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TWI349961B - Surface protection film peeling method and surface protection film peeling device - Google Patents

Surface protection film peeling method and surface protection film peeling device

Info

Publication number
TWI349961B
TWI349961B TW096117846A TW96117846A TWI349961B TW I349961 B TWI349961 B TW I349961B TW 096117846 A TW096117846 A TW 096117846A TW 96117846 A TW96117846 A TW 96117846A TW I349961 B TWI349961 B TW I349961B
Authority
TW
Taiwan
Prior art keywords
protection film
surface protection
film peeling
peeling device
peeling method
Prior art date
Application number
TW096117846A
Other languages
English (en)
Other versions
TW200814174A (en
Inventor
Isamu Kawashima
Hideshi Sato
Hideo Kino
Minoru Ametani
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200814174A publication Critical patent/TW200814174A/zh
Application granted granted Critical
Publication of TWI349961B publication Critical patent/TWI349961B/zh

Links

Classifications

    • H10P95/00—
    • H10P72/0442—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW096117846A 2006-05-19 2007-05-18 Surface protection film peeling method and surface protection film peeling device TWI349961B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006140074A JP4688728B2 (ja) 2006-05-19 2006-05-19 表面保護フィルム剥離方法および表面保護フィルム剥離装置

Publications (2)

Publication Number Publication Date
TW200814174A TW200814174A (en) 2008-03-16
TWI349961B true TWI349961B (en) 2011-10-01

Family

ID=38291176

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117846A TWI349961B (en) 2006-05-19 2007-05-18 Surface protection film peeling method and surface protection film peeling device

Country Status (6)

Country Link
US (1) US8151856B2 (zh)
EP (1) EP1858060A1 (zh)
JP (1) JP4688728B2 (zh)
KR (1) KR100881449B1 (zh)
SG (1) SG137801A1 (zh)
TW (1) TWI349961B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4964070B2 (ja) * 2007-09-10 2012-06-27 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
JP4922201B2 (ja) * 2008-01-31 2012-04-25 リンテック株式会社 シート剥離装置及び剥離方法
JP5102138B2 (ja) * 2008-07-31 2012-12-19 株式会社ディスコ 保護テープ剥離装置
JP4740297B2 (ja) * 2008-09-04 2011-08-03 リンテック株式会社 マウント装置及びマウント方法
JP5159650B2 (ja) * 2009-01-16 2013-03-06 リンテック株式会社 シート貼付装置および貼付方法
CN102694064A (zh) * 2011-03-24 2012-09-26 株式会社日立高新技术 导电性膜的隔离膜剥离装置及太阳能电池组件组装装置
KR101989484B1 (ko) 2012-07-09 2019-06-17 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
TWI585028B (zh) * 2013-01-30 2017-06-01 斯克林集團公司 剝離裝置及剝離方法
KR102069851B1 (ko) 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
US9335367B2 (en) 2013-08-27 2016-05-10 International Business Machines Corporation Implementing low temperature wafer test
KR102128396B1 (ko) 2013-10-22 2020-07-01 삼성디스플레이 주식회사 필름 박리 장치
TWI555071B (zh) * 2014-05-07 2016-10-21 鴻積科機股份有限公司 使黏著物能夠轉換至另一膠膜的撕膜裝置
JP6406942B2 (ja) * 2014-09-05 2018-10-17 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
US9751293B2 (en) * 2014-12-04 2017-09-05 Industrial Technology Research Institute Laminated substrate separating device and method for separating laminated substrate
JP2016160072A (ja) * 2015-03-04 2016-09-05 株式会社ジャパンディスプレイ 剥離装置及び剥離ヘッド
CN105197583B (zh) * 2015-10-30 2017-06-23 江苏比微曼智能科技有限公司 Pcb板下板机
WO2018090362A1 (zh) * 2016-11-21 2018-05-24 江苏比微曼智能科技有限公司 一种贴膜自动剥离装置
CN109573607A (zh) * 2018-12-29 2019-04-05 昆山拓誉自动化科技有限公司 平板灯装配线用导光板装配工位
JP6916223B2 (ja) * 2019-01-30 2021-08-11 日機装株式会社 剥離装置
CN113911488B (zh) * 2021-10-21 2023-03-14 深圳市智显科技有限公司 一种新型lcd贴偏光片后再撕膜机构
JP7766467B2 (ja) * 2021-10-26 2025-11-10 株式会社ディスコ 剥離治具、剥離治具を用いたシート剥離方法及びシート剥離装置
CN114571716B (zh) * 2022-04-07 2024-08-23 深圳一鑫新材料有限公司 双面贴合设备
CN117008372A (zh) * 2022-04-29 2023-11-07 东捷科技股份有限公司 显示器及其亮点瑕疵处理方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0212597B1 (en) * 1985-08-16 1994-12-28 Somar Corporation Film peeling method and apparatus
JPH0691153B2 (ja) * 1987-11-28 1994-11-14 日東電工株式会社 保護フイルムの剥離方法
JPH0682750B2 (ja) * 1989-08-30 1994-10-19 日東電工株式会社 ウエハ保護シートの剥離方法
EP0848415A1 (en) * 1995-08-31 1998-06-17 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JP2001319906A (ja) * 2000-05-11 2001-11-16 Takatori Corp ウエハ表面保護テープの剥離装置
JP4739584B2 (ja) 2001-07-05 2011-08-03 リンテック株式会社 剥離装置
JP2003059862A (ja) * 2001-08-09 2003-02-28 Lintec Corp 剥離装置
KR20040026900A (ko) 2002-09-26 2004-04-01 삼성전자주식회사 보호 테이프 제거 설비 및 보호 테이프 제거 방법
US6971431B2 (en) * 2003-04-07 2005-12-06 Robert Steinberger Tape dispenser
JP4592289B2 (ja) 2004-01-07 2010-12-01 日東電工株式会社 半導体ウエハの不要物除去方法
JP4297829B2 (ja) * 2004-04-23 2009-07-15 リンテック株式会社 吸着装置
JP2006100728A (ja) * 2004-09-30 2006-04-13 Nitto Denko Corp 保護テープ剥離方法およびこれを用いた装置

Also Published As

Publication number Publication date
KR20070112078A (ko) 2007-11-22
US20070269962A1 (en) 2007-11-22
JP4688728B2 (ja) 2011-05-25
SG137801A1 (en) 2007-12-28
EP1858060A1 (en) 2007-11-21
JP2007311612A (ja) 2007-11-29
KR100881449B1 (ko) 2009-02-06
US8151856B2 (en) 2012-04-10
TW200814174A (en) 2008-03-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees