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TWI350011B - Light emitting device and method for making the light emitting device - Google Patents

Light emitting device and method for making the light emitting device

Info

Publication number
TWI350011B
TWI350011B TW096101386A TW96101386A TWI350011B TW I350011 B TWI350011 B TW I350011B TW 096101386 A TW096101386 A TW 096101386A TW 96101386 A TW96101386 A TW 96101386A TW I350011 B TWI350011 B TW I350011B
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting device
making
light
emitting
Prior art date
Application number
TW096101386A
Other languages
English (en)
Other versions
TW200744232A (en
Inventor
Goro Narita
Original Assignee
Element Denshi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Element Denshi Co Ltd filed Critical Element Denshi Co Ltd
Publication of TW200744232A publication Critical patent/TW200744232A/zh
Application granted granted Critical
Publication of TWI350011B publication Critical patent/TWI350011B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H10W70/681—
    • H10W70/682—
    • H10W72/884—
    • H10W90/724—
TW096101386A 2006-05-24 2007-01-15 Light emitting device and method for making the light emitting device TWI350011B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006144613A JP3914954B1 (ja) 2006-05-24 2006-05-24 発光装置およびその製造方法

Publications (2)

Publication Number Publication Date
TW200744232A TW200744232A (en) 2007-12-01
TWI350011B true TWI350011B (en) 2011-10-01

Family

ID=38156613

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101386A TWI350011B (en) 2006-05-24 2007-01-15 Light emitting device and method for making the light emitting device

Country Status (5)

Country Link
US (1) US20070278483A1 (zh)
JP (1) JP3914954B1 (zh)
KR (1) KR100785554B1 (zh)
CN (1) CN100479213C (zh)
TW (1) TWI350011B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021420A (ja) * 2008-07-11 2010-01-28 Denka Agsp Kk 発光素子搭載用基板、発光素子パネル、発光素子パッケージおよび発光素子搭載用基板の製造方法
JP2011077275A (ja) * 2009-09-30 2011-04-14 Toppan Printing Co Ltd Ｌｅｄパッケージおよびその製造方法
CN102593271A (zh) * 2011-01-14 2012-07-18 九介企业股份有限公司 发光二极管封装结构与其槽型封装导线架的形成方法
CN103380502B (zh) * 2011-03-24 2016-10-12 株式会社村田制作所 发光元件用基座基板以及led器件
JP6244130B2 (ja) * 2013-07-26 2017-12-06 新光電気工業株式会社 発光素子搭載用パッケージ及び発光素子パッケージ
JP2017135326A (ja) * 2016-01-29 2017-08-03 イビデン株式会社 発光素子搭載用基板、及び、発光素子搭載用基板の製造方法
JP2018129469A (ja) * 2017-02-10 2018-08-16 イビデン株式会社 発光素子搭載用基板、及び、発光素子搭載用基板の製造方法
CN113251761B (zh) * 2021-06-08 2022-03-11 淮北市三丰肥业有限公司 一种用于功能性化肥生产的干燥包膜设备及其工作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114293A (en) 1981-01-06 1982-07-16 Sanyo Electric Co Ltd Manufacture of light emitting diode substrate
JPH0774395A (ja) * 1993-08-31 1995-03-17 Victor Co Of Japan Ltd 発光ダイオード装置及びその製造方法
JP3127195B2 (ja) * 1994-12-06 2001-01-22 シャープ株式会社 発光デバイスおよびその製造方法
DE19549818B4 (de) * 1995-09-29 2010-03-18 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiter-Bauelement
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
JP4280050B2 (ja) 2002-10-07 2009-06-17 シチズン電子株式会社 白色発光装置
WO2004068596A1 (en) * 2003-01-25 2004-08-12 Nam-Young Kim Lamp module with light emitting diode
TWI239670B (en) * 2004-12-29 2005-09-11 Ind Tech Res Inst Package structure of light emitting diode and its manufacture method

Also Published As

Publication number Publication date
KR100785554B1 (ko) 2007-12-13
JP3914954B1 (ja) 2007-05-16
CN101079462A (zh) 2007-11-28
CN100479213C (zh) 2009-04-15
TW200744232A (en) 2007-12-01
KR20070113097A (ko) 2007-11-28
US20070278483A1 (en) 2007-12-06
JP2007317803A (ja) 2007-12-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees