TWI398623B - Measurement method of interference system - Google Patents
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Description
本發明係關於一種量測方法,尤指一種干涉系統之量測方法。The invention relates to a measuring method, in particular to a measuring method of an interference system.
在量測技術之領域中,有非常多的量測方法被廣泛的運用,干涉系統即為其中一種,一般來說,干涉系統可以被運用來量測待測物的二維與三維表面形貌。In the field of measurement technology, there are many measurement methods widely used, and the interference system is one of them. In general, the interference system can be used to measure the two-dimensional and three-dimensional surface topography of the object to be tested. .
請參閱第一圖,第一圖係為待測物之示意圖。白光干涉系統係應用光干涉原理,先以白光照明系統透過準直透鏡發射平行光,並經過45度分光鏡反射後進入干涉顯微物鏡,而顯微物鏡會將入射光分成兩道光,一道經由參考鏡面反射,另一道則經由置放於掃描平台上的待測物100反射,最後二道反射光再度重合並因光程差不同產生干涉,干涉影像再經45度分光鏡、成像物鏡聚焦而成像於影像感測裝置。Please refer to the first figure, the first picture is a schematic diagram of the object to be tested. The white light interferometry system applies the principle of optical interference. First, the white light illumination system emits parallel light through the collimating lens, and after 45-degree spectroscopic reflection, it enters the interference microscope objective lens, and the microscope objective beam divides the incident light into two lights, one through Referring to the specular reflection, the other is reflected by the object to be tested 100 placed on the scanning platform, and the last two reflected lights are again combined and interfered by the difference in optical path difference, and the interference image is then focused by the 45-degree beam splitter and the imaging objective lens. Imaging on an image sensing device.
藉由干涉顯微物鏡或掃描平台沿垂直掃描路徑D1的移動,使影像感測裝置能接收到一系列由不同光程差所產生之干涉影像,而電腦即可對所有的干涉影像中的每一像素點進行分析,以得到待測物100之表面形貌。By interfering with the movement of the microscope objective or the scanning platform along the vertical scanning path D1, the image sensing device can receive a series of interference images generated by different optical path differences, and the computer can be used for each of the interference images. A pixel is analyzed to obtain a surface topography of the object 100 to be tested.
請參閱第二圖,第二圖係為具有干涉條紋之二維形貌圖像。雖然白光干涉系統在量測待測物100時,可以經由上述的分析方式得到待測物100的表面形貌高度資訊,並藉由高度資訊得到待測物100的三維形貌圖像,然而,由於干涉顯微物鏡在聚焦時會產生干涉現象,造成影像感測裝置所接收到的二維形貌圖像I0含有干涉條紋S,無法清楚的分辨待測物100的形貌邊界。Please refer to the second figure, which is a two-dimensional topographic image with interference fringes. Although the white light interference system measures the object to be tested 100, the surface topography height information of the object to be tested 100 can be obtained through the above analysis manner, and the three-dimensional topographic image of the object to be tested 100 is obtained by the height information. Since the interference microscopy lens produces an interference phenomenon when focusing, the two-dimensional topographical image I0 received by the image sensing device contains the interference fringe S, and the topography boundary of the object to be tested 100 cannot be clearly distinguished.
而習知技術為了解決二維形貌圖像I0含有干涉條紋S的問題,發展出了兩種方式,其中一種方式是在干涉系統藉由垂直掃描獲得複數張干涉影像,並由複數張干涉影像得到待測物100的三維形貌圖像後,再藉由調整影像感測裝置的位置到二道反射光不會產生光干涉之處,以避免二維形貌圖像I0中含有干涉條紋S,然而此一量測方法待測物100的三維形貌圖像與二維形貌圖像I0係藉由不同的掃描過程分別取得,因此此一量測方法較傳統的量測方法來的複雜。However, in order to solve the problem that the two-dimensional topographic image I0 contains interference fringes S, two methods are developed, one of which is to obtain a plurality of interference images by vertical scanning in the interference system, and to obtain a plurality of interference images by a plurality of interference images. After obtaining the three-dimensional topographic image of the object to be tested 100, the position of the image sensing device is adjusted to the two reflected light without causing interference of the light, so as to avoid the interference fringe S in the two-dimensional topographic image I0. However, the three-dimensional topographic image and the two-dimensional topographical image I0 of the test object 100 are respectively obtained by different scanning processes, so the measurement method is more complicated than the conventional measurement method. .
另一種量測方法係於干涉系統藉由垂直掃描獲得複數張干涉影像,並由複數張干涉影像得到待測物100的三維形貌圖像後,再將干涉顯微物鏡更換為非干涉的顯微物鏡,以避免光干涉的產生,並藉以避免二維形貌圖像I0中含有干涉條紋S,然而此一量測方法相較於傳統的量測方法不僅需要多餘的掃描流程,且需要多製備一組非干涉的顯微物鏡,亦增加了硬體的成本。Another measurement method is that the interference system obtains a plurality of interference images by vertical scanning, and obtains a three-dimensional shape image of the object 100 by a plurality of interference images, and then replaces the interference microscope objective with a non-interference display. The micro objective lens avoids the generation of light interference and avoids the interference fringe S contained in the two-dimensional topographic image I0. However, this measurement method requires not only an unnecessary scanning process but also more than the conventional measurement method. The preparation of a set of non-interfering microscope objectives also adds to the cost of the hardware.
緣此,本發明之主要目的係提供一種干涉系統之量測方法,此量測方法之目的在於不增加硬體成本與擷取待測物影像流程的情況之下,得到不含干涉條紋的待測物之二維形貌圖像。Accordingly, the main object of the present invention is to provide a measurement method for an interference system. The purpose of the measurement method is to obtain an interference-free stripe without increasing the hardware cost and the image flow of the sample to be tested. A two-dimensional image of the object.
一種干涉系統之量測方法係用以於干涉系統沿垂直掃描路徑對待測物進行垂直掃描,並在該垂直掃描路徑的複數個掃描高度依序分別產生複數張干涉影像後,藉以利用這些干涉影像以產生二維形貌圖像,此量測方法係包括以下步驟:對各干涉影像中的每一個像素點取樣,以得到每一干涉影像之干涉區域面積,並利用干涉影像所對應之掃描高度與干涉區域面積建立高度-干涉面積對應比資訊;利用高度-干涉面積對應比資訊,在這些干涉影像所對應之干涉區域面積中擷取相對峰值,藉以擷取相對峰值所對應之掃描高度,並將其定義為特徵高度;以及擷取特徵高度與鄰近特徵高度上下各一第一預定張數之干涉影像進行疊合,以產生二維形貌圖像。An interference system measuring method is used for vertical scanning of an object to be measured by an interference system along a vertical scanning path, and a plurality of interference images are sequentially generated at a plurality of scanning heights of the vertical scanning path to utilize the interference images. To generate a two-dimensional topographic image, the measuring method comprises the steps of: sampling each pixel point in each interference image to obtain an interference region area of each interference image, and using the scanning height corresponding to the interference image Establishing a height-interference area correspondence ratio information with the interference area area; using the height-interference area correspondence ratio information, extracting relative peaks in the interference area area corresponding to the interference images, thereby extracting a scan height corresponding to the relative peak value, and It is defined as a feature height; and the interference image of the first predetermined number of sheets of the feature height and the height of the adjacent feature is superimposed to generate a two-dimensional topographic image.
相較於習知之干涉系統量測方法,本發明於干涉系統藉由垂直掃描獲得複數張干涉影像後,可以直接透過這些干涉影像獲得不含干涉條紋的待測物的二維形貌圖像,不需要增加硬體成本或者進行額外的擷取待測物影像流程,不僅節省成本,且量測過程亦較為簡便。Compared with the conventional interference system measurement method, the present invention can obtain a two-dimensional image of the object to be tested without interference fringes directly after obtaining an interference image by vertical scanning in the interference system. There is no need to increase the cost of hardware or to carry out additional image processing of the object to be tested, which not only saves costs, but also makes the measurement process relatively simple.
本發明所採用的具體實施例,將藉由以下之實施例及圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following examples and drawings.
本發明係關於一種一種量測方法,尤指一種干涉系統之量測方法。以下茲列舉一較佳實施例以說明本發明,然熟習此項技藝者皆知此僅為一舉例,而並非用以限定發明本身。有關此較佳實施例之內容詳述如下。The invention relates to a measuring method, in particular to a measuring method of an interference system. The invention is illustrated by the following description of the preferred embodiments of the invention, and is not intended to limit the invention. The contents of this preferred embodiment are detailed below.
請先參閱第一圖,第一圖係為待測物之示意圖。本發明之干涉系統之量測方法係用以於干涉系統沿垂直掃描路徑D1對待測物100進行垂直掃描,並在垂直掃描路徑D1的複數個掃描高度依序分別產生複數張干涉影像後,藉以利用這些干涉影像以產生二維形貌圖像;其中,干涉系統的種類對於本發明之量測方法並沒有影響,干涉系統可以是Mirau白光干涉儀、Michelson白光干涉儀、Linnik白光干涉儀或者其他常見之干涉儀。Please refer to the first figure first. The first picture is a schematic diagram of the object to be tested. The measuring method of the interference system of the present invention is used for vertically scanning the object to be tested 100 along the vertical scanning path D1 of the interference system, and sequentially generating a plurality of interference images respectively at a plurality of scanning heights of the vertical scanning path D1. These interference images are utilized to generate a two-dimensional topographic image; wherein the type of interference system has no effect on the measurement method of the present invention, and the interference system may be a Mirau white light interferometer, a Michelson white light interferometer, a Linnik white light interferometer or the like. A common interferometer.
請繼續參閱第三圖,第三圖係為高度-干涉面積對應比資訊。本發明之干涉系統之量測方法係包括數個步驟,首先,必須先對各干涉影像中的每一個像素點取樣,以得到每一干涉影像之干涉區域面積,並利用每一干涉影像所對應之掃描高度與干涉區域面積建立出高度-干涉面積對應比資訊,以第一圖之待測物100為例,由於待測物100的頂面11佔了上視圖的大部分面積,因此於高度-干涉面積對應比資訊中,頂面11所對應的掃描高度及鄰近掃描高度處就會顯示佔了相當大的面積,而本實施例中為了方便操作者觀察,可以將每一掃描高度所對應的干涉區域面積顯示為百分比狀態。Please continue to refer to the third figure, the third figure is the height-interference area correspondence ratio information. The measuring method of the interference system of the present invention comprises several steps. First, each pixel point in each interference image must be sampled to obtain the interference area of each interference image, and corresponding to each interference image. The scan height and the interference area area establish a height-interference area correspondence ratio information. Taking the object to be tested 100 of the first figure as an example, since the top surface 11 of the object to be tested 100 occupies most of the area of the upper view, the height is In the interference area correspondence ratio information, the scanning height corresponding to the top surface 11 and the adjacent scanning height are displayed to occupy a considerable area, and in this embodiment, in order to facilitate the operator's observation, each scanning height can be correspondingly The area of the interference area is shown as a percentage state.
接著,利用高度-干涉面積對應比資訊,在這些干涉影像所對應之這些干涉區域面積中擷取一個相對峰值,藉以得到此相對峰值所對應之掃描高度,並將其定義為特徵高度H1。Then, using the height-interference area correspondence ratio information, a relative peak is obtained in the areas of the interference regions corresponding to the interference images, thereby obtaining the scanning height corresponding to the relative peak, and defining the feature height H1.
請參閱第四圖與第五圖,第四圖係為干涉系統於一個干涉波包範圍中的掃描取樣點示意圖,第五圖係為自所有干涉影像中擷取部份干涉影像進行疊合之示意圖。在判斷出特徵高度H1之後,即可自所有干涉影像中擷取特徵高度H1與鄰近特徵高度H1上下各一第一預定張數之干涉影像進行數值處理,以產生二維形貌圖像,而於本實施例中之較佳者,所述之數值處理係為一影像疊合處理;此外,於本實施例中之較佳者,若干涉系統沿垂直掃描路徑D1對待測物100進行垂直掃描時,於垂直掃描路徑D1的一個干涉波包之範圍內產生了第二預定張數之干涉影像,換以言之,即是在一個干涉波包之範圍內進行了第二預定張數的取樣,那麼上述的第一預定張數可以是相等於一半之第二預定張數。Please refer to the fourth and fifth figures. The fourth figure is a schematic diagram of the scanning sampling points of the interference system in an interference wave packet range. The fifth figure is to extract some interference images from all the interference images to be superimposed. schematic diagram. After the feature height H1 is determined, the interference image of the feature height H1 and the first predetermined number of frames of the adjacent feature height H1 can be extracted from all the interference images to perform numerical processing to generate a two-dimensional image. Preferably, in the embodiment, the numerical processing is an image superimposing process; further, in the preferred embodiment, if the interfering system scans the object 100 vertically along the vertical scanning path D1. In the range of one interference wave packet of the vertical scanning path D1, a second predetermined number of interference images are generated, in other words, a second predetermined number of samples are taken within the range of one interference wave packet. Then, the first predetermined number of sheets described above may be equal to half of the second predetermined number of sheets.
請同時參考第六圖,第六圖係為不含干涉條紋之二維形貌圖像示意圖。舉例而言,當干涉系統在一個干涉波包內對11個掃描高度做取樣,並產生11張干涉影像,那麼在得到特徵高度H1後,即可自所有干涉影像中擷取特徵高度H1所對應之干涉影像Ibase,並將干涉影像Ibase與鄰近特徵高度H1上下各5張之干涉影像I1~I10進行疊加,以得到不含干涉條紋的二維形貌圖像Ieng。Please also refer to the sixth figure. The sixth picture is a schematic diagram of the two-dimensional shape image without interference fringes. For example, when the interference system samples 11 scanning heights in an interference wave packet and generates 11 interference images, after obtaining the feature height H1, the feature height H1 can be extracted from all the interference images. The interference image Ibase is superimposed on the interference image Ibase and the interference images I1 to I10 of the top and bottom of the adjacent feature height H1 to obtain a two-dimensional topographic image Ieng without interference fringes.
此外,於本實施例中之較佳者,將干涉影像Ibase與干涉影像I1~I10進行疊加之過程,其主要目的在於將每一干涉影像I1~I10與干涉影像Ibase在每一個像素點的灰階值差異,疊加至二維形貌圖像Ieng相對應的像素點,並將二維形貌圖像Ieng像素點的灰階值除以一個干涉波包內之取樣點數,在本實施例中即是除以11,來使二維形貌圖像Ieng的灰階範圍正規化,即可利用多張干涉影像製作出不含干涉條紋的二維形貌圖像Ieng。In addition, in the preferred embodiment, the process of superimposing the interference image Ibase and the interference images I1~I10 is mainly for the gray of each interference image I1~I10 and the interference image Ibase at each pixel. The difference of the order value is superimposed on the pixel corresponding to the two-dimensional topographical image Ieng, and the grayscale value of the two-dimensional topographical image Ieng pixel is divided by the number of sampling points in one interference wave packet, in this embodiment In the middle, by dividing 11 to normalize the gray scale range of the two-dimensional topographic image Ieng, a two-dimensional topographic image Ieng without interference fringes can be created by using multiple interference images.
綜合以上所述,相較於習知之干涉系統量測方法,本發明於干涉系統藉由垂直掃描獲得複數張干涉影像後,可以直接透過這些干涉影像獲得不含干涉條紋的待測物的二維形貌圖像Ieng,並不需要增加硬體成本或者進行額外的擷取待測物影像流程,不僅節省成本,且量測過程亦較為簡便。In summary, compared with the conventional interference system measurement method, the present invention can obtain the two-dimensional interference image without interference fringes directly after obtaining a plurality of interference images by vertical scanning in the interference system. The shape image Ieng does not need to increase the hardware cost or perform additional image processing of the object to be tested, which not only saves cost, but also makes the measurement process simple.
此外,本發明之干涉系統之量測方法並不侷限於對一特徵高度H1進行干涉影像的疊加動作,以上述實施例而言,待測物100係具有一個凹槽,因此在第三圖之高度-干涉面積對應比資訊中可以清楚發現,在另一掃描高度處亦具有相對峰值,因此該相對峰值亦對應了一個特徵高度H2,本量測方法可以對特徵高度H2所對應之干涉影像與對特徵高度H2上下各一第一預定張數之干涉影像進行疊加,即可獲得待測物於特徵高度H2處的不含干涉條紋之二維形貌圖像;更進一步來說,當待測物100具有二個以上的特徵高度H1與H2時,亦可將特徵高度H1與H2所對應之干涉影像以及所有特徵高度H1與H2上下各一第一預定張數之干涉影像進行疊加,以獲得另一不含干涉條紋之二維形貌圖像。In addition, the measuring method of the interference system of the present invention is not limited to the superimposing action of the interference image on a feature height H1. In the above embodiment, the object to be tested 100 has a groove, so in the third figure The height-interference area correspondence ratio information can be clearly found, and the relative peak value also has a relative peak value at another scanning height. Therefore, the relative peak value also corresponds to a feature height H2, and the measurement method can correspond to the interference image corresponding to the feature height H2. The interference images of the first predetermined number of sheets above and below the feature height H2 are superimposed to obtain a two-dimensional topographic image without interference fringes at the feature height H2 of the object to be tested; further, when to be tested When the object 100 has two or more characteristic heights H1 and H2, the interference images corresponding to the feature heights H1 and H2 and the interference images of all the first predetermined number of upper and lower levels of the feature heights H1 and H2 may be superimposed to obtain Another two-dimensional topographic image without interference fringes.
藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.
100...待測物100. . . Analyte
11‧‧‧頂面11‧‧‧ top surface
D1‧‧‧垂直掃描路徑D1‧‧‧ vertical scan path
I0‧‧‧二維形貌圖像I0‧‧‧ two-dimensional image
Ibase‧‧‧干涉影像Ibase‧‧ Interference image
I1~I10‧‧‧干涉影像I1~I10‧‧‧ interference image
Ieng‧‧‧二維形貌圖像Ieng‧‧‧ two-dimensional image
S‧‧‧干涉條紋S‧‧‧ interference fringe
H1、H2‧‧‧特徵高度H1, H2‧‧‧ feature height
第一圖係為待測物之示意圖;The first figure is a schematic diagram of the object to be tested;
第二圖係為具有干涉條紋之二維形貌圖像;The second figure is a two-dimensional topographic image with interference fringes;
第三圖係為高度-干涉面積對應比資訊;The third figure is the height-interference area correspondence ratio information;
第四圖係為干涉系統於一個干涉波包範圍中的掃描取樣點示意圖;The fourth figure is a schematic diagram of the scanning sampling points of the interference system in an interference wave packet range;
第五圖係為自所有干涉影像中擷取部份干涉影像進行疊合之示意圖;以及The fifth figure is a schematic diagram of superimposing partial interference images from all interference images;
第六圖係為不含干涉條紋之二維形貌圖像示意圖。The sixth picture is a schematic diagram of a two-dimensional topographic image without interference fringes.
Ibase...干涉影像Ibase. . . Interference image
I1~I10...干涉影像I1~I10. . . Interference image
Ieng...二維形貌圖像Ieng. . . Two-dimensional image
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4869593A (en) * | 1988-04-22 | 1989-09-26 | Zygo Corporation | Interferometric surface profiler |
| EP1818699A1 (en) * | 2002-06-28 | 2007-08-15 | Australian Photonics Pty Ltd | Writing of photo-induced structures |
| US7446882B2 (en) * | 2005-01-20 | 2008-11-04 | Zygo Corporation | Interferometer for determining characteristics of an object surface |
| US20090262362A1 (en) * | 2008-04-22 | 2009-10-22 | Zygo Corporation | Interferometer for overlay measurements |
| TWI316600B (en) * | 2007-01-26 | 2009-11-01 | Chroma Ate Inc | Integrated scanning type optical measurement method |
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2010
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4869593A (en) * | 1988-04-22 | 1989-09-26 | Zygo Corporation | Interferometric surface profiler |
| EP1818699A1 (en) * | 2002-06-28 | 2007-08-15 | Australian Photonics Pty Ltd | Writing of photo-induced structures |
| US7446882B2 (en) * | 2005-01-20 | 2008-11-04 | Zygo Corporation | Interferometer for determining characteristics of an object surface |
| TWI316600B (en) * | 2007-01-26 | 2009-11-01 | Chroma Ate Inc | Integrated scanning type optical measurement method |
| US20090262362A1 (en) * | 2008-04-22 | 2009-10-22 | Zygo Corporation | Interferometer for overlay measurements |
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