TWI386125B - System and method for delivering printed circuit board - Google Patents
System and method for delivering printed circuit board Download PDFInfo
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- TWI386125B TWI386125B TW97111408A TW97111408A TWI386125B TW I386125 B TWI386125 B TW I386125B TW 97111408 A TW97111408 A TW 97111408A TW 97111408 A TW97111408 A TW 97111408A TW I386125 B TWI386125 B TW I386125B
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- 238000000034 method Methods 0.000 title claims description 19
- 238000012546 transfer Methods 0.000 claims description 87
- 230000005540 biological transmission Effects 0.000 claims description 56
- 230000001939 inductive effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000006698 induction Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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- Supply And Installment Of Electrical Components (AREA)
- Control Of Conveyors (AREA)
Description
本發明涉及電路板技術領域,尤其涉及一種電路板傳送系統以及電路板傳送方法。 The present invention relates to the field of circuit board technologies, and in particular, to a circuit board transmission system and a circuit board transmission method.
電路板製作工藝通常包括下料、導電線路製作、導通孔製作、防焊層印刷、鍍金等步驟。下料係指將原材料如覆銅層壓板裁切成便於生產之適當尺寸之基板。導電線路製作係指將基板上之銅箔製成設計之導電圖形,一般藉由塗覆光阻、曝光顯影、蝕刻線路以及光阻去除等步驟形成,參見Moon-Youn Jung等人於2004年發表於IEEE 17th International Conference on Micro Electro Mechanical Systems之文獻“Novel lithography process for extreme deep trench by using laminated negative dry film resist ”。導通孔之製作工藝包括鑽孔及孔電鍍,以實現層間導電線路之互連。導電線路、導通孔製作完成後,將於基板之導電線路表面(除終接端點外)塗覆一層防焊層以避免導電線路氧化,並避免後續貼裝時對導電線路造成破壞從而造成焊接短路。鍍金係指於電路板之終接端點鍍上一層具高化學鈍性之金層以保護終接端點,同時提供良好導電性。 The circuit board manufacturing process usually includes the steps of blanking, conductive circuit fabrication, via hole fabrication, solder mask printing, gold plating, and the like. The blanking refers to cutting a raw material such as a copper clad laminate into a substrate of an appropriate size for ease of production. Conductive circuit fabrication refers to the formation of a conductive pattern on a copper foil on a substrate, generally formed by coating photoresist, exposure development, etching lines, and photoresist removal. See Moon-Youn Jung et al. "Novel lithography process for extreme deep trench by using laminated negative dry film resist", IEEE 17th International Conference on Micro Electro Mechanical Systems. The manufacturing process of the via hole includes drilling and hole plating to realize interconnection of interlayer conductive lines. After the conductive circuit and the via hole are completed, a solder resist layer is applied on the surface of the conductive line of the substrate (except the terminating end point) to avoid oxidation of the conductive line, and to avoid damage to the conductive line during subsequent mounting, thereby causing soldering. Short circuit. Gold plating refers to the plating of a highly chemically inactive gold layer on the termination of the board to protect the termination terminals while providing good electrical conductivity.
電路板之導電線路製作一般於傳送帶上進行,亦即,先將電路板依次放置於傳送帶上,再藉由傳送帶將電路板傳送至光阻塗覆機、曝光掩模、顯影機、蝕刻液噴淋槽 以及剝膜機,從而完成導電線路之製作。然而,以人工方式將電路板放置於傳送帶時,放板速度不易控制,從而使得傳送帶上之電路板間距不均,不便於後續工藝之進行。 The conductive circuit of the circuit board is generally fabricated on a conveyor belt, that is, the circuit board is first placed on the conveyor belt, and then the circuit board is transported to the photoresist coater, the exposure mask, the developing machine, and the etching liquid spray by the conveyor belt. Drenching And a stripping machine to complete the production of conductive lines. However, when the circuit board is manually placed on the conveyor belt, the speed of the board is not easily controlled, so that the spacing of the boards on the conveyor belt is uneven, which is not convenient for subsequent processes.
因此,有必要提供一種可有效控制電路板間距之電路板傳送系統以及電路板傳送方法。 Therefore, it is necessary to provide a board transfer system and a board transfer method which can effectively control the board pitch.
以下將以實施例說明一種電路板傳送系統以及電路板傳送方法。 A circuit board transfer system and a circuit board transfer method will be described below by way of embodiments.
一種電路板傳送系統,其包括第一傳送裝置、第二傳送裝置、感應裝置以及控制器。該第一傳送裝置與第二傳送裝置沿電路板傳送方向相鄰設置。該感應裝置包括相鄰設置之第一感應器與第二感應器,該第一感應器設置於第一傳送裝置上方且靠近第二傳送裝置,第二感應器設置於第二傳送裝置上方且靠近第一傳送裝置。感應裝置用於感測兩個相鄰之分別位於第一傳送裝置與第二傳送裝置之電路板之位置。該控制器具有計時電路與控制電路,該計時電路與該第一感應器、該第二感應器相連接,用於獲得兩個相鄰之電路板中位於該第二傳送裝置之電路板離開該第二感應器之感應範圍時到該兩個相鄰之電路板中位於該第一傳送裝置之電路板進入該第一感應器之感應範圍時所經過之時間,該控制電路與該計時電路、第一感應器以及第一驅動裝置具有電氣連接,用於根據該計時電路獲得之時間、該第一感應器與第二感應器間之距離以及第二傳送裝置之傳送速度調整第一傳 送裝置之傳送速度。 A circuit board transport system includes a first transfer device, a second transfer device, an inductive device, and a controller. The first transfer device and the second transfer device are disposed adjacent to each other in the board transfer direction. The sensing device includes a first sensor and a second sensor disposed adjacent to each other, the first sensor is disposed above the first transmitting device and adjacent to the second transmitting device, and the second sensor is disposed above the second transmitting device and close to First conveyor. The sensing device is configured to sense two adjacent locations of the circuit boards respectively located at the first transmitting device and the second transmitting device. The controller has a timing circuit and a control circuit, and the timing circuit is connected to the first inductor and the second inductor for obtaining a circuit board of the two adjacent circuit boards located at the second transmitting device When the sensing range of the second sensor reaches the time when the circuit board of the first transmitting device enters the sensing range of the first sensor in the two adjacent circuit boards, the control circuit and the timing circuit, The first inductor and the first driving device have an electrical connection for adjusting the first transmission according to the time obtained by the timing circuit, the distance between the first inductor and the second inductor, and the transmission speed of the second transmitting device The delivery speed of the delivery device.
一種電路板傳送方法,包括步驟:提供如上所述之電路板傳送系統以及複數電路板,該複數電路板依次從第一傳送裝置傳送至第二傳送裝置,複數電路板中之任兩個相鄰之電路板中先被傳送至第二傳送裝置之電路板為第n個電路板,後被傳送至第二傳送裝置之電路板為第n+1個電路板;當第n個電路板離開第二感應器之感應範圍時,第二感應器使得控制器開始計時;當第一感應器感應到第n+1個電路板進入第一感應器之感應範圍時,第一感應器使得控制器停止計時;控制器根據第n個電路板離開第二感應器之感應範圍到第一感應器感應到第n+1個電路板進入第一感應器之感應範圍間之時間、第一感應器與第二感應器之間距以及第二傳送裝置之傳送速度獲得第n個電路板與第n+1個電路板之間距,從而控制第一傳送裝置之傳送速度以將該間距調整至預定間距。 A circuit board transfer method comprising the steps of: providing a circuit board transfer system as described above and a plurality of circuit boards, wherein the plurality of circuit boards are sequentially transferred from the first transfer device to the second transfer device, and any two of the plurality of circuit boards are adjacent The circuit board that is first transferred to the second transfer device is the nth circuit board, and the circuit board that is transferred to the second transfer device is the n+1th circuit board; when the nth circuit board leaves the first When the sensing range of the two sensors is used, the second sensor causes the controller to start timing; when the first sensor senses that the n+1th circuit board enters the sensing range of the first sensor, the first sensor stops the controller Timing; the controller according to the sensing range of the nth circuit board leaving the second sensor until the first sensor senses the time between the n+1th circuit board entering the sensing range of the first sensor, the first sensor and the first The distance between the two inductors and the transfer speed of the second transfer device obtains the distance between the nth circuit board and the n+1th circuit board, thereby controlling the transfer speed of the first transfer device to adjust the pitch to a predetermined pitch.
本技術方案中之電路板傳送系統包括感應裝置以及控制器,控制器可藉由所獲取之時間以及第一感應器、第二感應器之感測結果控制第一傳送裝置之傳送速度,從而調整相鄰之第n個電路板與第n+1個電路板間之距離,使該兩個電路板間距位於預定間距範圍內。本技術方案之電路板傳送方法可避免電路板之間之距離過小或過大,從而有利於後續工序之進行。 The circuit board transmission system in the technical solution includes an inductive device and a controller, and the controller can adjust the transmission speed of the first transmitting device by using the acquired time and the sensing result of the first sensor and the second sensor, thereby adjusting The distance between the adjacent nth circuit board and the n+1th circuit board is such that the distance between the two circuit boards is within a predetermined pitch range. The circuit board transmission method of the technical solution can prevent the distance between the circuit boards from being too small or too large, thereby facilitating the subsequent processes.
