[go: up one dir, main page]

TWI340449B - Packaging substrate surface structure and method for fabricating the same - Google Patents

Packaging substrate surface structure and method for fabricating the same

Info

Publication number
TWI340449B
TWI340449B TW096123113A TW96123113A TWI340449B TW I340449 B TWI340449 B TW I340449B TW 096123113 A TW096123113 A TW 096123113A TW 96123113 A TW96123113 A TW 96123113A TW I340449 B TWI340449 B TW I340449B
Authority
TW
Taiwan
Prior art keywords
fabricating
same
substrate surface
surface structure
packaging substrate
Prior art date
Application number
TW096123113A
Other languages
Chinese (zh)
Other versions
TW200901419A (en
Inventor
Chao Wen Shih
Ying Chih Chan
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW096123113A priority Critical patent/TWI340449B/en
Publication of TW200901419A publication Critical patent/TW200901419A/en
Application granted granted Critical
Publication of TWI340449B publication Critical patent/TWI340449B/en

Links

Classifications

    • H10W72/012—
TW096123113A 2007-06-26 2007-06-26 Packaging substrate surface structure and method for fabricating the same TWI340449B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096123113A TWI340449B (en) 2007-06-26 2007-06-26 Packaging substrate surface structure and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096123113A TWI340449B (en) 2007-06-26 2007-06-26 Packaging substrate surface structure and method for fabricating the same

Publications (2)

Publication Number Publication Date
TW200901419A TW200901419A (en) 2009-01-01
TWI340449B true TWI340449B (en) 2011-04-11

Family

ID=44721656

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096123113A TWI340449B (en) 2007-06-26 2007-06-26 Packaging substrate surface structure and method for fabricating the same

Country Status (1)

Country Link
TW (1) TWI340449B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404182B (en) * 2009-04-24 2013-08-01 欣興電子股份有限公司 Package substrate and its manufacturing method and package structure
CN117374041A (en) * 2023-12-08 2024-01-09 英诺赛科(苏州)半导体有限公司 Packaging substrate and preparation method, packaging component, microelectronic component and electronic device
CN117594553B (en) * 2024-01-19 2024-04-09 苏州科阳半导体有限公司 Wafer level packaging structure and wafer level packaging method

Also Published As

Publication number Publication date
TW200901419A (en) 2009-01-01

Similar Documents

Publication Publication Date Title
TWI351087B (en) Package substrate and method for fabricating the same
TWI371809B (en) Wafer structure and method for fabricating the same
TWI365528B (en) Semiconductor structure and method for manufacturing the same
TWI348213B (en) Packaging substrate structure with capacitor embedded therein and method for fabricating the same
TWI365812B (en) Transfer film, method of manufacturing the same, transfer method and object surface structure
EP2096648A4 (en) Conductive film and method for manufacturing the same
EP2175492A4 (en) Semiconductor device and method for manufacturing the same
TWI371836B (en) Semiconductor device and method for fabricating the same
TWI372586B (en) Capacitor-embedded substrate and method of manufacturing the same
TWI341033B (en) Pixel structure and method for manufacturing the same
EP2201615B8 (en) Led package and method for manufacturing the led package
TWI348753B (en) Semiconductor package and the method for fabricating thereof
TWI341026B (en) Sensor-type semiconductor device and method for fabricating the same
TWI339883B (en) Substrate structure for semiconductor package and manufacturing method thereof
TWI341025B (en) Sensor semiconductor package and method for fabricating the same
TWI340451B (en) Packaging substrate structure with capacitor embedded therein and method for fabricating the same
EP2178127A4 (en) Device structure and method for manufacturing the same
ZA200908073B (en) Cordierite fiber substrate and method for forming the same
TWI371844B (en) Semiconductor device and method for manufacturing the same
EP2421026A4 (en) Substrate structure for semiconductor device fabrication and method for fabricating the same
TWI340450B (en) Packaging substrate structure with capacitor embedded therein and method for fabricating the same
TWI319615B (en) Package substrate and manufacturing method thereof
TWI366908B (en) Package structure and manufacturing method thereof
EP2224472B8 (en) Substrate and method for manufacturing the same
TWI351083B (en) Package structure and method of manufacturing the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees