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TWI340088B - - Google Patents

Info

Publication number
TWI340088B
TWI340088B TW095104878A TW95104878A TWI340088B TW I340088 B TWI340088 B TW I340088B TW 095104878 A TW095104878 A TW 095104878A TW 95104878 A TW95104878 A TW 95104878A TW I340088 B TWI340088 B TW I340088B
Authority
TW
Taiwan
Application number
TW095104878A
Other versions
TW200704518A (en
Inventor
Motoyuki Itoh
Kenichi Kubo
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Publication of TW200704518A publication Critical patent/TW200704518A/zh
Application granted granted Critical
Publication of TWI340088B publication Critical patent/TWI340088B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/40Inking units
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/34Screens, Frames; Holders therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/40Inking units
    • B41F15/42Inking units comprising squeegees or doctors
    • B41F15/426Inking units comprising squeegees or doctors the squeegees or doctors being magnetically attracted
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/44Squeegees or doctors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41PINDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00Screen printing machines
    • B41P2215/10Screen printing machines characterised by their constructional features
    • B41P2215/14Devices or methods for reducing snap effect
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139Blade or squeegee, e.g. for screen printing or filling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264Peeling insulating layer, e.g. foil, or separating mask
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104Using magnetic force, e.g. to align particles or for a temporary connection during processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Methods (AREA)
TW095104878A 2005-07-20 2006-02-14 Screen printing apparatus and screen priting method TW200704518A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005210122 2005-07-20
JP2005307496 2005-10-21

Publications (2)

Publication Number Publication Date
TW200704518A TW200704518A (en) 2007-02-01
TWI340088B true TWI340088B (zh) 2011-04-11

Family

ID=37668531

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104878A TW200704518A (en) 2005-07-20 2006-02-14 Screen printing apparatus and screen priting method

Country Status (5)

Country Link
US (1) US20090255425A1 (zh)
JP (1) JP2010012796A (zh)
KR (1) KR20080031277A (zh)
TW (1) TW200704518A (zh)
WO (1) WO2007010642A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104339897A (zh) * 2013-07-26 2015-02-11 凌通科技股份有限公司 低成本电子印章

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100944484B1 (ko) * 2008-02-04 2010-03-03 삼성전기주식회사 스크린 인쇄장치 및 스크린 인쇄방법
US20180015714A1 (en) * 2016-07-18 2018-01-18 Asm Assembly Systems Singapore Pte. Ltd. Screen printing apparatus and method
CN107215111B (zh) * 2017-06-14 2023-03-28 浙江大学 一种磁控转印印章及磁控转移印刷方法
CN107389877B (zh) * 2017-08-31 2024-12-27 京东方科技集团股份有限公司 刀口检验装置、方法及印刷修型系统
KR102147931B1 (ko) * 2018-12-28 2020-08-25 울산과학기술원 자석을 이용한 요철 형성방법 및 요철 형성장치
CN113117976B (zh) * 2021-04-13 2022-05-24 浙江蔚蓝航盾精密陶瓷科技有限公司 一种金属化陶瓷基板制造方法
CN114454613B (zh) * 2021-12-23 2023-04-21 前微科技(上海)有限公司 磁场开关和磁场开关的操作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319089U (zh) * 1976-11-17 1978-02-18
JPH039746Y2 (zh) * 1987-04-13 1991-03-11
JP3295274B2 (ja) * 1994-05-16 2002-06-24 キヤノン株式会社 スクリーン印刷機、スクリーン印刷方法、該方法を用いた画像形成装置の製造方法および該製造方法を用いて得られた画像形成装置
JP3835932B2 (ja) * 1998-09-10 2006-10-18 松下電器産業株式会社 スクリーン印刷装置およびスクリーン印刷方法
JP2001277470A (ja) * 2000-03-29 2001-10-09 Rasuko:Kk スクリーン印刷方法及び装置
JP2001297911A (ja) * 2000-04-13 2001-10-26 Dainippon Ink & Chem Inc 可撓性磁石シート
CN101398428B (zh) * 2002-11-07 2012-09-05 三菱化学美迪恩斯株式会社 用于收集磁性颗粒的磁性材料及其应用
JP2004291366A (ja) * 2003-03-26 2004-10-21 Micro-Tec Co Ltd スクリーン印刷装置及びスクリーン製版及びスクリーン印刷方法
JP2004314341A (ja) * 2003-04-14 2004-11-11 Kimio Ito 版離れ装置およびスクリーン印刷装置
JP4344272B2 (ja) * 2004-03-31 2009-10-14 株式会社小矢部精機 ワーク位置決め装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104339897A (zh) * 2013-07-26 2015-02-11 凌通科技股份有限公司 低成本电子印章
CN104339897B (zh) * 2013-07-26 2017-04-12 凌通科技股份有限公司 低成本电子印章
TWI639519B (zh) * 2013-07-26 2018-11-01 凌通科技股份有限公司 低成本電子印章

Also Published As

Publication number Publication date
JP2010012796A (ja) 2010-01-21
KR20080031277A (ko) 2008-04-08
US20090255425A1 (en) 2009-10-15
TW200704518A (en) 2007-02-01
WO2007010642A1 (ja) 2007-01-25

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