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TWI350018B - Glass substrate sealing system - Google Patents

Glass substrate sealing system

Info

Publication number
TWI350018B
TWI350018B TW096148582A TW96148582A TWI350018B TW I350018 B TWI350018 B TW I350018B TW 096148582 A TW096148582 A TW 096148582A TW 96148582 A TW96148582 A TW 96148582A TW I350018 B TWI350018 B TW I350018B
Authority
TW
Taiwan
Prior art keywords
glass substrate
sealing system
substrate sealing
glass
substrate
Prior art date
Application number
TW096148582A
Other languages
Chinese (zh)
Other versions
TW200828646A (en
Inventor
Hong-Jin Park
Ei-Ho Choi
Jae-Bong Han
Kwang-Jin Jeon
Joo-Jong Song
Tae-Hyun Um
Jung-Hyun Lee
Original Assignee
Lts Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lts Co Ltd filed Critical Lts Co Ltd
Publication of TW200828646A publication Critical patent/TW200828646A/en
Application granted granted Critical
Publication of TWI350018B publication Critical patent/TWI350018B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW096148582A 2006-12-29 2007-12-19 Glass substrate sealing system TWI350018B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060138459A KR100837618B1 (en) 2006-12-29 2006-12-29 Glass board sealing system and sealing method

Publications (2)

Publication Number Publication Date
TW200828646A TW200828646A (en) 2008-07-01
TWI350018B true TWI350018B (en) 2011-10-01

Family

ID=39695428

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148582A TWI350018B (en) 2006-12-29 2007-12-19 Glass substrate sealing system

Country Status (3)

Country Link
JP (1) JP4665260B2 (en)
KR (1) KR100837618B1 (en)
TW (1) TWI350018B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI623120B (en) * 2014-07-29 2018-05-01 Laser sealed glass package packaging system and packaging method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101065641B1 (en) * 2009-07-09 2011-09-19 주식회사 엘티에스 Sealing system and sealing method of flat panel display
KR101710852B1 (en) * 2012-02-27 2017-02-27 코닝 인코포레이티드 LOW Tg GLASS GASKET FOR HERMETIC SEALING APPLICATIONS
JP6464593B2 (en) 2014-07-24 2019-02-06 セイコーエプソン株式会社 Gas cell manufacturing method
CN110331384B (en) * 2019-07-29 2023-08-29 陕西煤业化工技术研究院有限责任公司 Flexible film surface treatment method and gas injection device
US12451377B2 (en) * 2023-03-31 2025-10-21 Microcircuit Laboratories, Llc Robotic cover sealer

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06337429A (en) * 1993-05-27 1994-12-06 M B K Maikurotetsuku:Kk Press and alignment device for liquid crystal cell
JP2000251720A (en) * 1999-02-25 2000-09-14 Canon Inc Image forming apparatus sealing method and manufacturing apparatus
JP2001237066A (en) * 2000-02-25 2001-08-31 Toray Ind Inc Organic electroluminescent device and method of manufacturing the same
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
JP2005203286A (en) * 2004-01-16 2005-07-28 Sanyo Electric Co Ltd Display panel manufacturing method and display panel
JP2005209413A (en) * 2004-01-20 2005-08-04 Sanyo Electric Co Ltd Display panel manufacturing method and display panel
JP2006318862A (en) * 2005-05-16 2006-11-24 Futaba Corp Manufacturing method of vacuum display panel
KR100685854B1 (en) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 Organic light emitting display device and manufacturing method
KR100713987B1 (en) * 2006-02-20 2007-05-04 삼성에스디아이 주식회사 Substrate adhesion device and sealing method of organic light emitting display device using the same
JP2007299549A (en) * 2006-04-27 2007-11-15 Rohm Co Ltd Image device
JP2007299548A (en) * 2006-04-27 2007-11-15 Rohm Co Ltd Manufacturing method of sealed container

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI623120B (en) * 2014-07-29 2018-05-01 Laser sealed glass package packaging system and packaging method

Also Published As

Publication number Publication date
TW200828646A (en) 2008-07-01
KR100837618B1 (en) 2008-06-13
JP2008166287A (en) 2008-07-17
JP4665260B2 (en) 2011-04-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees