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TWI367575B - - Google Patents

Info

Publication number
TWI367575B
TWI367575B TW096135319A TW96135319A TWI367575B TW I367575 B TWI367575 B TW I367575B TW 096135319 A TW096135319 A TW 096135319A TW 96135319 A TW96135319 A TW 96135319A TW I367575 B TWI367575 B TW I367575B
Authority
TW
Taiwan
Application number
TW096135319A
Other versions
TW200830590A (en
Inventor
Noboru Imai
Shuichi Nakazawa
Aki Suzuki
Original Assignee
Hitachi Cable
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable filed Critical Hitachi Cable
Publication of TW200830590A publication Critical patent/TW200830590A/zh
Application granted granted Critical
Publication of TWI367575B publication Critical patent/TWI367575B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H10W72/07251—
    • H10W72/20—
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W90/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW096135319A 2006-10-31 2007-09-21 LED module TW200830590A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006295294 2006-10-31
JP2007154236A JP2008135694A (ja) 2006-10-31 2007-06-11 Ｌｅｄモジュール

Publications (2)

Publication Number Publication Date
TW200830590A TW200830590A (en) 2008-07-16
TWI367575B true TWI367575B (zh) 2012-07-01

Family

ID=39329870

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096135319A TW200830590A (en) 2006-10-31 2007-09-21 LED module

Country Status (3)

Country Link
US (1) US7675755B2 (zh)
JP (1) JP2008135694A (zh)
TW (1) TW200830590A (zh)

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DE102008011809A1 (de) * 2007-12-20 2009-06-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US20090206243A1 (en) * 2008-02-11 2009-08-20 Texmag Gmbh Vertriebsgesellschaft Image Capturing System and Method for the Analysis of Image Data
TWI415528B (zh) * 2008-04-24 2013-11-11 Kinik Co 高導熱性電路載板及其製作方法
TW201017922A (en) * 2008-10-23 2010-05-01 Everlight Electronics Co Ltd Light emitting diode package
JP5363789B2 (ja) * 2008-11-18 2013-12-11 スタンレー電気株式会社 光半導体装置
US8101962B2 (en) * 2009-10-06 2012-01-24 Kuang Hong Precision Co., Ltd. Carrying structure of semiconductor
JP5526876B2 (ja) * 2010-03-09 2014-06-18 東京エレクトロン株式会社 加熱装置及びアニール装置
EP2561265A4 (en) * 2010-04-21 2015-03-11 Cooper Technologies Co REMOVABLE LED PLATE ARCHITECTURE
TW201235609A (en) 2010-07-13 2012-09-01 Koninkl Philips Electronics Nv Low cost mounting of LEDs in TL-retrofit tubes
US9698563B2 (en) 2010-11-03 2017-07-04 3M Innovative Properties Company Flexible LED device and method of making
WO2012061182A1 (en) * 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device with wire bond free die
KR20130141559A (ko) 2010-11-03 2013-12-26 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열 관리를 위한 가요성 ｌｅｄ 디바이스 및 제조 방법
JP2012142410A (ja) 2010-12-28 2012-07-26 Rohm Co Ltd 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置
WO2012123840A1 (en) * 2011-03-14 2012-09-20 Koninklijke Philips Electronics N.V. Led having vertical contacts redistributed for flip chip mounting
US9236547B2 (en) 2011-08-17 2016-01-12 3M Innovative Properties Company Two part flexible light emitting semiconductor device
CN107425103B (zh) * 2011-08-22 2019-12-27 Lg伊诺特有限公司 发光器件封装件和光装置
US9066443B2 (en) 2011-09-13 2015-06-23 General Electric Company Overlay circuit structure for interconnecting light emitting semiconductors
TW201324736A (zh) * 2011-12-08 2013-06-16 新世紀光電股份有限公司 發光裝置
CN103915556B (zh) * 2012-02-27 2016-06-29 俞国宏 一种使用陶瓷散热的高功率led灯具
CN103943747B (zh) * 2012-02-27 2015-12-30 义乌市运拓光电科技有限公司 一种使用陶瓷散热的高功率led灯具
CN103943745B (zh) * 2012-02-27 2016-08-24 俞国宏 一种使用陶瓷散热的高功率led灯具
JP6029912B2 (ja) * 2012-09-25 2016-11-24 スタンレー電気株式会社 半導体発光素子
US20140091647A1 (en) * 2012-09-28 2014-04-03 General Electric Company Thermoplastic copolymer insulated coil
CN102927483A (zh) * 2012-11-20 2013-02-13 田茂福 一体化倒装型led照明组件
DE102013100470A1 (de) * 2013-01-17 2014-07-17 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
US9293196B2 (en) 2013-03-15 2016-03-22 Micron Technology, Inc. Memory cells, memory systems, and memory programming methods
US20140321109A1 (en) * 2013-04-27 2014-10-30 GEM Weltronics TWN Corporation Light emitting diode (led) light tube
JP2013229639A (ja) * 2013-08-13 2013-11-07 Nec Lighting Ltd 発光装置及び発光装置の製造方法
US9419189B1 (en) 2013-11-04 2016-08-16 Soraa, Inc. Small LED source with high brightness and high efficiency
EP3117267B1 (en) * 2014-03-11 2018-05-02 Osram Sylvania Inc. Light converter assemblies with enhanced heat dissipation
JP6529223B2 (ja) * 2014-06-30 2019-06-12 晶元光電股▲ふん▼有限公司Ｅｐｉｓｔａｒ Ｃｏｒｐｏｒａｔｉｏｎ 光電部品
JP6519135B2 (ja) 2014-09-26 2019-05-29 日亜化学工業株式会社 発光装置及び発光装置用基板
JP6516212B2 (ja) * 2014-11-27 2019-05-22 パナソニックＩｐマネジメント株式会社 基板装置および電子機器
JP6519163B2 (ja) * 2014-12-05 2019-05-29 市光工業株式会社 光源装置、この光源装置を備えた車両用灯具及びその光源装置の製造方法
JP6519549B2 (ja) * 2016-08-02 2019-05-29 日亜化学工業株式会社 発光装置
JP6541629B2 (ja) * 2016-08-02 2019-07-10 ゼネラル・エレクトリック・カンパニイ 発光半導体を相互接続するためのオーバーレイ回路構造
TWI620352B (zh) * 2017-01-20 2018-04-01 大光能源科技有限公司 覆晶發光二極體及其製造方法
US10797027B2 (en) 2017-12-05 2020-10-06 Seoul Semiconductor Co., Ltd. Displaying apparatus having light emitting device, method of manufacturing the same and method of transferring light emitting device
WO2020054592A1 (ja) * 2018-09-13 2020-03-19 パナソニックＩｐマネジメント株式会社 半導体発光素子及び半導体発光装置
JP6843916B2 (ja) * 2019-05-14 2021-03-17 晶元光電股▲ふん▼有限公司Ｅｐｉｓｔａｒ Ｃｏｒｐｏｒａｔｉｏｎ 光電部品
EP3905326B1 (en) * 2020-04-28 2023-01-04 Nichia Corporation Light-emitting device
JP7223046B2 (ja) * 2021-02-24 2023-02-15 晶元光電股▲ふん▼有限公司 光電部品

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105597A (ja) * 1988-10-14 1990-04-18 Nec Corp 印刷配線板およびその製造方法
JPH10270760A (ja) * 1997-03-27 1998-10-09 Sharp Corp 発光ダイオード用成型樹脂の選定方法およびそれを用いた発光ダイオード
JP3531475B2 (ja) 1998-05-22 2004-05-31 日亜化学工業株式会社 フリップチップ型光半導体素子
WO2000044041A1 (fr) * 1999-01-22 2000-07-27 Hitachi, Ltd. Circuit integre a semi-conducteur et fabrication de ce dernier
JP2000260819A (ja) * 1999-03-10 2000-09-22 Toshiba Corp 半導体装置の製造方法
JP4122784B2 (ja) * 2001-09-19 2008-07-23 松下電工株式会社 発光装置
JP4045767B2 (ja) 2001-09-28 2008-02-13 日亜化学工業株式会社 半導体発光装置
US20040120151A1 (en) * 2002-12-20 2004-06-24 Cao Group, Inc. Forensic light using semiconductor light source
JP2006086139A (ja) 2003-07-07 2006-03-30 Toyoda Gosei Co Ltd 発光装置
JP4255367B2 (ja) * 2003-12-04 2009-04-15 デンカＡｇｓｐ株式会社 発光素子搭載用基板及びその製造方法

Also Published As

Publication number Publication date
TW200830590A (en) 2008-07-16
US20080101071A1 (en) 2008-05-01
JP2008135694A (ja) 2008-06-12
US7675755B2 (en) 2010-03-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees