TWI398599B - Led illumination device - Google Patents

Description

Light-emitting diode lighting device

The invention relates to a light-emitting diode lamp, in particular to a light-emitting diode lighting device with a heat dissipation structure.

As a new generation of light source, the light-emitting diode light source can not replace the traditional incandescent lamp on a large scale, but it has the advantages of long working life, energy saving and environmental protection, and is generally favored by the market. Moreover, the module composed of the light-emitting diode can generate a high-power, high-brightness light source, which can completely replace the existing incandescent lamp to achieve indoor and outdoor illumination, and will also widely and revolutionarily replace the existing light source such as the traditional incandescent lamp. And become the main light source in line with the theme of energy conservation and environmental protection.

However, the greater the heat generated by the light-emitting diode or its module, the greater the power and brightness, the accumulation in the limited-volume LED lamp is difficult to dissipate in time. Therefore, the application of the light-emitting diode in lighting still has a large heat-dissipation technology bottleneck, which is also the key point for the current market breakthrough of high-power, high-brightness light-emitting diode lamps. At present, the general heat dissipation scheme in the industry is to provide a heat sink in the luminaire, and the heat is radiated into the surrounding air through the surface of the heat sink in contact with natural convection air. Therefore, it is generally required to improve the heat dissipation efficiency of the heat dissipation structure in the light-emitting diode lamp to meet the heat dissipation requirement of the high-power, high-brightness light-emitting diode lamp, so that it can work normally only by increasing the heat dissipation area. However, increasing the heat dissipation area of the heat sink formed by aluminum extrusion, molding, etc., also increases the volume and weight of the heat sink, thereby making the overall lamp volume larger and heavier and less prone to widespread use.

In view of this, it is necessary to provide a light-emitting diode lighting device with an active heat dissipation structure.

A light emitting diode lighting device includes a heat sink and a plurality of light emitting diode modules attached to the top of the heat sink, the heat sink comprising a substrate and a plurality of heat sinks spaced apart from the bottom surface of the substrate, the heat sinks An air flow passage is formed between the air flow passages, and a blower mounted on the substrate and facing the air flow passage between the heat sinks. A casing and the substrate cooperate to cover the heat sink and the blower, and the one end of the substrate is adjacent to the air flow passage of the heat sink An air inlet is defined at the position, and an air outlet is formed between the other end of the substrate and the casing.

The blower of the above-mentioned light-emitting diode lighting device allows external airflow to enter from the air inlet of one end of the substrate, and passes through the airflow passage between the heat sinks under the guidance of the casing, and then flows out from the air outlet of the other end of the base, thereby being in the light-emitting diode An unobstructed cooling air circulation system is formed in the body lighting device, so that the heat from the LED module can be dissipated to the outside in time.

As shown in FIG. 1-3, the illuminating diode device of the present invention comprises a heat sink 10, a blower 20 mounted on one side of the heat sink 10, and a plurality of LED modules 30 attached to the top of the heat sink 10. The heat sink 10 is disposed on the heat sink 10 and covers the heat sink 10 and the blower 20 in a housing 40 and a light cover 50 under the heat sink 10 and covers the light emitting diode module 30 therein.

The heat sink 10 is made of a metal having good thermal conductivity such as copper, aluminum or the like, and includes a rectangular substrate 12 and a plurality of fins 14 vertically arranged on the bottom surface of the substrate 12. The fins 14 are equally spaced from each other and opposite to the substrate 12 The two long edges are parallel, and an air flow passage for airflow is formed between each adjacent two fins 14. The substrate 12 defines a rectangular air inlet 120 at a short edge side of the heat sink 14 and adjacent to the air flow passage between the heat sinks 14. The long edge of the air inlet 120 is perpendicular to the long edges of the heat sink 14 and the substrate 12. And close to one of the short edges of the substrate 12.

The blower 20 is mounted on the bottom surface of the substrate 12, and is located on the side of the heat sink 14 and faces the air flow passage between the fins 14. The air blower 20 includes two mounting brackets 22 respectively fixed on the base plate 12 and located outside the two short edges of the air inlet 120 and between the mounting bracket 22 and directly above the air inlet 120 of the base plate 12 and having a cylindrical shape. Impeller group 24.

The LED modules 30 are disposed side by side on the top surface of the substrate 12 of the heat sink 10 and parallel to the heat sink 14 . Each of the LED modules 30 includes an elongated circuit board 32 and a circuit board 32 . The plurality of light emitting diode elements 34 are arranged in two rows in the longitudinal direction.

The housing 40 is a rectangular box facing the opening of the heat sink 10. It includes four side walls 44 surrounding the fins 14 and the blower 20 and a top wall 42 connecting the bottom edges of the four side walls 44. The housing 40 is sized to fit the long sides of the opposite sides of the substrate 12 of the heat sink 10 to form a space between the substrate 12 and the housing 40 for accommodating the heat sink 14 and the blower 20, and the housing 40 is adjacent to the air inlet of the substrate 12. One end side wall 44 of the 120 is joined to the bottom surface of the substrate 12 near its short edge, and the other end side wall 44 of the housing 40 extends from the substrate 12 away from one end of the air inlet 120 to the substrate 12 and between the top end of the side wall 44 and the substrate 12. An air outlet 100 is formed (as shown in FIG. 1). In addition, the housing 40 forms a circular chamfer (not labeled) for guiding the airflow at the corners of the corresponding air inlet 120 and the air outlet 100.

The lamp cover 50 is integrally formed of a transparent or translucent material such as plexiglass or resin, and is mounted on the top surface of the substrate 12 of the heat sink 10 and covers the LED module 30 therein. The lamp cover 50 is located therein. One side of the inlet port 120 of the substrate 12 is not covered on the intake port 120. The lamp cover 50 includes a cover 52 covering the LED module 30 and a mounting edge 520 extending downwardly from the periphery of the cover 52. The mounting edge 520 surrounds the light emitting diode module 30 and is connected to the substrate 12 .

When the light-emitting diode lighting device is in use, the outside air enters from the air inlet 120 at one end of the substrate 12 under the action of the air blower 20, and passes through the air flow passage between the heat sinks 14 under the guidance of the housing 40 from the base 12 The other end of the air outlet 100 flows out to form an unobstructed cooling air circulation system in the LED illumination device, and then can be generated by the LED module 30 and transmitted to the heat sink 14 through the substrate 12 in time. Heat is released into the outside world. The above-mentioned light-emitting diode lighting device actively dissipates the light-emitting diode 30 by circulating airflow formed by the air blower 20, thereby effectively improving the heat dissipation efficiency of the heat-dissipating structure in the light-emitting diode lighting device, thereby satisfying the high-power some light-emitting two Thermal requirements for polar lighting equipment.

In addition, in other embodiments, the airflow direction of the light-emitting diode lighting device may be opposite to that of the previous embodiment, and the airflow generated by the air blower 20 enters from the air outlet 100, flows through the heat sink 14, and flows out from the air inlet 120.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧ radiator

12‧‧‧Substrate

120‧‧‧air inlet

14‧‧‧ Heat sink

20‧‧‧Blowers

22‧‧‧ Mounting bracket

24‧‧‧Iron group

30‧‧‧Lighting diode module

32‧‧‧ boards

34‧‧‧Lighting diode components

40‧‧‧shell

42‧‧‧ top wall

44‧‧‧ side wall

50‧‧‧light cover

52‧‧‧ Cover

520‧‧‧Installation edge

100‧‧‧air outlet

1 is a perspective assembled view of a preferred embodiment of a light-emitting diode lighting device of the present invention.

2 is an exploded perspective view of the light-emitting diode lighting device of FIG. 1.

3 is an inverted exploded view of the light-emitting diode lighting device of FIG. 2.

10‧‧‧ radiator

20‧‧‧Blowers

30‧‧‧Lighting diode module

40‧‧‧shell

50‧‧‧light cover

100‧‧‧air outlet

Claims (5)

A light emitting diode lighting device includes a heat sink and a plurality of light emitting diode modules attached to the top of the heat sink, the heat sink comprising a substrate and a plurality of heat sinks spaced apart from the bottom surface of the substrate, the heat sinks An air flow channel is formed between the two, and the improvement is that the air blower is mounted on the substrate and faces the air flow passage between the heat sinks. A casing and the substrate cooperate to cover the heat sink and the blower, and the substrate is near one end. An air inlet is formed at a position of the air flow channel of the heat sink, and an air outlet is formed between the other end of the substrate and the housing, and the light emitting diode module is disposed at a position opposite to the heat sink of the top surface of the substrate. The air blower is installed at the air inlet of the bottom surface of the substrate and is located on the side of the heat sink. The substrate is rectangular. The heat sinks are vertically arranged on the bottom surface of the substrate and parallel to the opposite long edges of the substrate. The housing includes a heat sink and a blower. a four side wall and a top wall connecting one end edge of the four side walls, the housing and the opposite sides of the opposite sides of the substrate cooperate to cover the heat sink and the blower, and the housing is adjacent to the substrate One end side wall of the tuyere is engaged with the substrate, and the other end side wall of the housing protrudes from the substrate away from one end of the air inlet to form the air outlet between the side wall and the substrate, and the shell is at the corner of the corresponding air inlet and the air outlet A circular chamfer for guiding the air flow is formed thereon. The light-emitting diode lighting device of claim 1, wherein the air inlet is rectangular and perpendicular to the heat sink. The illuminating diode illuminating device of claim 1, further comprising a lamp cover mounted on the top surface of the substrate and covering the illuminating diode module therein and located between the air inlet and the air outlet . The illuminating diode illuminating device of claim 1, wherein the blower comprises two mounting brackets fixed to a bottom surface of the substrate and located between the mounting brackets The impeller group is one of the inlets. The illuminating diode device of claim 1, wherein the illuminating diode modules are affixed side by side on the top surface of the substrate, and each of the illuminating diode modules comprises a strip-shaped circuit board and is mounted on the circuit. Light-emitting diode components on the board.