TWI366291B - Semiconductor light-emitting device having stacked transparent electrodes - Google Patents
Semiconductor light-emitting device having stacked transparent electrodesInfo
- Publication number
- TWI366291B TWI366291B TW096111705A TW96111705A TWI366291B TW I366291 B TWI366291 B TW I366291B TW 096111705 A TW096111705 A TW 096111705A TW 96111705 A TW96111705 A TW 96111705A TW I366291 B TWI366291 B TW I366291B
- Authority
- TW
- Taiwan
- Prior art keywords
- emitting device
- semiconductor light
- transparent electrodes
- stacked transparent
- stacked
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096111705A TWI366291B (en) | 2007-03-30 | 2007-03-30 | Semiconductor light-emitting device having stacked transparent electrodes |
| KR1020080028735A KR101013506B1 (ko) | 2007-03-30 | 2008-03-28 | 적층 구조의 투명 전극을 갖는 반도체 발광 장치 |
| JP2008085554A JP2008258615A (ja) | 2007-03-30 | 2008-03-28 | スタック型透明電極を有する半導体発光装置 |
| DE102008016074.1A DE102008016074B4 (de) | 2007-03-30 | 2008-03-28 | Licht emittierendes Halbleiterbauteil mit transparenten Mehrschichtelektroden |
| US12/078,375 US8293382B2 (en) | 2007-03-30 | 2008-03-31 | Semiconductor light-emitting device having stacked transparent electrodes |
| US13/623,315 US20130020609A1 (en) | 2007-03-30 | 2012-09-20 | Semiconductor light-emitting device having stacked transparent electrodes |
| JP2014081406A JP5815788B2 (ja) | 2007-03-30 | 2014-04-10 | スタック型透明電極を有する半導体発光装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096111705A TWI366291B (en) | 2007-03-30 | 2007-03-30 | Semiconductor light-emitting device having stacked transparent electrodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200840089A TW200840089A (en) | 2008-10-01 |
| TWI366291B true TWI366291B (en) | 2012-06-11 |
Family
ID=39744428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096111705A TWI366291B (en) | 2007-03-30 | 2007-03-30 | Semiconductor light-emitting device having stacked transparent electrodes |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8293382B2 (zh) |
| JP (2) | JP2008258615A (zh) |
| KR (1) | KR101013506B1 (zh) |
| DE (1) | DE102008016074B4 (zh) |
| TW (1) | TWI366291B (zh) |
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| US9508902B2 (en) | 2005-02-21 | 2016-11-29 | Epistar Corporation | Optoelectronic semiconductor device |
| TWI376817B (en) * | 2007-11-23 | 2012-11-11 | Epistar Corp | Light emitting device, light source apparatus and backlight module |
| DE102008051048A1 (de) | 2008-10-09 | 2010-04-15 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper |
| JP5276959B2 (ja) | 2008-11-19 | 2013-08-28 | 昭和電工株式会社 | 発光ダイオード及びその製造方法、並びにランプ |
| JP5428684B2 (ja) * | 2009-09-11 | 2014-02-26 | 豊田合成株式会社 | 半導体発光素子 |
| CN102024884B (zh) * | 2009-09-18 | 2013-03-06 | 晶元光电股份有限公司 | 光电半导体装置 |
| TWD139107S1 (zh) * | 2010-02-10 | 2011-02-21 | 晶元光電股份有限公司 | 發光二極體陣列 |
| US9236532B2 (en) | 2009-12-14 | 2016-01-12 | Seoul Viosys Co., Ltd. | Light emitting diode having electrode pads |
| KR101055768B1 (ko) * | 2009-12-14 | 2011-08-11 | 서울옵토디바이스주식회사 | 전극패드들을 갖는 발광 다이오드 |
| JP5506417B2 (ja) * | 2010-01-15 | 2014-05-28 | スタンレー電気株式会社 | フェイスアップ型光半導体装置 |
| TWI425669B (zh) * | 2010-05-21 | 2014-02-01 | 榮創能源科技股份有限公司 | 發光二極體 |
| KR101125416B1 (ko) * | 2010-05-25 | 2012-03-27 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
| US9000469B2 (en) | 2010-12-08 | 2015-04-07 | Nichia Corporation | Nitride group semiconductor light emitting device |
| US8592847B2 (en) | 2011-04-15 | 2013-11-26 | Epistar Corporation | Light-emitting device |
| JP2014053458A (ja) * | 2012-09-07 | 2014-03-20 | Sharp Corp | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| US8796693B2 (en) * | 2012-12-26 | 2014-08-05 | Seoul Semiconductor Co., Ltd. | Successive ionic layer adsorption and reaction process for depositing epitaxial ZnO on III-nitride-based light emitting diode and light emitting diode including epitaxial ZnO |
| KR102091831B1 (ko) * | 2013-01-08 | 2020-03-20 | 서울반도체 주식회사 | 발광 다이오드 및 그 제조방법 |
| JP2016518703A (ja) * | 2013-03-15 | 2016-06-23 | グロ アーベーGlo Ab | 2ステップの透明導電膜の堆積方法、及び、GaNナノワイヤデバイスの製造方法 |
| JP6400281B2 (ja) * | 2013-09-12 | 2018-10-03 | 晶元光電股▲ふん▼有限公司Epistar Corporation | 複数の発光構造を有する発光素子 |
| USD733079S1 (en) * | 2014-04-30 | 2015-06-30 | Epistar Corporation | Light-emitting diode device |
| KR20160027730A (ko) * | 2014-09-02 | 2016-03-10 | 서울바이오시스 주식회사 | 발광 다이오드 |
| JP6617401B2 (ja) * | 2014-09-30 | 2019-12-11 | 日亜化学工業株式会社 | 半導体発光素子 |
| USD773410S1 (en) * | 2014-10-24 | 2016-12-06 | Epistar Corporation | Light-emitting diode array |
| KR101895227B1 (ko) * | 2016-12-22 | 2018-09-07 | 주식회사 세미콘라이트 | 반도체 발광소자 |
| JP6848485B2 (ja) * | 2017-01-31 | 2021-03-24 | 日亜化学工業株式会社 | 発光素子の製造方法 |
| TWI699904B (zh) * | 2017-07-31 | 2020-07-21 | 晶元光電股份有限公司 | 發光元件 |
| TWI662717B (zh) * | 2017-07-31 | 2019-06-11 | 晶元光電股份有限公司 | 發光元件 |
| TWI710841B (zh) * | 2019-09-24 | 2020-11-21 | 行政院原子能委員會核能研究所 | 電致變色裝置及其製備方法 |
| CN114914342B (zh) * | 2021-02-09 | 2025-07-25 | 隆达电子股份有限公司 | 发光二极管结构 |
| CN113809213B (zh) * | 2021-07-28 | 2025-03-28 | 京东方华灿光电(苏州)有限公司 | 降低电压的发光二极管芯片及其制备方法 |
| CN116978999B (zh) * | 2023-09-22 | 2024-01-02 | 南昌凯捷半导体科技有限公司 | 一种电流限域Micro-LED芯片及其制作方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE19517697A1 (de) * | 1995-05-13 | 1996-11-14 | Telefunken Microelectron | Strahlungsemittierende Diode |
| JPH0936431A (ja) * | 1995-07-13 | 1997-02-07 | Toshiba Corp | 半導体発光素子 |
| KR100293467B1 (ko) | 1998-06-12 | 2001-07-12 | 구자홍 | 청색발광소자및그제조방법 |
| JP2001237461A (ja) * | 2000-02-22 | 2001-08-31 | Toshiba Corp | 半導体発光素子 |
| JP3697609B2 (ja) * | 2001-05-23 | 2005-09-21 | 日立電線株式会社 | 半導体発光素子 |
| JP2004047504A (ja) * | 2002-07-08 | 2004-02-12 | Korai Kagi Kofun Yugenkoshi | 発光効率を高めた発光ダイオード |
| JP2004047662A (ja) * | 2002-07-11 | 2004-02-12 | Rohm Co Ltd | 半導体発光素子 |
| TW200414556A (en) * | 2003-01-17 | 2004-08-01 | Epitech Corp Ltd | Light emitting diode having distributed electrodes |
| US6958494B2 (en) * | 2003-08-14 | 2005-10-25 | Dicon Fiberoptics, Inc. | Light emitting diodes with current spreading layer |
| CN100472819C (zh) | 2003-09-26 | 2009-03-25 | 晶元光电股份有限公司 | 具有复合导电层的发光元件 |
| JP4449405B2 (ja) * | 2003-10-20 | 2010-04-14 | 日亜化学工業株式会社 | 窒化物半導体発光素子およびその製造方法 |
| JP4507594B2 (ja) * | 2003-12-26 | 2010-07-21 | 日亜化学工業株式会社 | 半導体発光素子 |
| US20050167681A1 (en) * | 2004-02-04 | 2005-08-04 | Samsung Electronics Co., Ltd. | Electrode layer, light emitting device including the same, and method of forming the electrode layer |
| JP2005260150A (ja) * | 2004-03-15 | 2005-09-22 | Sanyo Electric Co Ltd | 光起電力装置及びその製造方法 |
| US7615798B2 (en) | 2004-03-29 | 2009-11-10 | Nichia Corporation | Semiconductor light emitting device having an electrode made of a conductive oxide |
| JP4977957B2 (ja) * | 2004-03-29 | 2012-07-18 | 日亜化学工業株式会社 | 半導体発光素子 |
| DE102004025610A1 (de) | 2004-04-30 | 2005-11-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit mehreren Stromaufweitungsschichten und Verfahren zu dessen Herstellung |
| JP2006080426A (ja) | 2004-09-13 | 2006-03-23 | Sharp Corp | 発光ダイオード |
| JP2006120927A (ja) * | 2004-10-22 | 2006-05-11 | Sharp Corp | 発光ダイオード及びその製造方法 |
| JP2006179618A (ja) | 2004-12-21 | 2006-07-06 | Fujikura Ltd | 半導体発光素子およびその製造方法 |
| KR100665116B1 (ko) | 2005-01-27 | 2007-01-09 | 삼성전기주식회사 | Esd 보호용 led를 구비한 질화갈륨계 발광 소자 및그 제조 방법 |
| KR100983830B1 (ko) | 2005-02-05 | 2010-09-27 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
| TWI246210B (en) * | 2005-04-28 | 2005-12-21 | Epitech Corp Ltd | Lateral current blocking light emitting diode and method for manufacturing the same |
| KR100878433B1 (ko) | 2005-05-18 | 2009-01-13 | 삼성전기주식회사 | 발광소자의 오믹컨택층 제조방법 및 이를 이용한발광소자의 제조방법 |
| JP5138873B2 (ja) * | 2005-05-19 | 2013-02-06 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| KR100703091B1 (ko) | 2005-09-08 | 2007-04-06 | 삼성전기주식회사 | 질화물 반도체 발광 소자 및 그 제조 방법 |
| DE102006057747B4 (de) * | 2006-09-27 | 2015-10-15 | Osram Opto Semiconductors Gmbh | Halbleiterkörper und Halbleiterchip mit einem Halbleiterkörper |
-
2007
- 2007-03-30 TW TW096111705A patent/TWI366291B/zh active
-
2008
- 2008-03-28 DE DE102008016074.1A patent/DE102008016074B4/de active Active
- 2008-03-28 JP JP2008085554A patent/JP2008258615A/ja active Pending
- 2008-03-28 KR KR1020080028735A patent/KR101013506B1/ko active Active
- 2008-03-31 US US12/078,375 patent/US8293382B2/en active Active
-
2012
- 2012-09-20 US US13/623,315 patent/US20130020609A1/en not_active Abandoned
-
2014
- 2014-04-10 JP JP2014081406A patent/JP5815788B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008016074A1 (de) | 2008-10-16 |
| US20130020609A1 (en) | 2013-01-24 |
| KR20080089234A (ko) | 2008-10-06 |
| KR101013506B1 (ko) | 2011-02-10 |
| JP2014131087A (ja) | 2014-07-10 |
| JP2008258615A (ja) | 2008-10-23 |
| DE102008016074B4 (de) | 2023-03-30 |
| US20080241526A1 (en) | 2008-10-02 |
| JP5815788B2 (ja) | 2015-11-17 |
| TW200840089A (en) | 2008-10-01 |
| US8293382B2 (en) | 2012-10-23 |
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