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TWI350855B - - Google Patents

Info

Publication number
TWI350855B
TWI350855B TW096107342A TW96107342A TWI350855B TW I350855 B TWI350855 B TW I350855B TW 096107342 A TW096107342 A TW 096107342A TW 96107342 A TW96107342 A TW 96107342A TW I350855 B TWI350855 B TW I350855B
Authority
TW
Taiwan
Application number
TW096107342A
Other versions
TW200837203A (en
Inventor
Naohiko Era
Kazuhiko Fukamachi
Hiroshi Kuwagaki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW200837203A publication Critical patent/TW200837203A/zh
Application granted granted Critical
Publication of TWI350855B publication Critical patent/TWI350855B/zh

Links

TW96107342A 2005-10-14 2007-03-03 Cu-Ni-Si-based copper alloy for electronic material TW200837203A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005300249A JP4754930B2 (ja) 2005-10-14 2005-10-14 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系銅合金

Publications (2)

Publication Number Publication Date
TW200837203A TW200837203A (en) 2008-09-16
TWI350855B true TWI350855B (zh) 2011-10-21

Family

ID=38033155

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96107342A TW200837203A (en) 2005-10-14 2007-03-03 Cu-Ni-Si-based copper alloy for electronic material

Country Status (2)

Country Link
JP (1) JP4754930B2 (zh)
TW (1) TW200837203A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2669122C (en) * 2007-09-28 2012-03-20 Nippon Mining & Metals Co., Ltd. Cu-ni-si-co copper alloy for electronic materials and method for manufacturing same
JP4851596B2 (ja) * 2007-11-01 2012-01-11 古河電気工業株式会社 銅合金材の製造方法
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
JP4440313B2 (ja) * 2008-03-31 2010-03-24 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系合金
JP2011021225A (ja) * 2009-07-15 2011-02-03 Hitachi Cable Ltd 端子・コネクタ用銅合金材及びその製造方法
JP5638887B2 (ja) * 2010-09-10 2014-12-10 古河電気工業株式会社 銅合金材料の製造方法および銅合金部品
CN115386766A (zh) * 2022-08-11 2022-11-25 中国科学院金属研究所 一种Cu-Ni-Si-Cr-Mg五元铜合金及其制备方法
JP7648724B1 (ja) 2023-12-07 2025-03-18 Ｊｘ金属株式会社 銅合金及び電子部品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02221344A (ja) * 1989-02-21 1990-09-04 Mitsubishi Shindoh Co Ltd 熱間圧延性およびめっき加熱密着性のすぐれた高強度Ｃｕ合金
JP3511648B2 (ja) * 1993-09-27 2004-03-29 三菱伸銅株式会社 高強度Ｃｕ合金薄板条の製造方法
JP3800279B2 (ja) * 1998-08-31 2006-07-26 株式会社神戸製鋼所 プレス打抜き性が優れた銅合金板
JP2001207229A (ja) * 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd 電子材料用銅合金
JP4584692B2 (ja) * 2004-11-30 2010-11-24 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板およびその製造方法
JP2006265731A (ja) * 2005-02-28 2006-10-05 Furukawa Electric Co Ltd:The 銅合金

Also Published As

Publication number Publication date
JP4754930B2 (ja) 2011-08-24
TW200837203A (en) 2008-09-16
JP2007107062A (ja) 2007-04-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees