TWI573504B - The optical positioning structure of the circuit substrate - Google Patents
The optical positioning structure of the circuit substrate Download PDFInfo
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- TWI573504B TWI573504B TW102137259A TW102137259A TWI573504B TW I573504 B TWI573504 B TW I573504B TW 102137259 A TW102137259 A TW 102137259A TW 102137259 A TW102137259 A TW 102137259A TW I573504 B TWI573504 B TW I573504B
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- Prior art keywords
- circuit substrate
- region
- light
- optical
- positioning structure
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- 230000003287 optical effect Effects 0.000 title claims description 91
- 239000000758 substrate Substances 0.000 title claims description 74
- 238000005253 cladding Methods 0.000 claims description 23
- 230000005540 biological transmission Effects 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 229910052755 nonmetal Inorganic materials 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims 5
- 238000000576 coating method Methods 0.000 claims 5
- 239000010410 layer Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Description
本發明係關於一種電路板之光學辨識定位結構，尤其是涉及一種包括有一第一表面辨識圖型及一第二表面辨識圖型之電路基板或載板。 The present invention relates to an optical identification positioning structure for a circuit board, and more particularly to a circuit substrate or carrier board including a first surface identification pattern and a second surface identification pattern.
在相關技術領域的產業中，使用傳統習知定位機器來定位電路基板時，需使用定位裝置讓電路基板的位置一致，由於習知的電路基板都會設計有複數個定位圓孔，該定位裝置使用定位柱來固定定位圓孔並用複數個定位裝置之光學裝置來觀看電路板是否定位於位置上，該光學裝置用以辨識定位時，亦僅能單面辨識定位，且該定位裝置需將兩個以上的光學裝置，設置於電路基板表面及反面進行校正對位，且該定位圓孔最少需要有三個點以上才可以確實電路板於定位點上。 In the related art, when a conventional conventional positioning machine is used to position a circuit substrate, a positioning device is required to make the position of the circuit substrate uniform. Since the conventional circuit substrate is designed with a plurality of positioning circular holes, the positioning device is used. Positioning the column to fix the positioning hole and use the optical device of the plurality of positioning devices to observe whether the circuit board is positioned at the position. When the optical device is used for identifying the positioning, only one side can be identified and positioned, and the positioning device needs to be two The above optical device is disposed on the surface of the circuit substrate and the reverse surface for correcting the alignment, and the positioning circular hole needs at least three points or more to confirm the circuit board at the positioning point.
習知定位裝置存在了下列缺點：(1)需在電路板的上表面及下表面分別設置至少一個光學裝置，使定位裝置結構複雜成本過高並只適用於特定規格之機具。(2)定位裝置使用空間過大造成空間上之浪費。(3)定位裝置進行辨識定位時，需進行多次的辨識定位，此作業耗時且會有較大之誤差，導致產品良率下降。 The conventional positioning device has the following disadvantages: (1) At least one optical device is required to be respectively disposed on the upper surface and the lower surface of the circuit board, so that the structure of the positioning device is complicated and costly and is only applicable to the machine of a specific specification. (2) The space used by the positioning device is too large to cause space waste. (3) When the positioning device performs identification and positioning, it needs to perform multiple identification and positioning. This operation takes time and there is a large error, which leads to a decrease in product yield.
緣此，鑑於傳統定位裝置之缺失，本發明之主要目的即是提供以單一光學裝置即可執行電路基板之上表面及下表面的辨識定位，改善習知的定位裝置必須以兩個各別的光學裝置對電路基板進 行取像、辨識、定位的缺點。 Therefore, in view of the absence of the conventional positioning device, the main object of the present invention is to provide an identification and positioning of the upper surface and the lower surface of the circuit substrate by a single optical device, and the conventional positioning device must be improved in two different ways. Optical device into the circuit substrate The shortcomings of image acquisition, identification, and positioning.
為達上述目的，本發明電路基板的光學定位結構係主要由光學定位結構設置於電路基板上，該光學定位結構予以光學裝置辨識定位。其中光學定位結構具有一透光區、一第一表面辨識圖型、一第二表面辨識圖型所組成。第一表面辨識圖型形成在該電路基板的第一表面，並位在該透光區鄰近位置。第一表面辨識圖型具有第一覆層，該第一覆層形成至少一透光對應區。而在該透光對應區外環處形成一外鄰區。 To achieve the above objective, the optical positioning structure of the circuit substrate of the present invention is mainly disposed on the circuit substrate by an optical positioning structure, and the optical positioning structure is positioned and positioned by the optical device. The optical positioning structure has a light transmissive area, a first surface recognition pattern and a second surface recognition pattern. The first surface recognition pattern is formed on the first surface of the circuit substrate and is located adjacent to the light transmission region. The first surface recognition pattern has a first cladding layer, and the first cladding layer forms at least one light-transmitting corresponding region. An outer neighboring region is formed at the outer ring of the light-transmitting corresponding region.
第二表面辨識圖型形成在該電路基板的第二表面，該第二表面辨識圖型具有至少一對應於該透光區處之鏤空區，該第二覆層係形成一鏤空區，鏤空區的直徑係小於該圓形透光對應區的直徑。 The second surface recognition pattern is formed on the second surface of the circuit substrate, the second surface identification pattern has at least one hollow area corresponding to the light transmission area, and the second cladding layer forms a hollow area and a hollow area The diameter is smaller than the diameter of the circular light-transmissive corresponding region.
藉由本發明的光學定位結構，當一第一光源投射向該電路基板的第一表面時，該光學裝置在該電路基板的該第一表面一預定高度位置處，以該第一表面辨識圖型作為該電路基板之第一表面的一第一光學定位點；當一第二光源投射向該電路基板的第二表面時，該第二光源通過該第二表面辨識圖型之該鏤空區及該透光區，而在該電路基板的第一表面呈現出一反應該鏤空區之光學亮點，該光學裝置在該電路基板的該第一表面一預定高度位置處，以該光學亮點作為該電路基板之第二表面的一第二光學定位點。 According to the optical positioning structure of the present invention, when a first light source is projected onto the first surface of the circuit substrate, the optical device is at a predetermined height position of the first surface of the circuit substrate, and the first surface identification pattern is a first optical positioning point of the first surface of the circuit substrate; when a second light source is projected onto the second surface of the circuit substrate, the second light source passes through the hollow area of the second surface identification pattern and the a light-transmitting region, wherein an optical bright spot reflecting the hollow region is present on the first surface of the circuit substrate, the optical device is at the predetermined height position of the first surface of the circuit substrate, and the optical bright spot is used as the circuit substrate a second optical positioning point of the second surface.
本發明之優點在於(1)利用單一光學裝置對電路基板的第一表面及第二表面予以辨識定位，以減少光學裝置之數量，以提高產能及產品良率進而降低使用者使用成本。(2)結構簡單不需過多的零組件，適用於任何規格之機具。(3)進行辨識定位時，只需1次的辨識定位，可節省時間成本耗損並提高效率。 The invention has the advantages that: (1) the first surface and the second surface of the circuit substrate are identified and positioned by using a single optical device to reduce the number of optical devices, thereby increasing productivity and product yield and thereby reducing user use cost. (2) The structure is simple and does not require too many components, and is suitable for machines of any size. (3) When performing identification and positioning, only one identification and positioning is needed, which can save time and cost and improve efficiency.
本發明所採用的具體實施例，將藉由以下之實施例及附呈圖式作進一步之說明。 The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.
1、1a‧‧‧光學定位結構 1, 1a‧‧‧ optical positioning structure
11‧‧‧透光區 11‧‧‧Lighting area
12‧‧‧第一表面辨識圖型 12‧‧‧First surface identification pattern
121‧‧‧第一覆層 121‧‧‧ first cladding
122‧‧‧透光對應區 122‧‧‧Lighting corresponding area
123‧‧‧外鄰區 123‧‧‧Outer neighbourhood
124‧‧‧間隔圖型區 124‧‧‧Interval pattern area
13‧‧‧第二表面辨識圖型 13‧‧‧Second surface identification pattern
131‧‧‧第二覆層 131‧‧‧Second cladding
132‧‧‧鏤空區 132‧‧‧镂空区
2‧‧‧電路基板 2‧‧‧ circuit board
21‧‧‧第一表面 21‧‧‧ first surface
22‧‧‧第二表面 22‧‧‧ second surface
23‧‧‧第一端 23‧‧‧ first end
24‧‧‧第二端 24‧‧‧ second end
25‧‧‧導電線路 25‧‧‧Electrical circuit
3‧‧‧光學裝置 3‧‧‧Optical device
4‧‧‧載板 4‧‧‧ Carrier Board
41‧‧‧第一表面 41‧‧‧ first surface
42‧‧‧第二表面 42‧‧‧ second surface
L1‧‧‧第一光源 L1‧‧‧ first light source
L2‧‧‧第二光源 L2‧‧‧second light source
M‧‧‧第一光學定位點 M‧‧‧First optical positioning point
N‧‧‧第二光學定位點 N‧‧‧Second optical positioning point
第1圖係顯示本發明電路基板的光學定位結構之立體示意圖。 Fig. 1 is a perspective view showing the optical positioning structure of the circuit substrate of the present invention.
第2圖係顯示本發明電路基板的光學定位結構之第一表面擴大圖。 Fig. 2 is a first surface enlarged view showing the optical positioning structure of the circuit substrate of the present invention.
第3圖係顯示本發明電路基板的光學定位結構之第二表面擴大圖。 Fig. 3 is a second surface enlarged view showing the optical positioning structure of the circuit substrate of the present invention.
第4圖係顯示第2圖之4-4剖面圖。 Figure 4 is a cross-sectional view taken along line 4-4 of Figure 2.
第5圖係顯示第一表面辨識圖型定位剖面圖。 Figure 5 is a cross-sectional view showing the first surface identification pattern.
第6圖係顯示第一表面辨識圖型定位圖。 Figure 6 shows the first surface recognition pattern location map.
第7圖係顯示第二表面辨識圖型定位剖面圖。 Figure 7 is a cross-sectional view showing the second surface identification pattern.
第8圖係顯示第二表面辨識圖型定位圖。 Figure 8 shows a second surface recognition pattern location map.
第9圖係顯示本發明電路基板的光學定位結構第二實施例示意圖。 Fig. 9 is a view showing a second embodiment of the optical positioning structure of the circuit substrate of the present invention.
第10圖係顯示第9圖10-10剖面圖。 Figure 10 is a cross-sectional view showing Figure 9-10.
第11圖係顯示光學定位結構之載板第一表面擴大圖。 Figure 11 is a magnified view of the first surface of the carrier plate showing the optical positioning structure.
第12圖係顯示光學定位結構之載板第二表面擴大圖。 Figure 12 is a magnified view of the second surface of the carrier plate showing the optical positioning structure.
請參閱第1圖至第4圖，第1圖係顯示本發明電路基板的光學定位結構之立體示意圖，第2圖係顯示本發明電路基板的光學定位結構之第一表面擴大圖，第3圖係顯示本發明電路基板的光學定位結構之第二表面擴大圖，第4圖係顯示第2圖之4-4剖面圖。如圖所示，本發明電路基板的光學定位結構，用以提供一光學裝置3對一電路基板2的第一表面21以及該電路基板2的第二表面22予以辨識定位，該電路基板2具有一第一端23、一第二端24以及佈設在該第一端23與該第二端24之間的導電線路25，其特徵在於該光學定位結構1包括有一透光區11、一第一表面辨識圖型12、一第二表面辨識圖型13。其中該電路基板2係為一軟性電路基板。 1 to 4, FIG. 1 is a perspective view showing an optical positioning structure of a circuit board of the present invention, and FIG. 2 is a first surface enlarged view showing an optical positioning structure of the circuit board of the present invention, FIG. A second surface enlargement diagram of the optical positioning structure of the circuit substrate of the present invention is shown, and FIG. 4 is a cross-sectional view taken along line 4-4 of FIG. As shown in the figure, the optical positioning structure of the circuit substrate of the present invention is used to provide an optical device 3 for identifying and positioning a first surface 21 of a circuit substrate 2 and a second surface 22 of the circuit substrate 2. The circuit substrate 2 has a first end 23, a second end 24, and a conductive line 25 disposed between the first end 23 and the second end 24, wherein the optical positioning structure 1 includes a light transmissive area 11, a first The surface recognition pattern 12 and a second surface recognition pattern 13 are provided. The circuit board 2 is a flexible circuit board.
透光區11係呈一圓形透光區並形成在該電路基板2之 一選定位置，該透光區11位於第一表面辨識圖型12與第二表面辨識圖型13之間。 The light transmitting region 11 is formed in a circular light transmitting region and formed on the circuit substrate 2 The light transmissive region 11 is located between the first surface recognition pattern 12 and the second surface recognition pattern 13 at a selected position.
第一表面辨識圖型12形成在該電路基板2的第一表面21，並位在該透光區11鄰近位置。第一表面辨識圖型12具有一第一覆層121，該第一覆層121形成在電路基板2之第一表面21並係可以銅箔、鋁箔或其它金屬或非金屬材料製成，該第一覆層121係形成至少一透光對應區122，該透光對應區122係呈一圓形透光對應區。而在該透光對應區122之外環一預定距離處，形成一外鄰區123，該透光對應區122與該外鄰區123之間形成一間隔圖型區124。 The first surface recognition pattern 12 is formed on the first surface 21 of the circuit substrate 2 and is located adjacent to the light transmission region 11. The first surface recognition pattern 12 has a first cladding layer 121 formed on the first surface 21 of the circuit substrate 2 and made of copper foil, aluminum foil or other metal or non-metal material. A coating layer 121 forms at least one light-transmissive corresponding region 122, and the light-transmitting corresponding region 122 is a circular light-transmitting corresponding region. An outer neighboring region 123 is formed at a predetermined distance from the outer portion of the light-transmitting corresponding region 122, and a spacer pattern region 124 is formed between the light-transmitting corresponding region 122 and the outer adjacent region 123.
在實際製作時，該第一覆層121係以蝕刻方式而形成該透光對應區122、該外鄰區123，而在該透光對應區122與該外鄰區123之間形成一未蝕刻的間隔圖型區124。除採用蝕刻方法之外，亦可採用例如濺鍍、蒸鍍等方式。 In the actual fabrication, the first cladding layer 121 forms the light-transmissive corresponding region 122 and the outer adjacent region 123 by etching, and forms an unetched between the transparent corresponding region 122 and the outer adjacent region 123. Interval pattern area 124. In addition to the etching method, for example, sputtering, vapor deposition, or the like can be employed.
第二表面辨識圖型13形成在該電路基板2的第二表面22，該第二表面辨識圖型13具有至少一對應於該透光區11處之鏤空區132。第二覆層131係可以銅箔、鋁箔或其它金屬或非金屬材料製成並形成在該電路基板2的該第二表面22，而該鏤空區132係呈一圓形鏤空區132，且該圓形鏤空區132的直徑係小於該圓形透光對應區122的直徑。在鏤空區132亦可採用例如蝕刻、濺鍍、蒸鍍等方式而形成。 A second surface identification pattern 13 is formed on the second surface 22 of the circuit substrate 2. The second surface identification pattern 13 has at least one hollowed region 132 corresponding to the light transmissive region 11. The second cladding layer 131 may be made of copper foil, aluminum foil or other metal or non-metal material and formed on the second surface 22 of the circuit substrate 2, and the hollow region 132 is a circular hollow region 132, and the The diameter of the circular cutout region 132 is smaller than the diameter of the circular light-transmissive corresponding region 122. The hollow region 132 may be formed by, for example, etching, sputtering, vapor deposition, or the like.
請參閱第5圖及第6圖，第5圖係顯示第一表面辨識圖型定位剖面圖，第6圖係顯示第一表面辨識圖型定位圖。如圖所示，第一表面辨識圖型12形成在該電路基板2的第一表面21，並位在該透光區11鄰近位置，且該第一表面辨識圖型12具有對應於該透光區11之透光對應區122。 Please refer to FIG. 5 and FIG. 6 , FIG. 5 is a cross-sectional view showing a first surface identification pattern, and FIG. 6 is a first surface identification pattern positioning diagram. As shown, the first surface recognition pattern 12 is formed on the first surface 21 of the circuit substrate 2 and is located adjacent to the light transmission region 11, and the first surface recognition pattern 12 has a corresponding light transmission. The light-transmissive area 122 of the area 11 is.
當光學裝置3在該電路基板2的第一表面21的一預定 高度位置處，該光學裝置3進行光學定位時，將第一光源L1投射向該電路基板2的第一表面21，該透光對應區122之外環預定距離處以蝕刻形成的外鄰區123，因第一光源L1投射而形成第一表面辨識圖型12，該第一表面辨識圖型12作為該電路基板2之第一表面21的一第一光學定位點M。 When the optical device 3 is on a predetermined surface of the first surface 21 of the circuit substrate 2 At the height position, when the optical device 3 is optically positioned, the first light source L1 is projected toward the first surface 21 of the circuit substrate 2, and the outer adjacent region 123 is formed by etching at a predetermined distance outside the light-transmitting corresponding region 122. The first surface recognition pattern 12 is formed by the first light source L1 as a first optical positioning point M of the first surface 21 of the circuit substrate 2.
請參閱第7圖及第8圖，第7圖係顯示第二表面辨識圖型定位剖面圖，第8圖係顯示第二表面辨識圖型定位圖。如圖所示，第二表面辨識圖型13形成在該電路基板2的第二表面22，該第二表面辨識圖型13具有至少一對應於該透光區11之一鏤空區132。 Please refer to FIG. 7 and FIG. 8 , FIG. 7 is a cross-sectional view showing a second surface identification pattern, and FIG. 8 is a second surface identification pattern positioning diagram. As shown, a second surface identification pattern 13 is formed on the second surface 22 of the circuit substrate 2. The second surface identification pattern 13 has at least one hollowed out region 132 corresponding to the light transmissive region 11.
當第二光源L2投射向該電路基板2的第二表面22時，該第二光源L2通過該第二表面辨識圖型13之鏤空區132及該透光區11，而在該電路基板2的第一表面21呈現出一反應該鏤空區132之光學亮點並將光學亮點為第二表面辨識圖型13，該光學裝置3在該電路基板2的第一表面21一預定高度位置處，以該光學亮點作為該電路基板2之第二表面22的一第二光學定位點N。 When the second light source L2 is projected onto the second surface 22 of the circuit substrate 2, the second light source L2 passes through the hollow surface 132 of the second surface identification pattern 13 and the light transmissive region 11, and is on the circuit substrate 2 The first surface 21 exhibits an optical bright spot reflecting the hollowed out region 132 and the optical bright spot is a second surface identification pattern 13. The optical device 3 is at a predetermined height position of the first surface 21 of the circuit substrate 2, The optical bright spot serves as a second optical positioning point N of the second surface 22 of the circuit substrate 2.
請參閱第9圖至第12圖，第9圖係顯示本發明電路基板的光學定位結構第二實施例示意圖，第10圖係顯示第9圖10-10剖面圖，第11圖係顯示光學定位結構之載板第一表面擴大圖，第12圖係顯示光學定位結構之載板第二表面擴大圖。本實施例的大部份組成構件與第一實施例相同，故相同元件乃標示相同的元件編號，以資對應。 Please refer to FIG. 9 to FIG. 12, FIG. 9 is a schematic view showing a second embodiment of the optical positioning structure of the circuit substrate of the present invention, FIG. 10 is a cross-sectional view showing FIG. 9-10, and FIG. 11 is a view showing optical positioning. The first surface enlargement of the carrier plate of the structure, and the second surface enlargement of the carrier plate of the optical positioning structure is shown in FIG. Most of the constituent members of the present embodiment are the same as those of the first embodiment, and the same components are denoted by the same component numbers.
在本實施例中，本發明電路基板的光學定位結構，用以提供一光學裝置3對一載板4之第一表面41以及該載板4的第二表面42予以辨識定位，該載板4包括有複數個電路基板2，每一個電路基板2具有一第一端23、一第二端24以及佈設在該第一端23與該第二端24之間的導電線路25，其特徵在於該光學定位結構1a包括有一 透光區11、一第一表面辨識圖12型及一第二表面辨識圖型13。其中透光區11形成在該載板4位在該電路基板2以外之一選定位置。 In this embodiment, the optical positioning structure of the circuit substrate of the present invention is used to provide an optical device 3 for identifying and positioning the first surface 41 of a carrier 4 and the second surface 42 of the carrier 4, the carrier 4 The circuit board 2 includes a plurality of circuit boards 2, each of which has a first end 23, a second end 24, and a conductive line 25 disposed between the first end 23 and the second end 24, wherein The optical positioning structure 1a includes a The light transmissive area 11 , a first surface recognition pattern 12 and a second surface recognition pattern 13 . The light transmitting region 11 is formed at a selected position of the carrier 4 at a position other than the circuit board 2.
第一表面辨識圖型12，形成在該載板4的第一表面41，並位在該透光區11鄰近位置處，該透光區11係呈一圓形透光區。其中該第一表面辨識圖型12包括有第一覆層121形成在該載板4的第一表面41及位在該第一覆層121對應於該透光區11處，係形成該透光對應區122，該透光對應區122之外環一預定距離處，亦形成一外鄰區123，而在該透光對應區122與該外鄰區123之間形成一間隔圖型區124。該第一覆層121之使用材料為導電性材料，例如以銅箔為媒介材料且透光對應區122係呈一圓形透光對應區。 The first surface recognition pattern 12 is formed on the first surface 41 of the carrier 4 and is located adjacent to the light transmission area 11. The light transmission area 11 is a circular light transmission area. The first surface recognition pattern 12 includes a first cladding layer 121 formed on the first surface 41 of the carrier 4 and a first cladding layer 121 corresponding to the transparent region 11 to form the light transmission. Corresponding area 122, a predetermined distance between the outer ring of the light-transmitting corresponding area 122, also forms an outer adjacent area 123, and a spacing pattern area 124 is formed between the transparent corresponding area 122 and the outer adjacent area 123. The material used for the first cladding layer 121 is a conductive material, for example, a copper foil as a medium material and the light-transmitting corresponding region 122 is a circular light-transmitting corresponding region.
當第一光源L1投射向該載板4的第一表面41時，該光學裝置3在該載板4的該第一表面預定高度位置處，以該第一表面辨識圖型12作為該載板4之第一表面41的第一光學定位點M。 When the first light source L1 is projected onto the first surface 41 of the carrier 4, the optical device 3 is at the predetermined height position of the first surface of the carrier 4, and the first surface recognition pattern 12 is used as the carrier The first optical positioning point M of the first surface 41 of 4.
第二表面辨識圖型13具有第二覆層131並形成在該載板4的該第二表面42。該第二覆層131對應於該透光區11處，係形成該鏤空區132。該第二覆層131之使用材料為導電性材料，例如以銅箔為媒介材料且鏤空區132係呈一圓形鏤空區，該圓形鏤空區的直徑係小於該圓形透光對應區122的直徑。 The second surface recognition pattern 13 has a second cladding layer 131 and is formed on the second surface 42 of the carrier plate 4. The second cladding layer 131 corresponds to the light transmissive region 11 to form the hollow region 132. The material used for the second cladding layer 131 is a conductive material, for example, a copper foil as a medium material, and the hollow region 132 is a circular hollow region, and the diameter of the circular hollow region is smaller than the circular light-transmitting corresponding region 122. diameter of.
當第二光源L2投射向該載板4的第二表面42時，該第二光源L2通過鏤空區132及該透光區11，而在載板4的第一表面41呈現出一反應該鏤空區132之光學亮點，該光學亮點係為第二表面辨識圖型13，該光學裝置3以該光學亮點作為該載板4之第二表面42的第二光學定位點N。 When the second light source L2 is projected toward the second surface 42 of the carrier 4, the second light source L2 passes through the hollowed out region 132 and the light transmitting region 11, and the first surface 41 of the carrier 4 exhibits a reaction to the hollowing out. The optical bright spot of the area 132 is the second surface identification pattern 13 with the optical bright spot as the second optical positioning point N of the second surface 42 of the carrier 4.
前述的第一表面辨識圖型12及第二表面辨識圖型13是以圓形結構作為實施例說明，亦可採用任何其它可供光學辨識的圖型(例如方形、三角形)皆可實現本發明。再者，光學裝置3是以光學耦 合裝置(CCD)作為取像的光學裝置，亦可採用其它等效的光學裝置，例如X光、深度攝像裝置等。 The foregoing first surface recognition pattern 12 and the second surface recognition pattern 13 are described by using a circular structure as an embodiment, and any other optically recognizable pattern (for example, a square or a triangle) can be used to implement the present invention. . Furthermore, the optical device 3 is optically coupled. The CCD is used as the optical device for taking images, and other equivalent optical devices such as X-rays, depth imaging devices, and the like can also be used.
以上實施例僅為例示性說明本創作之結構設計，而非用於限制本創作。任何熟於此項技藝之人士均可在本創作之結構設計及精神下，對上述實施例進行修改及變化，唯這些改變仍屬本創作之精神及以下所界定之專利範圍中。因此本創作之權利保護範圍應如後述之申請專利範圍所列。 The above embodiments are merely illustrative of the structural design of the present invention and are not intended to limit the present creation. Any of the above-mentioned embodiments may be modified and changed in the context of the design and spirit of the present invention. These changes are still within the spirit of this creation and the scope of patents defined below. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.
1‧‧‧光學定位結構 1‧‧‧Optical positioning structure
11‧‧‧透光區 11‧‧‧Lighting area
12‧‧‧第一表面辨識圖型 12‧‧‧First surface identification pattern
121‧‧‧第一覆層 121‧‧‧ first cladding
122‧‧‧透光對應區 122‧‧‧Lighting corresponding area
123‧‧‧外鄰區 123‧‧‧Outer neighbourhood
124‧‧‧間隔圖型區 124‧‧‧Interval pattern area
2‧‧‧電路基板 2‧‧‧ circuit board
21‧‧‧第一表面 21‧‧‧ first surface
22‧‧‧第二表面 22‧‧‧ second surface
23‧‧‧第一端 23‧‧‧ first end
24‧‧‧第二端 24‧‧‧ second end
25‧‧‧導電線路 25‧‧‧Electrical circuit
Claims (14)
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| TW102137259A TWI573504B (en) | 2013-10-16 | 2013-10-16 | The optical positioning structure of the circuit substrate |
| CN201410400255.7A CN104582243B (en) | 2013-10-16 | 2014-08-14 | Optical positioning structure of circuit substrate |
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| TW102137259A TWI573504B (en) | 2013-10-16 | 2013-10-16 | The optical positioning structure of the circuit substrate |
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| TW201018984A (en) * | 2008-11-11 | 2010-05-16 | Au Optronics Suzhou Corp | Alignment inspection method and apparatus |
| TW201044539A (en) * | 2009-06-05 | 2010-12-16 | Nanya Technology Corp | Alignment mark arrangement and alignment mark structure |
| TW201331732A (en) * | 2012-01-17 | 2013-08-01 | Chin-Yen Wang | Calibration apparatus and calibration method using the same |
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| KR100831593B1 (en) * | 2007-04-23 | 2008-05-23 | 삼성전기주식회사 | Printed circuit board and manufacturing method thereof, via hole drilling apparatus |
| CN102065643B (en) * | 2009-11-17 | 2012-10-17 | 富葵精密组件(深圳)有限公司 | Method for making circuit board |
| CN201682692U (en) * | 2010-04-26 | 2010-12-22 | 深南电路有限公司 | Notching identification structure of non-transparent thin core plate |
| CN103228107B (en) * | 2012-01-31 | 2016-03-23 | 王锦燕 | Position correction apparatus and use the method for correcting position of this position correction apparatus |
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| TW201018984A (en) * | 2008-11-11 | 2010-05-16 | Au Optronics Suzhou Corp | Alignment inspection method and apparatus |
| TW201044539A (en) * | 2009-06-05 | 2010-12-16 | Nanya Technology Corp | Alignment mark arrangement and alignment mark structure |
| TW201331732A (en) * | 2012-01-17 | 2013-08-01 | Chin-Yen Wang | Calibration apparatus and calibration method using the same |
| CN103313525A (en) * | 2012-03-14 | 2013-09-18 | 技嘉科技股份有限公司 | Circuit board positioning correction system and method |
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| TW201517720A (en) | 2015-05-01 |
| CN104582243B (en) | 2018-07-27 |
| CN104582243A (en) | 2015-04-29 |
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