TWI235631B - Surface insulation method for multi-layered chip-type ceramic over-voltage suppressor device - Google Patents

Abstract

lectrode have excellent soldering characteristic. In addition, the main-body surface is prevented from being plated with metal to cause product malfunction due to short-circuit. Furthermore, when performing insulation coating onto the ceramic main-body before the manufacturing of terminal electrode, it is possible to have no electrical conduction between the terminal electrode manufactured in the following process, and the internal electrode for the terminal portion of the originally exposed internal electrode due to the block of the surface insulation layer. The present invention adopts dipping and etching method and thermal processing method to extend the internal electrode terminal portion outward, so as to assure the formation of excellent electric conduction between the internal electrode and the terminal electrode.

Description

1235631 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a multi-layer wafer type, in particular, to the surface over-voltage suppression benefit element electrode of the element can use # # sg _ / to make the element "The end" is applied to the soldering interface layer of the Japanese and Japanese chip components. The terminal electrode is plated-the end surface of the ceramic body is completely coated. It is all m-connection characteristics. At the same time, it can be avoided. Product short-circuit failure. [Previous technology] Recently: As electronic products become more mature and more demanding, the production of electronic circuits needs to compete with others-two tricks: functional enhancements. Basic requirements for high reliability with integrated circuits. Therefore, it is essentially a protection: pressure suppressor, a larger unit volume surge absorption capacity is applied in the direction of electric shock, is an inevitable result, and due to the lack of electromagnetic jMj) and electromagnetic compatibility (EMC Multi-layer ceramic over-voltage suppression is not widely used in electronic circuits of computer information and communication products. In addition, the transmission speed, high frequency bandwidth, high assembly density requirements, and compliance with regulations prevent ceramics from passing. The voltage suppressor is not only one step higher in the development of materials, but also various technologies such as chip forming that can be used with surface-mounted (SMT) circuits have promoted the development of the ceramic overvoltage suppressor industry, especially the multi-layer ceramic manufacturing process. The design and production of ceramic overvoltage suppressors have developed more widely. For example, the co-firing of electrodes in the multilayer ceramic manufacturing process involves the adjustment of the formulation of the Taumann overvoltage suppressor to reduce the sintering temperature and ceramic overvoltage suppression.

1235631 V. Description of the invention (2) :: Some components will react with the co-fired electrode, and the stability of the characteristics after adjusting the composition is an extremely important issue. -w = U, 1BA1C The conventional multilayer wafer-type ceramic over-electricity suppressor shown in the figure is made of Taoman green sheet, printed stacking, second electric sintering, and terminal electrode. "Structure, f using semiconductor or low-insulation material as a layer ceramic overvoltage suppressor and other chip-type electronic components = Method 2 uses Ag, Ag-pd4Ag_pd_pt as the terminal silver electrode, the terminal electrode of the electronic π part and The system circuit board is easy to be welded and combined, so that the electronic element should have the functions. After most of the electric wave is finished, f is plated with a welding electrode in the electro-mineral process. However, the multi-layer ceramic overvoltage suppressor is a Niyoto conductor! Raw materials: In the electroplating process, the electroplated metal M, pb —S Sn ore: On the ceramic body, make The short circuit of the component failed. ^ &S; Traditionally, the method to solve the above problems is to use precious metals and electrode materials, so that the terminal electrode does not need to be plated to have solderability. = The solderability of this type of terminal electrode and Reliability is still difficult ㈣Electric ^ pinch; I surface layer metal with the same welding quality and level. /, Ά In addition, there are two more important conventional insulation methods = extremely electric ore 'and will not be electroplated metal ore in ceramic 兖Dashi's practice and problems on the body are described as follows: The method of paper ^ Euro ^ Patent No. m is to soak multi-layer Taoman electrons in an aqueous solution of acid salt, and the main component of the body is zinc oxide to be acidified.

1235631 V. Description of the invention (3) After the liquid is dissolved, the concentration of the reactant is also formed. 2 · The Republic of China terminal electrode is formed to produce the insulation cover. The reduction of the use of electronic components will also limit the insulation. 3 · United States After the patent is completed, the production and then coating of the secondary electric silver electrode is not conducive to the production of zinc phosphate based on the surface of the zinc coating. The pH value and other conditions, and the use of ~ :: increase the cost of cereal fluid and environmental issues. The method of treating the waste solution after the patent # 447775 # Before running — on the Tao body, after the body is formed, the layer may cause the inner exposed pole, which was originally exposed! The efficiency and electrical performance of the electronic components in this method; the end is covered by the insulation layer at both ends of the insulation layer procedure, ^ 3 meaning must be added a layer of clearing material can withstand the temperature = electrode burning temperature must be 6232867 The method is based on the first & ceramic electronic component-shaped second-layer glass insulation layer of Xixun, and the manufacturing cost is controlled. Dealing with the problem of retelling of private sequence ’materials and processes and how to know how to do it. + What is missing is the present invention. [Content of the invention] The soldering interface layer of the terminal electrode production layer of the ceramic electronic component, so that the terminal electrode has the "technical problem to be solved" — the present invention is mainly to solve the 70% of multilayers. Plating process plating—

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Materials with good soldering properties, plating process on the ceramic body, make it problematic. 'However, in multilayer ceramics, the electrodes at both ends of the electroplated metallic Ni element will be connected to a semiconductor,' Pb-Sn or Sn ore ', which will cause the short circuit of the product. "Technical means to solve the problem" > The method is mainly coated on the surface of the multilayer ceramic suppressor body with glass, organic compounds, metals, or other highly insulating materials. After heat treatment, the shape of the surface of the ceramic body = an insulating layer, so that the component The terminal electrode can be applied to the traditional chip type components

^ Plating process, the terminal electrode is plated with a welding interface layer, so that the terminal electrode has good welding characteristics, and at the same time, the surface of the ceramic body can be plated with metal in the subsequent electroplating process, which causes product short circuit failure and the coating of the ceramic body surface The process of forming the edge layer can be performed before the ceramic body is sintered; or after the ceramic body is sintered and before the terminal electrode is manufactured; or after the ceramic body is sintered and the terminal electrode is manufactured and before the electroplating. In addition, when the insulating layer is coated on the surface of the ceramic body before the terminal electrode is manufactured, the exposed end of the internal electrode may be blocked by the surface insulating layer, so that the terminal electrode produced later cannot be electrically connected with the internal electrode. The technology of the present invention The hand # is mainly to apply an immersion method and a heat treatment method to extend the end of the internal electrode outward to ensure that the internal electrode and the terminal electrode form a good electrical conduction. "Effect on the prior art" Compared with the prior art, the insulation method of the present invention has the following advantages: · 1 · The formed insulating layer does not limit the choice of terminal electrode materials; 2 · The surface of the ceramic body has a flattening effect Can improve after soldering process

Page 8 1235631 V. Description of the invention (5) The cleaning effect of the recording aid, avoiding the leakage current caused by the flux residue, and the failure of the finished product; 3. The method of extending the inner electrode end outwardly according to the present invention can ensure The internal electrode blood end electrode forms a good electrical continuity without the need to increase the removal process of the two ends of the component; said 4. The heat treatment process of the surface insulation layer of the ceramic body can be combined with the end electrode firing process, and can also be combined with The sintering process of the ceramic body is combined and implemented. [The implementation method is a salt or body surface layer, so that the end welding characteristics are metallized. After the ceramic body and the ceramic body pole are manufactured, the ceramic will still be organically compounded. The thickness is semi-conductive. ] The oxide and gold voltage suppressors form an insulated electroplating system with good bonding short-circuit failure during ore sintering, before sintering; or sintering and termination of electricity as follows: A layer of glass, insulating material after sintering is mainly glass, organic Compounds, metals and other high-insulation materials are coated on the multilayer ceramics, and after that, the components are on the surface of the ceramic body The terminal electrode can be coated with a soldering interface layer on the traditional chip-type component electrode to make the terminal electrode, and at the same time avoid the subsequent electrical conduction of the ceramic body surface to make the two electrodes of the component conductive, resulting in the process of coating the surface with an insulating layer on the ceramic. After the body is sintered and before the terminal electrode is manufactured; or the ceramic body is applied before the electroplating, the specific implementation method details the uncoated multilayer ceramic green embryo overall surface coating, metal oxide, and metal salts before the body is sintered. Or another 1 ~ 100 / zm high, and then a sintering process to form an insulating layer on the surface of the ceramic body.

Page 9 of 1235631 V. Description of the invention (6) 1. Pottery will be sintered glass, organic materials, thickness semiconductor ceramics 3. Ceramics, multilayer ceramics, in the reaction process of component materials and metal after heat treatment of cloth materials After the melting process, and after the body is sintered, the terminal compound, gold is about 1 ~ 2 0, the ceramic material and the body are sintered, and the surface of the ceramic element is complete with salts or ceramics, which form an insulated or mixed current conducting terminal electrode. Coating the insulation layer before fabrication The surface of the ceramic body before fabrication is coated with a layer of vitreous oxide, metal salt or other high insulation #m. After heat treatment, the surface coating material on the surface of the ceramic body reacts to form an insulation layer. After the terminal electrode is manufactured, the insulating layer is coated to form a sintering process before the plating. After the terminal electrode is manufactured, the coating is plated = a layer of glass, organic compounds, and metal-oxygen and other insulating materials. The thickness is about 1 ~ 50 mm. The semi-conductive ceramic material and the surface coating edge layer, and the coating material on the surface of the terminal electrode are in the hot end electrode metal, which does not affect the subsequent electroplating of the above-mentioned component end insulation coating, which may cause the original barrier to 'make subsequent manufacturing this' Need to make the end of the internal electrode good electrical conduction, there are two: • After the ceramic body is sintered, the value and immersion time make it more resistant to erosion, the shape 2 · The internal electrode contains silver or the ceramic before the silver electrode is made The exposed internal electrode end electrode cannot extend outward with the internal electricity to ensure that the internal electrode end of the present invention is soaked with acid or alkali, and the surface of the body is immersed into an alloy component protruding from the end of the internal electrode on the surface body. The six surface conducting parts are electrically conductive due to the resistance of the surface insulating layer, and the internal electrode and the terminal electrode shape are extended outward to control the pH of the acid or alkaline solution. In vitro. Coating insulation layer and production

Page 10 V. Description of the invention (7) After the terminal electrode, apply 25 °. 〇 Above, silver is stretched out due to being pulled by the silver component in the terminal electrode. The embodiment of the electrode: The above generally describes the present invention, and the following will explain the present invention in more detail. Because the specific preferred embodiments of the M and H ports are clear, the present invention can be further understood. Example 1: The second book shown: In the ceramic book! Apply an insulating layer before sintering, as shown in Figure 2A, Fig. 2 and 3, making ceramic green embryo flakes, printing and stacking Nie and Qibao J. The sentence contains the ceramic body 10 internal mines — and the knife d into other components raw embryo # 土As early as 70 pieces of green embryos, etc., they will be combined with the surface coating layer 『〇 " m, and the sintering conditions for the green embryos of the components shall be the same as those used in the original components. You A, and M include Lu Xingde $ _ 2 after the formation of a structure as shown in the figure of the younger brother, the surface material of the body during the burning process, and the glass coating layer and pottery sign, # 二 从 鹿 、 ^ 过 転The surface insulation layer 60 formed by the intermediate reaction is shown in Fig. 2. After the end electrode is coated and burned, a small amount of glass coating 80 may remain on the end of the electrode 22 in the circuit, as shown in Figure 2C. To block the end of the internal electrode 22 and the terminal electrode 3: == coat =, it is necessary to implement electrical conduction between 50 (TC and above), so the silver in the electrode 32 is a lemma and two Electricity: 22 ^ ^ on, as shown in Figure 2D, if selected; Upper: Zhan 'to form a good electrical conductivity process so that the internal electrode 22 end electrode material It is expected that the implementation process of the heat treatment process 1A exhibition can be combined with the burning of the terminal electrode 1235631 V. Description of the invention (8) The combined process is implemented to obtain the same effect. After the above procedures are completed, the component can be passed through the traditional wafer-type component. The subsequent electroplating process has obtained the normal plating effect, and the surface of the ceramic body between the terminal electrodes will not be plated with metal after the insulation treatment. Example 2: This example is to apply insulation after the ceramic body is sintered and before the terminal electrode is manufactured. After the ceramic green sheet is made, printed, stacked, cut and sintered, the structure is formed as shown in Figure 3A, which includes the ceramic body △ and the pole 22. The sintered component is coated with a layer of zinc— Boron-silicon oxide mixed coating layer, and then subjected to 50 0 t: s85 (rCi heat treatment, to form the structure shown in Figure 3B, including the ceramic body 12, the internal electrode ", and the oxide mixed coating layer and the surface of the ceramic body The surface insulation layer 6 formed by the reaction of the material during the heat treatment process.

^: 'After the end electrode of this element is coated and fired, as shown in Figure 3c', a small amount of oxide mixed coating 80 may remain on the end of the internal electrode 22 that was originally exposed, and block the end of the internal electrode 22 from the terminal electrode. Therefore, it is necessary to perform 500 t: heat treatment above, the internal conduction I is pulled outward by the silver component in the terminal electrode 32, and the silver conduction is good, as shown in Figure 3D. The electrical processing process makes the end of the inner electrode 22 oriented; = = = Material 'The heat edge layer heat treatment and end electrode firing process ::::; The effect of surface insulation. ^ σ and yoke to get the same. After the above procedures are completed, the

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Ceramics between the terminal electrodes V. Description of the invention (9) The normal electroplating effect is obtained after the power ore process is continued. After the surface of the body is insulated, the metal will not be used. Example 3: This example is based on the ceramic body After sintering, the production of terminal electrodes: that is, through the production of Taoman green sheet, printing and stacking "knife cutting and sintering 22", 'to form a structure not shown in Figure 4A' includes ceramic body 12 and internal electricity, 70 pieces after sintering were immersed in 0.5% HC1 aqueous solution for 1 minute: Tao Jing body 12 was immersed and shrunk to make the internal electrode 2: Xibu protruding, as shown in FIG. 4B. Second, after the treatment, The element is coated with a glass coating layer whose main component is boro-silicon, and then subjected to a heat treatment of 50000 to 700C to form a structure as shown in FIG. 4C, which includes a ceramic body 12, The internal electrode 22, the glass coating layer, and the surface insulation layer 6 formed by the reaction of the surface material of the ceramic body during the concrete treatment process. "", And then, after the end electrode of the element is coated with the end electrode and fired, as shown in FIG. 4D No, there is a gap between the end of the internal electrode 22 and the terminal electrode 32 that had been exposed to the outside. Good electrical conduction properties, sticking the above-described embodiment of the process combined surface of the insulating layer of the heat treatment process may end electrodes ^ the same effect is obtained. After the above procedures are completed, the element can be subjected to a normal electroplating process after a conventional wafer-type element electroplating process. The surface of the ceramic body between the terminal electrodes is not coated with metal after the insulation treatment. Embodiment 4: This embodiment is performed after the components have completed the sintering process and the terminal electrodes are manufactured.

Page 13 1235631 V. Description of the invention (10) Insulation layer is applied before plating. After the traditional multilayer chip type component manufacturing process, before the power ore, the structure as shown in Figure 5A is obtained, including the ceramic body 12, inner The electrode 22 and the terminal electrode 32 'are then coated on the surface of the element with a glass coating layer 40 containing lead-zinc-boron-silicon as the main component, as shown in Figure VII, θ, and then 50 (TC to 700 ° C) The heat treatment forms a dry body structure as shown in FIG. 5 / FIG., Which includes the Tao Yao body 12, the internal electrode 22, the terminal electrode 32, and the glass coating layer and the surface insulation layer 60 of the ceramic body surface material during the heat treatment process. The coating applied to the surface of the terminal electrode is dissolved or mixed into the terminal electrode metal during the heat treatment, and the surface of the terminal electrode still maintains good electrical conductivity. The heat treatment process of the layer can be applied together with the firing process of the terminal electrode. The same effect. After the second power i: ί: After the completion, the M element can pass through the traditional wafer-type element after the body surface: it :: to the normal plating effect 1 the ceramic body surface between the electrodes 绖 insulation treatment, $ will Coated with metal. Already: explained with = The preferred embodiment of the creation is under the same: (1) any form of limitation, that is, more, are all modifications or changes related to the creation of this creation, which are covered by the patent scope. 1235631 Schematic Briefly explain that Figure 1A is a plan view of a conventional multilayer chip type ceramic magister overvoltage suppressor element, and Figure 1B is a longitudinal direction of the conventional multilayer chip type talman overvoltage suppressor element shown in Figure 1A 1C is a cross-sectional structural diagram of a conventional multilayer wafer-type ceramic overvoltage suppressor element shown in FIG. 1A; FIG. 2A is a multilayer wafer-type ceramic wafer of the present invention. In the first example of the voltage suppressor element, before the sintering of the ceramic body, a schematic cross-sectional structure of a glass coating layer is coated on the surface; Fig. 2B is a cross-section of an insulating layer formed on the surface after sintering following the process of Fig. 2A. Schematic diagram of the structure; Figure 2C is a schematic diagram of the cross-sectional structure of the component after the end electrode is coated and fired after the manufacturing process of Figure 2B;

Apply a layer of oxide on its surface and mix it on its surface to form an insulating layer. Section 3B is a diagram following the process of FIG. 3A, and the material layer is then subjected to a heat treatment process to form a schematic diagram. FIG. 3C is a process following the process of FIG. 3B. Schematic diagram of the cross-sectional structure; #The cross-sectional structure of the component after the end electrode is coated with a terminal electrode and after the heat treatment is shown in FIG. 3D is a process following FIG. 3c

Page 15 1235631

The drawing is for simple explanation; FIG. 4A is a third embodiment of the multilayer wafer-type ceramic overvoltage suppressor element of the present invention. The cross-sectional structure of the ceramic body after sintering and before the terminal electrode is manufactured. FIG. 4B is a process following FIG. 4A. After the element is immersed in a 0.5% HC1 aqueous solution for j minutes, the cross-sectional structure of the inner electrode end is projected outward; Figure 4C is a process following Figure 4B, the surface of the element is coated with a glass coating layer, and After the heat treatment process, the cross-sectional structure of an insulating layer is not intended on the surface; FIG. 4D is a schematic diagram of the cross-sectional structure of the component after the end electrode is coated with the terminal electrode and after firing; FIG. 5A This is the fourth embodiment of the multilayer wafer-type ceramic overvoltage suppressor element of the present invention. The cross-sectional structure after the ceramic body is sintered and the terminal electrode is completed is not intended. Figure 5B is a process following Figure 5A, and the surface is coated. A schematic view of the cross-sectional structure of a glass coating layer; FIG. 5C is a schematic view of the cross-sectional structure of an insulating layer formed on the surface after the process of FIG. 5B and then subjected to a heat treatment process. [Simple description of component symbols] Ceramic body that has not been sintered 1 0 Ceramic body that has been sintered 1 2 Internal electrode that has not been sintered 20 Internal electrode after sintering 22

1235631 The diagram simply illustrates the end electrode that has not been fired. 30 The end electrode after fired. 3 2 The coating layer on the surface of the ceramic body without heat treatment. 4 0 Surface insulation layer. Coatings 80 li ·· Page 17

Claims (1)

