1363222 95284 21300twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種顯示裝置及其光源模組，且特別 是有關於一種液晶顯示裝置及其側邊入光式背光模組。 【先前技術】 隨著現代視訊技術的進步’液晶顯示器（liquid cryStai display，LCD)已被大量地使用於手機(m〇bne phone)、筆記 型電腦（notebook personal computer)、個人電腦(personal comPuter，PC)及個人數位助理(personal digital assistant, PDA)等消費性電子產品的顯示螢幕上。然而，由於液晶 顯示器之液晶顯示面板(LCD panel)本身並不具有發光的 功能’因此需要於液晶顯示面板下方配置背光模組 (backlight module)以提供液晶顯示面板所需要之光源，進 而使液晶顯示面板達到顯示的效果。 圖1為習知之一種側邊入光式背光模組(Side_type backlightmodule)的剖面示意圖。請參考圖1，習知之側邊 入光式背光模組100包括一導光板(light guiding plate) 110、·~~金屬框架結構120、一金屬怒印刷電路板(metal core printed circuit board, MCPCB) 130、一發光元件（light emitting element) 140 以及一散熱墊(thermalpad) 150。導光 板110具有一第一表面112、一第二表面114與連接第一 表面112與第二表面114的入光面116’其中第一表面i 12 為出光面。金屬框架結構120用以承載導光板11〇並暴露 6 1363222 95284 21300twf.doc/n 出第一表面112。金屬框架結構120包括一侧板122及一 背板124。侧板122位於入光面116旁，而背板124則位 • 於第二表面114下方，其中側板122與背板124互相連接。 -- 金屬芯印刷電路板130貼附於側板122上，且位於側板122 與入光面116之間，其中金屬芯印刷電路板130與側板122 之間有一散熱墊150，散熱墊150以其黏性將金屬芯印刷 電路板130黏著於側板122上。發光元件140配置於金屬 % 芯印刷電路板130上且與金屬芯印刷電路板13〇電性連 接，並位於金屬芯印刷電路板130與入光面116之間。 習知之側邊入光式背光模組1〇〇採用散熱墊15〇將金 屬芯印刷電路板13〇黏著於側板丨22，但卻容易因金屬芯 印刷電路板130的平整度不佳而無法平整地貼附於側板 =2上。如此一來，發光元件14〇所產生的熱會無法有效 率地經由金屬芯印刷電路板13〇及散熱墊15〇而傳導到金 屬框架結構120上。因此，習知之側邊入光式背光模組1〇〇 鲁 有散熱效率不佳的缺點，如此一來，會容易使得發光件 過熱而影響其工作效率及壽命。 【發明内容】 本發明之目的是提供一種侧邊入光式背光模組，以解 、、驾知背光模組散熱效率不佳的問題。 本發明之另一目的是提供一種側邊入光式背光模 '、且，可使其電路板平整地貼附於其框架結構上。 本發明的又-目的是提供—種液晶顯示裝置，其具有 1363222 95284 21300twf.doc/n 上述側邊入光式背光模組，以解決習知 不佳的問題。 取…双午 本發明的再一目的是提供一種液晶顯示裝置，可使其 'i邊入光式θ光模組之電路板平整地貼附於框架結構上。 北丄ί達上述或是其他目的，本發明提出一種側邊入光式 二組1其包括—導光板、—框架結構、—電路板以及 發光凡件，射㈣結構包括—上板、 板;2板具有一第一表面、一第二表面與連接第-'第 一入光面，而第一表面為出光面。框架結構用以 tif光板並暴露出第一表面。上板位於第一表面旁，且 上板朝下的表面具有—第—滑執(sliding raii)。下板位 -表面下方，且下板朝上的表面具有一第二滑軌，並中： 與第一滑軌相對。側板連接上板與下板，且位於人 置於條、第—滑似及第二之間， 電路招it入光面之間。發光元件配置於電路板上且與 电板包性連接，並位於電路板與入光面之間。 更勺之—實施财，上述之側紅光式背光模組 —ί-鎖t構件，側板具有一第一鎖固孔且電路板具有 將電路板鎖固於側板上。 孔，、第-鎖固孔而 ^本發明之—實施例中，上述之第—滑轨包括一第一 ! 生執道，第一彈性轨道具有一連接段、— 接於上板，彎折段連接於連接段與自： 又之間，自由段與側板的距離小於連接段與側板的距離， 8 1363222 95284 21300twf.doc/n 且自由段適於抵住電路板。 在本發明之-實施例中，上述之第一滑執更包括一第 —直條轨道，第一直條執道接續於自由段之後，且第一直 條執道與側板的間距大於或等於電路板的厚度。 在本發明之一實施例中’上述之第二滑執包括一第二 彈性軌道，第二彈性軌道具有一連接段、一彎折段以及一 自由段，連接段連接於下板，彎折段連接於連接段與自由 段之間，自由段與側板的距離小於連接段與側板的距離， 且自由段適於抵住電路板。 在本發明之一實施例中，上述之第二滑軌更包括一第 二直條執道，第二直條軌道接續於自由段之後，且第二直 條軌道與側板的間距大於或等於電路板的厚度。 在本發明之一實施例中，上述之電路板靠近上板及下 板之兩側各具有一朝向導光板彎曲的彎曲邊緣。 在本發明之一實施例中，上述之上板例如為一膠框。 在本發明之一實施例中，上述之侧板以及下板之材質 包括金屬。 、 一在本發明之一實施例中，上述之發光元件例如為發光 —極體(light emitting diode, LED)。 在本發明之一實施例中，上述之電路板例如為金屬芯 印刷電路板。 為達上述或是其他目的，本發明更提出一種側邊入光 式月光模組，其包括一導光板、一框架結構、一電路板、 一夾片以及一發光元件’其中框架結構包括一下板以及一 9 1363222 95284 21300twf.doc/n T板。導光扳具有-第—表面、—第二表面與連接第一、 第二表面的-入光面，而第一表面為出光面。框架結構用 • 以承載導光板並暴露出第一表面。下板位於第二表面下 • I ’而做連接下板隸於人光面^。電路板配置於側板 上’且位於侧板與入光面之間。夹片用以夹住電路板與侧 板。發光元件配置於電路板上並位於電路板與入光面之 間’且與電路板電性連接。 在本發明之—實施例中’上述之下板鄰近側板處具有 一女裝孔，且電路板靠近下板的邊緣具有一與安裝孔對應 的凸起部，凸起部插置於安裝孔十。 〜 在本發明之一實施例中，上述之框架結構更包括一上 板’連接該侧板’並位於該第一表面旁。 在本發明之一實施例中，上述之上板例如是一膠框。 在本發明之一實施例中，上述之上板具有一貫孔，夾 片適於從貫孔置入而夾住電路板與側板。 ' 在本發明之一實施例中，上述之側邊入光式背光模組 • 的上板朝下的表面可具有一第一滑執，而下板朝上的表面 可具有一第二滑軌。其中第一滑軌與第二滑轨相對，且電 路板配置於側板與第一滑執以及第二滑執之間。 在本發明之一實施例中，上述之側板以及下板之材質 包括金屬。 在本發明之一實施例中，上述之發光元件例如是發光 二極體。 在本發明之一實施例中，上述之電路板例如是金屬芯 1363222 95284 21300twf.d〇c/n 印刷電路板。 為達上述或是其他目的，本發明更提出一種液晶顯示 • 裝置，其包括一液晶顯示面板以及上述之兩種側邊入光式 ▲ 背光模組之任一種，此背光模組配置於液晶顯示面板下方。 在本發明之液晶顯示器及其側邊入光式背光模組 中，是採用滑執或夹片來使電路板平整地貼附於框架結構 的側板上，故能使發光元件所產生的熱經由電路板而有效 率地傳導至框架結構上。因此，本發明能改善習知之側邊 入光式背光模組散熱效率不佳的缺點。 ‘為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 ' ° 【實施方式】 ，2A為本發明一實施例之側邊入光式背光模組的剖 面不意圖。請參考圖2A，側邊入光式背光模組2〇〇a包括 # 一導光板210、一框架結構22〇、一電路板230以及至少一 發光元件240。導光板210具有一第一表面212、一第二表 面214以及至少一連接第一表面212與第二表面214的入 光面216其中第一表面212為出光面。框架結構220用 以承載導光板210並暴露出第一表面212。框架結構220 包括一上板222、一下板224以及一側板226。上板222 位於第一表面212旁，且上板222朝下的表面具有一第一 滑軌222a。上板222例如為一膠框。下板224位於第二表 1363222 95284 21300twf.doc/n 面214下方，且下板224朝上的表面具有一第二滑執 224a，其中第二滑轨224a與第一滑轨222a相對。第一滑 軌222a例如是由上板222 一體成形，或由其他適當方式形 成。第二滑執224a例如由形成下板224的原始板件經由開 孔折彎而形成’或由其他適當方式形成。側板226連接上 板222與下板224，且位於入光面216旁。下板224與側 板226的材質包括金屬。電路板230配置於側板226與第 一滑轨222a以及第二滑執224a之間，且位於側板226與 入光面216之間。電路板230例如是金屬芯印刷電路板。 此外’電路板230在組裝時可由垂直圖面的方向沿著第一 滑軌222a與第二滑轨224a滑入框架結構220中。發光元 件240配置於電路板230上並與電路板230電性連接，且 發光元件240位於電路板230與入光面216之間。發光元 件240例如是發光二極體。 側邊入光式背光模組200a因具有第一滑執222a以及 第二滑轨224a，故能將電路板230夾在側板226與第一滑 執222a以及第二滑軌224a之間，使電路板230平整地貼 附於側板226上。因此，本實施例能使發光元件240所產 生的熱經由電路板230而有效率地傳導至框架結構220 上。此外，由於本實施例之側邊入光式背光模組200a中電 路板230的組裝採抽取式設計，因此可方便更換組件，並 減少重工的時間與成本。 圖2B為本發明另一實施例之侧邊入光式背光模組之 剖面示意圖。請參考圖2A與圖2B，側邊入光式背光模組 12 1363222 95284 21300twf.doc/n 200b與側邊入光式背光模組2〇〇a大致相同，其差異如下 所述。側邊入光式背光模組2〇〇b更包括—鎖固構件250， 而框架結構220’的側板226,更具有一第一鎖固孔226a，且 其電路板230’更具有一第二鎖固孔232。鎖固構件25〇穿 過弟一鎖固孔226a與弟二鎖固孔232以將電路板230,鎖 固於側板226’上。如此一來，可進一步轉保電路板23〇, 平整地貼附於侧板226’上。 圖2C為本發明又一實施例之侧邊入光式背光模組之 剖面示意圖’而圖2D為圖2C中沿A-A剖面線且未安裝 電路板的剖面示意圖。請參考圖2A、圖2C及圖2D，側 邊入光式背光模組200c與側邊入光式背光模組2〇〇a大致 相同’其差異處在於兩者之第一滑軌222a、222a，或第二滑 軌224a、224a’的設計不同。第一滑軌222a，可包括至少一 彈性執道222b ’此彈性執道222b具有一連接段222c、一 彎折段222d以及一自由段222e。連接段222c連接於上板 222,彎折段222d連接於連接段222c與自由段222e之間。 自由段222e與侧板226的距離B小於連接段222c與側板 226的距離C ’而距離B又以略小於電路板230的厚度ρ 為佳。當電路板230沿著箭頭D的方向滑入框架結構22〇 B夺，自由段222e可抵住電路板230而使電路板230平整地 貼附於側板226上。此外，在彎折段222d與自由段222e 旁之上板222之表面可做凹陷設計而形成一凹陷空間 222g，以避免彎折段222d與自由段222e在作動時摩擦到 上板222之表面。 13 1363222 95284 21300twf.doc/n 再者’第一滑軌222a’可更包括至少一直條執道222f， 此直條執道222f接續於自由段222e之後，其中直條執道 222f與側板226的間距E大於或等於電路板230的厚度F， 以使電路板230順利地沿著第一滑軌222a，滑入。 至於第二滑軌224a，之設計則可與第一滑軌222a，相 同，在此不再重述。值得注意的是，本實施例可將第一滑 轨222a’與第二滑執224a’的其中之一設計為具有彈性轨 道’而另一則設計為與第一滑執222a或第二滑執224a相 同。此外，本實施例亦可將第一滑轨222a，與第二滑執224a， 兩者皆設計為具有彈性執道。 圖2E為本發明再一實施例之側邊入光式背光模組之 剖面示意圖。請參考圖2A與2E，側邊入光式背光模組200d 與側邊入光式背光模組200a大致相同，其差異處僅在於電 路板230”與電路板230的設計不同。電路板230”靠近上板 222與下板224之兩側各具有一朝向導光板210彎曲的彎 曲邊緣234 ’此彎曲邊緣234可加強電路板230”之結構強 度，以使電路板230”不易彎曲變形而可保持平整。如此_ 來，便可進一步確保電路板230”平整地貼附於側板226上。 圖3A為本發明另一實施例之側邊入光式背光模組的 剖面示意圖’而圖3B為可用於此實施例之各種不同形狀 之夾片的側視示意圖。請參考圖3A及圖3B，側邊入光式 背光模組300a包括一導光板310、一框架結構320、一電 路板330、至少一發光元件340以及至少一夾片350。導光 板310具有一第一表面312、一第二表面314以及至少一 14 1363222 95284 21300twf.doc/n 連接第一表面212與第二表面214的入光面316，其中第 一表面312為出光面。框架結構320用以承載導光板310 . 並暴露出第一表面312。框架結構320包括一下板324以 及一側板326。下板324位於第二表面314下方。側板326 連接下板324 ’且位於入光面316旁。下板324與側板326 的材質包括金屬。框架結構320可更包括一上板322，其 連接側板326並位於第一表面212旁。上板322例如為一 膠框。此外，上板322的截面例如呈L型，且上板322可 _ 包覆於側板326之外。電路板330配置於側板326上，且 位於側板326與入光面316之間。電路板330例如是金屬 芯印刷電路板。夾片350夾住電路板330與側板320。夾 片350的材質可為金屬，舉例來說，以沖壓連續模的方式 大量製造成如圖3B之金屬夾片350a〜350d。而夾片350 的材質亦可為塑膠，舉例來說，以條狀擠壓並舞切的方式 來製造成如圖3B之塑膠夾片350e。發光元件34〇配置於 電路板330上並與電路板33〇電性連接，且發光元件34〇 • 位於電路板330與入光面316之間。發光元件340例如是 發光二極體。 側邊入光式背光模組3〇〇a因採用夾片350夾住電路 板330與側板326，故能使電路板33〇平整地貼附於側板 326上。因此，本實施例能使發光元件34〇所產生的熱經 由電路板330而有效率地傳導至框架結構32〇上。 九圖3C為將電路板的凸起部插置於側板的安裝孔之示 意圖。請參考圖3A及® 3C，側邊入光式背光模址3〇〇a 1363222 95284 21300twf.doc/n 的下板324鄰近側板326處可具有至少一安裝孔32如，而 電路板330靠近下板324的邊緣具有至少一與安裝孔32乜 對應的凸起部332。在組裝電路板33〇時，將凸起部 插置於對應的安裝孔324a中。如此一來，便可適當固定電 路板330與側板326的相對位置，並進一步確保電路板 平整地貼附於側板326上。值得一提的是，在各實施例中， 當多個發光元件340的間距過小時，夾片35〇可以形狀相 似的鋼絲取代。 圖3D為本發明又一實施例之側邊入光式背光模組之 剖面示意圖。請參考圖3D，側邊入光式背光模組3〇〇]3與 側邊入光式背光模組300a大致相同，其差異處在於上板 322a與上板322之設計不同。上板322a具有至少一貫孔 322b’以利組裝時夾片350從貫孔322b置入而夾住電路板 330與側板326。 圖3E為本發明再一實施例之側邊入光式背光模組之 剖面示意圖。請參考圖3D與圖3E，側邊入光式背光模組 300c與側邊入光式背光模組300b大致相同，其差異處在 於上板322c、下板324b以及電路板330a之設計分別與上 板322a、下板324以及電路板330之設計不同。上板322c 與上板322a同樣具有貫孔322b，然而上板322c朝下的表 面更具有至少一第一滑轨322d。下板324b不具有安裝孔， 且電路板330a靠近下板324b的邊緣不具有凸起部。下板 324b朝上的表面具有一第二滑軌324c，其中第二滑軌324c 與第一滑軌322d相對，且電路板330a配置於側板326與 1363222 95284 21300twf.doc/n 第一滑執322d以及第二滑執324c之間。如此一來，第一 滑執322d及第二滑執324c便可協助夹片350固定電路板 • 330a，使電路板330a平整地貼附於側板326上。第一滑軌 . 322d及弟一滑軌324c的形成方法與電路板330a置入框架 結構320的方法如同圖2A之實施例所述，在此不再重述。 圖4為本發明一實施例之液晶顯示裝置的示意圖。請 參考圖4，本發明之液晶顯示裝置4〇〇包括一液晶顯示面 板410以及配置於此液晶顯示面板41〇下方的一侧邊入光 _ 式背光模組42〇。側邊入光式背光模組420可為前述各實 施例之側邊入光式背光模組2〇〇a〜2〇〇d、300a〜300c的其 中之一或其他具有本發明之特徵的側邊入光式背光模組。 另外，背光模組420中的導光板(未繪示)是以出光面朝向 液晶顯示面板410而配置，亦即背光模組42〇所提供之面 光源是從鄰近液晶顯示面板41〇的一側發出。 綜上所述，由於本發明採用滑轨或夾片來使電路板平 整地貼附於框架結構的側板上，並可搭配鎖固構件或電路 • 板的彎曲邊緣之輔助，故能使來自發光元件的熱經由電路 板而有效率地傳導至框架結構上。因此，本發明之液晶顯 示裝置及其側邊入光式背光模組具有良好的散熱效率。此 外，具有滑轨之侧邊入光式背光模組中，電路板的組裝採 抽取式設計，因此可方便更換組件，並減少重工的時間與 成本。 —雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明’任何熟習此技藝者，在不脫離本發明之精神 17 1363222 95284 21300twf.doc/n 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 fe圍當視後附之申請專利範圍所界定者為準。 圖式簡單說明】 圖 圖1為習知之一種側邊入光式背光模組的剖面示意 圖2A為本發明—實施例之側邊入光式背光模組的 面示意圖。 圖2B為本發明另—實施例之側邊入光式背 剖面示意圖。 w 圖2C為本發明又一實施例之侧邊入光式背光模組之 剖面不意圖。 圖2D為圖2C 沿A_A剖面線且未安裝電路板的剖 面示意圖。 圖2E為本發明再—實施例之侧邊入光式背光模組之 剖面不意圖。 參 圖3A為本發明另—實施例之側邊入光式背光模組的 剖面不意圖。 圖3B為可用於圖3八之實施例之各種不同形狀之 的側視示意圖。 圖 意圖 3C為將電路板的凸起部插置於側板的安裝孔之示 圖3D為本發明又—實施例之侧邊入光式背光模組之 剖面示意圖。 '' 1363222 95284 21300twf.doc/n 圖3E為本發明再一實施例之側邊入光式背光模組之 剖面示意圖。 圖4為本發明一實施例之液晶顯示裝置的示意圖。 【主要元件符號說明】 100、200a〜200d、300a〜300c、420 :側邊入光式背 光模組 110、210、310 :導光板 112、212、312 :第一表面 114、214、314 :第二表面 116、216、316 :入光面 120 :金屬框架結構 122、226、226’、326 :側板 124 :背板 130 :金屬芯印刷電路板 140、240、340 :發光元件 150 :散熱墊 220、320 :框架結構 230、230’、230”、330、330a :電路板 222、322、322a、322c :上板 222a、222a’、322d :第一滑軌 222b :彈性執道 222c ··連接段 222d :彎折段 222e :自由段 19 1363222 95284 21300twf.doc/n 222f :直條執道 222g :凹陷空間 322b :貫孔 224、324、324b :下板 224a、224a’、324c :第二滑軌 226a :第一鎖固孔 232 :第二鎖固孔 234 :彎曲邊緣 250 :鎖固構件 324a :安裝孔 332 :凸起部 350 :夾片 350a〜350d :金屬夾片 350e :塑膠夾片 400 :液晶顯示裝置 410 .液晶顯不面板 B、C :距離 D .前頭 E :間距 F :厚度 201363222 95284 21300 twf.doc/n IX. Description of the Invention: [Technical Field] The present invention relates to a display device and a light source module thereof, and more particularly to a liquid crystal display device and a side-lit backlight thereof Module. [Prior Art] With the advancement of modern video technology, liquid cryStai display (LCD) has been widely used in mobile phones (m〇bne phones), notebook personal computers, personal computers (personal comPuters). PC) and personal digital assistant (PDA) display screens for consumer electronics. However, since the liquid crystal display panel (LCD panel) of the liquid crystal display does not have the function of emitting light itself, it is necessary to configure a backlight module under the liquid crystal display panel to provide a light source required for the liquid crystal display panel, thereby enabling the liquid crystal display. The panel achieves the effect of the display. FIG. 1 is a cross-sectional view of a conventional side-light backlight module (Side_type backlight module). Referring to FIG. 1 , the conventional edge-lit backlight module 100 includes a light guiding plate 110 , a metal frame structure 120 , and a metal core printed circuit board (MCPCB). 130, a light emitting element 140 and a thermal pad 150. The light guide plate 110 has a first surface 112, a second surface 114, and a light incident surface 116' connecting the first surface 112 and the second surface 114. The first surface i12 is a light exit surface. The metal frame structure 120 is used to carry the light guide plate 11 and expose the first surface 112 of the 6 1363222 95284 21300 twf.doc/n. The metal frame structure 120 includes a side panel 122 and a back panel 124. The side plate 122 is located beside the light incident surface 116, and the back plate 124 is positioned below the second surface 114, wherein the side plate 122 and the back plate 124 are connected to each other. The metal core printed circuit board 130 is attached to the side plate 122 and located between the side plate 122 and the light incident surface 116. The heat dissipation pad 150 is disposed between the metal core printed circuit board 130 and the side plate 122. The metal core printed circuit board 130 is adhered to the side plate 122. The light-emitting element 140 is disposed on the metal core printed circuit board 130 and electrically connected to the metal core printed circuit board 13 and located between the metal core printed circuit board 130 and the light incident surface 116. The conventional edge-lit backlight module 1 uses a heat-dissipating pad 15 to adhere the metal core printed circuit board 13 to the side plate 22, but is not easily flattened due to the poor flatness of the metal core printed circuit board 130. The ground is attached to the side panel = 2. As a result, the heat generated by the light-emitting element 14A cannot be efficiently conducted to the metal frame structure 120 via the metal core printed circuit board 13 and the heat-dissipating pad 15 turns. Therefore, the conventional side-lit backlight module 1 has the disadvantage of poor heat dissipation efficiency, and thus it is easy to overheat the light-emitting member and affect its working efficiency and life. SUMMARY OF THE INVENTION The object of the present invention is to provide a side-in-light backlight module to solve the problem of poor heat dissipation efficiency of the backlight module. Another object of the present invention is to provide a side-in-light backlight module, and to have its circuit board flatly attached to its frame structure. Still another object of the present invention is to provide a liquid crystal display device having the above-described side-in-light backlight module of 1363222 95284 21300 twf.doc/n to solve the problem of the conventional problem. A further object of the present invention is to provide a liquid crystal display device which can be attached to a frame structure by a circuit board of the 'i edge-into-optic θ optical module. In view of the above or other purposes, the present invention provides a side-into-light two-group 1 including a light guide plate, a frame structure, a circuit board, and a light-emitting component, and the radiation (four) structure includes an upper plate and a plate; The second plate has a first surface, a second surface and a first-first light incident surface, and the first surface is a light-emitting surface. The frame structure is used to tif the light panel and expose the first surface. The upper plate is located beside the first surface, and the upper surface of the upper plate has a - sliding naii. Lower plate position - below the surface, and the lower plate facing surface has a second slide rail, and: opposite to the first slide rail. The side plates are connected to the upper plate and the lower plate, and are placed between the person, the first slide, and the second, and the circuit is between the light and the light. The illuminating element is disposed on the circuit board and is inclusively connected to the electric board and located between the circuit board and the light incident surface. Further, the above-mentioned side red light type backlight module - ί-lock t member, the side plate has a first locking hole and the circuit board has a circuit board locked on the side plate. The first sliding track includes a first! The segment is connected between the connecting segment and the self: and the distance between the free segment and the side plate is smaller than the distance between the connecting segment and the side plate, 8 1363222 95284 21300 twf.doc/n and the free segment is adapted to be against the circuit board. In the embodiment of the present invention, the first sliding step further includes a first straight track, the first straight line continues after the free segment, and the distance between the first straight line and the side plate is greater than or equal to The thickness of the board. In an embodiment of the present invention, the second sliding handle includes a second elastic rail, the second elastic rail has a connecting section, a bending section and a free section, and the connecting section is connected to the lower plate and the bending section. Connected between the connecting section and the free section, the distance between the free section and the side panel is smaller than the distance between the connecting section and the side panel, and the free section is adapted to be against the circuit board. In an embodiment of the present invention, the second slide rail further includes a second straight track, the second straight track is connected to the free segment, and the distance between the second straight track and the side plate is greater than or equal to the circuit. The thickness of the board. In an embodiment of the invention, the circuit board has a curved edge that is curved toward the light guide plate on both sides of the upper and lower plates. In an embodiment of the invention, the upper plate is, for example, a plastic frame. In an embodiment of the invention, the material of the side panel and the lower panel comprises a metal. In an embodiment of the invention, the light-emitting element is, for example, a light emitting diode (LED). In one embodiment of the invention, the circuit board described above is, for example, a metal core printed circuit board. In order to achieve the above or other purposes, the present invention further provides a side entrance light type moonlight module, which comprises a light guide plate, a frame structure, a circuit board, a clip and a light emitting element. The frame structure includes a lower plate. And a 9 1363222 95284 21300twf.doc/n T board. The light guiding plate has a - surface, a second surface and a light incident surface connecting the first and second surfaces, and the first surface is a light emitting surface. The frame structure is used to carry the light guide plate and expose the first surface. The lower plate is located under the second surface • I ’ and the lower plate is attached to the human surface. The circuit board is disposed on the side panel and is located between the side panel and the light incident surface. Clips are used to clamp the board to the side panels. The light emitting element is disposed on the circuit board and located between the circuit board and the light incident surface and electrically connected to the circuit board. In the embodiment of the present invention, the lower plate has a female hole adjacent to the side plate, and the edge of the circuit board near the lower plate has a convex portion corresponding to the mounting hole, and the convex portion is inserted into the mounting hole. . In an embodiment of the invention, the frame structure further includes an upper plate s connecting the side plates and located beside the first surface. In an embodiment of the invention, the upper plate is, for example, a plastic frame. In an embodiment of the invention, the upper plate has a uniform aperture, and the clip is adapted to be inserted from the through hole to sandwich the circuit board and the side plate. In an embodiment of the present invention, the upper surface of the side-into-light backlight module may have a first sliding surface, and the upper surface of the lower plate may have a second sliding surface. . The first sliding rail is opposite to the second sliding rail, and the circuit board is disposed between the side panel and the first sliding handle and the second sliding handle. In an embodiment of the invention, the material of the side panel and the lower panel comprises a metal. In an embodiment of the invention, the light-emitting element is, for example, a light-emitting diode. In an embodiment of the invention, the circuit board is, for example, a metal core 1363222 95284 21300 twf.d〇c/n printed circuit board. In order to achieve the above or other objects, the present invention further provides a liquid crystal display device including a liquid crystal display panel and any one of the two types of side-input ▲ backlight modules. The backlight module is disposed on the liquid crystal display. Below the panel. In the liquid crystal display of the present invention and the side entrance light-emitting backlight module, the sliding plate or the clip is used to make the circuit board flatly attached to the side plate of the frame structure, so that the heat generated by the light-emitting element can be passed through The board is efficiently conducted to the frame structure. Therefore, the present invention can improve the disadvantages of the conventional side-lighting backlight module having poor heat dissipation efficiency. The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims appended claims '° Embodiment> 2A is a cross-sectional view of a side-lighting type backlight module according to an embodiment of the present invention. Referring to FIG. 2A, the side-lit backlight module 2A includes a light guide 210, a frame structure 22, a circuit board 230, and at least one light-emitting element 240. The light guide plate 210 has a first surface 212, a second surface 214, and at least one light incident surface 216 connecting the first surface 212 and the second surface 214, wherein the first surface 212 is a light exit surface. The frame structure 220 is used to carry the light guide plate 210 and expose the first surface 212. The frame structure 220 includes an upper plate 222, a lower plate 224, and a side plate 226. The upper plate 222 is located beside the first surface 212, and the downwardly facing surface of the upper plate 222 has a first slide rail 222a. The upper plate 222 is, for example, a plastic frame. The lower plate 224 is located below the second surface 1363222 95284 21300 twf.doc/n surface 214, and the upper surface of the lower plate 224 has a second sliding 224a, wherein the second sliding rail 224a is opposite the first sliding rail 222a. The first rail 222a is integrally formed, for example, by the upper plate 222, or by other suitable means. The second slide 224a is formed, for example, by the original panel forming the lower panel 224 being bent through the opening or formed by other suitable means. The side plates 226 are connected to the upper plate 222 and the lower plate 224 and are located beside the light incident surface 216. The material of the lower plate 224 and the side plate 226 includes metal. The circuit board 230 is disposed between the side plate 226 and the first sliding rail 222a and the second sliding 224a, and is located between the side plate 226 and the light incident surface 216. The circuit board 230 is, for example, a metal core printed circuit board. Further, the circuit board 230 can be slid into the frame structure 220 along the first rail 222a and the second rail 224a by the direction of the vertical plane during assembly. The illuminating element 240 is disposed on the circuit board 230 and electrically connected to the circuit board 230, and the illuminating element 240 is located between the circuit board 230 and the light incident surface 216. The light emitting element 240 is, for example, a light emitting diode. The side entrance light-emitting backlight module 200a has the first sliding 222a and the second sliding rail 224a, so that the circuit board 230 can be sandwiched between the side plate 226 and the first sliding 222a and the second sliding rail 224a, so that the circuit The plate 230 is attached flatly to the side panels 226. Therefore, the present embodiment enables the heat generated by the light-emitting element 240 to be efficiently conducted to the frame structure 220 via the circuit board 230. In addition, since the circuit board 230 of the side-lighting type backlight module 200a of the embodiment is assembled and removed, the components can be easily replaced, and the time and cost of rework can be reduced. 2B is a cross-sectional view of a side-lit backlight module according to another embodiment of the present invention. Referring to FIG. 2A and FIG. 2B, the side-lit backlight module 12 1363222 95284 21300 twf.doc/n 200b is substantially the same as the side-lit backlight module 2〇〇a, and the difference is as follows. The side-lighting backlight module 2〇〇b further includes a locking member 250, and the side plate 226 of the frame structure 220' further has a first locking hole 226a, and the circuit board 230' has a second Locking hole 232. The locking member 25 is threaded through the locking hole 226a and the second locking hole 232 to lock the circuit board 230 to the side plate 226'. In this way, the circuit board 23 can be further transferred and attached to the side plate 226'. 2C is a cross-sectional view of a side-lighting type backlight module according to still another embodiment of the present invention; and FIG. 2D is a cross-sectional view of the circuit board taken along line A-A of FIG. 2C and without a circuit board. Referring to FIG. 2A, FIG. 2C and FIG. 2D, the side-lighting backlight module 200c is substantially the same as the side-lighting backlight module 2〇〇a. The difference lies in the first slide rails 222a, 222a of the two. , or the design of the second slide rails 224a, 224a' is different. The first slide rail 222a may include at least one elastic road 222b'. The elastic road 222b has a connecting portion 222c, a bent portion 222d, and a free portion 222e. The connecting section 222c is connected to the upper plate 222, and the bent section 222d is connected between the connecting section 222c and the free section 222e. The distance B between the free section 222e and the side panel 226 is smaller than the distance C' of the connecting section 222c from the side panel 226, and the distance B is preferably slightly smaller than the thickness ρ of the circuit board 230. When the circuit board 230 slides into the frame structure 22 in the direction of the arrow D, the free segment 222e can abut the circuit board 230 to cause the circuit board 230 to be flatly attached to the side plate 226. In addition, the surface of the upper plate 222 adjacent to the bent section 222d and the free section 222e may be recessed to form a recessed space 222g to prevent the bent section 222d and the free section 222e from rubbing against the surface of the upper plate 222 when actuated. 13 1363222 95284 21300twf.doc/n Further, the 'first slide rail 222a' may further include at least a straight track 222f, which is followed by the free segment 222e, wherein the straight track 222f and the side plate 226 The pitch E is greater than or equal to the thickness F of the circuit board 230 such that the circuit board 230 smoothly slides along the first rail 222a. As for the second slide rail 224a, the design is the same as that of the first slide rail 222a, and will not be repeated here. It should be noted that, in this embodiment, one of the first sliding rail 222a' and the second sliding 224a' may be designed to have an elastic track 'and the other is designed to be the first sliding 222a or the second sliding 224a. the same. In addition, in this embodiment, the first slide rail 222a and the second slide rail 224a can also be designed to have an elastic manner. 2E is a cross-sectional view of a side-lit backlight module according to still another embodiment of the present invention. Referring to FIGS. 2A and 2E, the edge-lit backlight module 200d is substantially the same as the edge-lit backlight module 200a, except that the circuit board 230" is different from the circuit board 230. The circuit board 230" The two sides of the upper plate 222 and the lower plate 224 each have a curved edge 234 which is curved toward the light guide plate 210. The curved edge 234 can strengthen the structural strength of the circuit board 230", so that the circuit board 230" is not easily bent and can be maintained. smooth. In this way, the circuit board 230" can be further ensured to be attached to the side plate 226. FIG. 3A is a cross-sectional view of a side-lighting type backlight module according to another embodiment of the present invention, and FIG. 3B is applicable to FIG. FIG. 3A and FIG. 3B, the side-lighting backlight module 300a includes a light guide plate 310, a frame structure 320, a circuit board 330, and at least one light-emitting device. The component 340 and the at least one clip 350. The light guide plate 310 has a first surface 312, a second surface 314, and at least one 14 1363222 95284 21300 twf.doc/n light incident surface 316 connecting the first surface 212 and the second surface 214. The first surface 312 is a light-emitting surface. The frame structure 320 is used to carry the light guide plate 310. The first surface 312 is exposed. The frame structure 320 includes a lower plate 324 and a side plate 326. The lower plate 324 is located below the second surface 314. The side plate 326 is connected to the lower plate 324' and is located beside the light incident surface 316. The material of the lower plate 324 and the side plate 326 includes metal. The frame structure 320 may further include an upper plate 322 connected to the side plate 326 and located beside the first surface 212. Board 322, for example In addition, the upper plate 322 has an L-shaped cross section, for example, and the upper plate 322 can be wrapped around the side plate 326. The circuit board 330 is disposed on the side plate 326 and located between the side plate 326 and the light incident surface 316. The circuit board 330 is, for example, a metal core printed circuit board. The clip 350 sandwiches the circuit board 330 and the side plate 320. The material of the clip 350 can be metal, for example, mass-molded as a stamping continuous mold as shown in FIG. 3B. The metal clips 350a to 350d, and the material of the clip 350 may be plastic, for example, extruded and danced in a strip shape to form a plastic clip 350e as shown in Fig. 3B. The circuit board 330 is electrically connected to the circuit board 33, and the light-emitting element 34 is located between the circuit board 330 and the light-incident surface 316. The light-emitting element 340 is, for example, a light-emitting diode. Since the clip 330 is used to sandwich the circuit board 330 and the side panel 326, the circuit board 33 can be attached to the side panel 326 in a flat manner. Therefore, the heat generated by the light-emitting element 34 can be passed through the embodiment. The circuit board 330 is efficiently conducted to the frame structure 32. 9 Figure 3C A schematic diagram of inserting the raised portion of the circuit board into the mounting hole of the side plate. Referring to Figures 3A and 3C, the lower edge plate 324 of the side edge-lit backlight module 3〇〇a 1363222 95284 21300twf.doc/n is adjacent to the side plate. There may be at least one mounting hole 32 at 326, and the edge of the circuit board 330 near the lower plate 324 has at least one protrusion 332 corresponding to the mounting hole 32. When the circuit board 33 is assembled, the protrusion is inserted. In the corresponding mounting hole 324a. In this way, the relative positions of the circuit board 330 and the side plates 326 can be appropriately fixed, and the circuit board can be further ensured to be attached to the side plates 326 in a flat manner. It is to be noted that, in various embodiments, when the pitch of the plurality of light-emitting elements 340 is too small, the clips 35A may be replaced by wires having similar shapes. 3D is a cross-sectional view of a side-lit backlight module according to still another embodiment of the present invention. Referring to FIG. 3D, the side-lit backlight module 3〇〇3 is substantially the same as the side-into-light backlight module 300a, except that the upper plate 322a and the upper plate 322 are different in design. The upper plate 322a has at least a uniform hole 322b' to facilitate insertion of the clip 350 from the through hole 322b to sandwich the circuit board 330 and the side plate 326. 3E is a cross-sectional view of a side-lit backlight module according to still another embodiment of the present invention. Referring to FIG. 3D and FIG. 3E, the edge-lit backlight module 300c is substantially the same as the edge-lit backlight module 300b, and the difference is that the upper board 322c, the lower board 324b, and the circuit board 330a are respectively designed and mounted. The design of the board 322a, the lower board 324, and the circuit board 330 is different. The upper plate 322c has a through hole 322b as well as the upper plate 322a, but the lower surface of the upper plate 322c further has at least one first slide rail 322d. The lower plate 324b does not have a mounting hole, and the edge of the circuit board 330a near the lower plate 324b does not have a convex portion. The upper surface of the lower plate 324b has a second sliding rail 324c, wherein the second sliding rail 324c is opposite to the first sliding rail 322d, and the circuit board 330a is disposed on the side panel 326 and 13632222 95284 21300 twf.doc/n first sliding 322d And between the second slip 324c. In this way, the first slider 322d and the second slider 324c can assist the clip 350 to fix the circuit board 330a so that the circuit board 330a is flatly attached to the side panel 326. The method of forming the first slide rail 322d and the slide rail 324c and the method of inserting the circuit board 330a into the frame structure 320 are as described in the embodiment of FIG. 2A, and will not be repeated here. 4 is a schematic view of a liquid crystal display device according to an embodiment of the present invention. Referring to FIG. 4, the liquid crystal display device 4 of the present invention includes a liquid crystal display panel 410 and a light-incorporating backlight module 42 disposed under one side of the liquid crystal display panel 41. The side-lit backlight module 420 may be one of the side-input backlight modules 2〇〇a~2〇〇d, 300a-300c of the foregoing embodiments or other side having the features of the present invention. Edge-lit backlight module. In addition, the light guide plate (not shown) of the backlight module 420 is disposed with the light emitting surface facing the liquid crystal display panel 410, that is, the surface light source provided by the backlight module 42 is from the side adjacent to the liquid crystal display panel 41 issue. In summary, since the present invention uses a slide rail or a clip to make the circuit board flatly attached to the side panel of the frame structure, and can be matched with the curved member of the locking member or the circuit board, it can be illuminated. The heat of the component is efficiently conducted to the frame structure via the board. Therefore, the liquid crystal display device of the present invention and the side entrance light-emitting backlight module have good heat dissipation efficiency. In addition, in the side-lit backlight module with slide rails, the circuit board is assembled and removed, so that it is easy to replace components and reduce the time and cost of rework. The present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the invention to any skilled person, and may be made without departing from the spirit of the invention, in the scope of the invention. There are a few changes and refinements, and therefore the protection of the present invention is defined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a side-lit backlight module of the prior art. FIG. 2A is a schematic side view of a side-lit backlight module of the present invention. Figure 2B is a side elevational cross-sectional view of another embodiment of the present invention. FIG. 2C is a cross-sectional view of a side-lighting type backlight module according to still another embodiment of the present invention. Figure 2D is a cross-sectional view of Figure 2C taken along line A-A and without a circuit board mounted. Fig. 2E is a cross-sectional view of a side-lighting type backlight module according to still another embodiment of the present invention. 3A is a cross-sectional view of a side-lighting type backlight module according to another embodiment of the present invention. Figure 3B is a side elevational view of various shapes that may be used with the embodiment of Figure 38. FIG. 3D is a cross-sectional view showing a side-in-light backlight module according to still another embodiment of the present invention. FIG. 3E is a cross-sectional view of a side-lit backlight module according to still another embodiment of the present invention. 4 is a schematic view of a liquid crystal display device according to an embodiment of the present invention. [Description of main component symbols] 100, 200a to 200d, 300a to 300c, 420: side edge light-emitting backlight modules 110, 210, 310: light guide plates 112, 212, 312: first surface 114, 214, 314: Two surfaces 116, 216, 316: light-incident surface 120: metal frame structure 122, 226, 226', 326: side plate 124: back plate 130: metal core printed circuit board 140, 240, 340: light-emitting element 150: heat-dissipating pad 220 320: frame structure 230, 230', 230", 330, 330a: circuit board 222, 322, 322a, 322c: upper plate 222a, 222a', 322d: first slide rail 222b: elastic road 222c · · connection segment 222d: bending section 222e: free section 19 1363222 95284 21300twf.doc/n 222f: straight line 222g: recessed space 322b: through holes 224, 324, 324b: lower plate 224a, 224a', 324c: second slide 226a: first locking hole 232: second locking hole 234: curved edge 250: locking member 324a: mounting hole 332: boss 350: clips 350a to 350d: metal clip 350e: plastic clip 400: Liquid crystal display device 410. Liquid crystal display panel B, C: distance D. front E: pitch F: thickness 20