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TWI376003B - - Google Patents

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Publication number
TWI376003B
TWI376003B TW097133831A TW97133831A TWI376003B TW I376003 B TWI376003 B TW I376003B TW 097133831 A TW097133831 A TW 097133831A TW 97133831 A TW97133831 A TW 97133831A TW I376003 B TWI376003 B TW I376003B
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TW
Taiwan
Prior art keywords
bare
die
detecting device
transparent glass
image
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Application number
TW097133831A
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Chinese (zh)
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TW201011849A (en
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King Yuan Electronics Co Ltd
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Publication date
Application filed by King Yuan Electronics Co Ltd filed Critical King Yuan Electronics Co Ltd
Priority to TW097133831A priority Critical patent/TW201011849A/en
Priority to JP2008271129A priority patent/JP4767302B2/en
Priority to KR1020080115156A priority patent/KR101043705B1/en
Publication of TW201011849A publication Critical patent/TW201011849A/en
Application granted granted Critical
Publication of TWI376003B publication Critical patent/TWI376003B/zh

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    • H10P74/203
    • H10P72/0446
    • H10P72/0616

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Die Bonding (AREA)

Description

1376003 ίο 151376003 ίο 15

20 九、發明說明: 【發明所屬之技術領域】 本發明係關於-種裸晶粒雙面檢測設備,尤指一種適 用於半導體封裝測試製程中’用以檢測裸晶粒之正面、及 背面表面狀態之設備。 【先前技術】 半導體之封裝測試製程中,於封裝前之裸晶粒表面的 檢測步驟關係著整個最終產品品質中相當重要的一環。裸 晶粒表面檢測主要係在檢測其正反兩面之表面是否存在有 裂痕、Q任何原本就不該屬於待測裸晶粒之顆粒、 灰塵專外來物。其主要是因為表面任何的刮傷、裂痕、或 灰塵等外來物將會影響產品的運作,嚴重者甚至 會導致完全失去其功效。 二乂往習知裸晶粒表面的檢測步驟採以人工方式進行, 亦即完全以人工之肉眼夾推 古4 4 ^ 良來進仃檢查稞晶表面狀態,惟此一 方式效率極差,耗費相當多 檢的方式。再且,隨著製程:二:時間,而且僅能以抽 * ^ . 技術的進步,裸晶粒的尺寸越 來越小,而人工肉眼所能 萝程需求,的視力圍已無法滿足現代的 I程而求,其必須仰仗其他辅助設備。 ,,傳統肉眼檢查亦有一個嚴重缺 工檢測貝判斷標準不_,邋 母 ^ , ,,,, 導欠*有判斷錯誤之情況發生。 此外心有技㈣謂對心㈣ 以人工方式進行倒盤, 、衣囬彳欢判彳乃疋抹 ’、P以人工方式將裸晶粒翻面後再 5 1376003 進仃背面檢測。此方式亦同樣耗費相當多的人力及時間, 而且也同樣會隨著晶粒尺寸越來越小,而到達一定尺寸時 人工便無法在執行。其中,人工倒盤更有一個嚴重缺點, 此即因人工翻面常反而會造成裸晶粒品質異常,例如因人 5員疏忽造成到傷、或是沾附灰塵、毛髮、皮屑等外來物、 甚至置放方向錯誤等》 由此可知,如何減少人力、及時間,以節省成本並提 升作業效率,而且又能增加檢測的準確度,更不會因為翻 面檢測而造成裸晶粒額外損傷,實在是產業上的一種迫切 10 需要。 【發明内容】 本發明為一種裸晶粒雙面檢測設備,包括:一載入裝 置、一正面影像擷取裝置、一透明玻璃、一背面影像檢測 15裝置、一取放裝置、以及一控制器。其中,載入裝置包括 有一導引轨道、一滑台、及一承載盤。而滑台係滑移於導 引執道上並可停留於一第一位置、及一第二位置。且承載 &gt; 盤係承載於滑台上方,承載盤上容置有複數個裸晶粒。另 外,正面影像擷取裝置係位設於導引軌道上方、並對應於 20 位在第一位置之滑台上的承載盤。 再者,透明玻璃係組設於導引軌道之一側、並鄰近於 位在第二位置之滑台。而背.面影像檢測裝置係組設於透明 玻璃下S,背面影像檢測裝置包括有一攝像鏡帛,攝像鏡 頭朝上面向透明玻璃。此外’取放裝置是選擇式地移動於 6 1376003 位在第二位置之滑台上的承載盤、與透明玻璃之間。其中, 控制器分別與載入裝置、正面影像擷取裝置、背面影像檢 測裝置、及取放裝置電性連接。而控制器控制正面影像擷 取裝置分別拍攝並檢測承載盤上複數個裸晶粒之正面畫 5 面。 再且,控制器控制取放裝置取出承載盤上複數個裸晶 粒其中之一待測裸晶粒並放置於透明玻璃上方。且又控制 器控制背面影像檢測裝置之攝像鏡頭由下往上拍攝並檢測 鲁 2測裸晶粒之背面畫面。因此,本發明俾能大幅減少人力 需求、及檢測所需時間,進而節省成本並提升作業效率, 且又能有效增加檢測的準癌度,更不會造成裸晶粒絲毫的 損壞。 15 20 —其本發明之透明玻璃可包括有一特定區域,而半 定區域用以承載著待測裸晶粒’又背面影像檢測裝置之我 像鏡頭正好對應於透明玻璃之特定區域下方。而其特定屈 括有-凸透鏡’其主要用以當裸晶粒尺寸於很小以 二下太可错由凸透鏡放大影像,而更能進行精確的檢測 :於竟’其他等效透明透鏡或… 主另外,透明玻璃又可更包括有另一特定區域— 定區域二者中至…可包J㈠疋區域與上述特 八 』包括有一凸透鏡,另一特卞阳^ 具有與特定區域不同放大倍率。藉由提供不同倍率 7 1376003 區域以適用更多不同的裸晶粒尺寸、或不同精密之需求。 當然本發明並不僅以二個區域為限,亦可以包括多個區域。 此外’本發明之背面影像檢測裝置之攝像鏡頭可與透 明玻璃保持一特定距離’而攝像鏡頭並可選擇式地移行到 5 特疋區域下方與另一特定區域下方之間。亦即本發明背面 影像檢測裝置之攝像鏡頭可進行三軸移動於透明玻璃的下 方區域’以便針對不同裸晶粒尺寸、不同位置、或不同透 鏡倍率之區域進行檢測。據此,本發明之背面影像檢測裝 置可更包括有一辅助光源,用以提供照明以便協助背面檢 10 測的進行。 較佳的是,本發明可更包括有一第一載出裝置、及至 少一第二載出裝置。而第一載出裝置上承載有一合格裸晶 粒承載盤,至少一第二載出裝置上承載有至少一瑕疵裸晶 粒I載盤其主要用以提供檢測後的裸晶粒之合格與否進 15行刀類。其中,良品置放於合格裸晶粒承載盤不良品置 放於瑕疵裸晶粒承載盤。再且,本發明之取放裝置可包括 一真空吸嘴。 另外,本發明之控制器可包括一記憶體,而記憶體内 诸存有裸a曰粒正面標準圖像、及一裸晶粒背面標準圖 2〇 ^ ° X ’控制器可操取正面影像操取裝置傳來之複數個裸 晶粒之正面畫面’並據以分別與記憶體中之裸晶粒正面標 準圖像進行分析比對。此外,控制器更可擷取背面影像檢 測裝置傳來之待測裸晶粒之背面畫面,並據以與記憶體中 之該裸晶粒背面標準圖像進行分析比對。 8 25 1376003 * 【實施方式】 請同時參閱圖丨及圖2,其中圖丨為本發明之裸晶粒雙面 檢測设備較佳實施例之整體設備示意圖,圖2為本發明—較 佳實施例之局部立體圖。圖_顯示有一載入裝置〖,其具有 5 一導引軌道11、一滑台12、及一承載盤13。其中,滑台12 係滑移於導引軌道U上並可停留於一第一位置14、及一第 二位置15。而本實施例中導引執道丨丨上為滾筒輸送帶,當 然可以依據不同需求而進行替換,例如滑軌等。而承載盤 鲁(_)13係承載於滑台12上方,其承載盤13上容置有複數個 10待檢測的裸晶粒2。另外,載入裝置i還包括有如圖中顯示 之一夾盤器,其主要用於自動化載入承載盤13,亦即藉 由炎盤器191從-載入區19來夹取承載盤13而到導引轨道 此外,圖中另顯示有一正面影像擷取裝置3, A係位力 15 20 於導引軌it U上方、並制純在第-位置14之滑台山 的承載盤13。而且’其包括有一移動支架31、及一 _ 32,攝影機32是滑設於移動支架31上。亦即,在本實施众 中攝影機取可進行三財向㈣動,以较崎影像^ 擷取。另外,在本實施例令攝影機32是逐一針對單一裸畜 粒之正面進行畫面摘取,而本實施例之攝影機 CCD。 …不⑺ 其中,圖f上顯7F有-個透明玻璃4,其係組設於導引 軌道11之-側、並鄰近於位在第二位置15之滑台12。'而本 貫施例中透明玻璃4包括有一特定區域41、及另—特定區域 9 1376003 42而特疋區域41、及另一特定區域42是用以承載著待測 裸晶粒20。其中,肖定區域41、及另一特定區域42分別為 不同放大倍率之凸透鏡。而本實施例特別設置凸透鏡主要 目的在於’當裸晶粒尺寸於很小的情況下,可藉由凸透鏡 5來放大影像,而能進行更精確的檢測,並藉由提供不同倍 率之透鏡區域41,42以提供適用更多不同尺寸的裸晶粒。 當然本發明並不僅以二個區域為限,亦可以包括多個 區域。並且,特定區域41、及另一特定區域42之透鏡的配 φ 置可以是平面透鏡與平面透鏡 '平面透鏡與凸透鏡、或是 10凸透鏡與凸透鏡,可以依需求搭配適合的透鏡。再者,本 發明亦不限於凸透鏡,其他等效透明透鏡或裝置亦可運用 於本發明中。 請一併參閱圖3,圖3為本發明一較佳實施例之局部側 視示意圖,為求能更明確顯示背面影像檢測裝置5、透明玻 15璃4、與其他元件之配置關係,圖中省略於第二位置15中之 滑台12、承載盤13、及裸晶粒2。圖中之背面影像檢測裝置 5是組設於透明玻璃4下方,而背面影像檢測裝置$具有一攝 像鏡頭51,而攝像鏡頭51朝上且面向透明玻璃4,其主要用 以擷取裸晶粒的背面畫面,而本實施例之攝像鏡頭Μ是採 20 用 CCD。 其中,背面影像檢測裝置5之攝像鏡頭51係與透明玻璃 4保持一特定距離d。而攝像鏡頭51並可選擇式地移行到特 定區域41下方與另一特定區域42下方之間。亦即,本實施 例之背面影像檢測裝置5之攝像鏡頭5丨可進行三軸移動於 1376003 透明破璃4的下方區域,以了 要吏針對不同裸晶粒尺寸、不η办 置、或不同透鏡倍率之區域了不同位 一辅助井㈣甘進盯檢測。又,圖3令另顯示有 稍助尤源52,其用以槎供 月 進行。 、…、便協助背面晝面擷取的 另外,圖中又顯示有一 出裝置…其中,第裝置16、及一第二載 載出裝置16上承載有一合格禊曰鈿 承載盤161,第二載出裝置 棵的粒 171。並主巫田, 上承載有一瑕疵稞晶粒承載盤 類於、Λ 檢測後的裸晶粒之合格與否進行分 % 15IX. INSTRUCTIONS: [Technical Field] The present invention relates to a bare-die double-sided inspection device, and more particularly to a semiconductor package test process for detecting the front side and the back surface of a bare die. State of the device. [Prior Art] In the semiconductor package test process, the inspection step of the bare die surface before packaging is a very important part of the quality of the final product. The surface inspection of bare crystal is mainly to detect whether there are cracks on the surface of the front and back sides, and any particles or dusts that are not supposed to belong to the bare grains to be tested. It is mainly because any foreign matter such as scratches, cracks, or dust on the surface will affect the operation of the product, and even severely, it will completely lose its efficacy. The detection procedure of the surface of the bare die is carried out manually, that is, the surface of the twin is inspected by the artificial naked eye, but the efficiency of the method is extremely poor and costly. The way to check more. Moreover, with the process: two: time, and only with the advancement of technology, the size of the bare crystal is getting smaller and smaller, and the artificial eye can not meet the needs of the modern vision. I want to rely on it, and it must rely on other auxiliary equipment. ,, the traditional visual inspection also has a serious lack of detection. The judgment criteria are not _, 邋 mother ^, ,,,, guide owing * there is a judgment error. In addition, the heart has skills (4) that the heart (4) is manually reversible, and the clothing is returned to the 彳 彳 彳 ’ 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 This method also consumes a considerable amount of manpower and time, and also as the grain size becomes smaller and smaller, and when it reaches a certain size, the artificial cannot be executed. Among them, the artificial rewinding has a serious disadvantage, which is caused by the abnormal turning of the artificial surface, which may cause abnormal skin quality, such as injury caused by the inadvertentness of 5 people, or foreign objects such as dust, hair and dander. And even the wrong direction of placement, etc. This shows how to reduce manpower and time, to save costs and improve work efficiency, but also to increase the accuracy of detection, and not to cause additional damage to the bare die due to flip detection. It is really an urgent need in the industry. SUMMARY OF THE INVENTION The present invention is a bare-die double-sided inspection apparatus, including: a loading device, a front image capturing device, a transparent glass, a back image detecting device 15, a pick and place device, and a controller . The loading device includes a guiding track, a sliding table, and a carrying tray. The sliding table slides on the guiding track and can stay in a first position and a second position. The bearer &gt; is carried on the upper side of the sliding table, and the plurality of bare crystal grains are accommodated on the carrying tray. In addition, the front image capturing device is positioned above the guiding track and corresponds to 20 carrier disks on the sliding table in the first position. Further, the transparent glass is assembled on one side of the guide rail and adjacent to the slide table in the second position. The back image detecting device is disposed under the transparent glass S, and the back image detecting device includes a camera lens, and the camera lens faces upward toward the transparent glass. In addition, the pick-and-place device is selectively moved between the carrier tray of the 6 1376003 position on the slide table at the second position, and the transparent glass. The controller is electrically connected to the loading device, the front image capturing device, the back image detecting device, and the pick and place device. The controller controls the front image capturing device to separately capture and detect the front side of the plurality of bare crystals on the carrier. Moreover, the controller controls the pick and place device to take out one of the plurality of bare crystal grains on the carrier disk to be tested and place it on the transparent glass. Moreover, the controller controls the camera lens of the back image detecting device to shoot from the bottom up and detect the back image of the bare die. Therefore, the present invention can greatly reduce the manpower requirement and the time required for detection, thereby saving costs and improving work efficiency, and can effectively increase the quasi-cancer degree of detection without causing damage to the bare crystal. 15 20 - The transparent glass of the present invention may include a specific area, and the half area is used to carry the bare die to be tested. The image lens of the back side image detecting device corresponds exactly below a specific area of the transparent glass. And its specific flexor-convex lens is mainly used to enlarge the image when the bare die size is too small or too small to be magnified by the convex lens, and more accurate detection: in fact, 'other equivalent transparent lens or... In addition, the transparent glass may further include another specific region - the two regions of the region may be ... the J (one) region and the above-mentioned special eight" include a convex lens, and the other has a different magnification from the specific region. By providing different ratios of the 7 1376003 area to accommodate more different bare grain sizes, or different precision requirements. Of course, the present invention is not limited to two regions, and may also include multiple regions. Further, the image pickup lens of the back image detecting device of the present invention can maintain a certain distance from the transparent glass, and the image pickup lens can be selectively moved between the lower portion of the 5th region and the lower portion of the other region. That is, the image pickup lens of the back image detecting device of the present invention can be moved three-axis to the lower region of the transparent glass to detect for different bare grain sizes, different positions, or regions of different lens magnifications. Accordingly, the backside image sensing apparatus of the present invention may further include an auxiliary light source for providing illumination to assist in the performing of the back side inspection. Preferably, the present invention may further comprise a first loading device and at least one second loading device. The first carrying device carries a qualified bare die carrier, and at least one second carrying device carries at least one bare die I carrier, which is mainly used to provide the qualified die after inspection. Enter 15 rows of knives. Among them, the defective products placed on the qualified bare die carrier are placed on the bare die carrier. Further, the pick-and-place device of the present invention may include a vacuum nozzle. In addition, the controller of the present invention may include a memory, and the memory body has a standard image of the front side of the bare a grain, and a standard image of the back side of the bare die. The controller can operate the front image. The front side of the plurality of bare crystals transmitted from the device is processed and compared with the standard image of the bare front surface in the memory. In addition, the controller can capture the back image of the bare die to be tested transmitted from the back image detecting device, and compare and analyze the standard image of the bare die in the memory. 8 25 1376003 * [Embodiment] Please refer to both FIG. 2 and FIG. 2, which are schematic diagrams of the overall device of the preferred embodiment of the bare die double-sided detecting device of the present invention, and FIG. 2 is a preferred embodiment of the present invention. A partial perspective view of an example. Figure _ shows a loading device </ RTI> having a guide rail 11, a slide table 12, and a carrier tray 13. The slide table 12 is slid on the guide rail U and can stay at a first position 14 and a second position 15. In this embodiment, the guide rail is a roller conveyor belt, and can be replaced according to different requirements, such as a slide rail. The carrier disk (_) 13 is carried on the sliding table 12, and the carrier disk 13 houses a plurality of bare die 2 to be detected. In addition, the loading device i further includes a chuck as shown in the figure, which is mainly used for automatically loading the carrier tray 13, that is, the carrier tray 13 is gripped from the loading region 19 by the disk 191. In addition to the guide track, a front image capture device 3 is additionally shown, with the A system force 15 20 above the guide rail it U and making the carrier disk 13 of the slide table mountain at the first position 14. Moreover, it includes a moving bracket 31 and a _32, and the camera 32 is slidably disposed on the moving bracket 31. That is to say, in the present embodiment, the camera can take three (4) movements to capture the image. Further, in the present embodiment, the camera 32 is screen-removed one by one for the front side of a single naked animal, and the camera CCD of this embodiment. ...not (7) wherein, the display 7F has a transparent glass 4 which is disposed on the side of the guide rail 11 and adjacent to the slide table 12 located at the second position 15. In the present embodiment, the transparent glass 4 includes a specific region 41, and another specific region 9 1376003 42 and the special region 41, and another specific region 42 is used to carry the bare die 20 to be tested. The symmetrical region 41 and the other specific region 42 are convex lenses of different magnifications. The main purpose of the convex lens in this embodiment is that the image can be enlarged by the convex lens 5 when the size of the bare crystal grain is small, and more precise detection can be performed, and the lens region 41 with different magnifications can be provided. , 42 to provide more different sizes of bare die. Of course, the present invention is not limited to two regions, and may include a plurality of regions. Further, the φ of the lens of the specific region 41 and the other specific region 42 may be a planar lens and a planar lens 'planar lens and convex lens, or 10 convex lens and convex lens, and may be matched with a suitable lens as needed. Furthermore, the invention is not limited to convex lenses, and other equivalent transparent lenses or devices may also be utilized in the present invention. Please refer to FIG. 3 together. FIG. 3 is a partial side elevational view of the preferred embodiment of the present invention. In order to more clearly show the relationship between the back image detecting device 5 and the transparent glass, the arrangement relationship with other components is shown in the figure. The slide table 12, the carrier disk 13, and the bare die 2 in the second position 15 are omitted. The back image detecting device 5 is disposed under the transparent glass 4, and the back image detecting device $ has a camera lens 51, and the camera lens 51 faces upward and faces the transparent glass 4, which is mainly used for picking up the bare crystal The back side of the picture, and the camera lens of this embodiment is a CCD. The image pickup lens 51 of the back image detecting device 5 is held at a specific distance d from the transparent glass 4. The image pickup lens 51 is selectively moved between the lower portion of the specific area 41 and the lower portion of the other specific area 42. That is, the imaging lens 5 of the back image detecting device 5 of the present embodiment can be three-axisly moved to the lower region of the 13760003 transparent glass 4, so as to be different for different die sizes, not for n, or different. The area of the lens magnification is different from that of an auxiliary well (4). Again, Figure 3 shows that there is a slight help for the Eugene 52, which is used for the month. In addition, the rear side of the back surface is taken in addition, and the device is further shown in the figure. The first device 16 and the second loading device 16 carry a qualified load carrying tray 161. The particles 171 of the device are removed. And the main Wutian, carrying a 瑕疵稞 承载 承载 类 类 Λ Λ Λ Λ Λ Λ Λ Λ % % % % % %

類。於本實施例中另外有— 丁刀 4. f, —載出裝置18,其用以曰後 =對不同產。。之需求而擴充準備用,抑或可提供不同㈣ 4級之分料使用。又,圖巾__ _宁顯不有一取放裝置6,並可還遥 式地移動於位在第二位晋 、選擇 ⑦位置15之滑台12上的承載盤13、第一 載出裝置16、第二載出裝署^ f置6呈有直允坠璃4之間。而取放 =置6具有-真空吸嘴’用以吸取及放置裸晶粒,其優點在 於可快速取放、且又不損傷裸晶粒。 再且,控制器7是分別與載入裝置1、第一載出裝置16、 第一載出裝置17、正面影像擷取裝置3、背面影像檢測裝置 5、及取放裝置6電性連接。而控制器7控制正面影像擷取裝 置3分別拍攝並檢測承载盤13上複數個裸晶粒2之正面晝面 14卜另外’控制器7又控制取放裝置6取出承載盤η上複數 個裸晶粒2其令之-待測裸晶粒2〇並放置於透明玻璃*上 方。又,控制Is 7亦控制背面影像檢測裝置5之攝像鏡頭51 由下往上拍攝並檢測待測裸晶粒2〇之背面畫面15卜此外, 20 1376003 控制器7又將已檢測過後的待測裸晶粒齡別移動 於第-載出裝置16、或第二載出震置17其中之一。 據此一,本實施例之控制器7其控制細節如下說明。控制 準德有-繼71 ’而記憶體71内儲存有—裸晶 二圖❸η、及-裸晶粒背面標準圖像712。而檢測進行時, ίο 15 20 ;5僂取正面影像操取襄置3、及背面影像檢測裝 之昔而:裸晶粒2之正面畫面14卜及待測裸晶粒2〇 面m。賴,據时财析比對其巾裸晶粒正面 :像711與正面畫面14卜及裸晶粒背面標準圖像川與 :::面151。其甲當二者完全符合時,控制器7即驅動取 放裝置6自透明玻璃4取出待測裸晶粒並放置入第一載出裝 置16之合格裸晶粒承載盤161内。若其中有一面有瑕疫、^ :面皆有㈣’亦即沒有完全符合時,控制器7即驅動取放 裝置6自透明玻璃4取出待測裸晶粒並放置入第二載出裝置 17之瑕疵裸晶粒承載盤171内。 並且’本實施例中控制器7還具有一計數器72。而控制 器7是透過計數器72分別計數合格裸晶粒承載盤i6i、以及 瑕疲裸晶粒承載盤171之上之裸晶粒數量達-特定值時,亦 即合格裸晶粒承載盤161、或瑕疫裸晶粒承載盤m上承載 的裸晶粒已滿時,即控制第一載出裝置16、或第二載出裝 置Π將合格裸晶粒承載盤161、或瑕疫裸晶粒承載盤⑺載 ^然後再補充新的空承載盤。此外,圖中顯示有一回收 早元8 ’其主要用以回收載入裝置1中經檢測、及取放後之 空的承載盤13。 12 1376003 上述實施例僅係為了方便說明而舉例而已,本發明所 主張之權利範圍自應以申請專利範圍所述為準,而非僅限 於上述實施例。 【圖式簡單說明】 圖1係本發明一較佳實施例之整體設備示意圖。 圖2係本發明一較佳實施例之局部立體圖。 圖3係本發明一較佳實施例之局部側視示意圖。 【主要元件符號說明】 1 載入裝置 11 導引轨道 12 滑台 13 承載盤 14 第一位置 141 正面晝面 15 第二位置 151 .背面晝面 16 第一載出裝置 161 合格裸晶粒承載盤 17 第二載出裝置 171 瑕藏裸晶粒承載盤 18 第三載出裝置 19 載入區 191 夾盤器 2 裸晶粒 20 待測裸晶粒 3 正面影像擷取裝置 31 移動支架 32 攝影機 4 透明玻璃 41 特定區域 42 另一特定區域 5 月面影像檢測裝置 51 攝像鏡頭 52 輔助光源 6 取放裝置 7 控制器 13 1376003 71 記憶體 711 裸晶粒正面標準圖像 712 裸晶粒背面標準圖像 72 計數器 8 回收單元 d 特定距離class. In the present embodiment, there is additionally a Ding knife 4. f, a carrying device 18, which is used for the rearing = for different production. . For the needs of the expansion of the preparation, or can provide different (four) level 4 of the use of materials. Moreover, the towel __ _ 宁 obviously does not have a pick-and-place device 6, and can also be moved remotely in the second position, the carrier tray 13 on the slide table 12 of the 7 position 15 is selected, and the first loading device 16, the second load of the installation ^ f set 6 is between the straight drop of the glass 4 between. The pick-and-place = with 6 vacuum nozzles is used to pick up and place the bare die, which has the advantage of being able to pick and place quickly without damaging the bare die. Further, the controller 7 is electrically connected to the loading device 1, the first loading device 16, the first loading device 17, the front image capturing device 3, the back image detecting device 5, and the pick-and-place device 6, respectively. The controller 7 controls the front image capturing device 3 to respectively capture and detect the front surface 14 of the plurality of bare crystals 2 on the carrier 13 . In addition, the controller 7 controls the pick and place device 6 to take out the plurality of bare disks on the carrier η. The die 2 is such that the bare die to be tested is placed and placed over the transparent glass*. Moreover, the control Is 7 also controls the imaging lens 51 of the back image detecting device 5 to shoot from the bottom up and detect the back image of the bare die 2 to be tested. In addition, 20 1376003 controller 7 will detect the detected afterwards. The bare grain age is shifted by one of the first-loading device 16, or the second load-dissipating device 17. According to this, the control details of the controller 7 of the present embodiment are as follows. The control standard has - followed by 71 ' and the memory 71 stores - bare crystal 2, and - bare die back standard image 712. While the test is in progress, ίο 15 20 ;5 captures the front image manipulation device 3 and the back image detection device: the front picture 14 of the bare die 2 and the bare die 2 face m to be tested. Lai, according to the time of the financial analysis than the face of the bare die of the towel: like 711 with the front picture 14 and the standard image of the back of the bare die and ::: face 151. When the two are in full compliance, the controller 7 drives the pick-and-place device 6 to take out the bare die to be tested from the transparent glass 4 and place it into the qualified bare die carrier 161 of the first loading device 16. If one of the plagues has a plague, ^: the surface has (4) 'that is, when there is no complete compliance, the controller 7 drives the pick-and-place device 6 to take out the bare die to be tested from the transparent glass 4 and place it into the second loading device 17 The bare die carrier 171 is then placed. And the controller 7 also has a counter 72 in this embodiment. The controller 7 counts the qualified bare die carrier i6i and the bare die on the bare die carrier 171 by a specific value through the counter 72, that is, the qualified bare die carrier 161, Or when the bare die carried on the plaque bare die carrier m is full, that is, the first carrying device 16 or the second carrying device is controlled to pass the qualified bare die carrier 161 or the plaque bare die. The carrier tray (7) carries and then replenishes the new empty carrier tray. In addition, the figure shows a recovery tray 8' which is mainly used to recover the empty carrier tray 13 of the loading device 1 after being detected and picked up. The above-mentioned embodiments are merely examples for the convenience of the description, and the scope of the claims is intended to be limited to the above-mentioned embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic diagram of an overall apparatus in accordance with a preferred embodiment of the present invention. 2 is a partial perspective view of a preferred embodiment of the present invention. 3 is a partial side elevational view of a preferred embodiment of the present invention. [Main component symbol description] 1 Loading device 11 Guide rail 12 Slide table 13 Carrier tray 14 First position 141 Front surface 15 Second position 151. Back surface 16 First carrying device 161 Qualified bare die carrier 17 second carrying device 171 occlusion of bare die carrier 18 third carrying device 19 loading area 191 chuck 2 bare die 20 bare die to be tested 3 front image capturing device 31 moving bracket 32 camera 4 Transparent glass 41 Specific area 42 Another specific area May surface image detecting device 51 Camera lens 52 Auxiliary light source 6 Pick and place device 7 Controller 13 1376003 71 Memory 711 Bare die front standard image 712 Bare die back standard image 72 counter 8 recovery unit d specific distance

1414

Claims (1)

1376003 十、申請專利範圍: 1. 一種裸晶粒雙面檢測設備,包括: 一載入裝置’包括有一導引執道、一滑台、及一承載 盤’該滑台係滑移於該導引軌道上並可停留於—第一位 5 15 20 置、及一第二位置,該承載盤係承載於該滑台上方,該承 載盤上容置有複數個裸晶粒; 一正面影像擷取裴置,係位設於該導引軌道上方、並 對應於位在該第一位置之該滑台上的該承載盤; 一透明玻璃,係組設於該導引軌道之一側、並鄰近於 位在該第二位置之該滑台; 一背面影像檢測裝置,係組設於該透明玻璃下方,該 背面影像檢測裝置包括有一攝像鏡頭,該攝像鏡頭朝上面 向該透明玻璃; 二一取放裝置,選擇式地移動於位在該第二位置之該滑 台上的該承載盤、與該透明玻璃之間;以及 控制益,分別與該載入裝置、該正面影像擷取裝置、 該背面影像檢測裝置、及該取放裝置電性連接,該控制器 f制該正面影像操取裝置分別拍攝並檢測該承載盤上該複 I 1固Γ晶粒之正面畫面’該控制器控制該取放裝置取出該 透 該複數個裸晶粒其中之—待測裸晶粒並放置於該 上方’該控制器控制該背面影像檢測裝置之該攝 兄下在上拍攝並檢測該待測裸晶粒之背面晝面。 備,2苴中如1請專利範圍第1項所述之裸晶粒雙面檢測設 ”,〜透明玻璃包括有—特定區域,該特定區域用 15 1376003 該待測裸晶粒’該背面影像檢測裝置之該攝像鏡 頭正好對應㈣透明玻璃之該料區域下方。 ^如申請專利範圍第2項所述之裸晶粒雙面檢測設 備’其t ’該透明玻璃之該特定區域包括有—凸透鏡。 ^如申請專利範圍第2項所述之裸晶粒雙面檢測設 備,其中,該透明玻璃更包括有另__特定區域,該另 =域位於該特定區域之一側,該另一特定區域與該特定 者中至少其—包括有—凸透鏡,該另m域具 有與該特定區域不同放大倍率。 10 15 20 5. ”請專利範圍第4項所述之裸晶粒雙面檢測設 備,其中,該背面影像檢測裝置之該攝像鏡頭並可選擇式 地移行於該蚊區域下方與該另—特定區域下方之間。 6. 如申明專利範圍第〗項所述之裸晶粒雙面檢測設 備八更包括有一第一載出裝置、及至少一第二載出裝置, 該第一載出裝置上承載有一合格裸晶粒承載盤,該至少一 第-載出裝置上承載有至少一瑕疵裸晶粒承載盤。 7·如申請專利範圍第1項所述之裸晶粒雙面檢測設 備,其中,該控制器包括一記憶體,該記憶體内儲存有一 ,曰曰粒正面標準圖像、及一裸晶粒背面標準圖像’該控制 态擷取該正面影像擷取裝置傳來之該複數個裸晶粒之正面 晝面,並據以分別與該記憶體中之該裸晶粒正面標準圖像 進仃分析比對,該控制器更擷取該背面影像檢測裝置傳來 之該待測裸晶粒之背面畫面,並據以與該記憶體中之該裸 晶粒背面標準圖像進行分析比對。 16 申請專利範圍第I項所述之禊S私Μ二k 備,复Φ ^ 丨κ稞s日粒雙面檢測設 ’該背面影像檢測裝置之琴摄待# -s〆 破壤保持一特定距離。 置之該攝像鏡頭係與該透明 9.如申諳專利範圍第w所述之裸晶粒雙面檢測設 備,其中,該背面影像檢測裝置更包括有一辅助光源。 1 〇·如申請專利範圍第1項所述之裸晶粒雙面檢測設 備,其中,該取放裝置包括—真空吸嘴。1376003 X. Patent application scope: 1. A bare-die double-sided inspection device, comprising: a loading device 'including a guiding obstruction, a sliding table, and a carrying tray' The guide rail can be placed on the first position 5 15 20 and a second position, and the carrier tray is carried on the slide table, and the carrier tray accommodates a plurality of bare crystal grains; a locating device, the locating device is disposed above the guiding track and corresponding to the carrier plate located on the sliding table at the first position; a transparent glass is disposed on one side of the guiding track, and Adjacent to the sliding table located at the second position; a back image detecting device disposed under the transparent glass, the back image detecting device comprising an image capturing lens facing upwardly facing the transparent glass; a pick-and-place device selectively moving between the carrier tray on the slide table located at the second position and the transparent glass; and control benefits, respectively, with the loading device, the front image capturing device, The back image detection device And the device is electrically connected to the pick-and-place device, and the controller f is configured to respectively detect and detect a front view of the complex I 1 solid crystal die on the carrier disk. The controller controls the pick-and-place device to take out Passing through the plurality of bare dies, wherein the bare die to be tested is placed on the upper side, the controller controls the underside of the back image detecting device to photograph and detect the back surface of the bare die to be tested. surface. In the case of 2苴, please refer to the bare-die double-sided detection device described in item 1 of the patent scope. The transparent glass includes a specific area, and the specific area is 15 1376003. The bare die to be tested' The imaging lens of the detecting device corresponds exactly to the material region of the (4) transparent glass. ^The bare-die double-sided detecting device of the second aspect of the patent application, wherein the specific region of the transparent glass includes a convex lens The bare-die double-sided detecting device according to claim 2, wherein the transparent glass further includes another specific region, the another domain is located on one side of the specific region, and the other specific At least one of the region and the specific one includes a convex lens having a different magnification from the specific region. 10 15 20 5. "Please refer to the bare die double-sided detecting device described in claim 4 of the patent scope, Wherein, the imaging lens of the back image detecting device is selectively moved between the mosquito region and the lower portion of the other specific region. 6. The bare-die double-sided detecting device as described in claim </ RTI> includes a first carrying device and at least one second carrying device, wherein the first carrying device carries a qualified die The at least one first-loading device carries at least one bare-die carrier disk. 7. The bare-die double-sided inspection apparatus according to claim 1, wherein the controller comprises a memory, the memory body stores a front side standard image, and a bare die The back side standard image 'the control state captures the front side of the plurality of bare crystals transmitted from the front image capturing device, and accordingly enters the standard image of the bare crystal front in the memory respectively In the analysis comparison, the controller further captures the back image of the bare die to be tested transmitted from the back image detecting device, and compares and analyzes the standard image of the bare die on the memory. 16 申请S 私Μ二k, Φ 丨 稞 稞 稞 日 日 双面 日 日 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该distance. The image pickup lens and the transparent lens are as disclosed in the invention. The back image detecting device further includes an auxiliary light source. 1 . The bare-die double-sided detecting device according to claim 1, wherein the pick-and-place device comprises a vacuum nozzle. 1717
TW097133831A 2008-09-03 2008-09-03 Bare die dual-face detector TW201011849A (en)

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106483126B (en) * 2015-08-27 2019-12-24 京元电子股份有限公司 Semiconductor component image test device and its test equipment
JP6903268B2 (en) 2016-12-27 2021-07-14 株式会社Nsテクノロジーズ Electronic component transfer device and electronic component inspection device
JP6849468B2 (en) * 2017-02-13 2021-03-24 ファスフォードテクノロジ株式会社 Semiconductor manufacturing equipment and manufacturing method of semiconductor equipment
EP3854730B1 (en) * 2020-01-24 2024-03-20 Becton Dickinson Rowa Germany GmbH Device and method for identifying, measuring and positioning piece goods
CN112129700B (en) * 2020-09-01 2024-03-01 真贺科技(江苏)有限公司 Image detection method and device for flexible circuit board
CN112213936B (en) * 2020-09-28 2022-05-10 深圳市深科达智能装备股份有限公司 Positioning device and positioning method applied to fitting of circular product
TWI756142B (en) * 2021-06-15 2022-02-21 博磊科技股份有限公司 Substrate cutting device and operating method of substrate cutting device
CN113394139B (en) * 2021-06-25 2025-10-31 佛山缔乐视觉科技有限公司 Detection equipment for LED packaging defects
TWI780930B (en) * 2021-09-27 2022-10-11 由田新技股份有限公司 Carrier-based semiconductor inspection apparatus and semiconductor classification inspection system thereof
CN115106300A (en) * 2022-08-11 2022-09-27 深圳市标王工业设备有限公司 Chip detecting and sorting machine
CN116482851B (en) * 2023-04-23 2026-01-23 上海积塔半导体有限公司 Hot spot positioning auxiliary device and method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH083473B2 (en) * 1988-05-31 1996-01-17 松下電子工業株式会社 Appearance inspection device
JP2891825B2 (en) * 1992-07-27 1999-05-17 大日本スクリーン製造株式会社 Pattern inspection equipment
JP4203164B2 (en) * 1998-01-27 2008-12-24 大日本印刷株式会社 Metal sheet inspection method and apparatus
JP3855733B2 (en) * 2001-10-30 2006-12-13 株式会社村田製作所 Electronic component visual inspection apparatus and visual inspection method
JP2003232750A (en) * 2002-02-06 2003-08-22 Toshiba Corp Appearance inspection apparatus and method
WO2003075027A1 (en) 2002-03-07 2003-09-12 Yamaha Motor Co., Ltd. Electronic part inspection device
KR20060041454A (en) * 2004-11-09 2006-05-12 삼성전자주식회사 Chip appearance auto inspection device
JP4534025B2 (en) * 2004-11-30 2010-09-01 ルネサスエレクトロニクス株式会社 Appearance inspection apparatus and conveyance section for appearance inspection apparatus
KR100833716B1 (en) 2007-03-30 2008-05-29 (주) 인텍플러스 Semiconductor device vision inspection system

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