TWI388973B - Electrical package structure - Google Patents

Description

Electronic structure

The present invention relates to an electronic package structure, and more particularly to an electronic package structure in which a heat dissipating post is disposed.

1 shows an electronic structure of a prior art, in which a wafer 7 is disposed on a substrate 6, a packaging material 8 covers the wafer 7, and a heat sink 9 is disposed on the packaging material 8 to achieve a heat dissipation effect.

However, since the user's high-speed and multi-functional requirements for the system make the mounting density of the semiconductor element higher and higher, the heat generation density per unit volume or area also increases. Therefore, the heat dissipation and the height of the shortened structure are often not the best of both worlds.

Therefore, how to balance the size of the electronic structure and the heat dissipation function is an urgent task.

One of the objects of the present invention is to reduce the height of the electronic structure and to effectively dissipate heat.

According to an embodiment of the invention, an electronic package structure includes a substrate, a wafer, a heat sink, a package material, a plurality of solder balls, and a printed circuit board. The wafer system is disposed on the substrate and electrically connected to the substrate. The heat dissipating post is disposed through the substrate, wherein the heat dissipating post contacts the lower surface of the wafer and protrudes from the lower surface of the substrate. The encapsulating material covers the upper surface of the substrate and the wafer. The solder balls are disposed on the lower surface of the substrate. The solder ball on the lower surface of the substrate is electrically connected to the printed circuit board, and the heat dissipating post protruding from the lower surface of the substrate is pressed against or embedded in the upper surface of the printed circuit board.

The above and other aspects, features and advantages of the present invention will become more apparent from the description of the appended claims.

Referring to FIG. 2, an electronic structure according to an embodiment of the present invention includes a printed circuit board 1, a substrate 2, a wafer 3, and a heat dissipating post 5. The substrate 2 is electrically connected to the printed circuit board 1 by a plurality of solder balls 21 disposed on the lower surface thereof. The wafer 3 is fixed by the adhesive layer 31 to be disposed on the substrate 2 and electrically connected to the substrate 2 . The encapsulating material 4 covers the upper surface of the wafer 3 and the substrate 2.

As shown in the figure, the wafer 3 can be electrically connected to the substrate 2 by a plurality of leads 32. In addition, in another embodiment, the wafer 3 may also be electrically connected to the substrate 2 by a plurality of solder balls.

The heat dissipating post 5 is disposed through the substrate 2, and the heat dissipating post 5 is in contact with the lower surface of the wafer 3 and protrudes from the lower surface of the substrate 2. Compared with the prior art electronic structure shown in FIG. 1, the present invention has better heat dissipation effect because it can directly contact the wafer 3; and because the present invention does not need to provide a heat dissipating component on the package material 4, Reduce the height of the electronic structure.

Referring to FIG. 3, in an embodiment, the heat dissipating post 5 abuts against the upper surface of the printed circuit board 1 to achieve a fixed function. Referring to FIG. 4, in still another embodiment, the heat dissipating post 5 is embedded on the upper surface of the printed circuit board 1 to make the fixing function better.

The material of the heat dissipating post 5 is the same as that of a general heat dissipating component, and includes, but is not limited to, a metal having a high thermal conductivity such as aluminum or copper. In addition, the number and shape of the heat dissipation columns 5 can be flexibly set as needed. Referring to FIG. 5, the number of the heat dissipation columns 5 may be two, however, more may be used. The shape of the heat dissipating post is also not limited, and may include, but is not limited to, a cylinder, a rectangular column, and the like.

In summary, the present invention can reduce the height of the structure and effectively dissipate heat by providing a heat dissipation column that penetrates the substrate and is connected to the wafer. In addition, the heat dissipation column can also have a reinforcing and fixing function.

The embodiments described above are only intended to illustrate the technical idea and the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.

1‧‧‧Printed circuit board

2‧‧‧Substrate

21‧‧‧ solder balls

3‧‧‧ wafer

31‧‧‧Adhesive layer

32‧‧‧Leader

4‧‧‧Packaging materials

5‧‧‧ Thermal column

6‧‧‧Substrate

7‧‧‧ wafer

8‧‧‧Packaging materials

9‧‧‧heating device

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing an electronic construction structure of a prior art.

2 is a schematic view showing an electronic structure according to an embodiment of the present invention.

3 is a schematic view showing an electronic structure according to another embodiment of the present invention.

4 is a schematic view showing an electronic structure according to still another embodiment of the present invention.

FIG. 5 is a schematic view showing an electronic structure according to still another embodiment of the present invention.

1. . . A printed circuit board

2. . . Substrate

twenty one. . . Solder ball

3. . . Wafer

31. . . Adhesive layer

32. . . lead

4. . . Packaging material

5. . . Heat sink

Claims (6)

An electronic structure comprising: a substrate; a wafer disposed on the substrate and electrically connected to the substrate; a heat dissipating post disposed through the substrate, wherein the heat dissipating post is in contact with the lower surface of the wafer Projecting a lower surface of the substrate; a packaging material covering the upper surface of the substrate and the wafer; a plurality of solder balls disposed on a lower surface of the substrate; and a printed circuit board, wherein the substrate is under the substrate The solder balls of the surface are electrically connected to the printed circuit board, and the heat dissipating post protruding from the lower surface of the substrate is pressed against or embedded in the upper surface of the printed circuit board. The electronic package structure of claim 1 further comprising an adhesive layer for fixing the wafer to the substrate. The electronic component structure of claim 1 further comprising a plurality of leads for electrically connecting the wafer to the substrate. The electronic component structure of claim 1, further comprising a plurality of solder balls for electrically connecting the wafer to the substrate. The electronic component structure of claim 1, wherein the heat dissipating post protruding from the lower surface of the substrate is against the upper surface of the printed circuit board. The electronic component structure of claim 1, wherein the heat dissipating post protruding from the lower surface of the substrate is embedded in an upper surface of the printed circuit board.