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TWI398880B - Circuit connection material and circuit connection structure - Google Patents

Circuit connection material and circuit connection structure Download PDF

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Publication number
TWI398880B
TWI398880B TW098122278A TW98122278A TWI398880B TW I398880 B TWI398880 B TW I398880B TW 098122278 A TW098122278 A TW 098122278A TW 98122278 A TW98122278 A TW 98122278A TW I398880 B TWI398880 B TW I398880B
Authority
TW
Taiwan
Prior art keywords
circuit
conductive particles
particles
conductive
electrode
Prior art date
Application number
TW098122278A
Other languages
English (en)
Chinese (zh)
Other versions
TW201015588A (en
Inventor
立澤貴
小林宏治
關耕太郎
Original Assignee
日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成股份有限公司 filed Critical 日立化成股份有限公司
Publication of TW201015588A publication Critical patent/TW201015588A/zh
Application granted granted Critical
Publication of TWI398880B publication Critical patent/TWI398880B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/06—Polyurethanes from polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09D175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H10W72/074—
    • H10W72/30—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW098122278A 2008-07-01 2009-07-01 Circuit connection material and circuit connection structure TWI398880B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008172265 2008-07-01

Publications (2)

Publication Number Publication Date
TW201015588A TW201015588A (en) 2010-04-16
TWI398880B true TWI398880B (zh) 2013-06-11

Family

ID=41465992

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098122278A TWI398880B (zh) 2008-07-01 2009-07-01 Circuit connection material and circuit connection structure

Country Status (5)

Country Link
JP (1) JP4862921B2 (fr)
KR (1) KR20110019392A (fr)
CN (1) CN102047347B (fr)
TW (1) TWI398880B (fr)
WO (1) WO2010001900A1 (fr)

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JP5668636B2 (ja) * 2010-08-24 2015-02-12 日立化成株式会社 回路接続構造体の製造方法
JP5184612B2 (ja) * 2010-11-22 2013-04-17 日本化学工業株式会社 導電性粉体、それを含む導電性材料及びその製造方法
JP2014149918A (ja) * 2011-06-06 2014-08-21 Hitachi Chemical Co Ltd フィルム状回路接続材料及び回路接続構造体
WO2013108843A1 (fr) * 2012-01-20 2013-07-25 積水化学工業株式会社 Particules conductrices, matériau conducteur et structure de connexion
JP6079425B2 (ja) * 2012-05-16 2017-02-15 日立化成株式会社 導電粒子、異方性導電接着剤フィルム及び接続構造体
WO2014007238A1 (fr) * 2012-07-03 2014-01-09 積水化学工業株式会社 Particules conductrices dotées de particules isolantes, matériau conducteur et structure de connexion
JP6119130B2 (ja) * 2012-07-11 2017-04-26 日立化成株式会社 複合粒子及び異方導電性接着剤
KR102095823B1 (ko) * 2012-10-02 2020-04-01 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6149683B2 (ja) * 2013-10-18 2017-06-21 日立化成株式会社 フィルム状回路接続材料及びこれを用いた接続構造体
JP6119718B2 (ja) * 2013-11-19 2017-04-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
KR102697500B1 (ko) 2013-11-19 2024-08-21 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름 및 접속 구조체
WO2015105119A1 (fr) * 2014-01-08 2015-07-16 積水化学工業株式会社 Particules conductrices pour modules de cellules solaires à contact arrière, matériau conducteur et module de cellule solaire
WO2015105120A1 (fr) * 2014-01-08 2015-07-16 積水化学工業株式会社 Particules conductrices pour modules de cellules solaires à contact de repos, matériau conducteur, et module de cellules solaires
US10176903B2 (en) 2014-02-05 2019-01-08 Japan Science And Technology Agency Stretchable conductor, method for manufacturing same, and paste for forming stretchable conductor
US10461054B2 (en) * 2014-03-31 2019-10-29 Dexerials Corporation Anisotropic conductive film and production method of the same
JP6523794B2 (ja) * 2014-06-06 2019-06-05 積水化学工業株式会社 導電材料及び接続構造体
JP6114883B1 (ja) * 2015-05-20 2017-04-12 積水化学工業株式会社 導電性粘着材及び導電性基材付き導電性粘着材
CN107709414B (zh) * 2015-11-11 2021-12-28 积水化学工业株式会社 粒子、粒子材料、连接材料及连接结构体
JP6652513B2 (ja) * 2016-03-03 2020-02-26 信越化学工業株式会社 生体電極の製造方法
CN106367016A (zh) * 2016-08-29 2017-02-01 无锡万能胶粘剂有限公司 一种粉胶浆
WO2018042701A1 (fr) * 2016-08-30 2018-03-08 日立化成株式会社 Composition adhésive
WO2018079365A1 (fr) * 2016-10-24 2018-05-03 デクセリアルズ株式会社 Film conducteur anisotrope
WO2018139552A1 (fr) * 2017-01-27 2018-08-02 日立化成株式会社 Particules conductrices recouvertes d'isolant, film conducteur anisotrope et son procédé de production, et structure de connexion et son procédé de production
JP7534840B2 (ja) * 2017-06-12 2024-08-15 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子
JP7358065B2 (ja) * 2019-04-10 2023-10-10 日本化学工業株式会社 被覆粒子
JP6836729B2 (ja) * 2019-09-18 2021-03-03 日立金属株式会社 圧着端子、端子付き電線及び端子付き電線の製造方法
WO2025134747A1 (fr) * 2023-12-22 2025-06-26 株式会社レゾナック Film d'agent adhésif pour connexion de circuit, procédé de fabrication de structure de connexion, matériau conducteur et structure de connexion

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WO2007099965A1 (fr) * 2006-02-27 2007-09-07 Hitachi Chemical Company, Ltd. Materiau de connexion de circuit, structure de connexion pour element de connexion utilisant celui-ci et procede de production d'une telle structure de connexion
WO2008053873A1 (fr) * 2006-10-31 2008-05-08 Hitachi Chemical Company, Ltd. Structure de connexion de circuit

Also Published As

Publication number Publication date
CN102047347A (zh) 2011-05-04
JP4862921B2 (ja) 2012-01-25
TW201015588A (en) 2010-04-16
WO2010001900A1 (fr) 2010-01-07
JP2010034045A (ja) 2010-02-12
KR20110019392A (ko) 2011-02-25
CN102047347B (zh) 2012-11-28

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