下面將結合附圖及實施例,對本技術方案提供之電路板傳送系統以及電路板傳送方法作進一步之詳細說明。 The circuit board transmission system and the circuit board transmission method provided by the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.
請參閱圖1,本技術方案實施例提供之電路板傳送系統10包括第一傳送裝置11、第二傳送裝置12、感應裝置13以及控制器14。 Referring to FIG. 1 , a circuit board transmission system 10 provided by an embodiment of the present technical solution includes a first transmission device 11 , a second transmission device 12 , an induction device 13 , and a controller 14 .
該第一傳送裝置11與第二傳送裝置12用於傳送電路板。第一傳送裝置11與第二傳送裝置12沿電路板傳送方向相鄰設置,從而可將電路板從第一傳送裝置11傳送至第二傳送裝置12,並進一步將電路板自第二傳送裝置12傳送至後續加工裝置,例如,顯影/蝕刻/剝膜(Develeping/Etching/Stripping,DES)裝置。 The first conveyor 11 and the second conveyor 12 are used to transport a circuit board. The first transfer device 11 and the second transfer device 12 are disposed adjacent to each other in the board transfer direction, so that the circuit board can be transferred from the first transfer device 11 to the second transfer device 12, and the circuit board is further transferred from the second transfer device 12 Transfer to a subsequent processing device, such as a Develeping/Etching/Stripping (DES) device.
本實施例中,第一傳送裝置11包括輸送帶111、第一帶動輪112、第二帶動輪113以及第一驅動裝置114。該第一驅動裝置114藉由輸送帶111與第一帶動輪111、第二帶動輪112相連接,用於帶動輸送帶111移動並帶動第一帶動輪112、第二帶動輪113轉動。該第一帶動輪112與第二帶動輪113設置於第一驅動裝置114兩側,用於張設輸送帶111。該輸送帶111用於傳送放置於其上之電路板。當然,第一傳送裝置11亦可為其他可傳送電路板之結構。 In the present embodiment, the first conveying device 11 includes a conveyor belt 111, a first driving wheel 112, a second driving wheel 113, and a first driving device 114. The first driving device 114 is connected to the first driving wheel 111 and the second driving wheel 112 by the conveyor belt 111 for driving the conveyor belt 111 to move and driving the first driving wheel 112 and the second driving wheel 113 to rotate. The first driving wheel 112 and the second driving wheel 113 are disposed on both sides of the first driving device 114 for extending the conveyor belt 111. The conveyor belt 111 is used to transport a circuit board placed thereon. Of course, the first transfer device 11 can also be a structure of other transferable circuit boards.
該第二傳送裝置12包括複數傳動輪121以及至少一個第二驅動裝置122。該複數傳動輪121沿電路板傳送方向依次排列,且其軸線與電路板傳送方向垂直。該第二驅動裝置122可為馬達,藉由皮帶123與複數傳動輪121相連接 ,從而帶動複數傳動輪121轉動,複數傳動輪121之轉動即可將放置於其上之電路板進行傳送。當然,第二驅動裝置122亦可藉由齒輪或者其他元件與傳動輪121連接。 The second conveyor 12 includes a plurality of transmission wheels 121 and at least one second drive unit 122. The plurality of transmission wheels 121 are sequentially arranged in the board conveying direction, and their axes are perpendicular to the board conveying direction. The second driving device 122 can be a motor and is connected to the plurality of transmission wheels 121 by a belt 123. Therefore, the plurality of transmission wheels 121 are rotated, and the rotation of the plurality of transmission wheels 121 can transmit the circuit board placed thereon. Of course, the second driving device 122 can also be connected to the transmission wheel 121 by gears or other components.
該第一傳送裝置11與第二傳送裝置12間之距離應當小於一個電路板之長度之一半,以避免電路板於傳送過程中掉落。例如,當實際生產中之電路板長度為200毫米時,第一傳送裝置11與第二傳送裝置12間之距離優選為15至80毫米。 The distance between the first conveyor 11 and the second conveyor 12 should be less than one-half the length of one of the boards to prevent the board from falling during transport. For example, when the length of the board in actual production is 200 mm, the distance between the first conveyor 11 and the second conveyor 12 is preferably 15 to 80 mm.
該感應裝置13包括用於感應電路板之傳送位置之第一感應器131以及第二感應器132。該第一感應器131設置於第一傳送裝置11上方,與輸送帶111相對,且第一感應器131與輸送帶111間之距離於第一感應器131之感應距離之內,以使第一感應器131可有效感測輸送帶111上之電路板之傳送位置。該第二感應器132設置於第二傳送裝置12上方,與傳動輪121相對,且第二感應器132與傳動輪121間之距離於第二感應器132之感應距離內,以使第二感應器132可有效感測傳動輪121上之電路板之傳送位置。 The sensing device 13 includes a first inductor 131 and a second inductor 132 for sensing a transfer position of the circuit board. The first sensor 131 is disposed above the first conveyor 11 opposite to the conveyor belt 111, and the distance between the first inductor 131 and the conveyor belt 111 is within the sensing distance of the first inductor 131, so that the first The sensor 131 can effectively sense the transfer position of the circuit board on the conveyor belt 111. The second sensor 132 is disposed above the second conveyor 12 opposite to the transmission wheel 121, and the distance between the second inductor 132 and the transmission wheel 121 is within the sensing distance of the second inductor 132 to enable the second induction. The device 132 can effectively sense the transfer position of the circuit board on the drive wheel 121.
該第一感應器131與第二感應器132相鄰設置。第一感應器131設置於輸送帶111上方且靠近第二傳送裝置12,第二感應器132設置於傳動輪121上方且靠近第一傳送裝置11。從而,感應裝置13可感測兩個相鄰之分別位於第一傳送裝置11與第二傳送裝置12之電路板之位置。 The first inductor 131 is disposed adjacent to the second inductor 132. The first inductor 131 is disposed above the conveyor belt 111 and adjacent to the second conveyor 12 , and the second inductor 132 is disposed above the transmission wheel 121 and adjacent to the first conveyor 11 . Thus, the sensing device 13 can sense two adjacent locations of the circuit boards of the first conveyor 11 and the second conveyor 12, respectively.
第一感應器131與第二感應器132之感應距離可視需要而 定,一般應當大於或等於第一傳送裝置11與第二傳送裝置12間之距離,以方便後續對電路板間距之調整。當第一傳送裝置11與第二傳送裝置12間之距離為15至80毫米時,第一感應器131與第二感應器132間之距離優選為20至120毫米。 The sensing distance between the first sensor 131 and the second sensor 132 may be needed Generally, it should be greater than or equal to the distance between the first conveyor 11 and the second conveyor 12 to facilitate subsequent adjustment of the board spacing. When the distance between the first conveyor 11 and the second conveyor 12 is 15 to 80 mm, the distance between the first inductor 131 and the second inductor 132 is preferably 20 to 120 mm.
該第一感應器131與第二感應器132內部均具有感測電路,外部均具有訊號發射口以及訊號接收口。訊號發射口用於發射感測訊號,訊號接收口用於接收訊號發射口發射之經由電路板反射之感測訊號,感測電路根據訊號接收口是否接收到訊號發射口發射之訊號判斷電路板之傳送位置。例如,當電路板傳送至第一感應器131下方時,電路板將開始反射訊號發射口發射之感測訊號,從而使得訊號接收口從不能接收到感測訊號變化至可接收到感測訊號,從而可使第一感應器131之感測電路發出已感測到電路板之訊息,並傳輸給控制器14。該感測訊號可為雷射、紅外線、超聲波或其他訊號。 The first inductor 131 and the second inductor 132 both have a sensing circuit inside, and each has a signal emitting port and a signal receiving port. The signal transmitting port is used for transmitting the sensing signal, and the signal receiving port is configured to receive the sensing signal reflected by the circuit board and transmitted by the signal board, and the sensing circuit determines the circuit board according to whether the signal receiving port receives the signal emitted by the signal transmitting port. Transfer location. For example, when the circuit board is transferred to the lower side of the first sensor 131, the circuit board will start to reflect the sensing signal emitted by the signal transmitting port, so that the signal receiving port can change from receiving the sensing signal to receiving the sensing signal. Thereby, the sensing circuit of the first sensor 131 can send a message that the board has been sensed and transmitted to the controller 14. The sensing signal can be laser, infrared, ultrasonic or other signals.
控制器14內具有控制電路141與計時電路142。該計時電路142與第一感應器131、第二感應器132相連接,用於獲得兩個相鄰之電路板中位於第二傳送裝置12之電路板離開第二感應器132之感應範圍時到該兩個相鄰之電路板中位於第一傳送裝置11之電路板進入第一感應器131之感應範圍時所經過之時間。該控制電路141與計時電路142、第一感應器131以及第一驅動裝置114具有電氣連接,用於根據計時電路142獲得之時間、第一感應器131與第二感應器132間之距離以及第二傳送裝置12之傳送速度控 制第一傳送裝置11之傳送速度,從而使得該兩個相鄰之分別位於第一傳送裝置11與第二傳送裝置12之電路板之間距於預定間距範圍內。 The controller 14 has a control circuit 141 and a timing circuit 142 therein. The timing circuit 142 is connected to the first inductor 131 and the second inductor 132 for obtaining the sensing range of the second transmitting device 12 of the two adjacent circuit boards when the circuit board of the second transmitting device 12 leaves the second inductor 132. The time elapsed between the two adjacent circuit boards when the circuit board of the first conveyor 11 enters the sensing range of the first inductor 131. The control circuit 141 is electrically connected to the timing circuit 142, the first inductor 131, and the first driving device 114 for the time obtained by the timing circuit 142, the distance between the first inductor 131 and the second inductor 132, and the Transmission speed control of the second conveyor 12 The conveying speed of the first conveying device 11 is made such that the two adjacent ones are located within a predetermined distance range between the boards of the first conveying device 11 and the second conveying device 12, respectively.
優選地,控制器14可藉由一訊號放大器與感應裝置13相連接,以確保感應裝置13之感測結果進行有效傳輸。 Preferably, the controller 14 can be connected to the sensing device 13 by a signal amplifier to ensure effective transmission of the sensing result of the sensing device 13.
因此,第一傳送裝置11與第二傳送裝置12可將電路板從第一傳送裝置11傳送至第二傳送裝置12,感應裝置13可感測兩個相鄰之分別位於第一傳送裝置11與第二傳送裝置12之電路板之位置,控制器14可根據感應裝置13之感測結果控制第一傳送裝置11之傳送速度,從而調整該兩個電路板間之距離,即,電路板傳送系統10可傳送電路板並可調整所傳送電路板之間距。 Therefore, the first transfer device 11 and the second transfer device 12 can transfer the circuit board from the first transfer device 11 to the second transfer device 12, and the sensing device 13 can sense two adjacent ones located at the first transfer device 11 and The position of the circuit board of the second transfer device 12, the controller 14 can control the transfer speed of the first transfer device 11 according to the sensing result of the sensing device 13, thereby adjusting the distance between the two boards, that is, the board transfer system 10 can transfer the board and adjust the distance between the transmitted boards.
請參閱圖2,使用本技術方案之電路板傳送系統10傳送電路板之方法包括以下步驟: Referring to FIG. 2, a method for transmitting a circuit board using the board transfer system 10 of the present technical solution includes the following steps:
第一步,使用如上該電路板傳送系統10傳送複數電路板,複數電路板依次從第一傳送裝置11傳送至第二傳送裝置12。 In the first step, the plurality of boards are transported using the board transport system 10 as above, and the plurality of boards are sequentially transferred from the first conveyor 11 to the second conveyor 12.
此時,第一傳送裝置11之傳送速度與第二傳送裝置12之傳送速度相同,第二傳送裝置12之傳送速度與後續處理工站之加工速度相匹配。 At this time, the conveying speed of the first conveying device 11 is the same as the conveying speed of the second conveying device 12, and the conveying speed of the second conveying device 12 is matched with the processing speed of the subsequent processing station.
設複數電路板中之任兩個相鄰之電路板中先被傳送至第二傳送裝置12之電路板為第n個電路板21,後被傳送至第二傳送裝置12之電路板為第n+1個電路板22。 The circuit board that is first transferred to the second transfer device 12 among any two adjacent circuit boards of the plurality of circuit boards is the nth circuit board 21, and then the circuit board that is transferred to the second transfer device 12 is the nth +1 board 22.
第二步,第n個電路板21被傳送至第二傳送裝置12,進入第二感應器132之感應範圍後,又離開第二感應器132之感應範圍。於此過程中,第二感應器132之訊號接收口從不能接收到訊號發射口發射之感測訊號變化至能接收到感測訊號,並再從能接收到訊號發射口發射之感測訊號變化至不能接收到感測訊號。當第n個電路板21離開第二感應器132之感應範圍時,第二感應器132將第n個電路板21離開第二感應器132之訊息傳輸給控制器14,以使得控制器14之計時電路142開始計時。 In the second step, the nth circuit board 21 is transferred to the second transmitting device 12, and after entering the sensing range of the second sensor 132, it is separated from the sensing range of the second sensor 132. During this process, the signal receiving port of the second sensor 132 changes from the sensing signal that cannot be received by the signal transmitting port to the sensing signal, and then the sensing signal that can be received from the signal transmitting port. Until the sensor signal can not be received. When the nth circuit board 21 leaves the sensing range of the second sensor 132, the second sensor 132 transmits the message of the nth circuit board 21 away from the second sensor 132 to the controller 14, so that the controller 14 Timing circuit 142 begins timing.
此時,第n+1個電路板22仍於第一傳送裝置11上傳送,且未進入第一感應器131之感測範圍。 At this time, the n+1th circuit board 22 is still transmitted on the first transfer device 11 and does not enter the sensing range of the first sensor 131.
第三步,第n+1個電路板22被第一傳送裝置11傳送並進入第一感應器131之感應範圍。於此過程中,第一感應器131之訊號接收口從不能接收到訊號發射口發射之感測訊號變化至能接收到感測訊號。當第n+1個電路板22進入到第一感應器131之感應範圍時,第一感應器131將第n+1個電路板22進入到第一感應器131之感應範圍之訊息傳輸給控制器14,以使得控制器14之計時電路142停止計時。 In the third step, the n+1th circuit board 22 is transferred by the first transfer device 11 and enters the sensing range of the first sensor 131. During this process, the signal receiving port of the first sensor 131 changes from the sensing signal that cannot be received by the signal transmitting port to receive the sensing signal. When the n+1th circuit board 22 enters the sensing range of the first sensor 131, the first sensor 131 transmits the message of the n+1th circuit board 22 to the sensing range of the first sensor 131 to the control. The timer 14 is such that the timing circuit 142 of the controller 14 stops counting.
此時,第n個電路板21已於第二傳送裝置12上傳送一定時間。 At this time, the nth circuit board 21 has been transferred on the second transfer device 12 for a certain time.
第四步,控制器14之計時電路142獲取從第n個電路板21離開第二感應器132之感應範圍到第一感應器131感應到第n+1個電路板22進入第一感應器131之感應範圍所經過之時間,控制電路141根據該時間、第一感應器131與第 二感應器132間之距離以及第二傳送裝置12之傳送速度獲得第n個電路板與第n+1個電路板間之距離,並根據該距離控制第一傳送裝置11之傳送速度,從而將該距離調整至預定間距。 In the fourth step, the timing circuit 142 of the controller 14 acquires the sensing range from the nth circuit board 21 away from the second inductor 132 to the first sensor 131 to sense the n+1th circuit board 22 to enter the first sensor 131. The time elapsed between the sensing ranges, the control circuit 141 according to the time, the first sensor 131 and the The distance between the two inductors 132 and the transmission speed of the second conveyor 12 obtains the distance between the nth circuit board and the n+1th board, and controls the transmission speed of the first conveyor 11 according to the distance, thereby This distance is adjusted to a predetermined interval.
具體地,設第n個電路板21離開第二感應器132之感應範圍之時間為T,第一感應器131之訊號發射口與第二感應器132之訊號發射口間之距離為D,第二傳送裝置12之傳送速度為V2,第一傳送裝置11之傳送速度為V1,且V1等於V2,則此時第n個電路板21與第n+1個電路板22之間距S=V2×T+D。若S大於第n個電路板21與第n+1個電路板22之預定間距C,則控制器14應當適當增大第一傳送裝置11之傳送速度V1,以使得第n+1個電路板22之傳送速度大於第n個電路板21之傳送速度。設第一傳送裝置11之傳送速度變化值為△V1,即,改變後之第一傳送裝置11傳送第n+1個電路板22之傳送速度V1′=V1+△V1,設第一傳送裝置11以傳送速度V1′傳送第n+1個電路板22△T′時間,則此時第n個電路板21與第n+1個電路板22之間之距離S′可由下式得出,S′=(V2×T)+D(△V1×△T′) (1) Specifically, the time period from the sensing range of the nth circuit board 21 to the second sensor 132 is T, and the distance between the signal emitting port of the first sensor 131 and the signal emitting port of the second sensor 132 is D, The transmission speed of the second transmission device 12 is V2, the transmission speed of the first transmission device 11 is V1, and V1 is equal to V2, then the distance between the nth circuit board 21 and the n+1th circuit board 22 is S=V2× T+D. If S is greater than a predetermined distance C between the nth circuit board 21 and the n+1th circuit board 22, the controller 14 should appropriately increase the transmission speed V1 of the first transfer device 11 so that the n+1th circuit board The transfer speed of 22 is greater than the transfer speed of the nth circuit board 21. It is assumed that the transmission speed change value of the first transmission device 11 is ΔV1, that is, the changed transmission speed of the n+1th circuit board 22 by the first transmission device 11 is changed to V1′=V1+ΔV1, and the first transmission device 11 is provided. The n+1th circuit board 22 ΔT' time is transmitted at the transmission speed V1'. At this time, the distance S' between the nth circuit board 21 and the n+1th circuit board 22 can be obtained by the following formula: '=(V2×T)+D(△V1×△T') (1)
令S′=C,則控制器14控制第一傳送裝置11以V1′傳送△T′時間,即可使得第n個電路板21與第n+1個電路板22之間距為預定間距C。一般地,工作人員可根據需要事先設定△V1或者△T′為一定值。例如,可將△T′預先設定為2秒,5秒或其他值,控制器14之控制電路即可根據式(1)計算得出之△V1之具體數值,並控制第一傳送系統11 以V1′傳送第n+1個電路板22△T′時間,從而使得第n個電路板21與第n+1個電路板22之間距為預定間距C。 Let S'=C, the controller 14 controls the first transfer device 11 to transmit ΔT' time at V1', so that the distance between the nth circuit board 21 and the n+1th circuit board 22 is a predetermined pitch C. Generally, the worker can set ΔV1 or ΔT' to a certain value in advance as needed. For example, ΔT' can be preset to 2 seconds, 5 seconds or other values, and the control circuit of the controller 14 can calculate the specific value of ΔV1 according to the formula (1), and control the first transmission system 11 The n+1th circuit board 22 ΔT' time is transmitted at V1' such that the distance between the nth circuit board 21 and the (n+1)th circuit board 22 is a predetermined pitch C.
若第一感應器131感應到第n+1個電路板22進入第一感應器131之感應範圍時,第n個電路板21與第n+1個電路板22之間距S等於預定間距C,則控制器14應當維持第一傳送裝置11之傳送速度V1不變。 If the first sensor 131 senses that the n+1th circuit board 22 enters the sensing range of the first inductor 131, the distance S between the nth circuit board 21 and the n+1th circuit board 22 is equal to the predetermined spacing C, Then, the controller 14 should maintain the transmission speed V1 of the first transmitting device 11 unchanged.
若第一感應器131感應到第n+1個電路板22進入第一感應器131之感應範圍時,第n個電路板21與第n+1個電路板22之間距S小於第n個電路板21與第n+1個電路板22之預定間距C,則控制器14應當適當減小第一傳送裝置11之傳送速度V1,以使得第n+1個電路板22之傳送速度小於第n個電路板21之傳送速度。設第一傳送裝置11之傳送速度變化值為△V1,即,改變後之第一傳送裝置11傳送第n+1個電路板22之傳送速度V1′=V1△V1,設第一傳送裝置11以傳送速度V1′傳送第n+1個電路板22△T′時間,則此時第n個電路板21與第n+1個電路板22之間之距離S′可由下式得出,S′=(V2×T)+D+(△V1×△T′) (2) If the first sensor 131 senses that the n+1th circuit board 22 enters the sensing range of the first inductor 131, the distance S between the nth circuit board 21 and the n+1th circuit board 22 is smaller than the nth circuit. The predetermined distance C between the board 21 and the n+1th circuit board 22, the controller 14 should appropriately reduce the transmission speed V1 of the first transfer device 11 so that the transmission speed of the n+1th circuit board 22 is smaller than the nth. The transfer speed of the board 21. It is assumed that the transmission speed change value of the first transport device 11 is ΔV1, that is, the changed first transport device 11 transmits the transport speed V1′=V1ΔV1 of the n+1th circuit board 22, and the first transport device 11 is provided. The n+1th circuit board 22 ΔT' time is transmitted at the transmission speed V1'. At this time, the distance S' between the nth circuit board 21 and the n+1th circuit board 22 can be obtained by the following formula: '=(V2×T)+D+(△V1×△T') (2)
令S′=C,則控制器14控制第一傳送裝置11以V1′傳送△T′時間,即可使得第n個電路板21與第n+1個電路板22之間距為預定間距C。 Let S'=C, the controller 14 controls the first transfer device 11 to transmit ΔT' time at V1', so that the distance between the nth circuit board 21 and the n+1th circuit board 22 is a predetermined pitch C.
當然,於實際操作中,預定間距C通常允許一定誤差,即,預定間距C於一定範圍內即可。一般地,預定間距可於5至10厘米之間,允許誤差可於0.5至1厘米之間。 Of course, in actual operation, the predetermined pitch C generally allows a certain error, that is, the predetermined pitch C is within a certain range. Generally, the predetermined spacing can be between 5 and 10 cm, with an allowable error of between 0.5 and 1 cm.
控制器14將第一傳送裝置11之傳送速度進行調整並使得第n個電路板21與第n+1個電路板22之間距為預定間距後,控制器14可控制第一傳送裝置11之傳送速度V1′回復至調整前之傳送速度V1,從而使得第n個電路板21與第n+1個電路板22之間距保持於預定間距。當然,於將第n+1個電路板22從第一傳送裝置11完全傳送至第二傳送裝置12後,第n個電路板21與第n+1個電路板22均可被第二傳送裝置12平穩傳送,第n個電路板21與第n+1個電路板22間距亦穩定保持於預定間距。 After the controller 14 adjusts the transfer speed of the first transfer device 11 and makes the distance between the nth circuit board 21 and the n+1th circuit board 22 a predetermined interval, the controller 14 can control the transfer of the first transfer device 11. The speed V1' is returned to the transmission speed V1 before the adjustment, so that the distance between the nth circuit board 21 and the (n+1)th circuit board 22 is maintained at a predetermined interval. Of course, after the n+1th circuit board 22 is completely transferred from the first transfer device 11 to the second transfer device 12, the nth circuit board 21 and the n+1th circuit board 22 can be used by the second transfer device. 12 is smoothly transmitted, and the distance between the nth circuit board 21 and the (n+1)th circuit board 22 is also stably maintained at a predetermined pitch.
總之,本技術方案中之電路板傳送系統包括感應裝置以及控制器,控制器可藉由所獲取之時間以及第一感應器、第二感應器之感測結果控制第一傳送裝置之傳送速度,從而調整相鄰之第n個電路板與第n+1個電路板之間之距離,使該兩個電路板間距位於預定間距範圍內。本技術方案之電路板傳送方法可避免電路板之間之距離過小或過大,從而有利於後續工序之進行。 In summary, the circuit board transmission system in the technical solution includes an sensing device and a controller, and the controller can control the transmission speed of the first transmitting device by using the acquired time and the sensing result of the first sensor and the second sensor. Thereby, the distance between the adjacent nth circuit board and the n+1th circuit board is adjusted, so that the distance between the two circuit boards is within a predetermined pitch range. The circuit board transmission method of the technical solution can prevent the distance between the circuit boards from being too small or too large, thereby facilitating the subsequent processes.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10‧‧‧電路板傳送系統 10‧‧‧Board Transfer System
11‧‧‧第一傳送裝置 11‧‧‧First conveyor
12‧‧‧第二傳送裝置 12‧‧‧Second conveyor
13‧‧‧感應裝置 13‧‧‧Induction device
14‧‧‧控制器 14‧‧‧ Controller
111‧‧‧輸送帶 111‧‧‧Conveyor belt
112‧‧‧第一帶動輪 112‧‧‧First driving wheel
113‧‧‧第二帶動輪 113‧‧‧Second driving wheel
114‧‧‧第一驅動裝置 114‧‧‧First drive
121‧‧‧傳動輪 121‧‧‧Drive wheel
122‧‧‧第二驅動裝置 122‧‧‧Second drive
123‧‧‧皮帶 123‧‧‧Belt
131‧‧‧第一感應器 131‧‧‧First sensor
132‧‧‧第二感應器 132‧‧‧Second sensor
141‧‧‧控制電路 141‧‧‧Control circuit
142‧‧‧計時電路 142‧‧‧Timekeeping Circuit
21‧‧‧第n個電路板 21‧‧‧nth circuit board
22‧‧‧第n+1個電路板 22‧‧‧n+1th board
圖1係本技術方案實施例提供之電路板傳送系統之示意圖。 FIG. 1 is a schematic diagram of a circuit board transmission system provided by an embodiment of the present technical solution.
圖2係本技術方案實施例提供之電路板傳送系統傳送電路 板時之示意圖。 2 is a circuit board transmission system transmission circuit provided by an embodiment of the present technical solution Schematic diagram of the board.
10‧‧‧電路板傳送系統 10‧‧‧Board Transfer System
11‧‧‧第一傳送裝置 11‧‧‧First conveyor
12‧‧‧第二傳送裝置 12‧‧‧Second conveyor
13‧‧‧感應裝置 13‧‧‧Induction device
14‧‧‧控制器 14‧‧‧ Controller
111‧‧‧輸送帶 111‧‧‧Conveyor belt
112‧‧‧第一帶動輪 112‧‧‧First driving wheel
113‧‧‧第二帶動輪 113‧‧‧Second driving wheel
114‧‧‧第一驅動裝置 114‧‧‧First drive
121‧‧‧傳動輪 121‧‧‧Drive wheel
122‧‧‧第二驅動裝置 122‧‧‧Second drive
123‧‧‧皮帶 123‧‧‧Belt
131‧‧‧第一感應器 131‧‧‧First sensor
132‧‧‧第二感應器 132‧‧‧Second sensor
141‧‧‧控制電路 141‧‧‧Control circuit
142‧‧‧計時電路 142‧‧‧Timekeeping Circuit
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97111408A TWI386125B (en) | 2008-03-28 | 2008-03-28 | System and method for delivering printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97111408A TWI386125B (en) | 2008-03-28 | 2008-03-28 | System and method for delivering printed circuit board |
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| Publication Number | Publication Date |
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| TW200942107A TW200942107A (en) | 2009-10-01 |
| TWI386125B true TWI386125B (en) | 2013-02-11 |
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| Country | Link |
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| TW (1) | TWI386125B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW214627B (en) * | 1991-08-09 | 1993-10-11 | Morton Int Inc |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW214627B (en) * | 1991-08-09 | 1993-10-11 | Morton Int Inc |
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