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TWI372451B - Chip package structure and method of making the same - Google Patents

Chip package structure and method of making the same

Info

Publication number
TWI372451B
TWI372451B TW097133720A TW97133720A TWI372451B TW I372451 B TWI372451 B TW I372451B TW 097133720 A TW097133720 A TW 097133720A TW 97133720 A TW97133720 A TW 97133720A TW I372451 B TWI372451 B TW I372451B
Authority
TW
Taiwan
Prior art keywords
making
same
package structure
chip package
chip
Prior art date
Application number
TW097133720A
Other languages
English (en)
Other versions
TW201011868A (en
Inventor
Hung Yi Lin
Kuan Jui Huang
Yen Ting Kung
She Fen Tien
Original Assignee
Touch Micro System Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Touch Micro System Tech filed Critical Touch Micro System Tech
Priority to TW097133720A priority Critical patent/TWI372451B/zh
Priority to US12/485,059 priority patent/US20090273004A1/en
Publication of TW201011868A publication Critical patent/TW201011868A/zh
Application granted granted Critical
Publication of TWI372451B publication Critical patent/TWI372451B/zh

Links

Classifications

    • H10W70/099—
    • H10W70/60—
    • H10W70/682—
    • H10W72/073—
    • H10W72/5366—
    • H10W72/874—
    • H10W90/10—
    • H10W90/734—
TW097133720A 2006-07-24 2008-09-03 Chip package structure and method of making the same TWI372451B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW097133720A TWI372451B (en) 2008-09-03 2008-09-03 Chip package structure and method of making the same
US12/485,059 US20090273004A1 (en) 2006-07-24 2009-06-16 Chip package structure and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097133720A TWI372451B (en) 2008-09-03 2008-09-03 Chip package structure and method of making the same

Publications (2)

Publication Number Publication Date
TW201011868A TW201011868A (en) 2010-03-16
TWI372451B true TWI372451B (en) 2012-09-11

Family

ID=44828773

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097133720A TWI372451B (en) 2006-07-24 2008-09-03 Chip package structure and method of making the same

Country Status (1)

Country Link
TW (1) TWI372451B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI626774B (zh) * 2016-06-13 2018-06-11 開發晶照明（廈門）有限公司 Led支架和led封裝結構

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI626774B (zh) * 2016-06-13 2018-06-11 開發晶照明（廈門）有限公司 Led支架和led封裝結構

Also Published As

Publication number Publication date
TW201011868A (en) 2010-03-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees