TWI388855B - Electronic component testing device - Google Patents

Description

Electronic component testing device

The present invention relates to an electronic component testing apparatus for testing various electronic components (hereinafter, collectively referred to as IC components) such as a semiconductor integrated circuit component.

In an electronic component testing device called a Handler, a plurality of IC components housed in a tray are transported into a processor, and electrical contact between the input and output terminals of each IC component is applied while applying high-temperature or low-temperature thermal stress. The test is performed on an electronic component testing device (hereinafter, also referred to as a tester) to the contact portion of the test head. Further, when the test is completed, the IC elements are taken out from the test head and loaded onto the tray, thereby performing classification of good or defective products.

In general, an electronic component test device (hereinafter also referred to as a test device for a memory IC) in which a memory IC device (hereinafter also referred to as a memory IC) that requires a long test time is used as a test object is required to ensure simultaneous measurement. Most of the 32 or 64 ICs, from the trays of the memory ICs before and after the test (hereinafter also referred to as external trays), are loaded with most memory ICs to be cyclically transported in the electronic component tester before testing. The disk (hereinafter, also referred to as a test tray), in the state in which the memory IC is mounted on the test tray, the pusher causes the majority of the memory IC to be attached to the test head at the same time and tests, after the test, the corresponding test As a result, the test tray is loaded from the test tray to the external tray. In the test device for a memory IC of such a configuration, when the memory IC is pressed to the test head, the push surface of the pusher is in surface contact with the upper surface of the memory IC.

Further, in an electronic component test device (hereinafter, also referred to as a test device for logic IC) in which a logic IC element (hereinafter also referred to as a logic IC) which requires a shorter test time than a memory IC is used as a test object, The contact arm sucks and holds 4 or 8 equal-numbered logic ICs while moving, and the test arm is used to simultaneously attach the logic IC to the test head for testing. In the test device for a logic IC of such a configuration, when the logic IC is pressed to the test head, the push surface of the contact arm is in surface contact with the upper surface of the logic IC.

When the IC component is pressed by the pusher or the contact arm of the above electronic component testing device, when the upper surface of the IC component is subjected to a warpage or unevenness at the time of manufacture, the pressing surface of the pusher or the contact arm and the IC component The upper surface becomes locally in contact, and as a result, stress concentration occurs on the IC element. Due to the stress concentration, the IC element may be mechanically cracked and broken.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component testing apparatus capable of suppressing generation of mechanical stress or cracking of an electronic component under test when the electronic component to be tested is pressed.

In order to achieve the above object, when the present invention is used, it provides an electronic component testing apparatus for performing the test of the aforementioned tested electronic component by attaching the electronic component to be tested to the test head contact portion, wherein The pressing mechanism of the electronic component to be tested that is close to and away from the contact portion; the pressing mechanism has a pressing portion that is deformed while mimicking the shape of the upper surface of the electronic component to be tested, and can press the electronic component to be tested (refer to the patent application scope) Item 1).

In the present invention, when the input/output terminal of the electronic component to be tested is brought into contact with the test head contact portion, the shape of the pressing portion is deformed in accordance with the shape of the upper surface of the electronic component to be tested, and the electronic component to be tested is pressed by the pressing portion.

Thereby, even when the upper surface of the IC element is subjected to a warpage or unevenness at the time of manufacture, the electronic component to be tested can be uniformly pressed, so that mechanical stress or crack generation of the electronic component under test can be suppressed when pressed. .

Further, in the present invention, the pressing portion is pressed while mimicking the shape of the upper surface of the electronic component to be tested, and it is not necessary to accurately control the amount of stroke of the pressing mechanism for the electronic component to be tested at the time of pressing.

When the pressing portion is in partial contact with the upper surface of the electronic component to be tested, the heat transfer property at the contact portion is good, and the heat transfer property at the non-contact portion is poor. On the other hand, in the present invention, the pressing portion simulates the shape of the upper surface of the electronic component to be tested and is in integral contact with the upper surface of the electronic component to be tested. Therefore, in addition to the above advantages, the pressed electronic device can be tested. High precision temperature control of components.

In the above invention, it is preferable that the pressing mechanism has a plurality of pressing portions that press the electronic component to be tested at a plurality of points (see the second item of the patent application).

As described above, the plurality of test electronic components are pressed in a plurality of points by the plurality of pressing portions, and in addition to the above advantages, the input and output terminals are formed on the upper and lower surfaces such as FSCSP (Folded Stacked Chip Size Package). In the case of the electronic component to be tested, the input/output terminals formed on the upper surface of the electronic component to be tested are not electrically connected to each other by the pressing portion, and the electronic component to be tested can be easily pressed.

Further, when the electronic component to be tested having a special terminal arrangement such as an input/output terminal or the like formed only at the center portion of the lower surface or only the outer peripheral portion is pressed, the electronic component to be tested can be easily pressed.

Therefore, it is possible to provide an electronic component testing device which is excellent in the correspondence (softness) of the variety of the electronic component to be tested.

In the above invention, it is preferable that each of the pressing portions is expandable and contractable toward the electronic component side to be tested (see the third item of the patent application); preferably, each of the pressing portions is independent of each other and stretches. Free (refer to item 4 of the patent application scope).

In the above invention, it is preferable that each of the pressing portions includes an abutting member that abuts against the electronic component to be tested, and an elastic member that urges the abutting member toward the electronic component to be tested. Side (refer to item 5 of the patent application scope).

In a specific configuration of the pressing mechanism, it is preferable that the pressing mechanism further includes a holding portion that holds the pressing portion, so that the plurality of pressing portions protrude toward the electronic component to be tested, and the elastic member is interposed between the holding portion and the Between the components (refer to item 6 of the patent application scope). In this case, it is preferable that the abutting member, the elastic member, and the holding portion are made of a metal material (refer to item 7 of the patent application). Thereby, good heat transfer between the pressing mechanism and the electronic component to be tested can be ensured.

The specific structure of the pressing mechanism is preferably that the abutting member is a shaft member or a spherical member (refer to item 8 of the patent application); the elastic member is a spiral spring disposed coaxially with the shaft member or the spherical member. (Refer to the ninth application patent range), or a spiral spring which is arranged concentrically with the aforementioned shaft member (refer to claim 10 of the patent application). Further, each of the pressing portions preferably further includes at least a receiving space formed in the holding portion to accommodate the contact member portion and the elastic member, or a tubular member in which the abutting member portion and the elastic member are accommodated. One (refer to item 11 of the patent application scope).

In another specific configuration of the pressing mechanism, preferably, the pressing mechanism further includes a holding portion that holds the pressing portion such that the plurality of pressing portions protrude toward the electronic component to be tested; and each of the pressing portions includes the electronic component to be tested. The shaft member of the holding portion is held in a stretchable manner on the side (refer to item 12 of the patent application).

Further, in this case, each of the pressing portions further includes a pressure applying mechanism that applies fluid pressure to the shaft member toward the electronic component to be tested, whereby the pressing mechanism can have other specific configurations ( Refer to item 13 of the patent application scope).

Further, in the case of claim 12 or 13, the shaft member and the holding member are preferably made of a metal material (refer to item 14 of the patent application). Thereby, good heat transfer between the pressing mechanism and the electronic component to be tested can be ensured.

In another specific configuration of the pressing mechanism, preferably, the pressing mechanism further includes a holding portion that holds the pressing portion such that the plurality of pressing portions protrude toward the electronic component to be tested; and each of the pressing portions includes an elastically deformable elastic portion Component (refer to item 15 of the patent application scope). In this case, the elastic member is preferably made of a synthetic resin material containing a material having a heat transfer property higher than that of the synthetic resin material (refer to Patent Application No. 16). item). Thereby, good heat transfer between the pressing mechanism and the electronic component to be tested can be ensured.

In the above invention, it is preferable that the protruding portion that protrudes from the holding portion of the pressing portion can be detached from the pressing mechanism (refer to item 17 of the patent application). Further, although the invention is not particularly limited, it is preferable that the pressing mechanism can be replaced with another pressing mechanism (refer to item 18 of the patent application). Thereby, when the type of the electronic component to be tested in the electronic component testing device is replaced, it can be easily and quickly responded.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]

1 is a side view showing the entire electronic component testing apparatus according to the first embodiment of the present invention; FIG. 2 is a perspective view of the electronic component testing apparatus of FIG. 1; and FIG. 3 is a perspective view showing an IC component of the electronic component testing apparatus of FIG. FIG. 4 is a perspective view showing the structure of the IC register of the electronic component testing device of FIG. 1; and FIG. 5 is a perspective view showing the external tray used by the electronic component testing device of FIG. 1; FIG. Fig. 1 is a cross-sectional view of an important part in the measuring chamber of the electronic component testing device; Fig. 7 is a cross-sectional view showing the Z-axis driving device in the measuring cell of the electronic component testing device of Fig. 1; and Fig. 8 is a view showing the electronic component of Fig. 1 A partial exploded view of the test tray used in the test apparatus; and Fig. 9 is an exploded perspective view showing the structure of the insert, the contact guide, and the contact portion of the electronic component testing device of Fig. 1.

Further, Fig. 3 is a view for explaining a method of transferring an IC element in an electronic component test apparatus, and actually, there is also a portion in which a member arranged in parallel in the vertical direction is shown in a plan view. Therefore, the mechanical (three-dimensional) structure will be described with reference to Fig. 2 .

The electronic component testing device 100 of the present embodiment is a test device for a memory IC in which a memory IC is a test object, and is tested in a state in which a thermal stress of a high temperature or a low temperature is applied to an IC component (indicated by a number IC in the drawing). Check that the IC component is operating properly and that the IC component is classified according to the test result. In the operation test in which the thermal stress is applied, the IC device is loaded from the external tray KST on which the IC component to be tested is mounted, to the test tray TST transported inside the device 100.

Therefore, as shown in FIGS. 1 to 3, the electronic component testing apparatus 100 of the present embodiment includes the IC housing unit 120, which houses the IC component to be tested, and is classified and tested by the IC; The unit 130 sends the IC component supplied from the IC housing unit 120 to the cavity unit 110; the cavity unit 110 includes the test head 300; and the unloading unit 140 classifies the IC components that have been tested in the cavity portion 110. And take it out.

The test head 300 including the cavity portion 110 is provided with a plurality of contact portions 310 on its upper surface, and each of the contact portions 310 is electrically connected to the tester 400 through the electric wires 450. During the test, the IC component contacting the contact portion 310 is electrically connected to the tester 400 through the electric wire 450, and the IC component is tested by inputting an electrical signal from the tester 400.

In the lower portion of the electronic component testing apparatus 100, although a control device that mainly controls the electronic component testing device 100 is incorporated, as shown in Fig. 1, a space 101 is partially formed. In the space 101, the test head 300 can be replaced, and the IC component can be brought into contact with the contact portion 310 on the test head 300 through the opening portion 102a (see FIG. 6) formed on the device substrate 102 of the electronic component testing device 100.

Hereinafter, each part of the aforementioned electronic component testing device 100 will be described.

First, the IC housing unit 120 will be described.

As shown in FIGS. 2 and 3, the IC storage unit 120 is provided with a pre-test IC register 121 for storing the IC element before the test, and a post-test IC register 122 for storing the IC element classified according to the test result. .

The pre-test IC register 121 and the post-test IC register 122, as shown in FIG. 4, include a frame-shaped tray supporting member 123 and a lifting device 124 that can be moved toward the upper portion from the lower portion of the tray supporting member 123. . At the tray supporting member 123, the outer tray KST (refer to FIG. 5) is supported by a plurality of stacks, and only the stacked outer tray KST can be moved up and down by the lifting device 124.

Further, at the pre-test IC register 121, the external tray KST accommodating the IC component to be tested is stacked and held, and, in the IC register 122 after the test, the IC component is appropriately classified after the test. The outer tray KST is held in a stack.

Further, since the pre-test IC register 121 and the post-test IC register 122 have the same structure, an appropriate number can be set corresponding to the necessary number of the pre-test IC register 121 and the post-test IC register 122, respectively.

In the examples shown in Figs. 2 and 3, the IC register 121 is provided with two register STK-Bs before the test, and two empty registers STK- to the unloading unit 140 are provided in the partition wall. E, at the same time, after the test, the IC register 122 sets 8 registers STK-1, STK-2, . . The corresponding test results of STK-8 are classified into 8 categories and stored. That is to say, in addition to good products and defective products, high-quality components, medium-speed components, and low-speed components can be classified into good products, or components that must be retested can be classified in defective products.

Next, the loading unit 130 will be described.

The external tray KST is transported from the lower side of the apparatus substrate 102 to the window portion 133 of the loading unit 130 by the tray transport arm 125 provided between the IC housing portion 120 and the device substrate 102. Further, in the loading unit 130, the IC elements stacked in the external tray KST are temporarily transported to the precision instrument 132 by the XY-axis moving device 131. Here, the positions of the IC elements are corrected, and then transported to the precision instrument 132. The IC element is again used by the XY axis moving device 131, and is loaded to the test tray TST stopped at the loading unit 130.

The XY-axis moving device 131 for transferring the IC component from the external tray KST to the test tray TST, as shown in FIG. 2, includes two rails 131a mounted on the upper portion of the device substrate 102, and a movable arm 131b, two of the foregoing The rail 131a is reciprocally movable between the outer tray KST and the test tray TST (this direction is referred to as the Y direction); and the movable head 131c is supported by the movable arm 131b so as to be movable in the X direction along the movable arm 131b.

At the movable head 131c of the XY-axis moving device 131, the chuck is attached downward, and the chuck moves while sucking air, whereby the IC component is sucked from the external tray KST, and the IC component is transferred to the test tray TST. . In this way, the suction cup is attached to, for example, about eight of the movable heads 131c, and eight IC elements can be loaded one at a time to the test tray TST.

Further, in the general external tray KST, since the recess for holding the IC element has a larger shape than the IC element, the position of the IC component accommodated in the external tray KST has a large difference. Therefore, when the IC component is carried in this state, it is difficult to cause the IC component to correctly fall into the IC housing recess formed on the test tray TST. Therefore, in the electronic component testing apparatus 100 of the present embodiment, an IC component position correcting mechanism called a precision instrument 132 is provided between the external tray KST installation position and the test tray TST. The precision instrument 132 has a deep recessed portion, and the peripheral edge of the recessed portion surrounds the inclined surface. Therefore, when the IC component sucked by the chuck falls into the recessed portion, the falling position of the IC component is corrected on the inclined surface. Thereby, the positions of the eight IC components are correctly positioned, and the IC component whose position is corrected is again sucked by the suction cup and loaded to the test tray TST, whereby the IC component can be accurately loaded and formed into the test. The IC on the tray TST accommodates the recess.

Next, the cavity portion 110 will be described.

The test tray TST is sent to the cavity unit 110 after the IC unit is stacked by the loading unit 130, and each IC element is tested while being mounted on the test tray TST.

The cavity portion 110 includes: a thermostatic bath 111 for applying a high-temperature or low-temperature thermal stress on the IC component stacked on the test tray TST; and measuring the groove 112 to contact the IC component applying the superheat stress by the aforementioned thermostatic bath 111 The test head 300; and the heat removal tank 113 remove the applied thermal stress from the IC component tested by the measurement tank 112. Further, it is preferable that the heat removing tank 113 is insulated from the thermostatic bath 111 or the measuring tank 112, and in fact, a predetermined thermal stress is applied to the thermostatic bath 111 and the measuring tank 112, and the heat removing tank 113 and the both are in an adiabatic state. However, these items are still referred to as cavity portions 110 for convenience.

The thermostatic bath 111 is configured to protrude above the measurement tank 112. Further, as shown in Fig. 3, a vertical conveyance device is provided inside the constant temperature bath 111, and the measurement tanks TST stand by the vertical conveyance device while the measurement tanks 112 are in the unused state. Mainly in the aforementioned standby, the IC component is subjected to high temperature or low temperature thermal stress.

At the measurement tank 112, a test head 300 is disposed at a central portion thereof, and the test tray TST is transported to the test head 300, and the input and output terminals of the IC element are electrically contacted to the test head 300 contact pin 311 to perform a test.

As shown in Fig. 6, a temperature adjusting air blowing device 60 is provided inside the sealed casing 50 constituting the measuring tank 112. The air conditioning device 60 for temperature adjustment includes a fan 61, a heater 62, and a nozzle 63 for ejecting liquid nitrogen. The fan 61 sucks air inside the casing 50, and blows warm or cold air through the heater 62 or the nozzle 63. The inside of the casing 50, whereby the inside of the casing 50 is brought to a predetermined temperature condition (high temperature or low temperature). Thereby, the inside of the casing 50 can be maintained at a high temperature of, for example, about room temperature to 160 ° C or a low temperature of, for example, -60 ° C to room temperature. The internal temperature of the casing 50 is detected, for example, by the temperature detector 51, and the heat of the fan 61 air volume heater 62 or the discharge amount of the nozzle 63 is controlled to maintain the inside of the casing 50 at a predetermined temperature.

Further, as shown in Fig. 6, the warm air or the cold air generated by the temperature-adjusting air blowing device 60 flows in the upper portion of the casing 50 along the Y-axis direction, along the opposite side of the wall surface on which the temperature-adjusting air blowing device 60 is provided. The side wall of the casing descends and returns to the temperature-adjusting air blowing device 60 through the gap between the mating plate and the test head 300, and circulates inside the casing 50.

At the upper portion of the casing 50 of the measuring tank 112, a Z-axis driving device 40 is provided. Further, a heat insulating material 52 is provided on the inner wall of the casing 50. As shown in Fig. 7, the two pairs of drive shafts 42 extend through the casing 50 and extend above the casing 50, and the upper ends thereof are coupled to the upper plate body 43. A pair of bearings 53 are fixed to the upper portion of the casing 50, and the drive shaft 42 is allowed to move in the Z-axis direction by the aforementioned bearing 53.

At a slight central portion of the upper plate body 43, a ball screw adapter 43a is fixed. A female thread is formed at the adapter 43a, and the female thread is screwed to the male thread of the main drive shaft 44. The lower end of the main drive shaft 44 is rotatably held by a rotary bearing 54 embedded in the casing 50, and its upper end is rotatably held by a rotary bearing 45a attached to the support frame 45.

The support frame 45 is attached to the upper portion of the casing 50 by a support rod 45b. The upper end of the main drive shaft 44 protrudes upward from the support frame 45, and the first pulley 46a is fixed to the portion. Further, the second pulley 46b is disposed at a predetermined distance from the first pulley 46a, and is disposed on the upper portion of the support frame 45, and these elements are coupled by a transmission belt 46c.

The rotation shaft of the second pulley 46b is coupled to the gear case 47a, and the gear case 47a is coupled to the rotation shaft of the stepping motor 47. The second pulley 46b rotates by the rotation of the rotation shaft of the stepping motor 47. When the second pulley 46b is rotationally driven, the rotational force is transmitted to the first pulley 46a through the belt 46c, and the first pulley 46a rotates. Further, when the first pulley 46a rotates, the main drive shaft 44 also rotates, and as a result, the adapter 43a converts the rotational motion of the main drive shaft 44 into a linear motion, and moves the upper plate 43 in the Z-axis direction. When the upper plate body 43 moves, its driving force is transmitted to the drive plate body 41 through the drive shaft 42, and the drive plate body 41 is moved in the Z-axis direction. Further, the rotation speed of the stepping motor 47 is detected by the encoder 48, and based on the detection result, the control device 49 performs drive control of the stepping motor 47.

At the lower surface of the driving plate body 41, a plurality of convex portions 41a corresponding to the plurality of pushers 20 held by the engaging plate 10 are provided, and the driving plate body 41 is moved in the Z-axis direction, and the convex portions 41a can be respectively pressed. Pusher 20.

The heat removal tank 113 is disposed so as to protrude upward from the measurement tank 112 in the same manner as the constant temperature bath 111. As shown in Fig. 3, a vertical conveyance device is provided. Further, in the aforementioned heat removing tank 113, when a high temperature is applied by the constant temperature bath 111, the IC element is cooled back to room temperature by air blowing, and when the low temperature is applied by the constant temperature bath 111, the IC is heated by a warm air or a heater. After returning the element to a temperature at which dew condensation does not occur, the heat-removed IC element is carried out to the unloading unit 140.

An inlet-side opening for loading the test tray TST from the device substrate 102 is formed in the upper portion of the constant temperature bath 111, and an inlet-side opening for carrying the test tray TST to the device substrate 102 is formed in the upper portion of the heat removal groove 113. Further, a test tray transporting device 114 for carrying in and out of the test tray TST through the opening is provided in the device substrate 102. The test tray conveying device 114 is configured by, for example, a rotating roller. The test tray TST carried out from the heat removal tank 113 by the test tray conveyance device 114 is sent back to the constant temperature bath 111 through the unloading unit 140 and the loading unit 130.

Fig. 8 is an exploded perspective view showing the structure of the test tray TST used in the present embodiment. The test tray TST is provided with a plurality of pallets 36 at equal intervals in the square frame 35, and is equally spaced at the sides 35a of the square frames 35 on the sides of the pallets 36 and the pallets 36. A plurality of mounting pieces 37 are formed. The pallets 36 or the pallets 36 and the sides 35a are separated by a mounting piece, thereby constituting the insert accommodating portion 38.

Each of the insert accommodating portions 38 can accommodate one insert 30, and the inserted insert 30 can be attached to the two attachment pieces 37 in a floating state by using the fastening member 39. Therefore, at both end portions of the insert 30, mounting holes 33 mounted to the mounting pieces 37 are formed, respectively. In this way, the insert 30 is, for example, mounted on the test tray TST by about 4×6 or so.

As shown in Fig. 9, each of the inserts 30 is formed in a slightly central portion of the IC housing portion 31 in which the IC component is housed, and the IC component is placed on the test tray TST by the IC component falling therein. Further, at the central portions of both ends of the insert 30, guide holes 32 are formed, and the pusher 20 guide pins 24 and the contact guides 320 guide bushings 321 are respectively inserted into the guide holes 32 from above and below. Although not shown in the drawings, for example, the guide hole 32 has an upper half which is inserted by the pusher base 21 and the guide pin 24 is inserted to perform positioning of the small diameter hole, and the lower half thereof is guided by the contact guide 320. The guide sleeve 321 is inserted to perform positioning of the large diameter hole. Further, at the corners of both ends of the insert 30, mounting holes 33 mounted to the test tray TST mounting piece 37 are formed.

Further, each of the inserts 30 has the same shape and the same size, and each of the inserts 30 accommodates one IC element. The IC housing portion 31 of the insert 30 is set to correspond to the shape of the IC component to be accommodated, and in the example shown in Fig. 9, it is a square recess.

At the upper surface of the test head 300, a plurality of contact portions 310 are provided corresponding to the arrangement of the test trays TST.

Each of the contact portions 310 has a plurality of contact pins 311 provided corresponding to the number and pitch of the input and output terminals of the IC component, and each of the contact pins 311 is pressed by a spring (not shown) in the vertical direction. Therefore, even if the IC component is attached, the contact pin 311 retreats to the upper surface of the contact portion 310, and in addition, the contact pin 311 becomes accessible to all the terminals of the IC component.

Above each contact portion 310, a contact guide 320 is provided to ensure high-precision positioning of the pusher 20 and the insert 30, respectively. Two guide pins 24 formed on the pusher 20 are inserted on both sides of the contact guide 320, and a guide bushing 321 for positioning is provided between the two guide pins 24. Further, at the contact guide 320, four stoppers 322 for restricting the lower limit of the pusher 20 are formed.

Fig. 10 is a cross-sectional view showing the structure of a pusher of the electronic component testing apparatus according to the first embodiment of the present invention; Fig. 11 is a cross-sectional view taken along line XI-XI of Fig. 10; and Fig. 12 is a view showing a drawing of Fig. 10 A cross-sectional view showing a state in which an IC component is attached to a contact portion; and a 13A is a cross-sectional view showing an important portion of a portion XIIIA of Fig. 10.

Above the test head 300, as shown in Fig. 6, a pusher 20 is provided corresponding to the number of the contact portions 310. The pusher 20 in the present embodiment, as shown in Fig. 10, includes a pusher base 21 having a flat plate shape and a push block 22 having a convex shape, and the push block 22 is attached to the push. The base 21 is such that the convex portion of the push block 22 projects through the perforation formed at a slightly central portion of the pusher base 21 to protrude downward. Both the pusher base 21 and the push block 22 are made of a material having excellent heat transfer properties such as a metal material.

Further, at both end portions of the lower side of the pusher base 21, a guide pin 24 for inserting the insert guide hole 31 and the contact guide 320 for guiding the boss 321 is provided. Further, a stopper pin 25 is provided at four corners on the lower side of the pusher base 21, and when the pusher 20 is moved downward by the driving of the Z-axis driving device 40, the stopper pin 25 abuts the contact guide. The introducer 320 blocks the portion 322 to limit the lower limit.

Further, as shown in Fig. 13A, in the pusher 20 of the present embodiment, a plurality of pressing portions 23a are held so that the tip end surface of the self-pushing block 22 protrudes toward the IC element to be tested.

Each of the pressing portions 23a includes a metal spiral spring 23a1 housed in a receiving hole 22a formed in the pushing block 22, and a metal plunger 23a2 housed in the receiving hole 22a, a coil spring 23a1 and a plunger. 23a2 is a coaxial configuration.

The spiral spring 23a1 is fixed at its upper end portion to the upper end portion of the accommodation hole 22a, and its upper end portion is fixed to the upper end portion of the plunger 23a2. Each of the receiving holes 22a has a diameter smaller than the inner diameter of the tip end surface of the pushing block 22. The plunger 23a2 is disposed such that its lower end portion is protruded from the accommodating portion 22a and faces the IC component to be tested, and the spiral spring 23a1 is pressed toward the IC component to be tested, and the upper end portion thereof is locked at the lower end of the accommodating hole 22a. unit.

Each of the pressing portions 23a of the plunger 23a2 protrudes from the opening of the pressing block 22 in the receiving hole 22a. When the pusher 20 presses the IC element, the IC element is continuously pressed by the elastic force of the spiral spring 23a1 to mimic the upper surface of the IC element. The shape can be stretched independently of each other.

As a result, even if the IC element is unevenly pressed on the upper surface of the IC element, the IC element can be uniformly pressed. Therefore, the mechanical stress or crack generated in the IC element during pressing can be greatly suppressed.

Further, each of the pressing portions 23a is pressed while mimicking the shape of the upper surface of the IC element, whereby the stroke amount of the Z-axis driving device 40 does not need to be accurately controlled during pressing.

Further, since each of the pressing portions 23a is in contact with the upper surface of the IC element at the time of pressing, the temperature of the IC element can be controlled with high precision at the time of pressing.

Further, by forming the spiral spring 23a1 and the plunger 23a2 with a metal material, it is possible to ensure good heat transfer between the pusher 20 and the IC element.

Further, the shape of the tip end of each of the plungers 23a2 which is in contact with the IC element, as shown in Fig. 13A, is not limited to the push-pull shape of the tip, and may be, for example, a flat circular or a flange-shaped reaming. It can be appropriately set to a shape that ensures the desired heat transfer property.

Further, if necessary, the portion (projecting portion) of the plunger 23a2 that protrudes from the pushing block 22 can be made to be from the body side of the plunger 23a2 (to the side of the plunger 23a2) by, for example, screw locking. ) Free and easy.

Thereby, the first advantage is that it can easily correspond to different types of IC components by, for example, changing the protruding portions having different lengths. Further, the second advantage is that the IC element can be easily arranged in accordance with the terminal arrangement of the IC element, and the IC element having the special input/output terminal arrangement as shown in Fig. 14D or Fig. 14E can be easily used.

13B to 13F are cross-sectional views showing the first to fifth modifications of the pressing portion structure according to the first embodiment of the present invention.

As shown in Fig. 13B, the pressing portion 23b of the first modification is composed only of the metal plunger 23b1 housed in the housing hole 22a, and the lower end portion of the plunger 23b1 protrudes from the housing hole 22a to be opposed to the IC to be tested. The element is disposed, and at the same time, the upper end portion thereof can be locked at the lower end portion of the receiving hole 22a.

Each of the pressing portions 23a and the plunger 23b1 protrudes from the holding block 22 in the receiving hole 22a. When the pusher 20 presses the IC element, the IC element is continuously pressed by its own weight to mimic the shape of the upper surface of the IC element, and can be independently stretched and contracted. .

Thereby, even when the upper surface of the IC element is deformed by the back-up, unevenness, or the like at the time of manufacture, the electronic component to be tested can be uniformly pressed, so that the mechanical stress or the turtle of the electronic component to be tested can be greatly suppressed at the time of pressing. Cracking occurs. Further, it is not necessary to accurately control the stroke amount of the pressing mechanism for the electronic component to be tested during pressing, and the temperature of the IC component can be controlled with high precision.

Further, by forming the plunger 23b1 from a metal material, it is possible to ensure good heat transfer between the pusher 20 and the IC element.

Further, by attaching the ring body to each of the plungers 23b1 to manage the self-weight of the plunger 23b1, it is possible to optimize the pressing force of the IC component in various types.

Further, if necessary, the protruding portion of the plunger 23b1 can be detached from the main body side of the plunger 23b1.

As shown in Fig. 13C, the pressing portion 23c of the second modification is composed of a metal spiral spring 23c1 housed in the housing hole 22a and a metal plunger 23c2 housed in the housing hole 22a. The spring 23c1 and the plunger 23c2 are arranged in a concentric circle.

The spiral spring 23c1 is fixed to the upper end portion of the plunger 23c2 at its upper end portion, and is fixed to the lower end portion of the receiving hole 22a with its lower end portion. The lower end portion of the plunger 23c2 is disposed so as to protrude from the accommodating portion 22a. The IC component to be tested is pressed toward the IC component to be tested by the coil spring 23a1.

Each of the pressing portions 23c and the plunger 23c2 protrudes from the holding block 22 in the receiving hole 22a. When the pusher 20 presses the IC element, the IC element is continuously pressed by the elastic force of the spiral spring 23c1 to mimic the shape of the upper surface of the IC element. The ground can be stretched independently of each other.

Thereby, even when the upper surface of the IC element is deformed by the back-up, unevenness, or the like at the time of manufacture, the electronic component to be tested can be uniformly pressed, so that the mechanical stress or the turtle of the electronic component to be tested can be greatly suppressed at the time of pressing. Cracking occurs. Further, it is not necessary to accurately control the stroke amount of the pressing mechanism for the electronic component to be tested during pressing, and the temperature of the IC component can be controlled with high precision.

Further, by forming the spiral spring 23c1 and the plunger 23c2 with a metal material, it is possible to ensure good heat transfer between the pusher 20 and the IC element.

Further, if necessary, the protruding portion of the plunger 23c2 can be detached from the main body side of the plunger 23c2.

As shown in Fig. 13D, the pressing portion 23d of the third modification includes a tubular body 23d1 which is cylindrical and communicates with the receiving hole 22b formed in the pushing block 22; the spiral spring 23d2 is made of metal. The container is housed in the receiving hole 22b and the tubular body 23d1, and the spherical body 23d3 is made of metal and housed in the tubular body 23d1. The helical spring 23d2 and the spherical body 23d3 are coaxially arranged.

Each of the receiving holes 22b is formed to have a small diameter at the tip end surface of the pushing block 22 and is opened at the same diameter. The tubular body 23d1 is connected to the continuous accommodation hole 22b and has substantially the same diameter as the accommodation hole 22b, and the lower end portion thereof is opened and reduced in diameter to be opened. The spiral spring 23d2 is fixed at its upper end portion to the upper end portion of the accommodation hole 22b, and at the same time, the lower end portion thereof contacts the spherical body 23d3. The spherical body 23d3 is disposed so as to protrude from the opening of the tubular body 23d1 and face the IC component to be tested, and the spiral spring 23d2 is continuously pressed toward the IC component to be tested, and can be locked to the reduced diameter portion of the tubular body 23d1.

Each of the pressing portions 23d's spherical body 23d3 protrudes from the tubular body 23d1 by a predetermined amount. When the pusher 20 presses the IC component, the IC component is continuously pressed by the elastic force of the spiral spring 23d2, and the upper surface shape of the IC component can be mimicked to each other. Independently scaled.

Thereby, even when the upper surface of the IC element is deformed by the back-up, unevenness, or the like at the time of manufacture, the electronic component to be tested can be uniformly pressed, so that the mechanical stress or the turtle of the electronic component to be tested can be greatly suppressed at the time of pressing. Cracking occurs. Further, it is not necessary to accurately control the stroke amount of the pressing mechanism for the electronic component to be tested during pressing, and the temperature of the IC component can be controlled with high precision.

Further, at the time of pressing, the useless force for the planar direction of the IC element due to some reason is reduced by the rotation operation of the spherical body 23d3, and as a result, the positional deviation with respect to the planar direction of the contact portion 310 can be eliminated.

Further, by forming the spiral spring 23d2 and the spherical body 23d3 with a metal material, it is possible to ensure good heat transfer between the pusher 20 and the IC element.

As shown in Fig. 13E, the pressing portion 23e of the fourth modification is a metal plunger 23e1 housed in the housing space 22c formed in the pushing block 22, and a pressurized fluid (oil) enclosed in the housing space 22c. The lower end portion of the plunger 23e1 protrudes from the accommodating space 22c and can be disposed to face the IC component to be tested, and the upper end portion can be locked to the lower end portion of the accommodating space 22c.

The accommodating space 22c is formed by traversing the entire convex portion of the pushing block 22 to form a space so as to be shared by all the pressing portions held by the pushing block 22, and a plunger corresponding to the protruding from the accommodating space 22c is formed. 23e1 number of openings. Further, a pressure receiving port 22d that communicates with the pressure source 500 provided outside is formed in the accommodating space 22c, and the pressurized fluid to which a desired pressure is applied from the pressure source 500 can be transmitted through the pressure receiving port 22d. Each of the plungers 23e1 is continuously received in the accommodating space 22c through the opening of the upper end portion thereof, and can be locked at the lower end portion of the accommodating space 22c. Further, an oil seal structure (not shown) is provided at each opening, and it is possible to prevent the pressurized fluid sealed in the accommodating space 22c from leaking through the opening. Each of the plungers 23e1 can receive a desired pressure from the pressurized fluid enclosed in the accommodating space 22c at its upper end portion.

Each of the pressing portions 23e and the plungers 23e1 are respectively protruded from the accommodating space 22c by a substantially equal pressure when the pressurized fluid is applied, and the ejector 20 is sealed from the accommodating space when the pusher 20 presses the IC component. The pressure applied by the pressurized fluid in 22c continues to press the IC component while being able to independently expand and contract from each other while mimicking the shape of the upper surface of the IC component.

Thereby, even when the upper surface of the IC element is deformed by the back-up, unevenness, or the like at the time of manufacture, the electronic component to be tested can be uniformly pressed, so that the mechanical stress or the turtle of the electronic component to be tested can be greatly suppressed at the time of pressing. Cracking occurs. Further, it is not necessary to accurately control the stroke amount of the pressing mechanism for the electronic component to be tested during pressing, and the temperature of the IC component can be controlled with high precision.

Further, by forming the plunger 23e1 with a metal material, it is possible to ensure good heat transfer between the pusher 20 and the IC element.

Further, the pressurized fluid enclosed in the accommodating space 22c may be not only a liquid but also a gas, and may be appropriately set in accordance with the required pressure or heat transfer property between the pusher 20 and the IC element.

Further, if necessary, the protruding portion of the plunger 23e1 can be detached from the main body side of the plunger 23e1.

As shown in Fig. 13F, the pressing portion 23f of the fifth modification is composed of an elastic member 23f1 projecting from the tip end surface of the push block 22 toward the IC element to be tested, and the elastic member 23f1 is elastic. A deformed synthetic resin material. When a good heat transfer property is required between the pusher 20 and the IC component, the synthetic resin material may also use a material containing a heat transfer property such as a metal material or carbon black which is higher than that of the above synthetic resin material. The powder produced.

Each of the pressing portions 23f elastic members 23f1 can independently expand and contract independently of the shape of the upper surface of the IC device when the pusher 20 presses the IC element.

Thereby, even when the upper surface of the IC element is deformed by the back-up, unevenness, or the like at the time of manufacture, the electronic component to be tested can be uniformly pressed, so that the mechanical stress or the turtle of the electronic component to be tested can be greatly suppressed at the time of pressing. Cracking occurs. Further, it is not necessary to accurately control the stroke amount of the pressing mechanism for the electronic component to be tested during pressing, and the temperature of the IC component can be controlled with high precision.

Further, by including a powder having a heat transfer property higher than that of the synthetic resin material in the elastic member 23f1, it is possible to ensure good heat transfer between the pusher 20 and the IC element.

Further, if necessary, the protruding portion of the elastic member 23f1 can be detached from the main body side of the elastic member 23f1.

Further, in another modification of the pressing portion, for example, in the pressing portion 23a shown in Fig. 13A, the plunger 23a2 may be replaced with the elastic member 23f1 shown in Fig. 13F.

Figs. 14A to 14E are cross-sectional views showing the first to fifth types of changes in the arrangement of the pusher according to the first embodiment of the present invention.

As shown in FIG. 14A, the first arrangement is changed by pressing the pressing portion 23a when the upper surface of the smooth IC element having no irregularities or input/output terminals is formed. In this case, the upper surface of the IC element is uniformly distributed with respect to the upper surface of the IC element, and the plurality of pressing portions 20a are disposed on the tip end surface of the pushing block 22.

The second arrangement is changed, and as shown in Fig. 14B, the pressing portion 23a is pressed when the upper surface of the uneven surface of the IC element is pressed. In this case, the upper surface of the IC element is uniformly distributed with respect to the upper surface of the IC element, and the plurality of pressing portions 20a are disposed on the tip end surface of the pushing block 22.

When the unevenness formed on the upper surface of the IC element is small, the pressing portion 23a can be used practically. Further, when the unevenness is large, the length or the elastic force of each of the pressing portions 23a can be changed to match the uneven shape of the upper surface of the IC element.

As shown in Fig. 14C, for example, as shown in Fig. 14C, for example, the upper surface of the input/output terminal of the IC element is partially formed, and the pressing portion 23a in which the non-pressable prohibited portion is partially present is arranged. In this case, the pressing portion is configured to avoid the input/output terminals formed on the upper surface, whereby the uniform pressure distribution on the upper surface of the IC element can be facilitated.

As shown in FIG. 14D, the fourth arrangement is changed so that the pressing input/output terminal is formed only by the pressing portion 23a formed on the upper surface of the IC element at the center. In this case, each of the pressing portions 23a is uniformly distributed on the tip end surface of the pushing block 22 so as to be evenly distributed on the upper surface portion (that is, only the central portion of the upper surface) which is formed opposite to the input/output terminal portion. Thereby, the uniform press distribution corresponding to the arrangement of the input and output terminals of the IC element can be facilitated.

In the fifth arrangement, as shown in FIG. 14E, the pressing and receiving terminals are arranged only by the pressing portions 23a formed on the upper surface of the IC component on the outer peripheral portion. In this case, the plurality of pressing portions 23a are uniformly distributed only on the upper surface portion (that is, only the outer peripheral portion of the upper surface) which is formed opposite to the input/output terminal portion, and is disposed on the tip end surface of the pushing block 22. Thereby, the uniform press distribution corresponding to the arrangement of the input and output terminals of the IC element can be facilitated.

By using the above-described various arrangement changes, even when manufacturing defects such as back warpage or unevenness occur on the upper surface of the IC element, or the input/output terminals are formed on the upper surface side, or the lower surface side input/output terminals are arranged in a special arrangement, etc. Under various restrictions, the IC element can be easily pressed uniformly in accordance with the arrangement of the input and output terminals of the IC element, and mechanical stress or crack generated on the IC element at the time of pressing can be greatly suppressed.

Of course, not only the pressing portion 23a but also the pressing portions 23b to 23f of the first to fifth modifications can be arranged in accordance with the first to fifth alignments.

A plurality of the above-mentioned (for example, 32 or 64, etc.) pushers 20 are engaged with the peripheral edge portion of the upper end of the engaging block 22 by the peripheral edge portion of the push block 22 to correspond to the arrangement of the contact portions 310 on the test head 300. It is held in the mating panel 10.

The mating plate 10 is located at the upper portion of the test head 300, and the test tray TST can be inserted between the pusher 20 and the contact portion 310, supported by the drive plate body 41 of the Z-axis drive device 40, and held on the mating plate 10 Each of the pushers 20 is driven by the Z-axis driving device 40, and can all move in the Z-axis direction at the same time.

Next, the unloading unit 140 will be described.

The unloading unit 140 is also provided with an XY-axis moving device 141 having the same structure as the XY-axis moving device 131 provided on the loading unit 130. After the XY-axis moving device 141, the IC component is carried out from the unloading portion after the test. The 140 test tray TST is loaded to the external tray KST.

As shown in FIG. 2, at the unloading unit 140, the external substrate KST transported to the unloading unit 140 at the unloading unit 140 is provided with two pairs of window portions 143 on the upper surface facing the device substrate 102.

Further, although not shown, a lifting table for lifting the external tray KST is provided on the lower side of the window portion 143. Here, the external tray KST filled with the IC element after the load test is loaded and lowered. The aforementioned external tray KST is transferred to the tray transport arm 125.

Therefore, in the electronic component testing apparatus 100 of the present embodiment, the IC components can be classified into at most eight types, and at most, only four external trays KST can be disposed in the window portion 143 of the unloading unit 140. Therefore, instant classification can only be divided into 4 categories. In general, it is sufficient to classify good products into high-speed reaction elements, medium-speed reaction elements, and low-speed reaction elements, and it is sufficient to add a total of four types of defective products. However, IC components such as retesting are sometimes generated.

As described above, when an IC component other than the four external trays KST classified in the window portion 143 of the unloading portion 140 is generated, one external tray KST is returned from the unloading portion 140 to the IC housing portion 120, so that necessary storage is newly generated. The external tray KST of the classified IC component is transported to the unloading unit 140 as long as the IC component is housed.

However, when the replacement of the external tray KST is carried out in the sorting process, the sorting operation must be interrupted, and there is a problem that the output is lowered. Therefore, in the electronic component testing apparatus 100d of the present embodiment, the buffer portion 142 is provided between the test tray TST and the window portion 143 of the unloading portion 140, and the IC component classification which is rarely generated can be temporarily stored in the buffer portion 142.

For example, the buffer unit 142 has a capacity for accommodating about 20 to 30 IC elements, and a memory for storing the IC element classifications stored in the IC storage positions of the buffer unit 142, and temporarily stores the IC elements in the buffer unit. 142 IC component classification and location. Further, when the sorting work slot or the buffer unit 142 is full, the external tray KST of the classification of the IC component temporarily stored in the buffer unit 142 is called out from the IC storage unit 120, so that it is called. It is housed in the aforementioned external tray KST. At this time, although the IC components temporarily stored in the buffer unit 142 may be plurally classified, in this case, when the external tray KST is called, the plurality of external trays KST may be called once to the window of the unloading unit 140. 143.

Next, the operation will be described.

The IC component is mounted on the test tray TST, that is, it is mounted on the test tray TST as shown in Fig. 8. When more detailed, each |IC component is dropped into the insert 30IC of Fig. 8. In the state of the accommodating portion 31, the thermostat bath 111 is heated to a predetermined temperature and then transported into the measurement tank 112.

When the test tray TST on which the IC component is mounted is stopped above the test head 300, the Z-axis driving device 40 is driven and the convex portion 41a provided on the driving plate body 41 causes the pusher 20 to move downward. The pusher 20, the stopper pin 25, is lowered to abut the contact guide 320 of the contact guide 320.

When the pusher 20 is lowered, the plurality of pressing portions 23a protruding from the tip end of the pushing block 22 are pressed against the upper surface of the IC member to be pressed. In this case, each of the pressing portions 23a can be expanded and contracted independently of each other, and even when the upper surface of the IC element is subjected to a warpage or unevenness at the time of manufacture, the IC element can be uniformly pressed by mimicking the shape of the upper surface of the IC element. Thereby, mechanical stress or crack generation of the electronic component to be tested can be greatly suppressed at the time of pressing.

In this state, the self tester 400 contacts the pin 311 through the test head 300 to input an electrical signal to the IC component. Moreover, the response signal output from the IC component is sent to the tester 400 through the test head 300, thereby testing the performance and function of the IC component.

When the IC component test is completed, the Z-axis driving device 40 is driven to raise the mating panel 10. Further, the XY-axis moving device 141 transports the post-test IC component mounted on the test tray TST, and stores it in the external tray KST in accordance with the test result.

Here, the test object is, for example, an IC component in which an upper surface is smooth, an IC component in which an uneven surface or an input/output terminal is formed on the upper surface, or an IC component in which an input/output terminal is formed only in a central portion or an outer peripheral portion, so that each push is performed. By replacing the pusher with the IC component specifications of the type changed by the first to fifth types, for example, the device 22 can easily replace the type of the IC component to be tested.

[Second Embodiment]

Fig. 15 is a top view showing an electronic component testing apparatus according to a second embodiment of the present invention; Fig. 16 is a cross-sectional view taken along line XVI-XVI of Fig. 15, and Fig. 17 is a view showing electronic component testing according to a second embodiment of the present invention; A side view of the device contact arm structure; Fig. 18 is a cross-sectional view taken along line AA of Fig. 17; and Fig. 19 is a side view of the contact arm after the article corresponding portion is replaced from the state of Fig. 17.

The electronic component testing device 200 according to the second embodiment of the present invention is a logic IC test device using a logic IC as a test object. As shown in Fig. 15, the electronic component testing device 200 includes various trays 201 to 203, XY axis moving devices 204, 205, and a heating plate. 206 and buffer unit 208, the test head 300 and the test head 400 can be used to test the logic IC (indicated by the number IC in the figure). The test head 300 and the test head 400 are connected by a wire 450. Further, in the electronic component testing apparatus 200, the IC component mounted on the supply tray 202 is pressed against the contact portion 310 of the test head 300 by the XY axis moving device 204, 205, and passes through the test head 300 and the test head 400. After the tester 450 has performed the test of the IC component, the IC component subjected to the above test is stored in the sorting tray 203 in accordance with the test result.

In the electronic component testing device 200, a device substrate 209 is provided, and the device substrate 209 is provided with XY axis moving devices 204, 205. Moreover, the opening portion 210 is formed in the device substrate 209. As shown in Fig. 16, the IC element transmission opening 210 is pressed against the contact portion 310 of the test head 300 disposed on the back side of the electronic component testing device 200.

The XY-axis moving device 204 provided on one side of the device substrate 209 is provided with rails 204a and 204b along the X-axis direction and the Y-axis direction, whereby the absorbing device 204d attached to the mounting base 204c can be self-contained. The sorting tray 203 is moved to the area of the supply tray 202, the empty tray 201, the heating plate 206, and the two buffer portions 208, and the chuck of the IC absorbing device 204d can also be operated by a Z-axis actuator (not shown). The Z axis direction (ie, the up and down direction) moves. Further, by the two IC snubbers 204d provided on the attachment base 204c, two IC elements can be sucked, transported, and released once.

On the other hand, the other XY-axis moving device 205 is provided with rails 205a and 205b along the X-axis direction and the Y-axis direction, whereby the absorbing device 205d attached to the mounting base 205c can be The two buffer portions 208 are moved between the test heads 300, and a suction cup 205j is provided at the tip end of the contact arm 205d (see Fig. 17). Further, by the two contact arms 205d provided on the attachment base 205c, two IC elements can be sucked, transported, and released once.

Further, the XY-axis moving device 205 is attached to the susceptor 205c, and includes a Z-axis actuator that moves up and down in the Z-axis direction, whereby the mounting base 205c that holds the two contact arms 205d as a whole can be relatively opposed to the contact portion 310. Approach and leave the move.

In particular, as shown in Fig. 17, the contact arm 205d of the present embodiment has a type corresponding portion 205h designed to be connected to the arm main portion 205e of the attachment base 205c and the type of the IC component to be tested.

The heater 205f is embedded in the arm body portion 205e of the contact arm 205d to maintain the temperature of the IC element that is held and held. Further, a temperature detector 205g is embedded in the arm main portion 205e, and the temperature of the arm main portion 205e is detected to indirectly detect the temperature of the IC element, and the ON/OFF control of the heater 205f is provided.

At a slight central portion of the contact arm 205d variety corresponding portion 205h, a plurality of pressing portions 205i are held downward to be held.

Each of the pressing portions 205i has the same structure as the pin-shaped pressing portion 23a described with reference to Fig. 13 in the first embodiment, and a detailed description of the pressing portion 205i will be omitted. Of course, the pressing portion 205i may be the pressing portions 23b to 23f of the first to fifth modifications described in the first embodiment.

Further, in the contact arm 205d of the present embodiment, the suction cup 205j is provided. As shown in Fig. 18, the plurality of pressing portions are disposed around the suction cup 205j while avoiding the suction cup 205j.

The chuck 205j includes a function of sucking and holding the IC element and a function of pressing the IC element.

In the suction cup 205j, the suction surface protrudes from the tip end of the pressing portion 205i toward the IC element side by a certain amount, and the suction pad 205j can suck and hold the IC element before the pressing portion 205i presses the IC element. Moreover, the configuration of the suction cup 205j itself may be moved up and down.

Further, the suction cup 205j is made of, for example, a synthetic resin material, and preferably has the same elasticity as the spiral spring of the pressing portion 205i. Here, the negative pressure supplied to the suction cup 205j is preferably a strong negative pressure in which the IC element does not fall off.

In the contact arm 205d configured as described above, first, each of the pressing portions 205i can suck and hold the IC element by the suction pad 205j without pressing the IC element. Further, each of the pressing portions 205i can press the IC device together with the pressing portions 205i while sucking and holding the IC device with the suction pad 205j while the IC unit is being pressed.

In Fig. 18, the field other than the suction cup 205j is the same as the first arrangement change described in Fig. 14A of the first embodiment, and it is described that the pressing is not formed on the upper surface, and the smoothness of the input/output terminal or the like is not formed. The arrangement of the IC elements is not limited thereto, and the pressing portion 205i may be arranged in accordance with the second to fifth arrangement changes described in the first embodiment, avoiding the suction pad 205j.

Further, in the present embodiment, the contact arm 205d type corresponding portion 205h can be detached, and the shape of the IC component to be held by suction or the required pressing accuracy or heat transfer performance can be compared with other types of counterparts. replace.

For example, when the required pressing precision is high, the variety corresponding portion 205h including the plurality of pressing portions 205i shown in Fig. 17 may be used. On the other hand, when the pressing does not require a high degree of precision, as shown in FIG. 19, the type corresponding portion 205k that presses the IC element may be pressed without the pressing portion 205i and in surface contact with the flat surface 205m of the suction cup 2051.

Next, the operation will be described.

The pre-test IC component mounted on the electronic component testing device 200 supply tray 202 is sucked and held by the XY-axis moving device 204, and is transported to the concave portion 206a of the heating plate 206. Here, by placing only the predetermined time on the heating plate 206, the IC element is heated to a predetermined temperature. Therefore, the IC element is moved from the supply tray 202 to the XY-axis moving device 204 of the heating plate 206 before the temperature rise, and the IC element is released. Thereafter, the IC element is transported to the buffer unit 208 while the IC element placed on the heating plate 206 is heated to a predetermined temperature.

The buffer unit 208 carrying the IC element moves to the rail 208a, and as shown in Fig. 17, the IC element is sucked and held by the contact arm 205d of the XY-axis moving device 205, and the contact arm-transmitting device The opening portion 210 of the substrate 209 is lowered toward the test head 300 until the IC element abuts the contact portion 310.

When the contact arm 205d is lowered and the IC element abuts against the contact portion 310, the plurality of pressing portions 205i protruding from the variety corresponding portion 205h to the lower side press the upper surface of the IC element. In this case, each of the pressing portions 205i can be expanded and contracted independently of each other, whereby even if the upper surface of the IC element is uneven in manufacturing or the like, the IC element can be uniformly pressed against the upper surface of the IC element. The mechanical stress or crack generated by the IC element at the time of pressing is greatly suppressed.

Further, each of the pressing portions 205i is pressed while mimicking the shape of the upper surface of the electronic component to be tested, and it is not necessary to accurately control the amount of stroke of the pressing mechanism for the electronic component to be tested at the time of pressing.

Further, at the time of pressing, the plurality of pressing portions 205i are in integral contact with the upper surface of the IC element, so that high-precision temperature control of the electronic component under test can be performed at the time of pressing.

In this state, the self tester 400 contacts the pin 311 through the test head 300 to input an electrical signal to the IC component. Moreover, the response signal output from the IC component is sent to the tester 400 through the test head 300, thereby testing the performance and function of the IC component.

When the IC component test is completed, the contact arm 205d rises, and the IC component after the test is transported through the buffer portion 208 and the XY-axis moving device 204, and the IC component is housed in the sorting tray 203 in accordance with the test result.

Here, the test object is, for example, an IC component in which an upper surface is smooth, an IC component in which an uneven surface or an input/output terminal is formed, or an IC component in which an input/output terminal is formed only in a central portion or an outer peripheral portion, so that each contact arm The 205d-type-correspondence unit 205h can easily replace the object including the pressing portion of the IC component that has been replaced with the type of the first to fifth-described arrangements described in the first embodiment, and can easily correspond to the test object. Replacement of IC components.

In addition, when the IC component which is required to have a high pressing precision is changed to an IC component which requires a high pressing precision, for example, the contact arm 205d type corresponding portion 205h is replaced with the type of the IC component after the replacement of the above-mentioned variety. The corresponding portion 205k can thereby easily replace the type of the IC component.

Further, the embodiments described above are described in order to make the present invention easy to understand, and the present invention is not limited to the above embodiments. Therefore, all of the design changes or equivalents of the technical scope of the present invention are also included in the scope of the patent application of the present invention.

10. . . Mating board

11. . . Cavity

20. . . Pusher

twenty one. . . Pusher base

twenty two. . . Push block

twenty four. . . Guide pin

25. . . Stop pin

30. . . Insert

32. . . Guide hole

33. . . Mounting holes

35. . . Square box

36. . . Pallet

37. . . Mounting piece

38. . . Insert housing

39. . . Fastening element

40. . . Z-axis drive

41. . . Drive board

42. . . Drive shaft

43. . . Upper plate

44. . . Main drive shaft

45. . . Support frame

47. . . Stepper motor

48. . . Encoder

49. . . Control device

50. . . case

51. . . Temperature detector

53. . . Bearing

54. . . Rotary bearing

60. . . Air supply device for temperature adjustment

61. . . fan

62. . . Heater

63. . . nozzle

80. . . case

100. . . Electronic component testing device

101. . . space

102. . . Device substrate

110. . . Cavity

111. . . Thermostat

112‧‧‧Measurement tank

113‧‧‧Except hot tank

114‧‧‧Test pallet handling device

120‧‧‧IC Storage Department

121‧‧‧Test IC register

122‧‧‧Test IC Register

123‧‧‧Tray support member

125‧‧‧Tray handling arm

130‧‧‧Loading Department

131‧‧‧XY axis handling device

132‧‧‧Precision instruments

133‧‧‧ Window Department

140‧‧‧Unloading Department

141‧‧‧XY axis handling device

142‧‧‧ buffer

143‧‧‧ Window Department

200‧‧‧Electronic component tester

201‧‧‧Test IC Register

202‧‧‧Supply tray

203‧‧‧ sorting tray

205‧‧‧XY axis mobile device

206‧‧‧heating plate

208‧‧‧ buffer

209‧‧‧Device substrate

210. . . Opening

214. . . elevator

23e1. . . Plunger

300. . . Test head

310. . . Contact

311. . . Contact pin

320. . . Contact guide

321. . . Guide bushing

322. . . Stop

400. . . Tester

450. . . wire

500. . . pressure source

204,205. . . XY axis handling device

100d. . . Electronic component testing device

102a. . . Opening

131a. . . track

131b. . . Movable arm

131c. . . Movable head

201~203. . . tray

204a, 204b. . . track

204c. . . Mounting base

204d. . . IC sorption device

205a, 205b. . . track

205c. . . Mounting base

205d. . . Contact arm

205e. . . Arm body

205f. . . Heater

205g. . . Temperature detector

205h. . . Variety counterpart

205i. . . Pressing part

205j. . . Suction cup

208a. . . track

20a. . . Pressing part

22a. . . Receiving hole

22b. . . Receiving hole

22c. . . Containing space

22d. . . Pressure port

23a. . . Pressing part

23a1. . . Spiral spring

23a2. . . Plunger

23b1. . . Plunger

23c. . . Containing space

23c1. . . Spiral spring

23c2. . . Plunger

23d. . . Pressing part

23d1. . . Tube body

23d2. . . Spiral spring

23d3. . . Sphere

23e. . . Pressing part

23f. . . Pressing part

23f1. . . Elastic member

35a. . . side

41a. . . Convex

43a. . . Ball screw adapter

45a. . . Rotary bearing

45b. . . Support rod

46a. . . 1st pulley

46b. . . 2nd pulley

46c. . . Belt

47a. . . Gearbox

Fig. 1 is a side view showing the entire electronic component testing device according to the first embodiment of the present invention.

Fig. 2 is a perspective view of the electronic component testing device of Fig. 1.

Fig. 3 is a flow chart showing the tray of the method of transferring the IC elements in the electronic component testing apparatus of Fig. 1.

Fig. 4 is a perspective view showing the structure of an IC register of the electronic component testing device of Fig. 1.

Fig. 5 is a perspective view showing an external tray used in the electronic component testing device of Fig. 1.

Fig. 6 is a cross-sectional view showing an important part of the measuring chamber of the electronic component testing device of Fig. 1.

Fig. 7 is a cross-sectional view showing the Z-axis driving device in the measuring cell of the electronic component testing device of Fig. 1.

Fig. 8 is a partially exploded perspective view showing the test tray used in the electronic component testing device of Fig. 1.

Fig. 9 is an exploded perspective view showing the structure of the insert, the contact guide, and the contact portion of the electronic component testing device of Fig. 1.

Fig. 10 is a cross-sectional view showing the structure of a pusher of the electronic component testing device according to the first embodiment of the present invention.

Figure 11 is a cross-sectional view taken along line XI-XI of Figure 10.

Fig. 12 is a cross-sectional view showing a state in which the IC device is attached to the contact portion by the pusher of Fig. 10.

Fig. 13A is a cross-sectional view showing the structure of a pressing portion according to a first embodiment of the present invention, and is a cross-sectional view of an important part of a portion XIIIA of Fig. 10.

Fig. 13B is a cross-sectional view showing a first modification of the structure of the pressing portion according to the first embodiment of the present invention.

Fig. 13C is a cross-sectional view showing a second modification of the structure of the pressing portion according to the first embodiment of the present invention.

Fig. 13D is a cross-sectional view showing a third modification of the structure of the pressing portion according to the first embodiment of the present invention.

Fig. 13E is a cross-sectional view showing a fourth modification of the structure of the pressing portion according to the first embodiment of the present invention.

Fig. 13F is a cross-sectional view showing a fifth modification of the structure of the pressing portion according to the first embodiment of the present invention.

Fig. 14A is a cross-sectional view showing the first modification of the arrangement of the pusher according to the first embodiment of the present invention.

Fig. 14B is a cross-sectional view showing a second modification of the arrangement of the pusher according to the first embodiment of the present invention.

Fig. 14C is a cross-sectional view showing a third modification of the arrangement of the pusher according to the first embodiment of the present invention.

Fig. 14D is a cross-sectional view showing a fourth modification of the arrangement of the pusher according to the first embodiment of the present invention.

Fig. 14E is a cross-sectional view showing a fifth modification of the arrangement of the pusher according to the first embodiment of the present invention.

Fig. 15 is a top view showing an electronic component testing apparatus according to a second embodiment of the present invention.

Figure 16 is a cross-sectional view taken along line XVI-XVI of Figure 15.

Fig. 17 is a side view showing the structure of a contact arm of an electronic component testing device according to a second embodiment of the present invention.

Figure 18 is a cross-sectional view taken along line A-A of Figure 17.

Fig. 19 is a side view showing the contact arm after the article corresponding portion is replaced from the state of Fig. 17.

100. . . Electronic component testing device

101. . . space

300. . . Test head

400. . . Tester

450. . . wire

Claims (12)

An electronic component testing device for testing a test electronic component by attaching a tested electronic component to a test head contact portion, comprising: a pressing mechanism for bringing the tested electronic component closer to and away from the contact portion The pressing mechanism has a plurality of abutting members that press the one of the electronic components to be tested at a plurality of points; and a holding portion that holds the abutting member toward the electronic component to be tested and protrudes in a shaft shape; The abutting member is expandable and contractable toward the side of the electronic component to be tested; wherein the abutting member includes a tip having a push-shaped abutting surface having a small tip. The electronic component testing device according to claim 1, wherein each of the pressing mechanisms includes an elastic member that presses the abutting member toward the electronic component to be tested. The electronic component testing device according to claim 2, wherein the elastic member is interposed between the holding portion and the abutting member. The electronic component testing device according to claim 3, wherein the abutting member, the elastic member, and the holding portion are made of gold It is composed of materials. The electronic component testing device according to claim 3, wherein the elastic member is a spiral spring disposed coaxially with the abutting member. The electronic component testing device according to claim 3, wherein the elastic member is a spiral spring arranged concentrically with the abutting member. The electronic component testing device according to any one of claims 3 to 6, wherein each of the holding portions further includes at least a receiving space for accommodating the abutting member portion and the elastic member. The electronic component testing device according to claim 1, wherein each of the pressing mechanisms has a pressure applying mechanism that applies a fluid pressure to the shaft member toward the electronic component to be tested. An electronic component testing device for testing a test electronic component by attaching a tested electronic component to a test head contact portion, comprising: a pressing mechanism for bringing the tested electronic component closer to and away from the contact portion The pressing mechanism has a plurality of abutting members that press the one of the electronic components to be tested at a plurality of points; and a holding portion that holds the abutting member toward the electronic component to be tested and protrudes in a shaft shape; Each of the abutting members has an elastically deformable synthetic resin material; wherein the abutting member includes a spherical tip. The electronic component testing device according to claim 9, wherein the synthetic resin material contains a powder made of a material having a heat transfer property higher than that of the synthetic resin material. The electronic component testing device according to claim 1, wherein the protruding portion protruding from the holding portion of the pressing portion is detachable from the pressing mechanism. The electronic component testing device according to claim 1, wherein the pressing mechanism is replaceable with another pressing mechanism.