JP2010062508A - Double-side inspection apparatus for bare chip - Google Patents

Abstract

Provided is a double-sided inspection facility for bare chips, which can save labor and inspection time, save costs, increase work efficiency, increase inspection accuracy, and prevent damage to bare chips.
A carry-in device, a front image capture device, a transparent glass, a rear image capture device, a pickup device, and a controller are included. The front image capture device 3 captures and detects the front images 141 of the plurality of bare chips 2 on the tray 13, and then the pickup device 6 takes out the bare chips 2 to be inspected on the tray 13 and places them on the transparent glass 4. The back image capture device 5 captures and inspects the back image 151 of the bare chip 3 to be inspected from the bottom to the top, and finally classifies when the pickup device 6 carries out the bare chip 2 according to the inspection result.
[Selection] Figure 1

Description

  The present invention relates to a kind of double-sided inspection facility for bare chips, and more particularly, to an facility for inspecting the front and back surface conditions of a bare chip during a semiconductor package test.

  During semiconductor package testing, the bare chip surface inspection step prior to packaging is critical to the final quality of the product. The bare chip surface is inspected for the presence of foreign objects such as scratches, cracks, or granules or ash dust that do not originally belong to the bare chip to be inspected on the front and back surfaces. The reason is that the presence of foreign objects such as scratches and cracks on the surface or granules and ash dust affects the operation of the product, and in severe cases, its function can be completely lost.

  The well-known bare chip surface inspection step is performed by visual inspection, that is, the bare chip surface condition is completely inspected by the human naked eye. Such a method is very inefficient, takes a lot of time, and can only be inspected by a sampling method. Furthermore, advances in process technology make the bare chip size smaller and smaller, and the human eyesight range will not meet modern process requirements, and other auxiliary equipment must be relied upon.

  In addition to this, there is one more severe drawback to traditional macroscopic examinations. That is, the judgment criteria for each inspector are different, and judgment error situations are likely to occur. In addition, regarding the existing technology, it is necessary to invert the tray by a manual operation method to inspect the back surface of the bare chip. That is, the back surface inspection is performed by turning the bare chip over by the manual operation method. This method requires a considerable amount of time and the chip size becomes increasingly smaller. If the chip size is reduced to a certain size, it cannot be executed manually. If the tray is turned upside down by hand, there is a risk that the quality of the bare chip will be exceeded. For example, workers may be inadvertently scratched or foreign substances such as ash, hair, and dandruff may adhere. An error in the neglect direction may occur.

  As can be seen from the above, how to reduce the labor and time in bare chip inspection, save cost, improve work efficiency, increase the accuracy of inspection, and prevent damage to the bare chip by back inspection. However, this is an industrial problem that needs immediate resolution.

  The present invention is a kind of double-sided inspection facility for bare chips, and includes a carry-in device, a front image capture device, a transparent glass, a rear image capture device, and a controller. The carry-in device includes an introduction track, a slide, and a tray. The slide slides on the introduction track and can be stopped at the first position and the second position. The tray is stacked above the slide, and a plurality of bare chips are placed on the tray. The front image capture device is located above the introduction trajectory and corresponds to the tray on the slide in the first position.

  The transparent glass is assembled on one side of the introduction track and is in the vicinity of the slide in the second position. The rear image capture device is assembled below the transparent glass, the rear image capture device has a photographing lens, and the upward surface of the photographing lens faces the transparent glass. In addition, the pickup device selectively moves between the tray on the slide in the second position and the transparent glass. The controller is electrically connected to the carry-in device, the front image capture device, the back image capture device, and the pickup device. The controller controls the front image capture device to photograph and inspect front images of a plurality of bare chips on the tray.

  The controller controls the pickup device so that one bare chip to be inspected is taken out from the plurality of bare chips on the tray and is placed above the transparent glass. The controller also controls the taking lens of the back image capture device to take a back image of the bare chip to be inspected from below and inspect it. As a result, the present invention greatly reduces the manpower required and the time required for the inspection, thereby saving costs and increasing the work efficiency, and increasing the accuracy of the inspection without causing damage to the bare chip.

  The transparent glass of the present invention may have a first specific area, the first specific area is used for mounting a bare chip to be inspected, and a photographing lens of the rear image capture device is the transparent Corresponds below the specific area of the glass. The first specific area has a convex lens, and the convex lens enlarges the image with the convex lens in a situation where the bare chip size is very small so that accurate inspection can be performed. However, the first specific area of the present invention is not limited to the convex lens, and other transparent lenses or devices having the same effect can be used.

  Further, the transparent glass further has a second specific area, the second specific area is located on one side of the first specific area, and the second specific area and the first specific area are At least one of them has a convex lens, and the second specific area and the first specific area have different magnifications. By providing different magnification lens areas, it can be applied to many different bare chip sizes or different precision requirements.

  In addition, the photographic lens of the rear image capture device of the present invention maintains a specific distance from the transparent glass, and the photographic lens selectively moves between the lower part of the first specific area and the lower part of the second specific area. To do. That is, the photographing lens of the rear image capture device of the present invention can be moved in three axes in the lower area of the transparent glass, and can be inspected according to areas having different bare chip sizes, positions, or lens magnifications. The back image capture device of the present invention has an auxiliary light source that provides illumination to facilitate back inspection.

  Preferably, the present invention includes a first carry-out device and at least one second carry-out device. The first carry-out device places a non-defective bare chip tray, and the at least one second carry-out device places at least one defective bare chip tray. It is used to classify bare chips after inspection into good and defective products. The non-defective product is left in the non-defective bare chip tray, and the defective product is left in the defective bare chip tray. Furthermore, the pickup device of the present invention has a vacuum suction nozzle.

  In addition, the controller of the present invention may have a memory. A bare chip front standard image and a bare chip back standard image are stored in the memory. Further, the controller captures a plurality of bare chip front images sent from the front image capture device, and performs analysis comparison with the bare chip front standard images in the memory. In addition, the controller captures the back image of the bare chip sent from the back image capture device, and performs analysis comparison with the bare chip back standard image in the memory.

  The present invention greatly reduces the manpower required and the time required for inspection, thereby saving costs and increasing work efficiency, increasing the accuracy of inspection and avoiding damage to bare chips.

Please refer to FIG. 1 and FIG. 2 together. FIG. 1 is an overall facility display diagram of a preferred embodiment of a double-sided inspection facility for bare chips of the present invention, and FIG. 2 is a local three-dimensional view of a preferred embodiment of the present invention.
In the figure, a loading device 1 is shown, which includes an introduction track 11, a slide 12 and a tray 13. Among them, the slide 12 slides on the introduction track 11 and can be stopped at the first position 14 and the second position 15. In this embodiment, the introduction track 11 is a roller conveyor, but can be replaced with a slide rail or the like as necessary. The tray 13 is stacked above the slide 12, and a plurality of bare chips 2 are placed on the tray 13. In addition, the loading device 1 may further have a tray holder 191 which is illustrated, which automatically loads the tray 13, i.e. grabs the tray 13 from the loading area 19 onto the introduction track 11 by the tray holder 191.

  In addition, a front image capture device 3 is shown in the figure, which corresponds to the tray 13 on the slide 12 located above the introduction track 11 and in the first position 14. The front image capture device 3 includes a moving holder 31 and a camera 32, and the camera 32 is slidably attached to the moving holder 31. That is, in this embodiment, the camera 32 captures images one by one with respect to the front surface of a single bare chip. The camera 32 of the present invention employs a CCD.

  In the figure, a transparent glass 4 is shown, which is assembled on one side of the introduction track 11 and is located in the vicinity of the slide 12 in the second position 15. In this embodiment, the transparent glass 4 has a first specific area 41 and a second specific area 42. The first specific area 41 and the second specific area 42 are used to load the bare chip 20 to be inspected. Among them, the first specific area 41 and the second specific area 42 are convex lenses having different magnifications. The purpose of installing the convex lens in the present embodiment is to enlarge the image with the convex lens under a situation where the size of the bare chip is very small, and to perform an accurate inspection, and to perform the first specific area 41 having a different magnification. And providing the second specific area 42 so that it can be applied to many different sizes of bare chips.

  Of course, the present invention does not limit the specific area to two areas, and it is possible to provide more specific areas. In addition, the arrangement of the lenses in the first specific area 41 and the second specific area 42 can be a plane lens and a plane lens, a plane lens and a convex lens, or a convex lens and a convex lens, and the lenses are appropriately combined as necessary. It is. Furthermore, the present invention is not limited to a convex lens, and other transparent lenses or devices that can achieve the same effect can be used in the present invention.

  See also FIG. FIG. 3 is a local side view of a preferred embodiment of the present invention. The slide 12, the tray 13 and the bare chip 2 in the second position 15 are omitted in order to clearly show the arrangement relationship of the rear image capture device 5, the transparent glass 4, and other components. The rear image capture device 5 in the figure is attached below the transparent glass 4, and the rear image capture device 5 includes a photographing lens 51. The photographing lens 51 faces upward and faces the transparent glass 4, and the rear image of the bare chip. The photographic lens 51 of this embodiment employs a CCD.

  Among them, the photographing lens 51 of the rear image capture device 5 maintains a specific distance d from the transparent glass 4. The taking lens 51 is selectively movable between the lower side of the first specific area 41 and the lower side of the second specific area 42. That is, the photographing lens 51 of the rear image capture device 5 of this embodiment can be moved in three axes in the area below the transparent glass 4, and the inspection can be performed according to the size, position, or lens magnification area of the bare chip. it can. Also shown in FIG. 3 is an auxiliary light source 52 that provides illumination for rear image capture.

  In addition, the 1st carrying-out apparatus 16 and the 2nd carrying-out apparatus 17 are shown in the figure. The first carry-out device 16 places a non-defective bare chip tray 161 and the second carry-out device 17 places a defective bare chip tray 171. These are used to classify bare chips after inspection into good and defective products. In the present embodiment, in addition to this, a third carry-out device 18 is provided, which is provided for expansion preparation for different product requirements or classification of different defective product levels at a later date. Also, the pick-up device 6 is displayed in the figure, which is selectively between the tray 13 on the slide 12 at the second position 15, the first carry-out device 16, the second carry-out device 17, and the transparent glass 4. Moving. The pickup device 6 has a vacuum suction nozzle and sucks and leaves the bare chip. The advantage is that the pickup can be picked up quickly and the bare chip is not damaged.

  Further, the controller 7 is electrically connected to the carry-in device 1, the first carry-out device 16, the second carry-out device 17, the front image capture device 3, the rear image capture device 5, and the pickup device 6. The controller 7 controls the front image capture device 3 to capture the front images 141 of the plurality of bare chips 2 on the tray 13. In addition, the controller 7 controls the pickup device 6 to take out one of the bare chips 20 to be inspected from the plurality of bare chips 2 on the tray 13 and place it on the transparent glass 4. Further, the controller 7 controls the photographing lens 51 of the rear image capture device 5 to photograph and inspect the rear image 151 of the bare chip 20 to be inspected from the bottom to the top. In addition, the controller 7 moves the inspected bare chip 20 that has been inspected and places it on either the first carry-out device 16 or the second carry-out device 17.

  Thereby, the details of the control of the controller 7 of the present embodiment are as described below. The controller 7 has a memory 71, and a bare chip front standard image 711 and a bare chip rear standard image 712 are stored in the memory 71. When the inspection is executed, the controller 7 captures the front images 141 and the back images 151 of the plurality of bare chips 2 sent from the front image capture device 3 and the back image capture device 5. Thereafter, the bare chip front standard image 711 and the front image 141, and the bare chip rear standard image 712 and the rear image 151 are analyzed and compared. Among these, when both coincide completely, the controller 7 drives the pickup device 6 to take out the bare chip to be inspected from the transparent glass 4 and place it in the non-defective bare chip tray 161 of the first carry-out device 16. Of these, if one surface is scratched or both the front and back surfaces are scratched, i.e., they do not completely match, the controller 7 drives the pickup device 6 to take out the bare chip to be inspected, and the second unloading device 17 in a bare chip tray 171 of defective products.

  In the present embodiment, the controller 7 further includes a counter 72. The controller 7 uses the counter 72 to count the number of bare chips on the non-defective bare chip tray 161 and the non-defective bare chip tray 171. For example, the first carry-out device 16 or the second carry-out device 17 is controlled to carry out the non-defective product bare chip tray 161 and the defective product bare chip tray 171 and then replenish a new empty tray. In addition, a collection unit 8 is provided in the drawing, and the collection unit 8 collects the empty tray 13 in the carry-in device 1 after inspection and pickup.

It is a whole equipment display figure of a desirable example of a double-side inspection equipment for bare chips of the present invention. FIG. 3 is a local three-dimensional view of a preferred embodiment of the present invention. FIG. 2 is a local side view of a preferred embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Carry-in apparatus 11 Introduction track | orbit 12 Slide 13 Tray 14 1st position 141 Front image 15 2nd position 151 Back image 16 1st carry-out apparatus 161 Good quality bare chip tray 17 2nd carry-out apparatus 171 Defective product bare chip tray 18 3rd carry-out apparatus 19 Carry-in Area 191 Tray holder 2 Bare chip 20 Bare chip to be inspected 3 Front image capture device 31 Moving holder 32 Camera 4 Transparent glass 41 First specific area 42 Second specific area 5 Rear image capture device 51 Shooting lens 52 Auxiliary light source 6 Pickup device 7 Controller 71 Memory 711 Bare chip front standard image 712 Bare chip rear standard image 72 Counter 8 Collection unit d Specific distance

Claims (5)

In the double-sided inspection equipment for bare chips,
A loading device including an introduction track, a slide, and a tray, the slide sliding on the introduction track, and being able to stop at a first position and a second position, the tray being above the slide; The carrying-in device loaded and loaded with a plurality of bare chips on the tray;
A front image capture device, wherein the front image capture device is located above the introduction track and corresponds to the tray on the slide in the first position;
Transparent glass, assembled on one side of the introduction track, and located near the slide in the second position; and
A rear image capture device, which is assembled below the transparent glass, has a photographing lens, and the upper surface of the photographing lens faces the transparent glass;
A pick-up device that selectively moves between the tray on the slide in the second position and the transparent glass; and
A controller, electrically connected to the carry-in device, the front image capture device, the back image capture device, and the pickup device, the controller controlling the front image capture device and a plurality of bare chips on the tray The controller controls the pickup device to take out one inspected bare chip from the plurality of bare chips on the tray and place it on the transparent glass, and the controller The controller for controlling the photographic lens of the rear image capture device to inspect and inspect the rear image of the bare chip to be inspected from below to above,
A double-sided inspection facility for bare chips, characterized in that   2. The double-sided inspection equipment for bare chips according to claim 1, wherein the transparent glass has a first specific area, and the first specific area is provided for mounting the bare chip to be inspected. 2. A double-sided inspection facility for bare chips, wherein the photographing lens corresponds to the lower side of the specific area of the transparent glass.   The double-sided inspection facility for bare chips according to claim 2, wherein the first specific area of the transparent glass has a convex lens.   3. The double-sided inspection equipment for bare chips according to claim 2, wherein the transparent glass has the second specific area, the second specific area is located on one side of the first specific area, and the second specific area is the second specific area. At least one of the specific area and the first specific area has a convex lens, and the second specific area and the first specific area have different magnifications.   2. The double-sided inspection facility for bare chips according to claim 1, wherein the rear image capture device has an auxiliary light source.

Images