TWI393201B - 探測裝置製造方法 - Google Patents
探測裝置製造方法 Download PDFInfo
- Publication number
- TWI393201B TWI393201B TW098118192A TW98118192A TWI393201B TW I393201 B TWI393201 B TW I393201B TW 098118192 A TW098118192 A TW 098118192A TW 98118192 A TW98118192 A TW 98118192A TW I393201 B TWI393201 B TW I393201B
- Authority
- TW
- Taiwan
- Prior art keywords
- forming
- hole
- connection pad
- test
- manufacturing
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims description 79
- 238000004519 manufacturing process Methods 0.000 title claims description 33
- 238000000034 method Methods 0.000 title claims description 18
- 238000012360 testing method Methods 0.000 claims description 98
- 239000000758 substrate Substances 0.000 claims description 60
- 239000011241 protective layer Substances 0.000 claims description 31
- 239000004020 conductor Substances 0.000 claims description 26
- 239000010410 layer Substances 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 239000003989 dielectric material Substances 0.000 claims description 3
- 230000007261 regionalization Effects 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000035699 permeability Effects 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 81
- 239000004065 semiconductor Substances 0.000 description 34
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2008/060170 WO2009147718A1 (ja) | 2008-06-02 | 2008-06-02 | プローブウエハ製造方法 |
| PCT/JP2009/002366 WO2009147804A1 (ja) | 2008-06-02 | 2009-05-28 | プローブ装置製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200952108A TW200952108A (en) | 2009-12-16 |
| TWI393201B true TWI393201B (zh) | 2013-04-11 |
Family
ID=41397809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098118192A TWI393201B (zh) | 2008-06-02 | 2009-06-02 | 探測裝置製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TWI393201B (ja) |
| WO (2) | WO2009147718A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011149938A (ja) * | 2010-01-22 | 2011-08-04 | Kodi-S Co Ltd | フィルムタイプのプローブユニット及びその製造方法 |
| US10229877B2 (en) | 2016-06-22 | 2019-03-12 | Nanya Technology Corporation | Semiconductor chip and multi-chip package using thereof |
| US20200072561A1 (en) * | 2017-05-23 | 2020-03-05 | Mitsubishi Electric Corporation | Plate heat exchanger and heat pump hot water supply system |
| KR102452488B1 (ko) * | 2017-05-29 | 2022-10-11 | 삼성전자주식회사 | 웨이퍼 프로브 카드 및 이를 포함하는 분석 장치 및 웨이퍼 프로브 카드의 제조방법 |
| US10761146B2 (en) | 2017-05-29 | 2020-09-01 | Samsung Electronics Co., Ltd. | Wafer probe card for evaluating micro light emitting diodes, analysis apparatus including the same, and method of fabricating the wafer probe card |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006005109A (ja) * | 2004-06-17 | 2006-01-05 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP2006322876A (ja) * | 2005-05-20 | 2006-11-30 | Seiko Epson Corp | 半導体装置の検査プローブ及び半導体装置の検査プローブの製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274252A (ja) * | 1998-03-19 | 1999-10-08 | Mitsubishi Electric Corp | 半導体装置の検査装置及びその検査方法 |
-
2008
- 2008-06-02 WO PCT/JP2008/060170 patent/WO2009147718A1/ja not_active Ceased
-
2009
- 2009-05-28 WO PCT/JP2009/002366 patent/WO2009147804A1/ja not_active Ceased
- 2009-06-02 TW TW098118192A patent/TWI393201B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006005109A (ja) * | 2004-06-17 | 2006-01-05 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP2006322876A (ja) * | 2005-05-20 | 2006-11-30 | Seiko Epson Corp | 半導体装置の検査プローブ及び半導体装置の検査プローブの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200952108A (en) | 2009-12-16 |
| WO2009147804A1 (ja) | 2009-12-10 |
| WO2009147718A1 (ja) | 2009-12-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |