TWI394032B - Heat sink and method of manufacturing same - Google Patents

Description

Heat sink and method of manufacturing same

The invention relates to a heat dissipating device and a manufacturing method thereof, in particular to a heat dissipating device for dissipating heat of an electronic component and a manufacturing method thereof.

In recent years, with the development of the electronics industry, the performance of electronic components has been continuously improved, the computing speed has become faster and faster, the computing speed of the internal chipset has been continuously increased, the number of wafers has been increasing, and the amount of heat emitted by the wafers has increased accordingly. If the heat is not dissipated in time, the performance of the electronic components will be greatly affected, and the operation speed of the electronic components will be lowered. As the heat is accumulated, the electronic components may be burnt, and therefore the electronic components must be dissipated.

A conventional heat sink includes a bottom plate and a plurality of fins extending upward from the bottom plate. The bottom surface of the bottom plate is in contact with the electronic component to absorb the heat generated by the bottom plate, and the fins dissipate the heat absorbed by the bottom plate into the surrounding air, thereby achieving heat dissipation to the electronic component.

However, the flatness of the bottom surface of the conventional heat sink is low, so that the bottom surface is rough. When the bottom plate is in contact with the surface of the electronic component, the rough bottom surface will cause the bottom plate and the electronic component to be in close contact with each other, so that the contact area between the two is limited. Therefore, due to the flatness of the bottom surface of the bottom plate, the heat generated by the electronic components cannot be sufficiently transmitted to the bottom plate, and cannot be dissipated in time, which affects the normal operation of the electronic components.

In view of the above, it is necessary to provide a heat sink that can be sufficiently bonded to an electronic component and a method of manufacturing the same.

A heat dissipating device for dissipating heat from an electronic component, comprising a bottom plate and a plurality of fins bonded to the bottom plate, the surface of the bottom plate contacting the electronic component forming a smooth surface by grinding and milling.

A method for manufacturing a heat dissipating device, comprising the steps of: providing a bottom plate having a boss; grinding a contact surface of the boss and the electronic component to form a smooth surface; providing a plurality of heat pipes; welding the heat pipes to the bottom plate; providing a a top plate; the top plate is welded to the heat pipe and the bottom plate.

Compared with the prior art, the contact surface of the bottom plate and the electronic component of the heat dissipating device of the present invention forms a smooth surface by grinding and milling, so that the contact surface has a high flatness. When the bottom plate is attached to the electronic component, the surface can maintain sufficient contact with the surface of the electronic component to rapidly transfer the heat generated by the electronic component to the fin, thereby ensuring proper operation of the electronic component.

10‧‧‧heating device

20‧‧‧floor

22‧‧‧ board

220‧‧‧Boss

222‧‧‧ recess

24‧‧‧ side wall

26‧‧‧ Side

30‧‧‧ top board

32‧‧‧ gap

34‧‧‧Shrap

340‧‧‧ round hole

40‧‧‧Upper fin group

42, 52‧‧‧ fins

50‧‧‧low fin group

60‧‧‧heat pipe

62‧‧‧First heat pipe

626, 646‧‧ ‧ convex

64‧‧‧Second heat pipe

640‧‧‧ Straight section

642‧‧‧Bend section

644‧‧‧End

70‧‧‧Fixed Department

700‧‧‧Perforation

1 is a perspective assembled view of a heat sink of the present invention.

Figure 2 is an exploded view of Figure 1.

Figure 3 is an inverted view of the heat pipe of the heat sink of Figure 2.

Figure 4 is an inverted view of Figure 1.

Figure 5 is a front view of Figure 1.

As shown in FIGS. 1 and 2, the heat dissipating device 10 of the present invention is used for dissipating heat from an electronic component (not shown) mounted on a circuit board (not shown), and includes a bottom plate 20 and a top plate bonded to the bottom plate 20. 30. A lower fin group 50 and an upper fin group 40 respectively coupled to the bottom plate 20 and the top plate 30, and a plurality of flat heat pipes 60 sandwiched between the bottom plate 20 and the top plate 30.

Referring to FIG. 4 together, the bottom plate 20 is integrally formed by a metal plate, and has a longitudinal section of substantially "U" shape. The bottom plate 20 includes a flat rectangular plate body 22, and two vertically extending from opposite sides of the plate body 22 The side walls 24 and 2 extend from the side edges 26 extending horizontally opposite the top ends of the two side walls 24, respectively. A portion of the plate body 22 is punched downwardly into a square boss 220 (see FIG. 4). At this time, since the partial portion is recessed downward, a recess 222 is formed in the bottom plate 20, wherein the boss 220 is convex. Extending from the bottom surface of the plate body 22, the recessed portion 222 is recessed into the top surface of the plate body 22 and opens upward. The boss 220 is smoothed by grinding and milling to sufficiently contact the electronic component to quickly absorb the heat generated therefrom. The recess 222 is used to receive the corresponding structure of the heat pipe 60. The two side walls 24 and the two side edges 26 are bent outwardly horizontally outwardly from the middle portion (not shown). The two rectangular fixing portions 70 are respectively placed on the two fins and inserted into the side walls 24 and the side edges 26. Each of the fixing portions 70 has a height greater than the height of the side walls 24, and a top portion thereof extends beyond the two side edges 26 to abut the top plate 30. The two through holes 700 respectively extend through the two fixing portions 70 and the two fins, and the fasteners (not shown) pass through to fix the bottom plate 20 to the circuit board.

The top plate 30 is bonded to the side edges 26 of the bottom plate 20 by welding, which is also integrally formed by a metal plate. The top plate 30 has a flat rectangular configuration with its circumference conforming to the circumference of the bottom plate 20. The top plate 30 is parallel to the plate body 22 of the bottom plate 20, and each side thereof has two rectangular notches 32 of equal area and corresponding to the fins of the bottom plate 20. A portion of the top plate 30 between the two notches 32 on each side thereof is horizontally formed with a rectangular elastic piece 34 for elastically pressing against the fixing portion 70 mounted on the bottom plate 20. The sum of the areas of the two notches 32 and one of the elastic pieces 34 on each side of the top plate 30 is equal to the top area of each of the fixing portions 70. A circular hole 340 is defined in the middle of the elastic piece 34, and is aligned with the corresponding through hole 700 of the bottom plate 20 for the fastener to pass through to fix the welded bottom plate 20 and the top plate 30 to the circuit board.

Referring to FIG. 5 , the upper fin set 40 and the lower fin set 50 are respectively soldered to the top surface of the top board 30 and the bottom surface of the bottom board 20 , and each of them includes a plurality of parallel fins 42 , 52 stacked in series. The middle portion of each of the fins 42 and 52 is perpendicular to the top plate 30, and the upper and lower ends thereof are horizontally bent from the middle portion and are respectively coupled to the bottom plate 20 or the top plate 30. The periphery of the upper fin set 40 coincides with the periphery of the top plate 30, which occupies the entire top surface of the top plate 30; the lower fin set 50 is adjacent to the boss 220 of the bottom plate 20, which substantially occupies the board The bottom of one third of the body 22 (see Figure 4).

Referring to FIG. 3 together, the heat pipe 60 is sandwiched between the bottom plate 20 and the top plate 30, and includes two flat first heat pipes 62 and two bent second heat pipes 64. The two first heat pipes 62 are close together and in direct contact with each other. Each of the second heat pipes 64 includes a straight section 640, two bent sections 642 which are bent outwardly from both ends of the straight section 640, and a tip 644 formed at the end of a bent section 642. The straight section 640 of the second heat pipe 64 is in close contact with and directly in contact with the first heat pipe 62. The bent section 642 is obliquely spaced from the first heat pipe 62, and the tip 644 is spaced apart from the first heat pipe 62 in parallel. The distance between opposite ends of each second heat pipe 64 is equal to the length of the first heat pipe 62. The distance between the distal ends 644 of the second heat pipes 64 is equal to the distance between the ends of the two bent portions 642 and the distance between the two side walls 24 of the bottom plate 20, whereby when the heat pipe 60 is placed on the bottom plate 20, the bent portion 642 And the distal end 644 will be separated from the side wall 24 of the bottom plate 20 (as shown in FIG. 5), thereby forming a plurality of air flow passages between the heat pipe 60 and the bottom plate 20 to improve the heat dissipation efficiency of the heat sink 10. The second heat pipe 62 protrudes downwardly from the convex portion 626 at a position close to the middle portion thereof, and the second heat pipe 64 also protrudes downwardly from the bottom portion of the straight portion 640 by two rectangular convex portions 646. The four convex portions 626 and 646 are equal in area and smaller than the area of the concave portion 222 of the bottom plate 20 for receiving in the concave portion 222 of the bottom plate 20 and contacting the boss 220 to transfer the heat absorbed by the boss 220. To the heat pipe 60.

Compared with the prior art, the bottom surface of the boss 220 of the heat sink 10 of the present invention is formed by grinding and milling to form a smooth surface, so that it has a high flatness. When the boss 220 is placed on the electronic component, the smooth bottom surface can be in full contact with the surface of the electronic component, and the heat generated by the electronic component can be transmitted to the entire heat sink 10 in time to ensure the normal operation of the electronic component.

It can be understood that the bottom plate 20 of the present invention can also not form the boss 220, but directly grind and weld the bottom surface of the bottom plate 20 with the electronic component, and then attach a portion of the ground surface of the ground plate to the electronic component. Upper to fully contact the surface of the electronic component.

In addition, the present invention also provides a method of manufacturing the heat sink, comprising the steps of: providing a a bottom plate 20; a corresponding protrusion 220 is punched downward in a corresponding area of the bottom plate 20; the bottom surface of the boss 220 is ground to make it relatively smooth; a plurality of heat pipes 60 are provided; the heat pipes 60 are welded to the bottom plate 20; The top plate 30 is welded to the two side edges 26 of the bottom plate 20 and the heat pipe 60; a plurality of fins 42 and 52 are provided; and the fins 42 and 52 are welded to the top plate 30 and the bottom plate 20, respectively.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

20‧‧‧floor

220‧‧‧Boss

40‧‧‧Upper fin group

50‧‧‧low fin group

Claims (10)

A heat dissipating device for dissipating heat from an electronic component, comprising a bottom plate and a plurality of fins bonded to the bottom plate, wherein the surface of the bottom plate contacting the electronic component is formed by grinding and milling to form a smooth surface, the bottom plate facing The electronic component protrudes from a boss, a surface of the boss is used for contacting the electronic component, and the heat sink further comprises a top plate fixed to the bottom plate, wherein the bottom plate forms a hollow air flow passage with the top plate, and the top plate A plurality of fins are formed on a surface, and the fins formed on the top plate are oriented opposite to the fins formed on the bottom plate. The heat sink of claim 1, wherein the bottom plate is ground and ground only on a surface of the boss that is in contact with the electronic component. The heat sink of claim 1, wherein the fins are parallel to each other and perpendicular to the top plate. The heat dissipating device according to any one of claims 1 to 3, wherein the heat dissipating device further comprises a plurality of heat pipes sandwiched between the bottom plate and the top plate, and the plurality of air flow passages are formed between the heat pipes and the opposite sides of the bottom plate. The heat dissipating device of claim 4, wherein the heat pipe comprises two flat first heat pipes and two bent second heat pipes, wherein the first heat pipes and the second heat pipes are close together at a middle portion thereof The opposite ends are separated from each other. The heat dissipating device of claim 4, wherein the bottom plate is recessed at a position corresponding to the boss, and a portion of the heat pipes is received in the recess. The heat dissipating device of claim 6, wherein the middle portion of the heat pipes forms a plurality of convex portions toward the electronic component, and the convex portions are received in the concave portion. A method of manufacturing a heat sink according to claim 1, comprising the steps of: Providing a bottom plate having a boss; grinding and milling the contact surface of the boss and the electronic component to make it smooth; providing a plurality of heat pipes; welding the heat pipes on the bottom plate; providing a top plate; and welding the top plate to the bottom plate and the heat pipe. The heat sink manufacturing method of claim 8, further comprising the steps of: providing a plurality of fins and soldering the fins to the bottom plate and the top plate, respectively. A heat dissipating device for dissipating heat from an electronic component, comprising a bottom plate and a plurality of fins bonded to the bottom plate, wherein the surface of the bottom plate contacting the electronic component is formed by grinding and milling to form a smooth surface, the bottom plate facing The electronic component protrudes from a boss, a surface of the boss is used for contacting the electronic component, and the heat dissipating device further comprises a top plate fixed to the bottom plate, wherein the bottom plate forms a hollow air flow passage with the top plate, and the heat dissipating device The utility model further comprises a plurality of heat pipes sandwiched between the bottom plate and the top plate, wherein the heat pipes form a plurality of air flow passages between opposite sides of the bottom plate.