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TWI369390B - Method for manufacturing dicing and die-bonding film - Google Patents

Method for manufacturing dicing and die-bonding film

Info

Publication number
TWI369390B
TWI369390B TW098129119A TW98129119A TWI369390B TW I369390 B TWI369390 B TW I369390B TW 098129119 A TW098129119 A TW 098129119A TW 98129119 A TW98129119 A TW 98129119A TW I369390 B TWI369390 B TW I369390B
Authority
TW
Taiwan
Prior art keywords
die
bonding film
manufacturing dicing
dicing
manufacturing
Prior art date
Application number
TW098129119A
Other languages
English (en)
Other versions
TW201014894A (en
Inventor
Yasuhiro Amano
Takeshi Matsumura
Kouichi Inoue
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201014894A publication Critical patent/TW201014894A/zh
Application granted granted Critical
Publication of TWI369390B publication Critical patent/TWI369390B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H10P72/7402—
    • H10P72/7404—
    • H10W74/111—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10P72/7416—
    • H10W72/01336—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/07352—
    • H10W72/075—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/30—
    • H10W72/321—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W72/381—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/884—
    • H10W74/00—
    • H10W90/00—
    • H10W90/231—
    • H10W90/732—
    • H10W90/734—
    • H10W90/736—
    • H10W90/754—
    • H10W90/756—
    • H10W99/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
TW098129119A 2008-09-01 2009-08-28 Method for manufacturing dicing and die-bonding film TWI369390B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008223742A JP4801127B2 (ja) 2008-09-01 2008-09-01 ダイシング・ダイボンドフィルムの製造方法

Publications (2)

Publication Number Publication Date
TW201014894A TW201014894A (en) 2010-04-16
TWI369390B true TWI369390B (en) 2012-08-01

Family

ID=41721291

Family Applications (2)

Application Number Title Priority Date Filing Date
TW098129119A TWI369390B (en) 2008-09-01 2009-08-28 Method for manufacturing dicing and die-bonding film
TW101114556A TW201241142A (en) 2008-09-01 2009-08-28 Dicing and die-bonding film

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101114556A TW201241142A (en) 2008-09-01 2009-08-28 Dicing and die-bonding film

Country Status (5)

Country Link
US (1) US20100304092A1 (zh)
JP (1) JP4801127B2 (zh)
KR (2) KR20100065401A (zh)
TW (2) TWI369390B (zh)
WO (1) WO2010024121A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI695872B (zh) * 2015-03-30 2020-06-11 日商琳得科股份有限公司 樹脂膜形成用薄片、及樹脂膜形成用複合薄片

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011216671A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウエハの加工用テープ、その製造方法および半導体ウエハの加工方法
JP6013709B2 (ja) * 2010-06-08 2016-10-25 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
JP5534986B2 (ja) * 2010-07-09 2014-07-02 古河電気工業株式会社 ウエハ加工用テープ
JP5653675B2 (ja) * 2010-07-30 2015-01-14 古河電気工業株式会社 ウエハ加工用テープ
TW201206813A (en) * 2010-08-11 2012-02-16 Furukawa Electric Co Ltd Wafer processing tape
JP5435497B2 (ja) * 2010-08-11 2014-03-05 古河電気工業株式会社 ウエハ加工用テープ
JP2012069586A (ja) * 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法
CN102624352B (zh) * 2010-10-06 2015-12-09 日本碍子株式会社 复合基板的制造方法以及复合基板
JP5767478B2 (ja) * 2011-01-27 2015-08-19 古河電気工業株式会社 半導体ウエハ加工用テープの製造方法及び半導体ウエハ加工用テープ
WO2012115701A2 (en) * 2011-02-22 2012-08-30 Henkel Corporation Multilayered adhesive film
JP2012186360A (ja) * 2011-03-07 2012-09-27 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体素子
CN103459149B (zh) * 2011-03-28 2015-08-26 日立化成株式会社 多层树脂片、树脂片叠层体、多层树脂片固化物及其制造方法、带有金属箔的多层树脂片、以及半导体装置
JP5942261B2 (ja) * 2012-09-28 2016-06-29 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板
WO2014136836A1 (ja) * 2013-03-07 2014-09-12 住友ベークライト株式会社 接着フィルム、ダイシングシート一体型接着フィルム、バックグラインドテープ一体型接着フィルム、バックグラインドテープ兼ダイシングシート一体型接着フィルム、積層体、積層体の硬化物、および半導体装置、並び半導体装置の製造方法
JP6505362B2 (ja) * 2013-11-21 2019-04-24 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、熱硬化型ダイボンドフィルムの製造方法、及び、半導体装置の製造方法
JP2015005636A (ja) * 2013-06-21 2015-01-08 日東電工株式会社 ダイシング・ダイボンディングフィルム
JP6716263B2 (ja) * 2016-01-22 2020-07-01 株式会社ディスコ ウエーハの加工方法
JP7495776B2 (ja) * 2016-04-12 2024-06-05 日東電工株式会社 剥離ライナー付き粘着シート
JP6721398B2 (ja) * 2016-04-22 2020-07-15 日東電工株式会社 ダイシングダイボンディングフィルム、ダイシングダイボンディングテープおよび半導体装置の製造方法
WO2021005661A1 (ja) * 2019-07-05 2021-01-14 昭和電工マテリアルズ株式会社 ダイシング・ダイボンディング一体型フィルム、ダイボンディングフィルム、及び半導体装置の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961804A (en) * 1983-08-03 1990-10-09 Investment Holding Corporation Carrier film with conductive adhesive for dicing of semiconductor wafers and dicing method employing same
JP2002256239A (ja) * 2001-03-05 2002-09-11 Hitachi Chem Co Ltd 接着フィルム、それを用いた半導体装置の製造方法及び半導体装置
JP2002256238A (ja) * 2001-03-05 2002-09-11 Hitachi Chem Co Ltd 接着フィルム、それを用いた半導体装置の製造方法及び半導体装置
JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
JP4283596B2 (ja) * 2003-05-29 2009-06-24 日東電工株式会社 チップ状ワークの固定方法
EP1557880A1 (en) * 2004-01-21 2005-07-27 Nitto Denko Corporation Resin composition for encapsulating semiconductor
JP2006339236A (ja) * 2005-05-31 2006-12-14 Toyobo Co Ltd 半導体ウエハ保護用粘着テープ
JP2008124295A (ja) * 2006-11-14 2008-05-29 Toyobo Co Ltd ダイ・アタッチメントテープ及びそれを使用した半導体装置
JP2008135448A (ja) * 2006-11-27 2008-06-12 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP4430085B2 (ja) * 2007-03-01 2010-03-10 日東電工株式会社 ダイシング・ダイボンドフィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI695872B (zh) * 2015-03-30 2020-06-11 日商琳得科股份有限公司 樹脂膜形成用薄片、及樹脂膜形成用複合薄片

Also Published As

Publication number Publication date
TW201014894A (en) 2010-04-16
JP2010062205A (ja) 2010-03-18
KR20110036698A (ko) 2011-04-08
JP4801127B2 (ja) 2011-10-26
KR20100065401A (ko) 2010-06-16
US20100304092A1 (en) 2010-12-02
WO2010024121A1 (ja) 2010-03-04
TW201241142A (en) 2012-10-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees