TWI398212B - Heat sink - Google Patents

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat from an electronic component.

In recent years, with the development of the electronics industry, the performance of electronic components has been continuously improved, the computing speed has become faster and faster, the computing speed of the internal chipset has been continuously increased, the number of wafers has been increasing, and the amount of heat emitted by the wafers has increased accordingly. If the heat is not dissipated in time, the performance of the electronic components will be greatly affected, and the operation speed of the electronic components will be lowered. As the heat is accumulated, the electronic components may be burnt, and therefore the electronic components must be dissipated.

The conventional heat sink includes a bottom plate, a top plate fixed to the bottom plate, and a plurality of heat pipes sandwiched between the bottom plate and the top plate. The bottom plate comprises a plate body carrying the heat pipe and two side walls extending upward from opposite sides of the plate body. The top plate is joined to the two side walls of the bottom plate by welding so that the heat pipe is sandwiched therebetween. The bottom plate is in contact with the electronic component to absorb the heat generated thereby, and the heat pipe transfers the heat absorbed by the bottom plate to the top plate and is radiated into the air, thereby achieving heat dissipation to the electronic component.

Before the top plate is welded to the two side walls of the bottom plate, the top plate needs to be positioned on the two side walls. For this reason, the corresponding positioning jig is usually used to realize the positioning function. However, a fixture can only be applied to a heat sink. If the size of the heat sink changes, it is necessary to redesign and manufacture the fixture of the corresponding size, resulting in an increase in the overall manufacturing cost of the heat sink.

In view of this, it is necessary to provide a heat sink that can dissipate heat quickly.

A heat dissipating device for dissipating heat from an electronic component, comprising a bottom plate, a fin assembly coupled to the lower surface of the bottom plate, and a plurality of heat pipes disposed on the bottom plate, the heat dissipating device further comprising a joint to the bottom plate and being sandwiched with the bottom plate The top plates of the heat pipes are bent, and the heat pipes are bent at least once and are close to each other from beginning to end.

Compared with the prior art, the heat pipe clamp of the heat dissipating device of the present invention is disposed between the bottom plate and the top plate, and does not need to have a groove on the bottom plate. Therefore, the thickness of the bottom plate can be controlled within a small range, and the heat generated by the electronic component can be transmitted to the fin through the shortest heat conduction path, thereby improving the heat dissipation efficiency of the heat sink.

As shown in FIG. 1 to FIG. 3, the heat dissipating device 10 of the preferred embodiment of the present invention is configured to dissipate heat from an electronic component (not shown) mounted on a circuit board (not shown), and includes a bottom plate 20 and a bottom plate. The top plate 30 of the upper plate 30 is coupled to the lower fin group 50 and the upper fin group 40 of the bottom plate 20 and the top plate 30, respectively, and a plurality of flat heat pipes 60 sandwiched between the bottom plate 20 and the top plate 30.

Referring to FIG. 4 together, the bottom plate 20 is integrally formed by a metal plate, and has a longitudinal section of substantially "U" shape. The bottom plate 20 includes a flat rectangular plate body 22, two side walls 24 extending perpendicularly from opposite sides of the plate body 22, and two side edges 26 formed horizontally opposite from the top ends of the two side walls 24. A portion of the plate body 22 is punched downwardly into a square boss 220 (see FIG. 4) and a recess 222 corresponding to the other side of the boss 220. The boss 220 protrudes from the bottom surface of the plate body 22, The recess 222 is recessed into the top surface of the plate body 22 and opens upward. The boss 220 is used for contacting the electronic component to absorb the heat generated by the boss 220. The recess 222 is for receiving the corresponding structure of the heat pipe 60. The two side walls 24 and the two side edges 26 are bent outwardly horizontally outwardly from the middle portion (not shown). The two rectangular fixing portions 70 are respectively placed on the two fins and inserted into the side walls 24 and the side edges 26. Each of the fixing portions 70 has a height greater than the height of the side walls 24, and a top portion thereof extends beyond the two side edges 26 to abut the top plate 30. The two through holes 700 respectively extend through the two fixing portions 70 and the two fins, and the fasteners (not shown) pass through to fix the bottom plate 20 to the circuit board.

The top plate 30 is bonded to the side edges 26 of the bottom plate 20 by welding, which is also integrally formed by a metal plate. The top plate 30 has a flat rectangular configuration with its circumference conforming to the circumference of the bottom plate 20. The top plate 30 is parallel to the plate body 22 of the bottom plate 20, and each side thereof has two rectangular notches 32 of equal area and corresponding to the fins of the bottom plate 20. The portion of the top plate 30 between the two notches 32 on each side thereof forms a rectangular spring piece 34 for resiliently pressing against the fixing portion 70 mounted on the bottom plate 20. The sum of the areas of the two notches 32 and one of the elastic pieces 34 on each side of the top plate 30 is equal to the top area of each of the fixing portions 70 (see Fig. 1). A circular hole 340 is defined in the middle of the elastic piece 34, and is aligned with the corresponding through hole 700 of the bottom plate 20 for the fastener to pass through to fix the welded bottom plate 20 and the top plate 30 to the circuit board.

The upper fin set 40 and the lower fin set 50 are respectively soldered to the top surface of the top plate 30 and the bottom surface of the bottom plate 20, and each of the plurality of stacked fins 42 and 52 is stacked. The middle portion of each of the fins 42 and 52 is perpendicular to the top plate 30, and the upper and lower ends thereof are horizontally bent from the middle portion and are respectively coupled to the bottom plate 20 or the top plate 30. The periphery of the upper fin set 40 coincides with the periphery of the top plate 30, which occupies the entire top surface of the top plate 30; the lower fin set 50 is adjacent to the boss 220 of the bottom plate 20, which occupies approximately one third of the plate body 22. The bottom surface (Figure 4).

Referring to FIG. 3 together, the heat pipe 60 is sandwiched between the bottom plate 20 and the top plate 30, and includes three heat pipes 60 in close contact with each other. Each of the heat pipes 60 is bent into a substantially "S"-shaped configuration, and includes an evaporation section 62, two connecting sections 64 extending perpendicularly from opposite ends of the evaporating section 62, and two perpendicularly connected to the two connecting sections. A condensation section 66 at the end of 64, wherein the evaporation section 62 is parallel to the two condensation sections 66 and perpendicular to the two connection sections 64. The length of each connecting section 64 is substantially equal to the length of each condensing section 66 and greater than the length of the evaporating section 62. The evaporation section 62, the connecting section 64 and the condensation section 66 are all of a straight configuration, and the junctions 68 of the evaporation section 62, the connecting section 64 and the condensation section 66 are all curved. The three heat pipes 60 are all close together from beginning to end, and the condensation section 62, the evaporation section 66 and the connecting section 64 are in one-to-one correspondence and abut each other. A protrusion (not shown) protrudes from a bottom of each heat pipe 60. The protrusion is received in the recess 222 of the bottom plate 20 and abuts against the boss 220 to transfer the heat absorbed by the boss 220 to the heat pipe 60. Inside.

Fig. 5 shows another embodiment of the present invention which differs from the above embodiment only in the configuration of a portion of the heat pipes 60. The heat dissipating device (not shown) in the other embodiment also includes three heat pipes 60, 60a which are close to each other from beginning to end. For the sake of clarity, the heat pipes 60, 60a located at different positions are hereinafter referred to as a first heat pipe 60 and a second heat pipe 60a, respectively: the first heat pipe 60 located at the center is the same as the heat pipe 60 of the previous embodiment, which is substantially The second heat pipe 60a on both sides is truncated so that each second heat pipe 60a retains only one evaporation section 62a, one connection section 64a and one condensation section 66a, which is substantially "U". "shape. The second heat pipe 60a is opposite to the two sides of the first heat pipe 60. The evaporation section 62a of the two second heat pipes 60a is in contact with the evaporation section 62 of the first heat pipe 60, and the second heat pipe 60a is cold. The condensation section 66a and the connection section 64a are in contact with one of the condensation section 66 and the connection section 64 of the first heat pipe 60, the condensation section 66a and the connection section 64a of the other second heat pipe 60a and the other condensation section 66 of the first heat pipe 60 and The other connecting section 64 is in contact. The first heat pipe 60 and the second heat pipe 60a are sandwiched between the bottom plate 20 and the top plate 30, and the three evaporation sections 62, 62a are placed on the middle portion of the bottom plate 20 and the top plate 30, and the condensation section 66 at each end thereof. 66a extends to the edges of the top plate 30 and the bottom plate 20 to dissipate heat throughout the heat sink.

Compared with the prior art, the heat pipes 60, 60a of the heat sink of the present invention are sandwiched between the bottom plate 20 and the top plate 30 without opening a groove for inserting the bottom plate 20. Therefore, the thickness of the bottom plate 20 can be controlled within a small range, and the heat generated by the electronic component can be transmitted to the fins 42 and 52 via the shortest heat conduction path, so that the heat dissipation efficiency of the heat sink 10 is correspondingly obtained. Upgrade.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧heating device

20‧‧‧floor

22‧‧‧ board

220‧‧‧Boss

222‧‧‧ recess

24‧‧‧ side wall

26‧‧‧ Side

30‧‧‧ top board

32‧‧‧ gap

34‧‧‧Shrap

340‧‧‧ round hole

40‧‧‧Upper fin group

42, 52‧‧‧ fins

50‧‧‧low fin group

60, 60a‧‧‧ heat pipe

62, 62a‧‧Evaporation section

64, 64a‧‧‧ Connection section

66, 66a‧‧ condensed section

68‧‧‧ joint office

70‧‧‧Fixed Department

700‧‧‧Perforation

1 is a perspective assembled view of a heat sink according to a preferred embodiment of the present invention.

Figure 2 is an exploded view of Figure 1 with the heat pipe of the heat sink removed.

Figure 3 is a plan view of the heat pipe removed in Figure 2.

Figure 4 is an inverted view of Figure 1.

Fig. 5 is a plan view showing a heat pipe of a heat sink according to another embodiment of the present invention.

60‧‧‧heat pipe

62‧‧‧Evaporation section

64‧‧‧Connection section

66‧‧‧Condensation section

68‧‧‧ joint office

Claims (10)

A heat dissipating device for dissipating heat from an electronic component, comprising: a bottom plate, a fin assembly coupled to the lower surface of the bottom plate, and a plurality of heat pipes disposed on the bottom plate, wherein the heat dissipating device further comprises a bonding to the bottom plate The top plate of the heat pipe is sandwiched with the bottom plate, and the heat pipes are bent at least once and are close to each other and abutted against each other. The heat dissipating device of claim 1, wherein the heat dissipating device further comprises a fin assembly coupled to the top plate, the upper fin group and the lower fin group collectively sandwiching the top plate and the bottom plate therebetween. The heat sink of claim 2, wherein the upper fin group occupies the entire top surface of the top plate, and the lower fin group occupies one third of the bottom surface of the bottom plate. The heat dissipating device of claim 1, wherein the heat pipes comprise a first heat pipe, the first heat pipe comprises an evaporation section, two connecting sections extending from both ends of the evaporation section, and ends of the two connecting sections respectively Extending the second condensation section. The heat sink of claim 4, wherein the evaporation section of the first heat pipe is parallel to the condensation section and perpendicular to the connection section. The heat dissipating device of claim 4, wherein the connecting sections of the first heat pipe extend in opposite directions, and the extending directions of the two condensation sections are opposite. The heat dissipating device according to any one of claims 4 to 6, wherein the heat pipes further comprise two second heat pipes that sandwich the first heat pipe, each of the second heat pipes includes an evaporation section and an evaporation section. An extended connecting section and a condensation section connected to the end of the connecting section, the evaporation section of each of the second heat pipes and the first The evaporation section of the heat pipe contacts, the condensation section is in contact with one of the condensation sections of the first heat pipe, and the connection section is in contact with one of the connection sections of the first heat pipe. The heat dissipating device of claim 7, wherein the two second heat pipes are opposite to each other on opposite sides of the first heat pipe. The heat dissipating device of claim 7, wherein each of the second heat pipes further comprises another connecting section extending from the other end of the evaporation section and another condensation section connected to the end of the other connecting section, the other A connecting section is in contact with another connecting section of the first heat pipe, and the other condensing section is in contact with another condensing section of the first heat pipe. The heat dissipating device of claim 7, wherein the length of the connecting portion of the first heat pipe and the second heat pipe is equal to the length of the condensation section and larger than the length of the evaporation section.