[go: up one dir, main page]

TWI350575B - Integrated circuit die suitable for multiple packaging modes - Google Patents

Integrated circuit die suitable for multiple packaging modes

Info

Publication number
TWI350575B
TWI350575B TW096118883A TW96118883A TWI350575B TW I350575 B TWI350575 B TW I350575B TW 096118883 A TW096118883 A TW 096118883A TW 96118883 A TW96118883 A TW 96118883A TW I350575 B TWI350575 B TW I350575B
Authority
TW
Taiwan
Prior art keywords
integrated circuit
circuit die
multiple packaging
die suitable
packaging modes
Prior art date
Application number
TW096118883A
Other languages
English (en)
Other versions
TW200847305A (en
Inventor
Hsien Chun Chang
Chia Lung Hung
Tsung Chi Lin
Tzuo Bo Lin
Original Assignee
Realtek Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Realtek Semiconductor Corp filed Critical Realtek Semiconductor Corp
Priority to TW096118883A priority Critical patent/TWI350575B/zh
Priority to US12/127,265 priority patent/US8513708B2/en
Publication of TW200847305A publication Critical patent/TW200847305A/zh
Application granted granted Critical
Publication of TWI350575B publication Critical patent/TWI350575B/zh

Links

Classifications

    • H10W72/00—
    • H10W72/90—
    • H10W90/00—
    • H10W72/075—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/932—
    • H10W72/951—
    • H10W90/732—
    • H10W90/752—
    • H10W90/756—
TW096118883A 2007-05-25 2007-05-25 Integrated circuit die suitable for multiple packaging modes TWI350575B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096118883A TWI350575B (en) 2007-05-25 2007-05-25 Integrated circuit die suitable for multiple packaging modes
US12/127,265 US8513708B2 (en) 2007-05-25 2008-05-27 Integrated circuit for various packaging modes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096118883A TWI350575B (en) 2007-05-25 2007-05-25 Integrated circuit die suitable for multiple packaging modes

Publications (2)

Publication Number Publication Date
TW200847305A TW200847305A (en) 2008-12-01
TWI350575B true TWI350575B (en) 2011-10-11

Family

ID=40071578

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096118883A TWI350575B (en) 2007-05-25 2007-05-25 Integrated circuit die suitable for multiple packaging modes

Country Status (2)

Country Link
US (1) US8513708B2 (zh)
TW (1) TWI350575B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012114241A (ja) * 2010-11-25 2012-06-14 Renesas Electronics Corp 半導体チップおよび半導体装置
US9564903B2 (en) * 2013-12-20 2017-02-07 Qualcomm Technologies International, Ltd. Port spreading
TWI700795B (zh) 2019-03-26 2020-08-01 瑞昱半導體股份有限公司 積體電路晶片及用於其之組態調整方法
CN111766935B (zh) * 2019-04-02 2022-06-21 瑞昱半导体股份有限公司 集成电路芯片及用于集成电路芯片的组态调整方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4990996A (en) * 1987-12-18 1991-02-05 Zilog, Inc. Bonding pad scheme
JP2000243907A (ja) 1999-02-17 2000-09-08 Sony Corp 半導体チップとパッケージ
JP2003332376A (ja) 2002-05-15 2003-11-21 Matsushita Electric Ind Co Ltd 半導体装置
TWI244189B (en) 2004-01-02 2005-11-21 Via Tech Inc Arrangement of bonding wires in a semiconductor chip package
US7173340B2 (en) * 2004-02-25 2007-02-06 Texas Instruments Incorporated Daisy chaining of serial I/O interface on stacking devices
US7518231B2 (en) 2005-08-15 2009-04-14 Infineon Technologies Ag Differential chip performance within a multi-chip package
TWM294736U (en) 2005-12-08 2006-07-21 Mstar Semiconductor Inc Interconnect for multi-chip encapsulation
US7679198B2 (en) * 2007-05-04 2010-03-16 Micron Technology, Inc. Circuit and method for interconnecting stacked integrated circuit dies

Also Published As

Publication number Publication date
US8513708B2 (en) 2013-08-20
TW200847305A (en) 2008-12-01
US20080290375A1 (en) 2008-11-27

Similar Documents

Publication Publication Date Title
TWI366910B (en) Semiconductor package
AU315662S (en) Package
AU318966S (en) Packaging
AU320392S (en) Packaging
AU313874S (en) Package
GB0920099D0 (en) Insert package
GB0715606D0 (en) Packaging
GB0721439D0 (en) Packaging
IL205400A0 (en) Packaging unit
TWI348755B (en) Integrated circuit package system with offset stacked die
TWI339881B (en) Chip package
TWI366971B (en) Semiconductor integrated circuit
GB0822089D0 (en) Integrated circuit package
EP2027026A4 (en) PACKAGING
PL1820741T3 (pl) Opakowanie
TWI350575B (en) Integrated circuit die suitable for multiple packaging modes
GB2454776B (en) Semiconductor integrated circuit
GB0716443D0 (en) Packaging unit
GB2453224B (en) Semiconductor integrated circuit
AU316596S (en) Packaging
GB0702250D0 (en) Rigid packaging
GB2448066B (en) Ram circuit
TWI349993B (en) Semiconductor package
TWI371400B (en) Package
GB0720002D0 (en) Packaging