1235631 ------ Case No. 92132, six. After the patent application process is completed, a heat treatment will be performed to ensure that the inner electrode invites the end of the inner electrode of each piece to extend outward. 6. If a patent is applied for Η described in the range item 5 has good electrical continuity. The surface insulation of the suppressor element Fang Xixi Japanese wafer-type ceramic over-voltage inner electrode end extending outward a LL, this heat treatment method makes the element's terminal electrode firing attached on the same day 4 D f sequence can be combined with I Heat treatment of the surface insulation layer and 7. In the case of the patent application, the surface insulation method of the second real suppressor element is described as follows: the method of sheet-shaped ceramics over-electricity second development is characterized in that after the end of the inner electrode is extended outward, Apply 25 (TC or above) to pull the silver component in the electrode that makes the surface insulation layer and terminal electrode to deal with the metal silver in the internal electrode. .If the patent application scope item 5 or 7-pottery == pieces; r insulation method ... for the body's wafer type, he uses a high-conductivity or low-insulation material as the surface of the H i ΐ chip-type ceramic overvoltage suppressor element The method of insulation is that after the ceramic body is sintered and before the terminal electrodes are made, the component is immersed / encapsulated in I or test solution, so that the surface of the ceramic body is shrunk by the impregnation, and the internal electrode metal is formed due to corrosion and erosion. The electrode ends protrude out of the ceramic body; An insulating material is coated on the surface of the ceramic body, and then a heat treatment process is performed to form an insulating layer on the surface of the semiconductor ceramic body. Finally, a terminal electrode is produced to ensure that the internal electrode and the terminal electrode form a good electrical property. 10. The multi-layer wafer-type ceramic overvoltage as described in item 9 of the scope of patent application 19 page 1235631 -------- 921 _ 手 月 说 _ Amendment VI. Surface insulation method, wherein the surface insulation layer heat treatment process & the terminal electrode firing process are combined and implemented to obtain the same effect. 11 · The multilayer wafer-type ceramic overvoltage P device component as described in item 9 of the scope of patent application The surface insulation method, wherein the end of the internal electrode is extended outward = method 'characterized in that: after the ceramic body is sintered, the surface insulation layer is immersed in the acid or alkali solution, so that the surface of the ceramic body is immersed Retracted 'internal electrode metal protrudes out of the ceramic body. J. The surface insulation method of the multilayer wafer type ceramic over-external pressure suppressor element as described in item 9 or 11 of the scope of patent application, which The method of extending the end of the internal electrode in the middle of the night is also applicable to other wafer-type electronic components with semiconductor or low-insulation material as the body. 13. Surface insulation of a multilayer wafer-type ceramic overvoltage suppressor element The f method is after the ceramic body is sintered and the terminal electrodes are made, and before plating, it is coated with an insulating material on the surface of the ceramic body, and then heat-treated to form an insulating layer on the surface of the semiconductor ceramic body. The coating on the surface of the terminal electric jade is dissolved or mixed into the terminal electrode metal during the heat treatment, and the surface of the terminal electrode still maintains good conductive properties. The multilayer chip type ceramic over-electrical spasm described in item 13 of the patent scope Surface insulation method of PJ device components The heat treatment of the surface insulation layer of the bean = the Λ end Λ pole firing process can be combined and implemented to obtain the same effect. The surface insulation method of 70 pieces of multi-layer wafer-type Ξ ΐϊΐ Γ 制 device as described in item 1, 5, 9, or 13 of the scope of interest. The medium-high-insulation material is glass. 16. Multi-layer wafer type as described in patent application No. J, 5, 9, or 13 Page 20 Among them, the high-margin 1235631 case number 92132805 6. Scope of patent application The surface insulation method of the ceramic over-suppressor element can be an organic compound. 17. The surface insulation method of a multilayer wafer change ceramic overvoltage suppressor element as described in claim 1, 5, 9, or 13, wherein the highly insulating material may be a metal oxide. 18 ... The surface insulation method of the multilayer wafer type ceramic overvoltage suppressor element according to item 1, 5, 9, or 13 of the scope of the patent application, wherein the high insulation material may be a metal salt. ^ 1 9 · The surface insulation method of the multilayer crystal pottery 电压 overvoltage suppressor element described in item i, 5, 9 or 丨 3 of the scope of patent application, also applicable to & cattle conductive or low-insulation materials as The body's wafer-type electronic element is insulated from the human face. Table Page 21