200842450 2l300twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種顯示裝置及其光源模組，且特別 是有關於一種液晶顯示裝置及其側邊入光式背光模組。 【先前技術】 隨著現代視訊技術的進步，液晶顯示器（liquid crystal disPlay，LCD)已被大量地使用於手機(mobile phone)、筆記 型電腦(notebook personal computer)、個人電腦(pers〇nal computer，PC)及個人數位助理(pers〇nal邮㈤⑽咖祕， PDA)等消費性電子產品的顯示螢幕上。然而，由於液晶 顯示器之液晶顯示面板(LCD panel)本身並不具有發光的 功能’因此需要於液晶顯示面板下方配置背光模組 (backlight腦dule)以提供液晶顯示面板所需要之光源，進 而使液晶顯不面板達到顯示的效果。 圖1為習知之一種側邊入光式背光模組(side_type 〇 backlightmodule)的剖面示意圖。請參考圖1，習知之側邊 入光式月光模組100包括一導光板(light guiding plate) 110、一金屬框架結構120、一金屬芯印刷電路板(metal core printed circuit board，MCPCB) 130、一發光元件（light emitting dement) 140 以及一散熱墊(thermalpad) 15〇。導光 板110具有一第一表面112、一第二表面114與連接第一 表面112與第二表面Π4的入光面116,其中第一表面112 為出光面。金屬框架結構120用以承載導光板11()並暴露 200842450 95284 21300twf.doc/n 出第一表面112。金屬框架結構120包括一侧板122及一 背板124。側板122位於入光面116旁，而背板124則位 於第二表面114下方，其中側板122與背板124互相連接。 金屬芯印刷電路板130貼附於側板122上，且位於側板122 與入光面116之間，其中金屬芯印刷電路板13〇與側板122 之間有一散熱墊150，散熱墊150以其黏性將金屬芯印刷 電路板130黏著於側板122上。發光元件H0配置於金屬 q 芯印刷電路板13〇上且與金屬芯印刷電路板130電性連 接’並位於金屬4印刷電路板130與入光面116之間。 習知之側邊入光式背光模組100採用散熱墊150將金 屬芯印刷電路板130黏著於側板122，但卻容易因金屬芯 印刷電路板130的平整度不佳而無法平整地貼附於侧板 122上。如此一來，發光元件140所產生的熱會無法有效 率地經由金屬芯印刷電路板13〇及散熱墊15〇而傳導到金 屬框架結構120上。因此，習知之側邊入光式背光模組100 會有散熱效率不佳的缺點，如此一來，會容易使得發光件 1/ 過熱而影響其工作效率及壽命。 【發明内容】 本發明之目的是提供一種側邊入光式背光模組，以解 決省知为光模組散熱效率不佳的問題。 本發明之另一目的是提供一種側邊入光式背光模 組’可使其電路板平整祕附於其㈣結構上。 本發明的又一目的是提供一種液晶顯示裝置，其具有 200842450 95284 21300twf.doc/n 上述侧邊入光式背光模組，以解決習知背光模組散熱效率 不佳的問題。 本發明的再一目的是提供一種液晶顯示裝置，可使其 側邊入光式jg光核組之電路板平整地貼附於框架結構上。 為達上述或是其他目的，本發明提出一種侧邊入光式 月光模組，其包括一導光板、一框架結構、一電路板以及 一發光元件，其中框架結構包括一上板、一下板以及一側 板。導光板具有一第一表面、一第二表面與連接第一、第 二表面的一入光面，而第一表面為出光面。框架結構用以 承載導光板並暴露出第一表面。上板位於第一表面旁，且 上板朝下的表面具有-第一滑執(slidi u) 二表面下方’且下板朝上的表面具有一第二)滑:板= 一滑執與第-滑軌相對。側板連接上板與下板，且位於入 光面旁。電路板配置於織、第以及第二滑軌之間， ^位於側板與入光面之間。發光元件配置於電路板上且與 电路板電性連接’並位於電路板與人光面之間。 、 》實施例中，上述之側邊Μ·%· 括?固構件，側板具有—第—鎖固孔且電路板且有 將:：f:孔，鎖固構件穿過第-鎖固孔與第二鎖固：而 將電路板鎖固於側板上。 頌U札而 發例中，上述之第—_包H =軌道弟—弹性執道具有一連接段、 由段，連接段連接於上板，·料 ·^ …，自由段與側板的距離小於連接段與= 8 200842450 95284 21300twf.doc/n 且自由段適於抵住電路板。 一在本發明之-實施例中，上述之第一滑執更包括一第 直仏執道，第一直條執道接續於自由段之後，且第一直 條軌道與側板的間距大於或等於電路板的厚度。 ”在本發明之-實施例中，上述之第二滑執包括一第二 彈〖生執道，第一彈性執道具有一連接段、一彎折段以及一 ^由段，連接段連接於下板，彎折段連接於連接段與自由 D 段之間，自由段與側板的距離小於連接段與側㈣距離， 且自由段適於抵住電路板。 一在本發明之一實施例中，上述之第二滑軌更包括一第 —直條軌道，第二直條軌道接續於自由段之後，且第二直 么卞執道與侧板的間距大於或等於電路板的厚度。 在本發明之一實施例中，上述之電路板靠近上板及下 板之兩侧各具有一朝向導光板彎曲的彎曲邊緣。 在本發明之一實施例中，上述之上板例如為一膠框。 ❹在本發明之一實施例中，上述之側板以及下板之材質 包括金屬。 、 在本發明之一實施例中，上述之發光元件例如為發光 —極體(light emitting diode，LED)。 在本發明之一實施例中，上述之電路板例如為金屬芯 印刷電路板。 ^ 為達上述或是其他目的，本發明更提出一種側邊入光 式月光模組’其包括一導光板、一框架結構、一電路板、 ~失片以及一發光元件，其中框架結構包括一下板以及一 9 200842450 95284 21300twf.doc/n 侧板。導光板具有一第一表面、一第二表面與連接第一、 第二表面的一入光面，而第一表面為出光面。框架結構用 以承載導光板並暴露出第一表面。下板位於第二表面下 方’而側板連接下板且位於入光面旁。電路板配置於側板 上，且位於侧板與入光面之間。夾片用以夾住電路板與側 板。發光元件配置於電路板上並位於電路板與入光面之 間，且與電路板電性連接。 P 在本發明之一實施例中，上述之下板鄰近侧板處具有 一安裝孔，且電路板靠近下板的邊緣具有一與安裝孔對應 的凸起部，凸起部插置於安裝孔中。 在本發明之一實施例中，上述之框架結構更包括一上 板，連接該侧板，並位於該第一表面旁。 在本發明之一實施例中，上述之上板例如是一膠框。 在本發明之一實施例中，上述之上板具有一貫孔，夾 片適於攸貝孔置入而炎住電路板與側板。 在本發明之一實施例中，上述之側邊入光式背光模組 〇 的上板朝下的表面可具有一第一滑軌，而下板朝上的表面 可具有一第二滑軌。其中第一滑執與第二滑軌相對，且電 路板配置於側板與第一滑軌以及第二滑軌之間。 在本發明之一實施例中，上述之侧板以及下板之材質 包括金屬。 在本發明之一實施例中，上述之發光元件例如是發光 二極體。 在本發明之一實施例中，上述之電路板例如是金屬芯 200842450 ^5284 21300twf.doc/n 印刷電路板。 為達上述或是其他目的，本發明更提出一種液晶顯示 衣置，其包括一^夜晶顯不面板以及上述之兩種側邊入光式 月光模組之任一種’此背光板組配置於液晶顯示面板下方。 在本發明之液晶顯示器及其侧邊入光式背光模組 中’是採用滑軌或夾片來使電路板平整地貼附於框架結構 的側板上，故能使發光元件所產生的熱經由電路板而有效 ◎ 率地傳導至框架結構上。因此，本發明能改善習知之側邊 入光式背光模組散熱效率不佳的缺點。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 圖2A為本發明一實施例之側邊入光式背光模組的剖 面不意圖。請參考圖2A，側邊入光式背光模組2〇〇a包括 G —導光板210、一框架結構220、一電路板230以及至少一 發光元件240。導光板210具有一第一表面2丨2、一第二表 面214以及至少一連接第一表面212與第二表面214的入 光面216，其中第一表面212為出光面。框架結構22〇用 以承載導光板210並暴露出第一表面212。框架結構220 包括一上板222、一下板224以及一侧板226。上板222 位於第一表面212旁，且上板222朝下的表面具有一第一 滑軌222a。上板222例如為一膠框。下板224位於第二表 11 200842450 ^yzm 2i300twf.d〇c/n 面214下方，且下板224朝上的表面具有一第二滑軌 224a，其中第二滑轨224a與第一滑執222a相對。第一滑 軌222a例如是由上板222 —體成形，或由其他適當方式形 成。第二滑執224a例如由形成下板224的原始板件經由開 孔折彎而形成，或由其他適當方式形成。側板226連接上 板222與下板224 ’且位於入光面216旁。下板224與側 板226的材質包括金屬。電路板230配置於側板226與第 p —滑執222a以及第二滑軌224a之間，且位於側板226與 ’ 入光面216之間。電路板230例如是金屬芯印刷電路板。 此外’電路板230在組裝時可由垂直圖面的方向沿著第一 滑軌222a與第二滑軌224a滑入框架結構220中。發光元 件240配置於電路板230上並與電路板230電性連接，且 發光元件240位於電路板230與入光面216之間。發光元 件240例如是發光二極體。 側邊入光式背光模組200a因具有第一滑執222a以及 第二滑執224a，故能將電路板230夾在側板226與第一滑 執222a以及第二滑軌224a之間，使電路板230平整地貼 附於側板226上。因此，本實施例能使發光元件24〇所產 生的熱經由電路板230而有效率地傳導至框架結構22〇 上。此外，由於本實施例之侧邊入光式背光模組2〇〇a中電 路板230的組襄採抽取式設計，因此可方便更換組件，並 減少重工的時間與成本。 圖2B為本發明另一實施例之側邊入光式背光模組之 剖面示思圖。請參考圖2A與圖2B，側邊入光式背光模级 12 200842450 95284 21300twf.doc/n 200b與側邊入光式背光模組200a大致相同，其差異如下 所述。側邊入光式背光模組200b更包括一鎖固構件250， 而框架結構220’的侧板226,更具有一第一鎖固孔226a，且 其電路板230’更具有一第二鎖固孔232。鎖固構件250穿 過第一鎖固孔226a與第二鎖固孔232以將電路板230,鎖 固於側板226’上。如此一來，可進一步確保電路板23〇, 平整地貼附於側板226’上。 P 圖2C為本發明又一實施例之側邊入光式背光模組之 剖面示意圖，而圖2D為圖2C中沿A-A剖面線且未安裝 電路板的剖面示意圖。請參考圖2A、圖2C及圖2D，側 邊入光式背光模組200c與側邊入光式背光模組2〇〇a大致 相同，其差異處在於兩者之第一滑執222a、222a，或第二滑 執224a、224a’的設計不同。第一滑執222a，可包括至少一 彈性軌道222b，此彈性軌道222b具有一連接段222c、一 彎折段222d以及一自由段222e。連接段222c連接於上板 222,彎折段222d連接於連接段222c與自由段222e之間。 ϋ 自由段222e與側板226的距離Β小於連接段222c與侧板 226的距離C，而距離B又以略小於電路板230的厚度F 為佳。當電路板230沿著箭頭D的方向滑入框架結構220 時，自由段222e可抵住電路板230而使電路板230平整地 貼附於側板226上。此外，在彎折段222d與自由段222e 旁之上板222之表面可做凹陷設計而形成一凹陷空間 222g，以避免彎折段222d與自由段222e在作動時摩擦到 上板222之表面。 13 200842450 95284 21300twf.doc/n 再者，第一滑執222a’可更包括至少一直條轨道222f， 此直條執道222f接續於自由段222e之後，其中直條執道 222f與側板226的間距E大於或等於電路板230的厚度F， 以使電路板230順利地沿著第一滑軌222a，滑入。 至於第二滑執224a’之設計則可與第一滑執222a，相 同，在此不再重述。值得注意的是，本實施例可將第一滑 執222a與弟^一滑軌224a’的其中之一設計為具有彈性執 道，而另一則設計為與第一滑軌222a或第二滑執22知相 同。此外，本實施例亦可將第一滑軌222a，與第二滑軌224a， 兩者皆設計為具有彈性執道。 圖2E為本發明再一實施例之側邊入光式背光模纟且之 剖面示意圖。請參考圖2A與2E，側邊入光式背光模組2〇〇d 與侧邊入光式背光模組200a大致相同，其差異處僅在於電 路板230”與電路板230的設計不同。電路板230”靠近上板 222與下板224之兩側各具有一朝向導光板21〇彎曲的彎 曲邊緣234，此彎曲邊緣234可加強電路板230”之結構強 度，以使電路板230”不易彎曲變形而可保持平整。如此一 來，便可進一步確保電路板23〇”平整地貼附於側板226上。 圖3A為本發明另一實施例之側邊入光式背光模組的 剖面示意圖，而圖3B為可用於此實施例之各種不同形狀 之夾片的側視示意圖。請參考圖3A及圖3B，側邊入光式 月光模組300a包括—導光板31〇、一框架結構320、一電 路板330、至少一發光元件340以及至少一夾片350。導光 板310具有一第一表面312、一第二表面314以及至少一 14 200842450 y3^64 zi300twf.doc/n 連接第一表面212與第二表面214的入光面316，其中第 一表面312為出光面。框架結構32〇用以承載導光板31〇 並暴路出第一表面312。框架結構320包括一下板324以 及一側板326。下板324位於第二表面314下方。側板326 連接下板324，且位於入光面316旁。下板324與側板326 的材質包括金屬。框架結構320可更包括一上板322，其 連接側板326並位於第一表面212旁。上板322例如為一 ^ 膠框。此外，上板322的截面例如呈L·型，且上板322可 包覆於側板326之外。電路板33〇配置於側板326上，且 位於側板326與入光面316之間。電路板33〇例如是金屬 芯印刷電路板。夾片350夾住電路板330與側板326。夾 片350的材質可為金屬，舉例來說，以沖壓連續模的方式 大量製造成如圖3B之金屬夾片350a〜350d。而夾片350 的材質亦可為塑膠，舉例來說，以條狀擠壓並轉切的方式 來製造成如圖3B之塑膠夾片350e。發光元件34〇配置於 電路板330上並與電路板330電性連接，且發光元件34〇 ° 位於電路板330與入光面316之間。發光元件340例如是 發光二極體。 側邊入光式背光模組300a因採用夾片350夾住電路 板330與侧板326，故能使電路板33〇平整地貼附於側板 326上。因此，本實施例能使發光元件34〇所產生的熱經 由電路板330而有效率地傳導至框架結構32()上。 圖3C為將電路板的凸起部插置於側板的安裝孔之示 思圖。请芩考圖3A及圖3C，側邊入光式背光模組3〇〇a 15 200842450 2i300twf.doc/n 的下板324鄰近側板326處可具有至少一安裝孔324a，而 電路板330靠近下板324的邊緣具有至少一與安裝孔324a 對應的凸起部332。在組裝電路板330時，將凸起部332 插置於對應的安裝孔324a中。如此一來，便可適當固定電 路板330與侧板326的相對位置，並進一步確保電路板330 平整地貼附於側板326上。值得一提的是，在各實施例中， 當多個發光元件340的間距過小時，夾片350可以形狀相 ρ 似的鋼絲取代。 圖3D為本發明又一實施例之側邊入光式背光模組之 剖面示意圖。請參考圖3D，側邊入光式背光模組3〇〇b與 側邊入光式背光模組300a大致相同，其差異處在於上板 322a與上板322之設計不同。上板322a具有至少一貫孔 322b，以利組裝時夾片350從貫孔322b置入而夾住電路板 330與側板326。 圖3E為本發明再一實施例之側邊入光式背光模組之 剖面示意圖。請參考圖3D與圖3E，侧邊入光式背光模組 ϋ 與側邊入光式背光模組300b大致相同，其差異處在 於上板322c、下板324b以及電路板330a之設計分別與上 板322a、下板324以及電路板330之設計不同。上板322c 與上板322a同樣具有貫孔322b，然而上板322c朝下的表 面更具有至少一第一滑軌322d。下板324b不具有安裝孔， 且電路板330a靠近下板324b的邊緣不具有凸起部。下板 324b朝上的表面具有一第二滑軌324c，其中第二滑轨324c 與第一滑軌322d相對，且電路板330a配置於侧板326與 16 200842450 95284 2l300twf.doc/n 第一滑軌322d以及第二滑軌324c之間。如此一來，第一 滑軌322d及第二滑軌324c便可協助夾片350固定電路板 330a，使電路板330a平整地貼附於側板326上。第一滑執 322d及第二滑軌324c的形成方法與電路板330a置入框架 結構320的方法如同圖2A之實施例所述，在此不再重述。 圖4為本發明一實施例之液晶顯示裝置的示意圖。請 參考圖4，本發明之液晶顯示裝置4〇〇包括一液晶顯示面 板410以及配置於此液晶顯示面板41〇下方的一側邊入光 式背光模組420。側邊入光式背光模組420可為前述各實 施例之側邊入光式背光模組2〇〇a〜200d、300a〜300c的其 中之一或其他具有本發明之特徵的側邊入光式背光模組。 另外，背光模組420中的導光板(未繪示)是以出光面朝向 液晶顯示面板410而配置，亦即背光模組42〇所提供之面 光源是從鄰近液晶顯示面板410的一侧發出。 綜上所述，由於本發明採用滑軌或夾片來使電路板平 整地貼附於框架結構的側板上，並可搭配鎖固構件或電路 板的彎曲邊緣之輔助，故能使來自發光元件的熱經由電路 板而有效率地傳導至框架結構上。因此，本發明之液晶顯 不裝置及其側邊入光式背光模組具有良好的散熱效率。此 外，具有滑執之侧邊入光式背光模組中，電路板的組裝採 抽取式設計，因此可方便更換組件，並減少重工的時間與 成本。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 17 200842450 y λ 13 00twf.doc/n 和範圍内，當可作些許之更動與潤飾，因此 範圍當視後附之申請專利範圍所界定者為準發明之保護 【圖式簡單說明】圖上為習知之-種側邊人光式背光模組的剖面 圖。 意 Γ L) 面示=為本發明—實施例之側邊入光式背光模組的剖 模組之 圖2B為本發明另一實施例之側邊入光式背 剖面示意圖。 立I品圖^為本發日収—實施例之側邊人光式背光模組之 剖面不意圖。 ，2D為圖2C中沿A_A剖面線且未安裝電路板的剖 面示思圖。 圖2E為本發明再_實施例之側邊入光式背光模組之 剖面不意圖。 圖3A為本發明另—實施例之侧邊入光式背光模組的 剖面示意圖。 圖3B為可用於圖3A之實施例之各種不同形狀之灸片 的侧視示意圖。 意圖 圖3C為將電路才反的凸起部插置於側才反的安裝孔之示 圖3D為本發明又—實施例之側邊入光式背光模組之 剖面不意圖。 18 200842450 zi J00twf.doc/n 圖3E為本發明再一實施例之側邊入光式背光模組之 剖面示意圖。 圖4為本發明一實施例之液晶顯示裝置的示意圖。 【主要元件符號說明】 100、200a〜200d、300a〜300c、420 :側邊入光式背 光模組 110、210、310:導光板 、 112、212、312 :第一表面 〇 114、214、314 :第二表面 116、216、316 :入光面 120 :金屬框架結構 122、226、226’、326 :側板 124 :背板 130 :金屬芯印刷電路板 140、240、340 :發光元件 150 :散熱墊 〇 220、320 ··框架結構 230、230’、230”、330、330a :電路板 222、322、322a、322c :上板 222a、222a’、322d :第一滑軌 222b :彈性執道 222c ··連接段 222d :彎折段 222e :自由段 19 200842450 y z. 1300twf.d〇c/ll 222f :直條軌道 222g :凹陷空間 322b :貫孔 224、324、324b :下板 224a、224a，、324c :第二滑軌 226a ··第一鎖固孔 232 ··第二鎖固孔 234 :彎曲邊緣 f 250 :鎖固構件 324a :安裝孔 332 :凸起部 350 ··夾片 350a〜350d :金屬夾片 350e :塑膠夾片 400 :液晶顯示裝置 410 ·液晶顯不面板 Q B、C :距離 D :箭頭 E :間距 F :厚度 20200842450 2l300twf.doc/n IX. Description of the Invention: [Technical Field] The present invention relates to a display device and a light source module thereof, and more particularly to a liquid crystal display device and a side-into-light backlight module thereof group. [Prior Art] With the advancement of modern video technology, liquid crystal diss (LCD) has been widely used in mobile phones, notebook personal computers, and personal computers (pers〇nal computer, PC) and personal digital assistants (pers〇nal mail (5) (10) coffee, PDA) and other consumer electronic products on the display screen. However, since the liquid crystal display panel (LCD panel) of the liquid crystal display does not have the function of emitting light itself, it is necessary to configure a backlight module under the liquid crystal display panel to provide a light source required for the liquid crystal display panel, thereby making the liquid crystal The panel is displayed to achieve the displayed effect. FIG. 1 is a schematic cross-sectional view of a side-type backlight module (side_type 〇 backlight module). Referring to FIG. 1 , a conventional side light-emitting moonlight module 100 includes a light guiding plate 110 , a metal frame structure 120 , and a metal core printed circuit board (MCPCB) 130 . A light emitting element 140 and a thermal pad 15 〇. The light guide plate 110 has a first surface 112, a second surface 114 and a light incident surface 116 connecting the first surface 112 and the second surface Π4, wherein the first surface 112 is a light exit surface. The metal frame structure 120 is used to carry the light guide plate 11() and expose the first surface 112 of 200842450 95284 21300 twf.doc/n. The metal frame structure 120 includes a side panel 122 and a back panel 124. The side plate 122 is located beside the light incident surface 116, and the back plate 124 is located below the second surface 114, wherein the side plate 122 and the back plate 124 are connected to each other. The metal core printed circuit board 130 is attached to the side plate 122 and located between the side plate 122 and the light incident surface 116. The heat dissipation pad 150 is disposed between the metal core printed circuit board 13 and the side plate 122. The metal core printed circuit board 130 is adhered to the side plate 122. The light-emitting element H0 is disposed on the metal q-core printed circuit board 13A and electrically connected to the metal core printed circuit board 130 and located between the metal 4 printed circuit board 130 and the light-incident surface 116. The conventional edge-lit backlight module 100 uses the heat dissipation pad 150 to adhere the metal core printed circuit board 130 to the side plate 122, but is easily attached to the side due to the poor flatness of the metal core printed circuit board 130. On board 122. As a result, the heat generated by the light-emitting element 140 cannot be efficiently conducted to the metal frame structure 120 via the metal core printed circuit board 13 and the heat-dissipating pad 15 turns. Therefore, the conventional side-lit backlight module 100 has the disadvantage of poor heat dissipation efficiency, and thus, the light-emitting member 1/ can be easily overheated to affect its working efficiency and life. SUMMARY OF THE INVENTION It is an object of the present invention to provide a side-in-light backlight module to solve the problem of poor heat dissipation efficiency of the optical module. Another object of the present invention is to provide a side-in-light backlight module that can be used to flatten its circuit board to its (four) structure. It is still another object of the present invention to provide a liquid crystal display device having the above-mentioned side-lighting backlight module of 200842450 95284 21300 twf.doc/n to solve the problem of poor heat dissipation efficiency of the conventional backlight module. It is still another object of the present invention to provide a liquid crystal display device in which a circuit board of a side-input optical jg core group can be attached to a frame structure in a flat manner. In order to achieve the above or other objects, the present invention provides a side entrance light type moonlight module, which includes a light guide plate, a frame structure, a circuit board, and a light emitting component, wherein the frame structure includes an upper plate and a lower plate. One side board. The light guide plate has a first surface, a second surface and a light incident surface connecting the first and second surfaces, and the first surface is a light exit surface. The frame structure is configured to carry the light guide plate and expose the first surface. The upper plate is located beside the first surface, and the upper surface of the upper plate has a first slide (slidi u) below the two surfaces and a lower surface of the lower plate has a second slide: a plate = a slippery and a - Slide rails are opposite. The side panels connect the upper and lower panels and are located next to the entrance surface. The circuit board is disposed between the woven, the first and the second sliding rail, and is located between the side panel and the light incident surface. The light emitting element is disposed on the circuit board and electrically connected to the circuit board and located between the circuit board and the human light surface. In the embodiment, the side edge %·%· includes a solid member, the side plate has a first locking hole and the circuit board has a :f: hole, and the locking member passes through the first locking hole and Second locking: The board is locked to the side panel. In the case of 札U, the above-mentioned - _ H = track brother - elastic holding prop has a connecting section, the section, the connecting section is connected to the upper plate, the material · ^ ..., the distance between the free section and the side panel is less than the connection Segment and = 8 200842450 95284 21300twf.doc/n and the free segment is adapted to resist the board. In the embodiment of the present invention, the first sliding step further includes a first straight line, the first straight line follows the free section, and the distance between the first straight track and the side plate is greater than or equal to The thickness of the board. In the embodiment of the present invention, the second sliding handle includes a second bullet, the first elastic holding prop has a connecting section, a bent section, and a section, and the connecting section is connected to the lower section. The plate, the bent section is connected between the connecting section and the free D section, the distance between the free section and the side panel is smaller than the distance between the connecting section and the side (four), and the free section is adapted to abut the circuit board. In an embodiment of the invention, The second slide rail further includes a first straight rail, the second straight rail is connected to the free segment, and the distance between the second straight rail and the side panel is greater than or equal to the thickness of the circuit board. In an embodiment, the circuit board has a curved edge that is curved toward the light guide plate on both sides of the upper and lower boards. In an embodiment of the invention, the upper board is, for example, a plastic frame. In one embodiment of the invention, the material of the side plate and the lower plate includes a metal. In one embodiment of the invention, the light-emitting element is, for example, a light emitting diode (LED). In one embodiment, the above The circuit board is, for example, a metal core printed circuit board. ^ In order to achieve the above or other purposes, the present invention further provides a side-into-light moonlight module that includes a light guide plate, a frame structure, a circuit board, and a missing piece. And a light-emitting element, wherein the frame structure comprises a lower plate and a side plate of a 200842450 95284 21300 twf.doc/n. The light guide plate has a first surface, a second surface and a light incident surface connecting the first and second surfaces, The first surface is a light-emitting surface, the frame structure is configured to carry the light guide plate and expose the first surface, the lower plate is located below the second surface, and the side plate is connected to the lower plate and is located beside the light-incident surface. The circuit board is disposed on the side plate, and The clip is used to sandwich the circuit board and the side plate. The light-emitting component is disposed on the circuit board and located between the circuit board and the light-incident surface, and is electrically connected to the circuit board. In an embodiment of the invention, the lower plate has a mounting hole adjacent to the side plate, and the edge of the circuit board adjacent to the lower plate has a convex portion corresponding to the mounting hole, and the protruding portion is inserted into the mounting hole. this invention In one embodiment, the frame structure further includes an upper plate connected to the side plate and located beside the first surface. In an embodiment of the invention, the upper plate is, for example, a plastic frame. In one embodiment of the invention, the upper plate has a uniform hole, and the clip is adapted to be inserted into the hole of the mussel to insulate the circuit board and the side plate. In an embodiment of the invention, the side-into-light backlight module is The upper surface of the stack of the upper plate may have a first slide rail, and the surface of the lower panel may have a second slide rail, wherein the first slide is opposite to the second slide rail, and the circuit board is disposed on the side panel In an embodiment of the invention, the material of the side plate and the lower plate comprises a metal. In an embodiment of the invention, the light-emitting element is, for example, illuminated. In one embodiment of the invention, the circuit board described above is, for example, a metal core 200842450^5284 21300 twf.doc/n printed circuit board. In order to achieve the above or other objects, the present invention further provides a liquid crystal display device comprising: a night crystal display panel and any one of the above two side edge light-emitting moonlight modules. Below the LCD panel. In the liquid crystal display of the present invention and the side entrance light-emitting backlight module, the slide plate or the clip is used to make the circuit board flatly attached to the side plate of the frame structure, so that the heat generated by the light-emitting element can be passed through The board is effectively circulated to the frame structure. Therefore, the present invention can improve the disadvantages of the conventional side-lighting backlight module having poor heat dissipation efficiency. The above and other objects, features and advantages of the present invention will become more <RTIgt; [Embodiment] FIG. 2A is a cross-sectional view of a side-lighting type backlight module according to an embodiment of the present invention. Referring to FIG. 2A, the side-lit backlight module 2A includes a G-light guide 210, a frame structure 220, a circuit board 230, and at least one light-emitting element 240. The light guide plate 210 has a first surface 2丨2, a second surface 214, and at least one light incident surface 216 connecting the first surface 212 and the second surface 214, wherein the first surface 212 is a light emitting surface. The frame structure 22 is used to carry the light guide plate 210 and expose the first surface 212. The frame structure 220 includes an upper plate 222, a lower plate 224, and a side plate 226. The upper plate 222 is located beside the first surface 212, and the downwardly facing surface of the upper plate 222 has a first slide rail 222a. The upper plate 222 is, for example, a plastic frame. The lower plate 224 is located below the second surface 11 200842450 ^ yzm 2i300 twf.d 〇 c / n surface 214, and the upper surface of the lower plate 224 has a second sliding rail 224a, wherein the second sliding rail 224a and the first sliding 222a relatively. The first rail 222a is formed, for example, by the upper plate 222, or by other suitable means. The second slide 224a is formed, for example, by the original panel forming the lower panel 224 being bent through the opening, or formed by other suitable means. The side plates 226 are connected to the upper plate 222 and the lower plate 224' and are located beside the light incident surface 216. The material of the lower plate 224 and the side plate 226 includes metal. The circuit board 230 is disposed between the side plate 226 and the p-sliding 222a and the second sliding rail 224a, and is located between the side plate 226 and the light incident surface 216. The circuit board 230 is, for example, a metal core printed circuit board. Further, the circuit board 230 can be slid into the frame structure 220 along the first rail 222a and the second rail 224a by the direction of the vertical plane during assembly. The illuminating element 240 is disposed on the circuit board 230 and electrically connected to the circuit board 230, and the illuminating element 240 is located between the circuit board 230 and the light incident surface 216. The light emitting element 240 is, for example, a light emitting diode. The side entrance light-emitting backlight module 200a has the first sliding 222a and the second sliding 224a, so that the circuit board 230 can be sandwiched between the side plate 226 and the first sliding 222a and the second sliding rail 224a, so that the circuit The plate 230 is attached flatly to the side panels 226. Therefore, the present embodiment enables the heat generated by the light-emitting element 24 to be efficiently conducted to the frame structure 22 via the circuit board 230. In addition, since the circuit board 230 of the side-lighting backlight module 2〇〇a of the embodiment is of a removable design, the components can be easily replaced, and the time and cost of rework can be reduced. 2B is a cross-sectional view of a side-lit backlight module according to another embodiment of the present invention. Referring to FIG. 2A and FIG. 2B, the side-input backlight module 12 200842450 95284 21300 twf.doc/n 200b is substantially the same as the side-lit backlight module 200a, and the differences are as follows. The side-lighting backlight module 200b further includes a locking member 250, and the side plate 226 of the frame structure 220' further has a first locking hole 226a, and the circuit board 230' has a second locking function. Hole 232. The locking member 250 passes through the first locking hole 226a and the second locking hole 232 to lock the circuit board 230 to the side plate 226'. As a result, the circuit board 23 can be further ensured and attached to the side plate 226' in a flat manner. 2C is a cross-sectional view of a side-lighting type backlight module according to still another embodiment of the present invention, and FIG. 2D is a cross-sectional view of the circuit board taken along line A-A of FIG. 2C and without a circuit board. 2A, 2C, and 2D, the side-lighting backlight module 200c is substantially the same as the side-lighting backlight module 2A, and the difference lies in the first sliding 222a, 222a of the two. Or the design of the second slipper 224a, 224a' is different. The first sliding 222a may include at least one elastic rail 222b having a connecting portion 222c, a bent portion 222d and a free portion 222e. The connecting section 222c is connected to the upper plate 222, and the bent section 222d is connected between the connecting section 222c and the free section 222e. The distance Β between the free segment 222e and the side plate 226 is smaller than the distance C between the connecting segment 222c and the side plate 226, and the distance B is preferably slightly smaller than the thickness F of the circuit board 230. When the circuit board 230 slides into the frame structure 220 in the direction of the arrow D, the free section 222e can abut the circuit board 230 to cause the circuit board 230 to be flatly attached to the side panel 226. In addition, the surface of the upper plate 222 adjacent to the bent section 222d and the free section 222e may be recessed to form a recessed space 222g to prevent the bent section 222d and the free section 222e from rubbing against the surface of the upper plate 222 when actuated. 13 200842450 95284 21300twf.doc/n Furthermore, the first sliding 222a' may further include at least a straight track 222f, which is followed by the free segment 222e, wherein the distance between the straight 222f and the side plate 226 E is greater than or equal to the thickness F of the circuit board 230 so that the circuit board 230 smoothly slides along the first rail 222a. The design of the second sliding 224a' can be the same as that of the first sliding 222a, and will not be repeated here. It should be noted that, in this embodiment, one of the first sliding 222a and the first sliding rail 224a' may be designed to have a flexible manner, and the other is designed to be the first sliding rail 222a or the second sliding 22 know the same. In addition, in this embodiment, the first sliding rail 222a and the second sliding rail 224a can also be designed to have elastic behavior. 2E is a cross-sectional view showing a side-into-light backlight module according to still another embodiment of the present invention. Referring to FIGS. 2A and 2E, the edge-lit backlight module 2〇〇d is substantially the same as the side-lit backlight module 200a, except that the circuit board 230” is different from the circuit board 230. The plate 230" has a curved edge 234 bent toward the light guide plate 21 near both sides of the upper plate 222 and the lower plate 224. The curved edge 234 can strengthen the structural strength of the circuit board 230", so that the circuit board 230" is not easily bent. It can be deformed to keep it flat. In this way, the circuit board 23 can be further ensured to be attached to the side plate 226. FIG. 3A is a cross-sectional view of a side-lighting backlight module according to another embodiment of the present invention, and FIG. 3B is applicable to FIG. A side view of the clips of various shapes of this embodiment. Referring to FIG. 3A and FIG. 3B, the side entrance light-emitting moonlight module 300a includes a light guide plate 31, a frame structure 320, a circuit board 330, and at least a light-emitting element 340 and at least one clip 350. The light guide plate 310 has a first surface 312, a second surface 314, and at least one of the first surface 212 and the second surface 214 connected to the first surface 212 and the second surface 214. The light incident surface 316, wherein the first surface 312 is a light emitting surface, the frame structure 32 is configured to carry the light guide plate 31 and blast out the first surface 312. The frame structure 320 includes a lower plate 324 and a side plate 326. The lower plate 324 is located The second plate 326 is connected to the lower plate 324 and is located next to the light incident surface 316. The material of the lower plate 324 and the side plate 326 includes metal. The frame structure 320 may further include an upper plate 322 connected to the side plate 326 and located at the Next to a surface 212. Upper plate 32 2, for example, a plastic frame. In addition, the upper plate 322 has a cross section of, for example, an L shape, and the upper plate 322 can be wrapped around the side plate 326. The circuit board 33 is disposed on the side plate 326 and is located at the side plate 326 and The circuit board 33 is, for example, a metal core printed circuit board. The clip 350 sandwiches the circuit board 330 and the side plate 326. The clip 350 may be made of metal, for example, in the form of a stamped continuous mold. The metal clips 350a to 350d are formed as shown in Fig. 3B, and the material of the clip 350 may be plastic, for example, extruded and cut in a strip shape to form a plastic clip 350e as shown in Fig. 3B. The light-emitting element 34 is disposed on the circuit board 330 and electrically connected to the circuit board 330, and the light-emitting element 34 is located between the circuit board 330 and the light-incident surface 316. The light-emitting element 340 is, for example, a light-emitting diode. Since the optical backlight module 300a sandwiches the circuit board 330 and the side plate 326 by using the clip 350, the circuit board 33 can be attached to the side plate 326 in a flat manner. Therefore, the present embodiment can generate the light-emitting element 34. The heat is efficiently conducted to the frame structure 32() via the circuit board 330. 3C is a schematic diagram of inserting the convex portion of the circuit board into the mounting hole of the side plate. Please refer to FIG. 3A and FIG. 3C, the side-lighting backlight module 3〇〇a 15 200842450 2i300twf.doc/n The lower plate 324 may have at least one mounting hole 324a adjacent to the side plate 326, and the edge of the circuit board 330 near the lower plate 324 has at least one convex portion 332 corresponding to the mounting hole 324a. When assembling the circuit board 330, the convex portion The 332 is inserted into the corresponding mounting hole 324a. In this way, the relative positions of the circuit board 330 and the side plates 326 can be appropriately fixed, and the circuit board 330 can be further ensured to be attached to the side plates 326 in a flat manner. It is worth mentioning that, in various embodiments, when the pitch of the plurality of light-emitting elements 340 is too small, the clips 350 may be replaced by wires having a shape similar to ρ. 3D is a cross-sectional view of a side-lit backlight module according to still another embodiment of the present invention. Referring to FIG. 3D, the side-lit backlight module 3〇〇b is substantially the same as the side-lit backlight module 300a, with the difference that the upper plate 322a and the upper plate 322 are different in design. The upper plate 322a has at least a uniform hole 322b so that the clip 350 is inserted from the through hole 322b to sandwich the circuit board 330 and the side plate 326 when assembled. 3E is a cross-sectional view of a side-lit backlight module according to still another embodiment of the present invention. Referring to FIG. 3D and FIG. 3E, the side-lighting backlight module ϋ is substantially the same as the side-lighting backlight module 300b, and the difference is that the upper board 322c, the lower board 324b, and the circuit board 330a are respectively designed and mounted. The design of the board 322a, the lower board 324, and the circuit board 330 is different. The upper plate 322c has a through hole 322b as well as the upper plate 322a, but the lower surface of the upper plate 322c further has at least one first slide rail 322d. The lower plate 324b does not have a mounting hole, and the edge of the circuit board 330a near the lower plate 324b does not have a convex portion. The upper surface of the lower plate 324b has a second sliding rail 324c, wherein the second sliding rail 324c is opposite to the first sliding rail 322d, and the circuit board 330a is disposed on the side panel 326 and 16 200842450 95284 2l300twf.doc/n first sliding Between the rail 322d and the second rail 324c. In this way, the first slide rail 322d and the second slide rail 324c can assist the clip 350 to fix the circuit board 330a, so that the circuit board 330a is flatly attached to the side panel 326. The method of forming the first sliding 322d and the second sliding rail 324c and the method of placing the circuit board 330a into the frame structure 320 are as described in the embodiment of FIG. 2A, and will not be repeated here. 4 is a schematic view of a liquid crystal display device according to an embodiment of the present invention. Referring to FIG. 4, the liquid crystal display device 4 of the present invention includes a liquid crystal display panel 410 and a side-lit optical backlight module 420 disposed under the liquid crystal display panel 41A. The side-lighting backlight module 420 may be one of the side-input backlight modules 2〇〇a to 200d, 300a to 300c of the foregoing embodiments or other side-lighting light having the features of the present invention. Backlight module. In addition, the light guide plate (not shown) of the backlight module 420 is disposed with the light emitting surface facing the liquid crystal display panel 410, that is, the surface light source provided by the backlight module 42 is emitted from the side adjacent to the liquid crystal display panel 410. . In summary, since the present invention uses a slide rail or a clip to make the circuit board flatly attached to the side panel of the frame structure, and can be matched with the auxiliary member of the locking member or the curved edge of the circuit board, the light-emitting element can be obtained. The heat is efficiently conducted to the frame structure via the board. Therefore, the liquid crystal display device of the present invention and the side entrance light-emitting backlight module have good heat dissipation efficiency. In addition, in the sliding side-lit backlight module, the circuit board is assembled and removed, which makes it easy to replace components and reduce the time and cost of rework. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one skilled in the art, without departing from the spirit of the invention, will be able to devise the scope of the invention. Make some changes and refinements, so the scope is defined as the protection of the invention as defined in the attached patent application. [Simplified illustration] The figure is a cross-section of a conventional side-light human backlight module. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 2B is a side cross-sectional optical cross-sectional view of another embodiment of the present invention, which is a cross-sectional view of a side-lighting type backlight module of the present invention. The vertical figure of the present invention is not intended for the side of the human-light backlight module of the embodiment. 2D is a cross-sectional view of the A_A section line in Fig. 2C without a circuit board mounted. Fig. 2E is a cross-sectional view of a side-lit backlight module of a further embodiment of the present invention. 3A is a cross-sectional view of a side-lit backlight module according to another embodiment of the present invention. Figure 3B is a side elevational view of a variety of differently shaped moxibustion tablets that can be used in the embodiment of Figure 3A. 3C is a view showing the mounting hole of the side opposite to the side of the projection of the circuit. Fig. 3D is a cross-sectional view of the side-lighting type backlight module of the embodiment of the present invention. 18 200842450 zi J00twf.doc/n FIG. 3E is a cross-sectional view of a side-lit backlight module according to still another embodiment of the present invention. 4 is a schematic view of a liquid crystal display device according to an embodiment of the present invention. [Description of main component symbols] 100, 200a to 200d, 300a to 300c, 420: side-lighting backlight modules 110, 210, 310: light guide plates, 112, 212, 312: first surface defects 114, 214, 314 : second surface 116, 216, 316: light-incident surface 120: metal frame structure 122, 226, 226', 326: side plate 124: back plate 130: metal core printed circuit board 140, 240, 340: light-emitting element 150: heat dissipation Pads 220, 320 · Frame structures 230, 230', 230", 330, 330a: circuit boards 222, 322, 322a, 322c: upper boards 222a, 222a', 322d: first rails 222b: elastic road 222c · Connecting section 222d: bending section 222e: free section 19 200842450 y z. 1300twf.d〇c/ll 222f: straight rail 222g: recessed space 322b: through holes 224, 324, 324b: lower plates 224a, 224a, 324c: second slide rail 226a · first locking hole 232 · second locking hole 234: curved edge f 250 : locking member 324a : mounting hole 332 : boss 350 · clip 350a ~ 350d : Metal clip 350e : Plastic clip 400 : Liquid crystal display device 410 · Liquid crystal display panel QB, C : Distance D : Arrow E : Spacing F : Thickness 2 0