所示方向的側視圖。Fig. 7 is a side view of the second fixing member of Fig. 5 in the direction indicated by the arrow A.
第8圖係第5圖之第二固定件朝箭頭B所示方向的側視圖。Figure 8 is a side view of the second fixing member of Figure 5 in the direction indicated by the arrow B.
第9圖係第5圖之第二固定件的頂視圖。Figure 9 is a top plan view of the second fixture of Figure 5.
46．．．固定組件46. . . Fixed component
50．．．第一固定件50. . . First fixture
52．．．凹口52. . . Notch
54．．．第一鎖固孔54. . . First locking hole
56．．．緩衝區56. . . Buffer
60．．．第二固定件60. . . Second fixture
62．．．溝槽62. . . Trench
64．．．第二鎖固孔64. . . Second locking hole
66．．．保護孔66. . . Protective hole
68．．．凸緣68. . . Flange
70．．．鎖固件70. . . Lock firmware
65．．．嵌合區65. . . Chimeric area
Claims (21)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98135697A TWI399455B (en) | 2009-10-21 | 2009-10-21 | Chemical vapor deposition equipment |
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| TW98135697A TWI399455B (en) | 2009-10-21 | 2009-10-21 | Chemical vapor deposition equipment |
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| TWI399455B true TWI399455B (en) | 2013-06-21 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI265979B (en) * | 2004-12-06 | 2006-11-11 | Ritdisplay Corp | Photo chemical vapor deposition machine, configuration of photo chemical vapor deposition machine and deposition process |
| TWM353467U (en) * | 2008-09-09 | 2009-03-21 | Chunghwa Picture Tubes Ltd | CVD apparatus and shadow frame thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI265979B (en) * | 2004-12-06 | 2006-11-11 | Ritdisplay Corp | Photo chemical vapor deposition machine, configuration of photo chemical vapor deposition machine and deposition process |
| TWM353467U (en) * | 2008-09-09 | 2009-03-21 | Chunghwa Picture Tubes Ltd | CVD apparatus and shadow frame thereof |
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