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TWI369162B - Solder paste and printed circuit board - Google Patents

Solder paste and printed circuit board

Info

Publication number
TWI369162B
TWI369162B TW093109131A TW93109131A TWI369162B TW I369162 B TWI369162 B TW I369162B TW 093109131 A TW093109131 A TW 093109131A TW 93109131 A TW93109131 A TW 93109131A TW I369162 B TWI369162 B TW I369162B
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
solder paste
solder
paste
Prior art date
Application number
TW093109131A
Other languages
English (en)
Other versions
TW200501855A (en
Inventor
Masahiko Hirata
Toshihiko Taguchi
Masanobu Okuyama
Yoshitaka Toyoda
Original Assignee
Senju Metal Industry Co
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co, Panasonic Corp filed Critical Senju Metal Industry Co
Publication of TW200501855A publication Critical patent/TW200501855A/zh
Application granted granted Critical
Publication of TWI369162B publication Critical patent/TWI369162B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H05K3/346—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW093109131A 2003-04-01 2004-04-01 Solder paste and printed circuit board TWI369162B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003098405 2003-04-01

Publications (2)

Publication Number Publication Date
TW200501855A TW200501855A (en) 2005-01-01
TWI369162B true TWI369162B (en) 2012-07-21

Family

ID=33156671

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093109131A TWI369162B (en) 2003-04-01 2004-04-01 Solder paste and printed circuit board

Country Status (8)

Country Link
US (1) US7681777B2 (zh)
EP (1) EP1614500A4 (zh)
JP (1) JP4613823B2 (zh)
KR (1) KR101059710B1 (zh)
CN (1) CN100491053C (zh)
MY (1) MY143536A (zh)
TW (1) TWI369162B (zh)
WO (1) WO2004089573A1 (zh)

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JP3991788B2 (ja) * 2002-07-04 2007-10-17 日本電気株式会社 はんだおよびそれを用いた実装品
KR101052452B1 (ko) 2004-03-09 2011-07-28 센주긴조쿠고교 가부시키가이샤 솔더 페이스트
WO2005102594A1 (ja) * 2004-04-21 2005-11-03 Nec Corporation はんだ及びそれを使用した実装品
DE102004034035A1 (de) * 2004-07-13 2006-02-09 W.C. Heraeus Gmbh Bleifreie Lotpasten mit erhöhter Zuverlässigkeit
JP4493658B2 (ja) * 2005-05-25 2010-06-30 千住金属工業株式会社 鉛フリーソルダペースト
US20070292708A1 (en) * 2005-08-12 2007-12-20 John Pereira Solder composition
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
US20070036670A1 (en) * 2005-08-12 2007-02-15 John Pereira Solder composition
US20090197103A1 (en) * 2007-01-30 2009-08-06 Da-Yuan Shih Modification of pb-free solder alloy compositions to improve interlayer dielectric delamination in silicon devices and electromigration resistance in solder joints
US20090197114A1 (en) * 2007-01-30 2009-08-06 Da-Yuan Shih Modification of pb-free solder alloy compositions to improve interlayer dielectric delamination in silicon devices and electromigration resistance in solder joints
US7910837B2 (en) * 2007-08-10 2011-03-22 Napra Co., Ltd. Circuit board, electronic device and method for manufacturing the same
CN101549441B (zh) * 2008-04-01 2011-06-29 东莞市中实焊锡有限公司 一种无铅焊料
JP5807221B2 (ja) * 2010-06-28 2015-11-10 アユミ工業株式会社 接合構造体製造方法および加熱溶融処理方法ならびにこれらのシステム
CN102581507B (zh) * 2012-01-19 2014-03-19 广东中实金属有限公司 一种锡锌铋多元共晶无铅钎料及制备方法
KR101438897B1 (ko) * 2012-08-13 2014-09-17 현대자동차주식회사 유리용 무연솔더 조성물
JP5780365B2 (ja) 2012-08-31 2015-09-16 千住金属工業株式会社 導電性密着材料
US9520347B2 (en) 2013-05-03 2016-12-13 Honeywell International Inc. Lead frame construct for lead-free solder connections
CN103722304B (zh) * 2014-01-09 2016-12-07 北京航空航天大学 一种用于界面强化传热的铝合金界面低温扩散连接用材料
EP3107683B1 (en) 2014-02-20 2021-12-08 Honeywell International Inc. Method of forming a solder wire
US9956649B2 (en) 2014-06-24 2018-05-01 Harima Chemicals, Incorporated Solder alloy, solder paste, and electronic circuit board
CN104668810B (zh) * 2015-01-29 2016-09-07 苏州天兼新材料科技有限公司 一种新型无铅焊接材料及其助焊剂的制备方法
DE102016112390B4 (de) 2016-07-06 2021-08-12 Infineon Technologies Ag Lötpad und Verfahren zum Verbessern der Lötpadoberfläche
KR101992001B1 (ko) * 2016-11-03 2019-06-24 엘에스전선 주식회사 태양전지 모듈의 환형 와이어용 땜납 조성물 및 이로부터 형성된 땜납 도금층을 포함하는 태양전지 모듈의 환형 와이어
JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
JP7145855B2 (ja) * 2017-11-22 2022-10-03 深▲チェン▼市福英達工業技術有限公司 マイクロ／ナノ粒子強化型複合はんだ及びその調製方法
CN109732237A (zh) * 2019-01-02 2019-05-10 昆明理工大学 一种SnBiCuAgNiCe低温无铅焊料合金
US11581239B2 (en) 2019-01-18 2023-02-14 Indium Corporation Lead-free solder paste as thermal interface material
CN109943751B (zh) * 2019-05-10 2021-03-12 云南锡业集团（控股）有限责任公司研发中心 一种低温无铅焊料及其重力铸造方法
CN110064864B (zh) * 2019-05-29 2020-07-31 南京达迈科技实业有限公司 一种用于多晶硅与金属连接的钎料、采用该钎料制备的焊膏与制法及用其焊接的方法
CN110699656A (zh) * 2019-11-07 2020-01-17 昆明理工大学 Sn-Zn-Ag焊料薄膜及其制备方法
US11383330B2 (en) * 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition
CN113399859A (zh) * 2021-05-27 2021-09-17 西安理工大学 一种Sn-Zn-Cu系无铅钎料及其制备方法
CN113798725B (zh) * 2021-10-13 2022-10-04 浙江强力控股有限公司 选择性波峰焊用免焊剂无铅焊料及其制备方法
US11832386B2 (en) * 2021-12-16 2023-11-28 Dell Products L.P. Solder composition for use in solder joints of printed circuit boards
CN115595466A (zh) * 2022-10-17 2023-01-13 常州大学（Cn） 一种含Bi和In的无铅低温焊料合金及其制备工艺
KR102684541B1 (ko) * 2022-10-27 2024-07-15 단국대학교 천안캠퍼스 산학협력단 고전기전도성 합금형 솔더볼 및 이의 제조방법
CN119115299B (zh) * 2024-10-31 2025-09-23 西安理工大学 铜-铝电弧焊接用锌基焊丝及其制备方法

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US2950184A (en) * 1957-06-06 1960-08-23 Glidden Co Process for preparing powdered silversolder compositions
JPH01138292A (ja) * 1987-11-24 1989-05-31 Nippon Steel Corp コークス乾式消火設備の集塵コークス紛処理方法
DE69524912T2 (de) * 1994-09-30 2002-08-22 AT & T CORP., NEW YORK Bleifreie Legierungen zum Weichlöten
WO1997012719A1 (en) * 1995-09-29 1997-04-10 Matsushita Electric Industrial Co., Ltd. Lead-free solder
JPH0994687A (ja) * 1995-09-29 1997-04-08 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JPH09174278A (ja) * 1995-12-27 1997-07-08 Hitachi Ltd 無鉛はんだ合金およびそれを用いた電子回路装置
JPH09277082A (ja) * 1996-04-17 1997-10-28 Senju Metal Ind Co Ltd ソルダペースト
JP3776505B2 (ja) * 1996-05-02 2006-05-17 松下電器産業株式会社 はんだ接合
JPH10249579A (ja) * 1997-03-11 1998-09-22 Sony Corp はんだ材料
US5928404A (en) 1997-03-28 1999-07-27 Ford Motor Company Electrical solder and method of manufacturing
JPH11138292A (ja) * 1997-11-10 1999-05-25 Showa Denko Kk 無鉛ソルダペースト
US20010042779A1 (en) * 2000-02-08 2001-11-22 Hitoshi Amita Solder paste
JP4073183B2 (ja) * 2001-08-01 2008-04-09 株式会社日立製作所 Ｐｂフリーはんだを用いた混載実装方法及び実装品
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JP2004017093A (ja) * 2002-06-17 2004-01-22 Toshiba Corp 鉛フリーはんだ合金、及びこれを用いた鉛フリーはんだペースト
JP3991788B2 (ja) * 2002-07-04 2007-10-17 日本電気株式会社 はんだおよびそれを用いた実装品

Also Published As

Publication number Publication date
KR20050111750A (ko) 2005-11-28
TW200501855A (en) 2005-01-01
US7681777B2 (en) 2010-03-23
EP1614500A1 (en) 2006-01-11
JPWO2004089573A1 (ja) 2006-07-06
CN100491053C (zh) 2009-05-27
US20060261131A1 (en) 2006-11-23
KR101059710B1 (ko) 2011-08-29
WO2004089573A1 (ja) 2004-10-21
EP1614500A4 (en) 2006-05-10
CN1764515A (zh) 2006-04-26
MY143536A (en) 2011-05-31
JP4613823B2 (ja) 2011-01-19

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Legal Events

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