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TWI341389B - - Google Patents

Info

Publication number
TWI341389B
TWI341389B TW096124509A TW96124509A TWI341389B TW I341389 B TWI341389 B TW I341389B TW 096124509 A TW096124509 A TW 096124509A TW 96124509 A TW96124509 A TW 96124509A TW I341389 B TWI341389 B TW I341389B
Authority
TW
Taiwan
Application number
TW096124509A
Other languages
Chinese (zh)
Other versions
TW200819752A (en
Inventor
Kiyoshi Takekoshi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200819752A publication Critical patent/TW200819752A/en
Application granted granted Critical
Publication of TWI341389B publication Critical patent/TWI341389B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW96124509A 2006-07-31 2007-07-05 Probe pin TW200819752A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006208123A JP2008032620A (en) 2006-07-31 2006-07-31 Probe pin

Publications (2)

Publication Number Publication Date
TW200819752A TW200819752A (en) 2008-05-01
TWI341389B true TWI341389B (en) 2011-05-01

Family

ID=38997050

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96124509A TW200819752A (en) 2006-07-31 2007-07-05 Probe pin

Country Status (3)

Country Link
JP (1) JP2008032620A (en)
TW (1) TW200819752A (en)
WO (1) WO2008015868A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120043987A1 (en) * 2010-08-23 2012-02-23 Star Technologies Inc. Probe Card for Testing Semiconductor Devices and Vertical Probe Thereof
JP5870762B2 (en) * 2012-03-01 2016-03-01 三菱電機株式会社 Electrical property measurement method, contact probe
JP2013205191A (en) * 2012-03-28 2013-10-07 Nidai Seiko:Kk Spring probe and manufacturing method of spring probe
JP6337633B2 (en) * 2014-06-16 2018-06-06 オムロン株式会社 Probe pin
JP6737002B2 (en) * 2016-06-17 2020-08-05 オムロン株式会社 Probe pin
JP7620385B2 (en) * 2019-04-25 2025-01-23 オムロン株式会社 Probe pins, inspection jigs and inspection units
DE102022119935A1 (en) * 2022-08-08 2024-02-08 Ingun Prüfmittelbau Gmbh Test pin device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3924710B2 (en) * 1998-08-12 2007-06-06 東京エレクトロン株式会社 Contactor
JP4026281B2 (en) * 1999-08-06 2007-12-26 三菱電機株式会社 Test socket, manufacturing method thereof, and test method using test socket

Also Published As

Publication number Publication date
JP2008032620A (en) 2008-02-14
WO2008015868A1 (en) 2008-02-07
TW200819752A (en) 2008-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees